KR20100054623A - Molding compound discharge device - Google Patents

Molding compound discharge device Download PDF

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Publication number
KR20100054623A
KR20100054623A KR20080113608A KR20080113608A KR20100054623A KR 20100054623 A KR20100054623 A KR 20100054623A KR 20080113608 A KR20080113608 A KR 20080113608A KR 20080113608 A KR20080113608 A KR 20080113608A KR 20100054623 A KR20100054623 A KR 20100054623A
Authority
KR
South Korea
Prior art keywords
encapsulant
nozzle
image data
unit
camera
Prior art date
Application number
KR20080113608A
Other languages
Korean (ko)
Inventor
고종만
Original Assignee
삼성엘이디 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성엘이디 주식회사 filed Critical 삼성엘이디 주식회사
Priority to KR20080113608A priority Critical patent/KR20100054623A/en
Publication of KR20100054623A publication Critical patent/KR20100054623A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Abstract

The present invention relates to an encapsulant discharge device, comprising: a transfer table for moving an LED package having a cavity in which an LED chip is mounted; An encapsulant supply source provided on the transfer table and provided with a nozzle for discharging an encapsulant in the cavity; A camera provided at an outer side of the feeder to obtain an image of the nozzle and provide image data; A central processing unit for storing and managing image data of a nozzle obtained from the camera; Receiving and displaying image data of the nozzle from the CPU

A display unit; And a control unit which receives the image data of the nozzle from the central processing unit and controls the encapsulant supply source.

LED Package, Encapsulant, Discharge Device, Dispenser

Description

Sealing compound discharge device

The present invention relates to an encapsulant discharging apparatus, and more particularly, an encapsulant discharging apparatus for inspecting a state in which the encapsulant is discharged from a nozzle of an encapsulant supply source in a process of discharging the encapsulant in a cavity in which an LED chip is mounted using a camera. It is about.

In general, a light emitting diode, that is, a light emitting diode (LED), is a semiconductor light emitting device that emits light when a current flows, and converts electrical energy into light energy using a PN junction diode composed of GaAs and GaN optical semiconductors.

The area of light emitted from these LEDs ranges from red (630 nm to 700 nm) to blue-violet (400 nm), including blue, green, and white, and the LEDs have low power consumption and high efficiency compared to conventional light sources such as incandescent lamps and fluorescent lamps. Demand for LED package is continuously increasing due to its long operating life.

In particular, the LED package is gradually expanding its application range from the small light of the mobile terminal to the backlight for indoor and outdoor general lighting, automotive lighting, and large liquid crystal display (LCD).

Referring to the general manufacturing process of the LED package, the lead frame is accommodated inside, a package body having an encapsulant discharge space is formed in the center, and the LED chip is mounted on the lead frame located inside the package body. Next, a wire is connected to the LED chip and the lead frame to conduct electricity, and an encapsulant is applied to an encapsulant discharge space of the package body. The lens is then combined onto the package body to complete it.

Here, the encapsulant is composed of a light-transmissive resin excellent in light transmittance, and serves to protect the LED chip and the wire, and is applied to the encapsulant discharge space by a dispensing method using a nozzle. However, during the encapsulant coating process, if the nozzle contacts the LED chip or wire mounted in the encapsulant discharge space or if the amount and shape of the encapsulant applied from the nozzle are not constant, it may cause a defect to improve reliability of the LED package. There was a problem of deterioration.

Accordingly, the present invention is to solve the problems and problems associated with the conventional encapsulant discharge device, the camera is a state in which the encapsulant is discharged from the nozzle of the encapsulant source in the process of discharging the encapsulant in the cavity in which the LED chip is mounted It is an object of the present invention to provide an encapsulant discharging device that reduces the defective rate of the LED package by inspecting and controlling the same.

The present invention for achieving the above object is a transfer table for moving the LED package having a cavity in which the LED chip is mounted; An encapsulant supply source provided on the transfer table and provided with a nozzle for discharging an encapsulant in the cavity; A camera provided at an outer side of the feeder to obtain an image of the nozzle and provide image data; A central processing unit for storing and managing image data of a nozzle obtained from the camera; A display unit which receives and displays the image data of the nozzle from the central processing unit; and a control unit that receives the image data of the nozzle from the central processing unit and controls the encapsulant supply source. Provided.

The camera may capture the position of the nozzle and the shape of the encapsulant discharged from the nozzle.

In this case, the camera comprises a lens for forming an image of the nozzle; And an image sensor which acquires an image of the nozzle formed by the lens and converts the image into image data.

The CPU may include an input unit configured to receive image data of the nozzle obtained from the camera; A memory unit for storing image data of the nozzle received from the input unit; And a transmission unit converting image data of the nozzle stored in the memory unit into an electrical signal and transmitting the electrical signal to the display unit and the control unit.

In addition, the encapsulant source may discharge the encapsulant in an air compression or plunge manner.

In addition, the control unit compares the image data of the nozzle transmitted from the central processing unit with the image data indicating a state in which the sealing agent is normally discharged from the nozzle, the discharge state for determining whether the discharge state of the sealing agent of the nozzle is normal Determination unit; And an operation stopper for stopping the operation of the encapsulant supply source when the encapsulant discharge state of the nozzle is not normal by the discharge state determination unit.

As described above, the encapsulant discharging apparatus according to the present invention uses the camera to inspect and control the state in which the encapsulant is discharged from the nozzle of the encapsulant supply source in the process of discharging the encapsulant in the cavity in which the LED chip is mounted. There is an advantage to improve the productivity by reducing the defective rate of the LED package.

Therefore, there is an effect of ensuring the reliability and stability of the LED package.

Matters relating to the operational effects including the technical configuration of the encapsulant discharge device according to the present invention will be clearly understood by the following detailed description with reference to the drawings in which preferred embodiments of the present invention are shown.

1 to 3 will be described in detail with respect to the encapsulant discharge device according to an embodiment of the present invention.

1 is a block diagram of an encapsulant discharge device according to an embodiment of the present invention, Figure 2 is a block diagram of a central processing unit according to an embodiment of the present invention, Figure 3 is a control according to an embodiment of the present invention A schematic diagram of the unit.

1 to 3, the encapsulant discharging device 100 according to the exemplary embodiment of the present invention is largely on the transport table 110 and the transport table 110 for moving the LED package 120. And an encapsulant supply source 130 including a nozzle 133 for discharging the encapsulant, a camera 140 for photographing the nozzle 133, a central processing unit 150, a display unit 160, and a control unit. It comprises 170.

The LED package 120 accommodates a part of a pair of lead frames (not shown) inside, a package body 121 having a cavity 123, and an LED chip mounted on a lead frame in the cavity 123. And a wire 127 for electrical connection between the LED chip 125 and the lead frame.

Here, the LED chip 125 is a conventional LED chip is applied, preferably a GaN-based LED chip is used.

The encapsulant protecting the LED chip 125 and the wire 127 is coated in the cavity 123. At this time, the encapsulating agent is preferably made of any one selected from the group consisting of a transparent epoxy, silicone and phosphor mixture. In addition, the encapsulant is applied to a predetermined height of the cavity 123, so that the LED chip 125 and the wire 127 mounted in the cavity 123 may be embedded, the LED chip 125 And it is preferable to apply at a height thicker than the height of the wire 127.

The carriage 110 serves to constantly move the LED package 120 placed on the upper surface at a set speed, and the carriage 110 is in the cavity 123 of the LED package 120. The source of the encapsulant stops at a position corresponding to the position so that the encapsulant is applied, and is set to operate intermittently when the encapsulant application is completed in the cavity 123.

The encapsulant supply source 130 is provided with a nozzle for discharging the encapsulant at a lower portion thereof, and serves to discharge the encapsulant on the conveyer 110 in an air compression or plunge manner. The air compression type refers to a method of discharging the extruded air controlled by the pressure to the encapsulant, the plunge method is to discharge the encapsulant using a drive source such as a pump.

At this time, the encapsulant supply source 130 is operated according to an encapsulant ejection condition such as a predetermined discharge amount or time of the encapsulant, and between the nozzle 133 of the encapsulant supply source 130 and the cavity 123. The distance of is preferably maintained at about 400 μm.

The camera 140 is located at one side or the other side of the transfer table 110, the position of the nozzle 133 of the encapsulant supply source 130 and the size and shape of the encapsulant discharged from the nozzle 133 Obtain an image for and provide image data. That is, the camera 140 monitors the overall state of the sealing agent discharged from the nozzle 133 of the encapsulant supply source 130 in real time.

The camera 140 includes a lens 143, a detection sensor 145, and an image sensor 147. The lens 143 forms an image of the nozzle 133 and transfers the image of the formed nozzle 133 to the image sensor 147, and the lens 143 is provided from the nozzle 133. A sensing sensor 145 may be further provided to optically detect the discharge of the encapsulant and operate the image sensor 147. The image sensor 147 converts an image of the nozzle 133 formed by the lens 143 into image data. The image data is digitized and transferred to the central processing unit 150. It is imaged by the central processing unit 150.

The central processing unit 150 is connected to the camera 140 by a cable to store and manage the image data of the nozzle 133. As shown in FIG. 2, the CPU 150 may include an input unit 153 for receiving image data of the nozzle 133 obtained from the camera 140 and the input unit 153. The display unit 160 and the control unit 170 convert the image data of the nozzle 133 storing the image data of the nozzle 133 and the image data of the nozzle 133 stored in the memory 155 into electrical signals. It comprises a transmission unit 157 for transmitting to.

The display unit 160 has a graphic processing function of receiving and displaying image data of the nozzle 133 from the transmission unit 157 of the central processing unit 150, and discharging the encapsulant of the nozzle 133. Status images can be displayed in real time. In this case, the display device of the display unit 160 includes a monitor connected to the CPU 150.

The control unit 170 receives the image data of the nozzle 133 from the transmission unit 157 of the central processing unit 150 and controls the supply source 130 of the encapsulant. As shown in FIG. 3, the control unit 170 includes a discharge state determination unit 173 and an operation stop unit 175. The discharge state determination unit 173 compares the image data of the nozzle 133 transmitted from the CPU 150 with the image data indicating a state in which the encapsulant is normally discharged from the nozzle 133. It is determined whether the discharge state of the encapsulant 133 is normal. The operation stopper 175 stops the operation of the encapsulant supply source 130 when the discharging state of the encapsulant discharge of the nozzle 133 is not normal by the discharging state determination unit 173. As such, when the operation of the encapsulant supply source 130 is stopped by the operation stopper 175, the encapsulant supply condition of the encapsulant supply source 130 is reset, and then the encapsulant supply source 130 is operated again. Let's do it.

As described above, the encapsulant discharging device 100 according to the present invention discharges the encapsulant from the nozzle 133 of the encapsulant supply source 130 in the process of discharging the encapsulant in the cavity 123 in which the LED chip 125 is mounted. By inspecting and controlling the state by using the camera 140, the defective rate of the LED package 120 may be reduced and productivity may be improved to secure reliability and stability of the LED package 120.

Although the preferred embodiments of the present invention described above have been described in detail, those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom.

Accordingly, the scope of the present invention is not limited to the disclosed embodiments, but various modifications and improvements of those skilled in the art using the basic concepts of the present invention defined in the following claims should also be considered as belonging to the scope of the present invention. .

1 is a block diagram of an encapsulant discharge device according to an embodiment of the present invention.

2 is a block diagram of a central processing unit according to an embodiment of the present invention.

3 is a block diagram of a control unit according to an embodiment of the present invention.

<Explanation of Signs of Major Parts of Drawings>

100: sealing agent discharge device 110: transfer table

120: LED package 121: package body

123: cavity 125: LED chip

127 wire 130 source of encapsulant

133: nozzle 140: camera

143: lens 145: detection sensor

147: image sensor 150: central processing unit

153: input unit 155: memory unit

157: transmission unit 160: display unit

170: control unit

Claims (6)

A carriage for moving the LED package having a cavity in which the LED chip is mounted; An encapsulant supply source provided on the transfer table and provided with a nozzle for discharging an encapsulant in the cavity; A camera provided outside of the transfer table to acquire an image of the nozzle and provide image data; A central processing unit for storing and managing image data of a nozzle obtained from the camera; A display unit for receiving and displaying image data of the nozzle from the central processing unit; And A control unit which receives the image data of the nozzle from the central processing unit and controls the encapsulant supply source; Encapsulant discharge device comprising a. The method of claim 1, And the camera captures the position of the nozzle and the shape of the encapsulant discharged from the nozzle. The method of claim 1, The camera A lens for forming an image of the nozzle; And An image sensor which acquires an image of the nozzle formed by the lens and converts the image into image data; Encapsulant discharge device comprising a. The method of claim 1, The central processing unit An input unit configured to receive image data of the nozzle obtained from the camera; A memory unit for storing image data of the nozzle received from the input unit; And A transmission unit converting image data of the nozzle stored in the memory unit into an electrical signal and transmitting the electrical signal to the display unit and the control unit; Encapsulant discharge device comprising a. The method of claim 1, And the encapsulant supply source discharges the encapsulant in an air compression or plunge manner. The method of claim 1, The control unit A discharge state determination unit which compares the image data of the nozzle transmitted from the central processing unit with the image data indicating a state in which the encapsulant is normally discharged from the nozzle, and determines whether the discharge state of the encapsulant of the nozzle is normal; And An operation stop unit for stopping the operation of the encapsulant supply source when the encapsulant discharge state of the nozzle is not normal by the discharge state determination unit; Encapsulant discharge device comprising a.
KR20080113608A 2008-11-14 2008-11-14 Molding compound discharge device KR20100054623A (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150006781A (en) * 2013-07-09 2015-01-19 도쿄엘렉트론가부시키가이샤 Substrate processing system, method for controlling substrate processing system, and storage medium
KR101642463B1 (en) * 2015-08-17 2016-07-25 주식회사 엠에스비전 Device for verifying normal operation of moving nozzle in semiconductor producing process
US9433970B2 (en) 2012-08-06 2016-09-06 Samsung Display Co., Ltd. Reinforcement liquid jet device and method of manufacturing display panel
US10302412B2 (en) 2016-03-11 2019-05-28 Samsung Electronics Co., Ltd. Testing apparatus and manufacturing apparatus for testing light emitting device package
WO2024054070A1 (en) * 2022-09-08 2024-03-14 주식회사 레신저스 Apparatus and method for manufacturing optical wire

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9433970B2 (en) 2012-08-06 2016-09-06 Samsung Display Co., Ltd. Reinforcement liquid jet device and method of manufacturing display panel
KR20150006781A (en) * 2013-07-09 2015-01-19 도쿄엘렉트론가부시키가이샤 Substrate processing system, method for controlling substrate processing system, and storage medium
KR101642463B1 (en) * 2015-08-17 2016-07-25 주식회사 엠에스비전 Device for verifying normal operation of moving nozzle in semiconductor producing process
US10302412B2 (en) 2016-03-11 2019-05-28 Samsung Electronics Co., Ltd. Testing apparatus and manufacturing apparatus for testing light emitting device package
WO2024054070A1 (en) * 2022-09-08 2024-03-14 주식회사 레신저스 Apparatus and method for manufacturing optical wire

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