KR20100079498A - Apparatus for bonding substrates - Google Patents

Abstract

PURPOSE: An apparatus for bonding substrates is provided to remove a particle adhered to an adhesive member by discharging plasma to the adhesive member from a cleaning unit. CONSTITUTION: A lower stage comprises a lower adhesive member adhering to a lower plate. A lower chamber(120) offers an inner space for the lower stage. An upper stage comprises an upper adhesive member adhering to the upper plate. The upper chamber(110) offers an inner space for the upper stage and provides a space in which the lower chamber and the upper substrate are combined. A cleaning unit cleans one of the upper adhesive member and the lower adhesive member by using plasma. The cleaning unit includes a cleaning member corresponding to one of the upper adhesive member and the lower adhesive member.

Description

Board Bonding Machine {APPARATUS FOR BONDING SUBSTRATES}

The present invention relates to a substrate bonding machine, and more particularly, to a substrate bonding machine using an adhesive member.

As the information society develops, the demand for display devices is increasing in various forms, and in recent years, liquid crystal display devices (LCDs), plasma display panels (PDPs), electro luminescent displays (ELDs), and vacuum fluorescent (VFD) Various flat panel display devices such as displays have been studied, and some of them are already used as display devices in various devices.

Among them, LCD is currently being used most frequently as a substitute for CRT (Cathode Ray Tube) for mobile image display because of its excellent image quality and light weight, thinness and low power consumption. In addition to the mobile use, various types of monitors, such as televisions and computers that receive and display broadcast signals, have been developed.

As described above, although various technical advances have been made in the liquid crystal display device to serve as a screen display device in many fields, the task of improving the image quality as the screen display device is often arranged with the above characteristics and advantages. .

Therefore, in order for a liquid crystal display device to be used in various parts as a general screen display device, the key to development is how much high quality images such as high definition, high brightness and large area can be realized while maintaining the characteristics of light weight, thinness and low power consumption. It can be said.

Such a liquid crystal display may be largely divided into a liquid crystal panel displaying an image and a driving unit for applying a driving signal to the liquid crystal panel, wherein the liquid crystal panel has a predetermined space and is bonded to the first and second glass substrates. And a liquid crystal layer formed between the first and second glass substrates.

The first glass substrate (TFT array substrate) may include a plurality of gate lines arranged in one direction at a predetermined interval, a plurality of data lines arranged at regular intervals in a direction perpendicular to the gate lines, and A plurality of pixel electrodes formed in a matrix form in each pixel region defined by crossing each gate line and data line, and a plurality of thin films that transmit signals of the data line to each pixel electrode by being switched by signals of the gate line Transistors are formed.

The second glass substrate (color filter substrate) includes a black matrix layer for blocking light in portions other than the pixel region, an R, G and B color filter layer for expressing color colors, and a common electrode for implementing an image. Is formed.

The first and second substrates are bonded by a sealant to have a predetermined space and a liquid crystal injection hole by a spacer, and a liquid crystal is injected between the two substrates.

In this case, in the liquid crystal injection method, when the liquid crystal injection hole is immersed in the liquid crystal liquid by maintaining the vacuum state between the two substrates bonded by the real material, love is injected between the two substrates by the osmotic phenomenon. When the liquid crystal is injected as described above, the liquid crystal injection hole is sealed with a sealing material.

However, the manufacturing method of such a liquid crystal injection type liquid crystal display device has the following problems.

First, after cutting into the unit panel, the liquid crystal injection hole is immersed in the liquid crystal liquid by maintaining the vacuum state between the two substrates to inject the liquid crystal, so the liquid crystal injection takes a lot of time, productivity is reduced.

Second, in the case of manufacturing a large-area liquid crystal display device, when the liquid crystal is injected by the liquid crystal injection method, the liquid crystal is not completely injected into the panel, which causes a defect.

Third, since the process is complicated and time-consuming as described above, several liquid crystal injection equipment is required, which requires a lot of space.

Therefore, in recent years, the manufacturing method of the liquid crystal display device using the method of dropping a liquid crystal is researched.

That is, in Japanese Patent Application Laid-Open No. 11-089612 and Japanese Patent Application Laid-Open No. 11-172903, after dropping a liquid crystal onto one substrate and applying a sealing material, another substrate is placed on the substrate on which the liquid crystal and the sealing material are formed. The liquid crystal dropping method etc. which place and bond in a vacuum were proposed.

The liquid crystal dropping method has an advantage of simplifying the process as it can omit many processes (for example, each process for forming the liquid crystal injection hole, liquid crystal injection, sealing of the liquid crystal injection hole, etc.) compared to the liquid crystal injection method.

An object of the present invention to provide a substrate bonding machine capable of cleaning the adhesive member.

Other objects of the present invention will become more apparent from the following detailed description and the accompanying drawings.

According to the present invention, the substrate bonding machine includes a lower stage having a lower adhesive member to adhere the lower substrate; A lower chamber providing an inner space in which the lower stage is installed; An upper stage positioned on an upper portion of the lower stage and having an upper adhesive member adhering to an upper substrate; An upper chamber positioned above the lower chamber to provide an inner space in which the upper stage is installed, and providing a space in which the upper substrate and the lower substrate are joined together with the lower chamber; And a cleaning unit positioned between the upper stage and the lower stage, the cleaning unit cleaning any one of the upper adhesive member and the lower adhesive member by using a plasma, wherein the cleaning unit includes the upper adhesive member and the lower member. A cleaning member corresponding to any one of the adhesive members is provided.

The cleaning unit may further include a movable plate disposed between the upper stage and the lower stage, and the cleaning member may be installed on one surface of the movable plate corresponding to any one of the upper adhesive member and the lower adhesive member. have.

The cleaning unit may further include a partition wall that blocks the space where the cleaning is performed from the outside.

The substrate joining unit further includes a moving unit for moving the cleaning unit, wherein the moving unit includes a first moving unit moving the cleaning unit in a horizontal direction and positioned between the upper stage and the lower stage; And a second moving part for moving the cleaning member in a vertical direction to position the cleaning member to be close to any one of the upper adhesive member and the lower adhesive member.

The first moving unit comprises a moving rail; A frame moving along the moving rail and on which the cleaning unit is installed; And it may include a first drive device for moving the frame along the moving rail.

According to the present invention, the particles attached to the adhesive member can be removed.

Hereinafter, preferred embodiments of the present invention will be described in more detail with reference to FIGS. 1 to 4. The embodiments of the present invention can be modified in various forms, and the scope of the present invention should not be construed as being limited to the embodiments described below. The embodiments are provided to explain the present invention to a person having ordinary skill in the art to which the present invention belongs. Accordingly, the shape of each element shown in the drawings may be exaggerated to emphasize a more clear description.

Hereinafter, the substrate is described as an example, but the spirit and scope of the present invention are not limited thereto.

Meanwhile, the words "comprising", "including", "having", "having", "comprising", and "accompanied" in the specification are intended to include additional items as well as the listed items and their equivalents. Interpreted

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows schematically a board | substrate bonding machine. Substrate bonding includes an upper chamber 110 and a lower chamber 120, and an upper stage and a lower stage. The upper chamber 110 is positioned above the lower chamber 120, and the upper chamber 110 provides a space in which the substrate bonding process is performed together with the lower chamber 120. The side wall 112 of the upper chamber 110 contacts the lower chamber 122 to block the space where the process is performed from the outside, and for this purpose, a sealing member 122a is installed between the side wall 112 and the side wall 122. .

The upper chamber 110 is supported by the lifting shaft 114, and is lifted up and down by the lifting shaft 114. Likewise, the lower chamber 120 is supported by the support shaft 124, and can be lifted up and down by the support shaft 124.

The upper stage is installed in the inner space of the upper chamber 110, the lower stage is installed in the inner space of the lower chamber 120. Two substrates (TFT array substrate and color filter substrate S) carried in the upper chamber 110 and the lower chamber 120 are bonded up and down while being fixed to the upper stage and the lower stage, respectively.

The upper stage includes a plurality of adhesive members 132 provided on the lower surface of the upper plate 130 and the upper plate 130, and the lower stage has a plurality of upper surfaces of the lower plate 140 and the lower plate 140. The adhesive members 142 are provided. The adhesive members 132 and 142 fix the substrates S to the lower surface of the upper plate 130 and the upper surface of the lower plate 140 using adhesive force.

Meanwhile, particles attached to the substrate S or particles floating in the inner space of the upper chamber 110 and the lower chamber 120 may be attached to the adhesive surfaces of the adhesive members 132 and 142 to which the substrate S is adhered. Can be. When particles are attached to the adhesive surface, the adhesive force of the adhesive members 132 and 142 is significantly lowered, thereby stably fixing the substrate S to the lower surface of the upper plate 130 or the upper surface of the lower plate 140. Can't.

2 and 3 are views schematically showing a cleaning unit and a moving unit according to an embodiment of the present invention, Figure 4 is a view showing a cleaning member of FIG. As shown in FIG. 2, the cleaning unit 80 includes a moving plate 81 and a cleaning member 82. The moving plate 81 is generally disposed side by side with the upper plate 130 and the lower plate 140, and moves in a direction generally parallel with the upper plate 130 and the lower plate 140 by the moving unit 90 described later. Can be.

The cleaning member 82 is installed on the upper surface of the movable plate 81 and is installed to correspond to the adhesive member 132 installed on the upper plate 130. A plurality of adhesive members 132 are installed on the upper surface of the movable plate 81 to correspond to the number of adhesive members 132. Meanwhile, in the present embodiment, the cleaning unit 80 will be described with respect to the adhesive member 132 of the upper plate 130. In contrast, the cleaning unit 80 uses the adhesive member 142 of the lower plate 140. Can be used as a subject.

As shown in FIG. 4, the cleaning member 82 ejects the plasma stored therein toward the adhesive member 132 to remove particles attached to the adhesive surface of the adhesive member 132. The type of plasma may be selected according to the type of particles easily attached to the adhesive surface.

The moving unit 90 includes a first moving part 91 for moving the cleaning unit 80 in a direction parallel to the moving plate 81, and a second moving for moving the cleaning member 82 toward the adhesive member 132. Part 92 is included.

The first moving part 91 includes a rail 911 extending in a direction parallel to the moving plate 81, and installed on the rail 911 so as to be movable along the rail 911, and the moving plate 81 is connected thereto. And a first drive device 913 connected to the frame 912 to move the frame 912 along the rail 911. A rack gear 914 may be installed on the rail 911, and the first driving device 913 may include a pinion gear 915 having a screw thread engaged with the rack gear 914 on an outer circumferential surface thereof, and a frame 912. Rotation shaft 916 is installed to be rotatable and connected to the pinion gear 915, and a rotation motor 917 installed on the frame 912 and connected to the rotation shaft 916 to rotate the rotation shaft 916, Can be configured. Meanwhile, at least one idle gear 918 may be installed around the pinion gear 915 to be engaged with the rack gear 914 and rotate to support the frame 912.

The second moving part 92 includes a second driving device 921 installed on the frame 912 and connected to the moving plate 81 to move the cleaning member 82 in a direction toward the adhesive member 132. do. As the second driving device 921, a hydraulic cylinder or a pneumatic cylinder may be applied.

Hereinafter, operations of the cleaning unit and the mobile unit will be described with reference to FIGS. 2 to 4.

First, when the foreign matter of the adhesive member 132 is required, when the lifting shaft 114 is raised, the upper chamber 110 and the lower chamber 120 are spaced apart from each other.

In addition, a frame 912 in which a rail 911 is installed between the upper chamber 110 and the lower chamber 120, and the cleaning unit 80, the first moving unit 91, and the second moving unit 92 are assembled. ) Is mounted on the rail 911 so that the pinion gear 915 is engaged with the rack gear 914.

At this time, when the rotary motor 917 is operated, the frame 912 of the upper chamber 110 and the lower chamber 120 along the rail 911 due to the interaction of the rack gear 914 and the pinion gear 915. The cleaning unit 80 moves to the lower portion of the adhesive member 132.

When the cleaning unit 80 moves and the positions of the cleaning member 82 and the adhesive member 132 are aligned, the operation of the rotating motor 917 is stopped. At this time, the cylinder 921 is operated to move the movable plate 81 upward to bring the cleaning member 82 close to the adhesive member 132, and then, as shown in FIG. 4, from the cleaning member 82. The plasma is ejected toward the adhesive member 132. Through the above method, the particles attached to the adhesive member 132 may be removed.

When the particle removal process is completed, the moving plate 81 is lowered, and the cleaning unit 80 is moved along the rail 911 so as to deviate from between the upper chamber 110 and the lower chamber 120, and then cleaning. Removing the frame 912 in which the unit 80, the first moving part 91 and the second moving part 92 are assembled from the rail 911, and removing the rail 911 completes the process of removing particles. do.

In the present embodiment, the cleaning unit 80 is mounted on the rail 911 to move the cleaning unit 80 to the lower portion of the adhesive member 132 and is operated by the rack gear 914 and the pinion gear 915. The first moving part 91 for moving the moving part and the second moving part 92 for moving the moving plate 81 in the vertical direction by the operation of the cylinder 921 are presented. However, the present invention is not limited to such a configuration, and the first moving part 91 and the second moving part 92 are provided with a transfer mechanism using a ball screw, a mover and a stator, and an electron of the mover and the stator. Various configurations such as a transfer mechanism for linearly moving the cleaning unit 80 using a miracle interaction, a linear transfer mechanism using a belt or a biaxial transfer mechanism using a robot, and a transfer mechanism using a linear actuator may be applied.

FIG. 5 is a view illustrating a partition wall installed in the cleaning member of FIG. 3. When the plasma is ejected from the cleaning member 82 as shown in FIG. 4, since the plasma is not concentrated on the adhesive member 132, as shown in FIG. 5, the partition wall 83 is formed around the cleaning member 82. ), And when the cleaning is performed, the upper end of the partition 83 is in close contact with the upper plate 130 to block the cleaning space from the outside. Through this method, the plasma may be concentrated on the adhesive member 132.

6 and 7 are views showing a state in which the partition wall is installed on the moving plate of FIG. In addition, the partition wall 84 can be provided at the edge of the movable plate 81. Through such a method, the plasma may be prevented from being emitted to the outside of the upper plate 130, and the plasma may be concentrated on the adhesive member 132.

8 is a view schematically showing a cleaning unit according to another embodiment of the present invention. As shown in FIG. 8, the valve 134a is opened while the space to be cleaned is blocked from the outside to supply the source gas through the gas supply line 134, and an electric field is formed in the space where the cleaning is performed to form a plasma. Can be formed. The formed plasma is used to clean the adhesive surface of the adhesive member 132.

Although the present invention has been described in detail by way of preferred embodiments thereof, other forms of embodiment are possible. Therefore, the spirit and scope of the claims set forth below are not limited to the preferred embodiments.

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows schematically a board | substrate bonding machine.

2 and 3 are views schematically showing a cleaning unit and a mobile unit according to an embodiment of the present invention.

4 is a view illustrating the cleaning member of FIG. 3.

FIG. 5 is a view illustrating a partition wall installed in the cleaning member of FIG. 3.

6 and 7 are views showing a state in which the partition wall is installed on the moving plate of FIG.

8 is a view schematically showing a cleaning unit according to another embodiment of the present invention.

<Description of Symbols for Main Parts of Drawings>

90: mobile unit 110: upper chamber

114: lifting shaft 120: lower chamber

124: support shaft 130: upper plate

132: upper adhesive member 140: lower plate

142: lower adhesive member 80: cleaning unit

Claims (5)

A lower stage having a lower adhesive member for adhering the lower substrate; A lower chamber providing an inner space in which the lower stage is installed; An upper stage positioned on an upper portion of the lower stage and having an upper adhesive member adhering to an upper substrate; An upper chamber positioned above the lower chamber to provide an inner space in which the upper stage is installed, and providing a space in which the upper substrate and the lower substrate are joined together with the lower chamber; And Located between the upper stage and the lower stage, comprising a cleaning unit for cleaning any one of the upper adhesive member and the lower adhesive member using a plasma, And the cleaning unit includes a cleaning member corresponding to any one of the upper adhesive member and the lower adhesive member. The method of claim 1, The cleaning unit further includes a moving plate installed between the upper stage and the lower stage, And the cleaning member is installed on one surface of the moving plate corresponding to any one of the upper adhesive member and the lower adhesive member. The method of claim 1, The cleaning unit further comprises a partition wall for blocking the space in which the cleaning is performed from the outside. The method of claim 1, The substrate joining unit further includes a moving unit to move the cleaning unit, The mobile unit, A first moving part which moves the cleaning unit in a horizontal direction and is positioned between the upper stage and the lower stage; And And a second moving part moving the cleaning member in a vertical direction to position the cleaning member to be in proximity to any one of the upper adhesive member and the lower adhesive member. The method of claim 4, wherein The first moving unit, Moving rail; A frame moving along the moving rail and on which the cleaning unit is installed; And And a first driving device for moving the frame along the moving rail.

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