KR20100073396A - Tcp package for pdp pannel and pdp display using the same - Google Patents

Abstract

PURPOSE: A tape carrier package(TCP) for a plasma display panel(PDP) and the PDP using the same are provided to improve the efficiency of the heat radiation by radiating heat through a heat radiating metal thin film. CONSTITUTION: A PDP panel(110) includes an address electrode. An inner assembly(120) is welded to the PDP panel. The inner assembly drives and controls the PDP panel. A TCP connects the PDP panel and the inner assembly in order to transfer signal related to a driving operation and a controlling operation. A heat radiating metal thin film is composed of a flexible material.

Description

TCP package for PDP panel and PDP display using same {TCP package for PDP pannel and PDP display using the same}

The present invention relates to a TCP package for a PDP panel and a PDP display using the same.

Plasma Display Pannel (PDP) display is a representative of large display, and it has attracted attention as a display device to replace cathode ray tube because it has excellent features such as self-luminous, high speed response and wide viewing angle.

Such a PDP display is driven by the X electrode, the Y electrode and the Z electrode. In other words, an intersection region between the Y electrode and the X electrode crossing the Z electrode is called a pixel cell. In the pixel cell, a wall voltage is formed by the addressing discharge between the X electrode and the Y electrode. Thereafter, when a sustain pulse is applied between the Y electrode and the Z electrode, discharge is maintained to maintain light emission of the phosphor.

A data driver IC driven at a high speed is used to apply a data pulse at high speed to the X electrode in the addressing process. Such a data driver IC is mounted on a PDP driving device in a package form. Recently, in order to reduce cost and improve workability of the PDP display, the package type of the data driver IC has been changed from a chip on film (TCP) to a TCP. .

The reason why the package type of the data driver IC is changed from COF to TCP is that the price of TCP itself is cheaper than COF, and since the COF is installed separately, TCP is supplied in a reel form, so it is cut to fit the PDP. This is because the manufacturing process is simple because it is installed.

TCP is a surface-mount package of a semiconductor that connects a large scale integrated circuit (LSI) bear chip to a lead by mounting a tape-shaped insulating film forming a lead wire, and is flexible. ) Is implemented.

The present invention is to provide a PDP panel TCP and a PDP display using the same for high heat dissipation efficiency and easy manufacturing.

Technical problems to be achieved by the present invention are not limited to the above-mentioned technical problems, and other technical problems not mentioned above will be clearly understood by those skilled in the art from the following description. Could be.

One embodiment according to the present invention for achieving the above object is a PDP panel having an address electrode; An inner assembly bonded to the PDP panel to drive and control the PDP panel; A plurality of TCPs (Tape Carrier Package) for transmitting signals related to the driving and control; And a heat dissipating metal thin film made of a flexible material bonded to the surface of the TCP.

Here, the TCP is an element connecting at least the address electrode of the PDP panel and the address electrode driver of the internal assembly for generating an electrical signal for driving the address electrode, wherein the heat-dissipating metal thin film is made of aluminum, iron or copper. It may include at least one of.

In addition, the bonding between the heat dissipation metal thin film and the TCP may be performed by a heat dissipation tape, and the heat dissipation metal thin film may have a shape corresponding to the uneven shape of the TCP surface to be bonded, in which case the uneven shape is the TCP. An object may be formed due to an IC (Integrated Circuit) mounted on the circuit.

On the other hand, when the plurality of TCP is arranged on the same line of the TCP panel, the heat-dissipating metal thin film may be formed in a continuous form on the same line, or may be formed separately for each of the TCP, the latter case the heat radiation The width of the metal thin film can be made larger than the width of the TCP.

The heat dissipating metal thin film may have a structure bonded to both surfaces of the TCP.

On the other hand, the TCP package for the PDP panel according to an embodiment of the present invention TCP (Tape Carrier Package, Tape Carrier Package) used in the PDP panel; A heat dissipating metal thin film made of a flexible material bonded to the surface of the TCP; And a heat conductive adhesive layer for bonding the TCP and the heat dissipating metal thin film.

The heat dissipating metal thin film may have a shape corresponding to the concave-convex shape of the TCP surface, and the width of the heat dissipating metal thin film may be larger than the width of the TCP.

The heat dissipating metal thin film may be bonded to both sides of the TCP.

As described above, the PDP panel TCP and the PDP display using the same according to the present invention can perform heat radiation through a heat-dissipating metal thin film bonded to the TCP, thereby facilitating easy fabrication and high heat radiation.

In describing the technique of the present invention, a pair of substrates (front substrate, rear substrate) facing each other and having a plurality of discharge cells in which gas discharge occurs between the substrates, It is abbreviated as PDP panel including an address electrode which extends to the ends of the pair of substrates and causes an address discharge to select a discharge cell in which gas discharge occurs. On the other hand, an element including at least an address electrode driver for generating an electrical signal for driving the address electrode, the element structurally bonded to the PDP panel is abbreviated as an internal assembly.

Hereinafter, a portable terminal related to the present invention and a screen control method using the same will be described in more detail with reference to the accompanying drawings.

1 is a cross-sectional view showing the inside of a PDP display according to the present invention.

Referring to FIG. 1, it can be seen that the PDP panel 10 and the inner assembly 20 are bonded by the PDP panel heat dissipation tape 30.

The PDP panel 10 includes a front substrate and a rear substrate, a transparent electrode, a bus electrode, a dielectric layer, and a protective layer are formed on the front substrate, an address electrode, a dielectric layer, and a partition phosphor are formed on the rear substrate. Sealed, the interior is filled with discharge gas which is an inert gas. When the power is supplied in this state, gas discharge occurs and ultraviolet rays are generated. At this time, the generated ultraviolet rays collide with the phosphor to emit visible light.

In summary, the plasma display panel (PDP) panel 10 includes a plurality of discharge cells in which gas discharge occurs between a pair of substrates facing each other and spaced apart from each other, and across the discharge cells. An address electrode which extends to an end and causes an address discharge to select a discharge cell in which gas discharge occurs.

The inner assembly 20 controls an address electrode driver 22 for generating an electrical signal for driving the address electrode and an electrical signal transmission between the address electrode and the address electrode driver as shown in FIG. Accordingly, a plurality of signal transmission means for mounting the integrated circuit chip is provided. Here, a tape carrier package (TCP) 21 may be used as the signal transmission means, and these signal transmission means may be a lower side, an upper side, or a side of the chassis 23 that forms the basis of the inner assembly. It is arranged in a row on the reinforcing member 24 to reinforce the chassis or the rigidity of the chassis along an edge such as, one side is connected to the PDP panel, the other side is the inner assembly, more specifically the inner It is connected to the address electrode driver forming the assembly.

The PDP panel heat dissipation tape 30 is an element for bonding the PDP panel and the internal assembly, and is formed of an adhesive tape.

Since the TCP 21 mounts the TCP IC 25 which is an IC disposed on the TCP, heat dissipation is required to dissipate heat generated in the mounted IC. To this end, the inner assembly 20 is provided with a heat sink 29 for heat dissipating the TCP IC.

The heat dissipation plate 29 is fixed to the inner assembly through fixing members 27 such as screws, and has a shape of wrapping the TCP at the side and the top.

In FIG. 1, the TCP IC is clearly shown in a form spaced apart from the heat sink, but in manufacture, the TCP IC is bonded to the inner surface of the heat sink using a heat dissipation tape. Heat dissipation is achieved.

In some cases, a heat dissipation tape may also be applied to the back surface of the TCP on which the TCP IC is not mounted and bonded to the side or top surface of the inner assembly. An internal view of the PDP display thus formed is shown in FIG. 3. 3 shows a part of the plan view of the inner assembly as viewed from above, showing a heat sink 29 in which a fastening is made through a screw that is a fixing member 27. Inside the heat sink is located a TCP including a TCP IC bonded to the inner surface of the heat sink through a heat radiation tape.

However, in the case of dissipating the TCP and the TCP IC mounted on the TCP by attaching the fixed heat sink through the fixing member, it is difficult to reliably bond the TCP IC to the heat sink, and the bonding is made reliably after the bonding. It's hard to see if it's lost. In addition, since the bonding between the heat sink and the TCP is made through the heat radiation tape, it is difficult to separate the TCP from the PDP panel or to separate the heat sink from the TCP during maintenance.

4 is a view illustrating another interior of the PDP display according to the present invention, and the PDP display illustrated in FIG. 4 includes a PDP panel 110, an internal assembly 120, a TCP 121, and a heat dissipation metal thin film 129. It is included.

The PDP panel 110 is provided with an address electrode and emits phosphors through discharge. The PDP panel 110 is the same as described above. The internal assembly 120 has also been described above. It is bonded to the PDP panel by using, and is an element for driving and controlling the PDP panel.

The TCP (Tape Carrier Package) 121 serves as a signal transmission means for performing data transfer related to driving and control between the PDP panel and the internal assembly, and various wirings and TCP ICs are disposed. It consists of a plurality of PDP panels and internal assemblies.

The heat dissipating metal thin film 129 is a metal thin film made of a flexible material bonded to the surface of the TCP, and is made of a heat conductive material for heat dissipation. Specifically, the heat dissipating metal thin film 129 may include aluminum, copper, and iron. .

Since the heat-dissipating metal thin film is flexible, it can be bonded by bringing it into close contact with the surface of the flexible TCP. The surface of the TCP to which the heat-dissipating metal thin film is bonded is preferably a surface on which a TCP IC is mounted, and in some cases, may be bonded to both surfaces of the TCP. Of course, in the latter case, two heat-dissipating metal thin films are required for double-sided bonding.

The TCP to which the heat-dissipating metal thin film is bonded includes at least an address electrode of the PDP panel and a TCP connecting the address electrode driver of the internal assembly to generate an electrical signal for driving the address electrode. It can be applied to other TCPs inside the PDP display.

Bonding of the heat dissipation metal thin film and the TCP is preferably made of a heat dissipation tape, wherein the heat dissipation tape may be simply made of an adhesive layer. In the case where only the adhesive layer is formed, the bonding is performed through the application of the pressure-sensitive adhesive rather than the common tape. Since the heat dissipation tape must perform a heat dissipation function in addition to a tape function which is a bonding function between dissimilar materials, the heat dissipation tape includes a heat conductive material.

As described above, in the case of the PDP display using the heat dissipation metal thin film, since the TCP and the heat dissipation metal thin film functioning as the heat dissipation plate of the TCP are formed in one set, the connector formed in the address electrode driver 122 ( 126) and the like can be easily attached and detached. In addition, since the bonding between the TCP and the heat-dissipating metal thin film can be performed reliably, the heat dissipation efficiency of TCP and the TCP IC mounted on the TCP is improved. Of course, the thickness, width (W), length (L) and material of the heat dissipation metal thin film should be determined in consideration of the degree of flexibility in consideration of heat dissipation efficiency and ease of assembly. In general, it is preferable to improve the heat dissipation efficiency by controlling the wide width of the available range, unlike the limited thickness and TCP length, in order to provide flexible properties. It is preferable to form larger than the width of the TCP as shown.

On the other hand, the heat dissipation metal thin film 129 preferably has a shape ⓐ corresponding to the concave-convex shape of the surface of the TCP 121 to be bonded as shown in FIG. An IC may be mounted on a surface to which the heat-dissipating metal thin film is bonded for heat dissipation in TCP. The uneven shape may be formed in a shape corresponding to a TCP IC which is an IC (Integrated Circuit) integrated in the TCP. Do. Of course, the concave-convex shape should be viewed as a cross-sectional shape.

As described above, a plurality of TCPs to which a heat dissipating metal thin film is bonded are generally disposed inside a PCP display.

As illustrated in FIG. 6, a plurality of TCPs 121 are disposed on the same line inside the PDP display and on one side of the PDP panel. In this case, the heat-dissipating metal thin film 129 may be formed in a continuous form on the same line. . In this configuration, the ease of assembly is somewhat reduced, but the heat dissipation efficiency is maximized by maximizing the area of the heat dissipating metal thin film.

Meanwhile, as shown in FIG. 7, the heat dissipation metal thin films may be formed separately for each TCP. In this case, the heat dissipation efficiency is somewhat reduced compared to the previous example, but the ease of assembly is maximized. 6 and 7, the heat-dissipating metal thin film is formed in a structure extending from a separate reinforcing member 124 to facilitate the process of bonding the heat-dissipating metal thin film to the TCP. Even if the heat dissipating metal thin film extends from the reinforcing member 124, when the function of the reinforcing member differs from the function of the heat dissipating metal thin film, it is possible to fasten the reinforcing member and the heat dissipating metal thin film by using a separate fastening means. Do. If the reinforcing member is made of the same material as the heat dissipating metal thin film, the reinforcing member may also perform a function of the heat dissipation plate, thereby enabling more efficient heat dissipation. In any case, the step of joining the heat dissipating metal thin film to the TCP becomes easier by having the structure in which the heat dissipating metal thin film extends from the reinforcing member.

On the other hand, the position of the reinforcing member may be variously applied to a predetermined position of the inner assembly, but when the TCP is seen as a structure that extends from the PDP panel, the connector 126 which is detachable the end of the extended TCP is provided It is preferable that it is a lower end of the address electrode driver. When the reinforcing member is fastened to the inner assembly, substantial fastening is made with respect to the chassis 123 of the inner assembly.

On the other hand, the heat-dissipating metal thin film of a flexible material can be bonded to either side of the TCP. This means that it is possible to provide a sufficient heat dissipation function on either side of the TCP. According to the present embodiment, the TCP IC can be arranged on any side of the TCP. Thus, a more flexible and reliable TCP can be designed. Accordingly, FIG. 4 shows an example in which a heat-dissipating metal thin film is bonded to the outer side surface of the TCP and the inner side of the TCP is shown in FIGS. 6 and 7, and in FIG. 8, a heat-dissipating metal thin film is bonded to both the inner side and the outer side of the TCP. An example is shown. 8 shows the state after the TCP connection is made to the connector 126.

If the heat dissipating metal thin films are bonded to both sides of the TCP, the heat dissipating metal thin films may have a structure in which they are connected to each other, so that efficient heat dissipation may be achieved. For example, when the width of the heat dissipation metal thin film is larger than the TCP, it is preferable to connect the surfaces of the heat dissipation metal thin films exceeding the width of the TCP. However, when the connection between the heat dissipation metal thin film, it is preferable that the connection is made to allow flow in consideration of the change in the length of each surface generated when the TCP is folded for the connection with the connector.

Hereinafter, look at in more detail with respect to TCP associated with the present invention.

9 is a cross-sectional view illustrating a TCP package for a PDP panel according to the present invention. According to FIG. 9, the TCP package for a PDP panel according to the present embodiment includes a TCP 221, an adhesive layer 230, a heat-dissipating metal thin film 229, and the like. It includes.

The tape carrier package (TCP) is used for a PDP panel, and the heat-dissipating metal thin film is a flexible thermal conductive thin film bonded to the surface of the TCP.

The adhesive layer 230 is an element for bonding the TCP and the heat-dissipating metal thin film, and is generally formed as an adhesive tape. However, the adhesive layer 230 may be formed only of the adhesive layer as described above.

The heat-dissipating metal thin film may be formed in a shape corresponding to that of the concave-convex shape due to the TCP IC mounted on the TCP surface as shown in FIG. 5, or may be formed in a flat plate shape as shown in FIG. 9.

When the heat dissipation metal thin film is formed in the concave-convex shape as shown in FIG. 5, it means that the heat dissipation metal thin film is firmly fixed to a predetermined position of the surface of the TCP. However, when the positions are fixedly bonded to each other in this way, when the TCP can be folded may occur. Also, as the adhesive layer, when the adhesive or the heat radiation tape is disposed on the TCP surface, and then the heat dissipating metal thin film is bonded, when the adhesive or the heat dissipation tape is disposed on the bonding surface of the heat radiation metal thin film, the position is If there is a mistake, it should be removed again and the joining should be carried out according to the irregularities. Even when the correct joining is made, it is obvious that an effort is required to adjust the position at the joining.

Accordingly, when the thickness of the TCP IC 225 mounted on the TCP is thin, as shown in FIG. 10, the heat-dissipating metal thin film is formed in a flat plate shape, and the adhesive layer is thicker to easily fold the TCP, It may facilitate the bonding between the TCP and the heat dissipating metal thin film. Since the pressure-sensitive adhesive layer is thermally conductive as described above, no problem is caused even in heat dissipation.

As described above, the heat-dissipating metal thin film having an uneven shape or a flat shape is advantageously larger than the width of the TCP, and in some cases, may be bonded to both sides of the TCP. In case of bonding on both sides of TCP, it is the case that you want to derive more heat dissipation effect or when TCP IC is mounted on both sides of TCP. It can be maximized further. However, when the front and rear heat dissipation metal thin films are connected, there is a possibility that assembly problems may occur, so that the connection between the heat dissipation metal thin films is preferably made flexible. For example, as shown in FIG. 11 and a side view of FIG. 12, a flexible property can be maintained by forming a guide 229a for cutting a heat radiation metal thin film on one surface and bonding the heat radiation metal thin film on the other surface. In this case, the heat radiation plate shape having a two-layer structure in which an internal air flow path is formed is also expected to improve heat radiation performance.

On the other hand, while the technical spirit of the present invention has been described in detail according to the above preferred embodiment, it should be noted that the above embodiment is for the purpose of description and not for the limitation. In addition, those skilled in the art will understand that various embodiments are possible within the scope of the technical idea of the present invention. For example, the adhesive layer may be formed of one or more adhesive layers, and may be mixed with an adhesive polymer resin such as acrylic, urethane, graphite, aluminum, and the like, and a thermally conductive filler. It can comprise with the heat conductive pressure sensitive adhesive tape hardened | cured by the.

1 is a cross-sectional view showing the inside of a PDP display according to an embodiment of the present invention.

2 is a perspective view showing the inside of a PDP display according to an embodiment of the present invention;

Figure 3 is a plan view showing the inner assembly of the PDP display according to an embodiment of the present invention from the top.

4 is a perspective view showing a part of a PDP display according to an embodiment of the present invention.

5 is a diagram illustrating a TCP structure of a PDP display according to an embodiment of the present invention.

6 is a perspective view of a portion of a PDP display in accordance with another embodiment of the present invention.

7 is a perspective view of a portion of a PDP display in accordance with another embodiment of the present invention.

8 is a perspective view showing a portion of a PDP display according to another embodiment of the present invention.

9 is a view showing a laminated structure of a TCP package for a PDP panel according to an embodiment of the present invention.

Fig. 10 is a diagram showing the stacking structure of a TCP package for a PDP panel according to another embodiment of the present invention.

11 and 12 are a perspective view and a side view showing a state in which a heat radiation metal thin film formed on both sides in accordance with another embodiment of the present invention.

* Description of the symbols for the main parts of the drawings *

110 ... PDP panel 120 ... inner assembly

121, 221 ... TCP 123 ... Chassis

125, 225 ... TCP IC 129, 229 ... heat-resistant metal thin film

122 ... address electrode drive 124 ... reinforcement member

126 ... connector

Claims (18)

A PDP panel having an address electrode; An inner assembly bonded to the PDP panel to drive and control the PDP panel; A plurality of TCPs (Tape Carrier Package) which connects the PDP panel and the internal assembly to transmit signals related to the driving and control; And A heat-dissipating metal thin film of a flexible material bonded to the surface of the TCP PDP display comprising a. The method of claim 1, And said TCP connects an address electrode of said PDP panel with an address electrode driver of said internal assembly for generating an electrical signal for driving said address electrode. The method of claim 1, The material of the heat dissipating metal thin film includes at least one of aluminum, iron, copper. The method of claim 1, Bonding of the heat dissipation metal thin film and the TCP is performed by a heat dissipation tape. The method of claim 1, The heat dissipation metal thin film has a concave-convex cross section, and the concave-convex cross section corresponds to the concave-convex shape of the TCP surface to which the heat dissipation metal thin film is bonded. The method of claim 5, The TCP includes an integrated circuit (IC), and the uneven surface of the TCP surface is formed by the IC. The method of claim 1, The plurality of heat dissipating metal thin films are formed in a continuous form on the same line when the TCP is disposed on the same line of the TCP panel. The method of claim 1, The heat dissipation metal thin film is a PDP display formed separately for each of the TCP. The method of claim 8, The width of the heat-dissipating metal thin film is larger than the width of the TCP PDP display. The method of claim 1, The heat dissipation metal thin film is a PDP display bonded to both sides of the TCP. The method of claim 10, The heat dissipation metal thin film bonded to both sides of the TCP is a structure that is connected to each other PDP display. The method of claim 1, The heat dissipation metal thin film has a structure extending from the reinforcing member additionally fastened to the inner assembly. TCP (Tape Carrier Package) used for PDP panels; A heat dissipating metal thin film made of a flexible material bonded to the surface of the TCP; And A thermally conductive adhesive layer for bonding the TCP and the heat-dissipating metal thin film TCP package for the PDP panel containing. The method of claim 13, The heat dissipation metal thin film has a concave-convex cross section, and the concave-convex cross section corresponds to the concave-convex shape of the TCP surface to which the heat dissipation metal thin film is bonded. The method of claim 13, The width of the heat-dissipating metal thin film TCP package for a PDP panel larger than the width of the TCP. The method of claim 13, The heat dissipation metal thin film is a TCP package for a PDP panel bonded to both sides of the TCP. The method of claim 16, The heat dissipation metal thin film bonded to both sides of the TCP is a TCP package for a PDP panel that is connected to each other structure. The method of claim 13, The TCP includes a TCP IC which is an IC mounted on the TCP, and the surface of the TCP to which the heat-dissipating metal thin film is bonded is a surface on which the TCP IC is mounted.

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