KR20100074346A - Polishing pad for preventing scratch and its manufacturing method - Google Patents

Abstract

PURPOSE: A grinding pad for preventing scratches and a manufacturing method thereof are provided to improve yield rate and the operating rate of a facility by preventing scratches due to the grinding pad. CONSTITUTION: A manufacturing method of a grinding pad for preventing scratches comprises the following steps. Multiple thin nonwoven fabrics or polyester(1) is prepared. The multiple nonwoven fabrics or the polyester is dyed with different colors. The multiple dyed nonwoven fabrics or the polyester(2) is stacked.

Description

Polishing pad for preventing scratch and its manufacturing method

The present invention relates to a polishing pad for scratch prevention, and in detail, a stack of polishing pads having a thin thickness and dyed in different colors, and a polishing pad for preventing scratches and a method of manufacturing the same. It is about.

Semiconductor devices such as diodes, transistors, and thyristors used in radio, television, and computers of electronic and computer-related products are made from wafers made of discs by thinly cutting columnar rods on which single crystals such as silicon are grown. That is, a silicon wafer is manufactured through a series of unit processes such as a photo process, an etching process, and a thin film forming process. However, with the recent rapid spread of information media such as computers, the semiconductor field is also rapidly developed, and devices using the semiconductor devices are required to operate at high speed and have a large storage capacity. In order to meet these requirements, high integration is essential.

Currently, a chemical mechanical polishing (CMP) process that combines a mechanical polishing method and a chemical polishing method has been developed and used for high integration. In this chemical mechanical polishing process, mechanical polishing is performed by contacting a silicon wafer with a polishing pad having a constant roughness and causing friction by moving it relative to each other. It is made by injecting between the pad and the wafer to cause the insulating film and the slurry of the wafer to react.

A schematic structure of a conventional chemical mechanical polishing apparatus is described, wherein a polishing pad is attached to an upper surface of a polishing table, a wafer having an insulating film is mounted on a polishing head, and a wafer is polished with a silicon wafer in close contact with the polishing pad. Mechanical polishing takes place as the tables rotate in opposite directions. In addition, a slurry is introduced between the wafer and the polishing pad through a slurry supply unit that is separately installed to react with the insulating film on the wafer surface, thereby chemically polishing.

In the chemical mechanical polishing apparatus, the polishing pad is a very important factor. 1 is an enlarged photograph of a conventional polishing pad. As shown in Figure 1, a conventional polishing pad is made of polyurethane. It is a monolayer since polyurethane is produced using a foaming reaction. Since the polishing pad is a single layer, the polishing pad is not visible to the naked eye and how much more can be used in the future, so it is not known exactly when to replace it. In particular, when the polishing pad is excessively used and worn out, scratches may frequently occur due to foreign matter.

As device devices become finer, the importance of the CMP process is increasing. Nevertheless, CMP is not only chemically polished but also mechanically involved, resulting in scratches during polishing. There are many factors that cause such scratches, but CMP polishing pads are one factor. In particular, CMP polishing pads wear out as usage increases, so the frequency of CMP scratches increases.

The present invention has been invented to solve the above problems, the present invention by stacking a plurality of polishing pads of different thickness and dyed in different colors, the scratch-resistant polishing pad that can visually check the replacement time of the polishing pad and Its purpose is to provide a manufacturing method thereof.

The anti-scratch polishing pad according to the present invention is characterized in that a plurality of thin nonwoven fabric or polyester is laminated.

According to another preferred feature of the invention, the thin nonwoven fabrics or polyesters are dyed in different colors.

Scratch-resistant polishing pad manufacturing method according to the present invention comprises the steps of preparing a plurality of thin nonwoven fabric or polyester; Dyeing a plurality of nonwovens or polyesters in different colors; Laminating a plurality of dyed nonwoven fabrics or polyesters.

It is easy to manage because the wear level of the polishing pad can be easily seen with the naked eye. Therefore, it is possible to prevent the scratches due to the polishing pad in advance, which has the effect of improving the yield and increase the operation rate of equipment.

Hereinafter, the configuration and operation of an embodiment of the present invention will be described in detail with reference to the accompanying drawings. However, the following examples are provided to enable those skilled in the art to fully understand the present invention, but the scope of the present invention is not limited by the embodiments described below.

2 is a schematic view of a scratch prevention polishing pad according to the present invention. As shown in Figure 2, the scratch prevention polishing pad according to the present invention is characterized in that a plurality of polishing pads are stacked. Conventional polyurethane is composed of a single layer by the foaming reaction, the scratch-resistant polishing pad according to the present invention is composed of a plurality of layers. Therefore, the material is used nonwoven fabric or polyester. The nonwoven fabric or polyester may be any one capable of functioning as a polishing pad, so there is no particular limitation on its specification.

However, since the polishing pad is completed by laminating multiple layers of nonwoven fabric or polyester, each nonwoven fabric or polyester should be thinner than a conventional polishing pad. The polishing pad is completed by laminating a relatively thin nonwoven fabric or polyester to the desired thickness.

In addition, it is preferable that the nonwoven fabric or polyester laminated in several layers is dyed in different colors. Since the dyeing method may use a conventionally known technique, a detailed description thereof will be omitted.

Since the nonwoven fabric or polyester is laminated in different colors, as the polishing pad is worn out as the polishing pad is used, the color of the polishing pad changes, and the user can see the color of the polishing pad to know exactly when the polishing pad is to be replaced.

The manufacturing method of the scratch prevention polishing pad by this invention is demonstrated. 3 is a view illustrating a manufacturing process of a scratch prevention polishing pad according to the present invention. Method for producing a scratch-resistant polishing pad according to the present invention comprises the steps of preparing a plurality of thin nonwoven fabric or polyester; Dyeing a plurality of nonwovens or polyesters in different colors; Laminating a plurality of dyed nonwovens or polyesters.

A nonwoven fabric or polyester is prepared as in FIG. 3 (a). The nonwoven or polyester 1 should be relatively thin in thickness compared to conventional polishing pads. The nonwoven fabric or polyester is prepared so that the thickness at the time of laminating | stacking several sheets may become desired thickness.

As shown in Figure 3 (b), the prepared nonwoven fabric or polyester (1) is dyed in a different color to prepare a dyed nonwoven fabric or polyester (2).

Next, a plurality of nonwoven fabrics or polyesters are laminated to complete a polishing pad 10 having a shape as shown in FIG. 2.

1 is an enlarged view of a conventional polishing pad,

2 is a schematic view of a scratch prevention polishing pad according to the present invention;

3 is a view illustrating a manufacturing process of a scratch prevention polishing pad according to the present invention.

<Description of the major symbols for the main parts of the drawings>

1: nonwoven fabric or polyester

2: dyed nonwoven or polyester

10: polishing pad according to the present invention

Claims (3)

A scratch-resistant polishing pad, characterized in that a plurality of thin nonwoven fabric or polyester laminated. The scratch prevention polishing pad according to claim 1, wherein the plurality of thin polishing pads are dyed in different colors. Preparing a plurality of thin nonwoven fabrics or polyesters; Dyeing a plurality of nonwovens or polyesters in different colors; Method for producing a scratch-resistant polishing pad comprising the step of laminating a plurality of dyed non-woven or polyester.

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