KR20100046980A - Probe card - Google Patents

Abstract

PURPOSE: A probe card is provided to control the number of semiconductors to be inspected through one inspection process in response to the variation of the number of semiconductor devices formed on a wafer. CONSTITUTION: A printed circuit board(200) comprises a circuit pattern. A space transformer(300) comprises a first pad and a second pad. The first and second pads perform pitch transformation. A probe unit(400) comprises a plurality of probes and a probe block. The plurality of probes are mounted on the probe block. The probe block unit forms a receiving space of the probe unit. An interposer unit of one probe is opposite to the end of the second support unit. The interposer unit of another probe is opposite to the space between the body unit and the second support unit.

Description

Probe Card {PROBE CARD}

The present invention relates to a probe card, and more particularly, to a probe card capable of inspecting various types of inspected objects.

In general, semiconductor devices have a fabrication process of forming contact pads for circuit patterns and inspections on a wafer, and an assembly process of assembling wafers having circuit patterns and contact pads into respective semiconductor chips. It is manufactured through.

Between the fabrication process and the assembly process, an inspection process is performed in which an electrical signal is applied to the contact pads formed on the wafer to inspect the electrical properties of the wafer.

This inspection process is performed to inspect a defect of a wafer and to remove a portion of a wafer in which a defect occurs during an assembly process.

In the inspection process, inspection equipment called a tester for applying an electrical signal to a wafer and probe equipment for performing an interface function between the wafer and the tester are mainly used. Among them, the probe card includes a printed circuit board that receives an electrical signal applied from a tester and a plurality of probes in contact with contact pads formed on the wafer.

In recent years, as the demand for high integrated semiconductor chips increases, the circuit patterns formed on the wafer by the fabrication process become high integrated, whereby the spacing between neighboring contact pads, i.e., the pitch, is formed very narrowly. It is becoming.

In order to inspect such fine pitch contact pads, the probe of the probe card is also formed at a fine pitch, thus compensating the difference between the terminal spacing and the probe spacing on the printed circuit board between the printed circuit board and the probe. Space transformers are being used.

1 is a cross-sectional view of a conventional probe card with a space transducer.

As shown in FIG. 1, a conventional probe card 10 includes a printed circuit board 11, an interposer 12, a space converter 13, and a probe 14.

The printed circuit board 11 includes a probe circuit pattern formed for an inspection process, and performs a function of receiving an electric signal applied from a tester (not shown) and transferring it to the probe 14.

The interposer 12 is connected to the probe circuit pattern of the printed circuit board 11 to electrically connect the printed circuit board 11 and the probe 14.

The space transducer 13 has a smaller spacing (pitch) between the first pads 13a formed on the lower surface than the spacing (pitch) between the second pads 13b formed on the upper surface, thereby performing a function of pitch conversion.

In addition, the space converter 13 is formed of a multi-layer ceramic (MLC) substrate, and transmits an electrical signal received from the printed circuit board 11 to the probe 14 by a conductive layer formed therein. .

Such a multilayer ceramic substrate is manufactured by alternately forming a conductive layer and an insulating layer in an insulating substrate several times.

The conventional probe card 10 has a problem that the manufacturing cost of the probe card 10 increases because the space converter 13 is made of an expensive multilayer ceramic substrate.

In addition, the conventional probe card 10 can simply inspect one type of object under test, and there is a problem in that the entire form of the probe card 10 needs to be reconfigured in order to test various types of object.

In addition, the conventional probe card 10 may inspect only the number of semiconductor devices set in one inspection process on a wafer on which a plurality of semiconductor devices are formed, and inspect one time in response to a change in the number of semiconductor devices formed on the wafer. Since the number of semiconductors that can be inspected by the process cannot be adjusted, the number of inspection processes increases as the number of semiconductor devices formed on the wafer increases.

One embodiment of the present invention is to provide a probe card capable of inspecting various types of inspected objects.

Another object of the present invention is to provide a probe card that can adjust the number of semiconductors that can be inspected in one inspection process in response to a change in the number of semiconductor devices formed on a wafer.

As a technical means for achieving the above-described technical problem, the first aspect of the present invention is a probe card for inspecting a test object, a printed circuit board on which a circuit pattern is formed, a first pad and a second pad for pitch conversion And a probe unit including a space transducer in which a probe is formed, a plurality of probes in contact with the test object, and a probe block in which the plurality of probes are mounted, and a probe block unit in which a seating space in which the probe unit is mounted is formed. And a plurality of the probes of the probe unit, wherein the interposer portion of the probe of any one of the plurality of probes faces the end of the second support portion, wherein the probe of the other one of the plurality of probes The interposer portion is opposed to between the body portion and the second support portion. It provides a probe card.

The probe may include a body part extending in one direction, a first support part bent from a portion of the body part, a beam part spaced apart from the first support part and extending from one end of the body part, and an end portion of the beam part. A tip portion extending from the other portion, a second support portion bent from the other portion of the body portion to face the first support portion, an elastic portion bent and extended at least once from the second support portion, and opposite the tip portion from an end portion of the elastic portion. It may include an interposer portion that is bent extending in the direction.

The probe block is formed on a block body portion, a lower side of the block body portion, a first slit into which a portion of the first support portion and the beam portion of the probe is inserted, and an upper side of the block body portion. The second support part may include a second slit into which a part of the elastic part is inserted. The probe block may be provided in plural, and the body part of the neighboring probe may be positioned with the neighboring probe block interposed therebetween.

According to one of the problem solving means of the present invention mentioned above, a test subject of various forms can be inspected.

According to another one of the problem solving means of the present invention described above, it is possible to adjust the number of semiconductors that can be inspected in one inspection process corresponding to the change in the number of semiconductor devices formed on the wafer.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. In the drawings, parts irrelevant to the description are omitted in order to clearly describe the present invention, and like reference numerals designate like parts throughout the specification.

Throughout the specification, when a part is "connected" to another part, this includes not only "directly connected" but also "electrically connected" with another element in between. . In addition, when a part is said to "include" a certain component, which means that it may further include other components, except to exclude other components unless otherwise stated.

Hereinafter, a probe block unit and a probe card including the same according to an embodiment of the present invention will be described with reference to FIGS. 2 to 30.

2 is an exploded perspective view of a probe card according to an embodiment of the present invention, Figure 3 is a bottom view of the probe card according to an embodiment of the present invention, Figure 4 is a probe card according to an embodiment of the present invention It is a cross section.

2 to 4, the probe card 1000 according to an embodiment of the present invention may include a reinforcement plate 100, a printed circuit board 200, a space converter 300, a probe unit 400, and And a probe block unit 500.

5 is a perspective view of a reinforcing plate according to an embodiment of the present invention.

As shown in FIG. 5, the reinforcing plate 100 is positioned on the printed circuit board 200, and serves to protect the printed circuit board 200 from external shocks and the like.

The reinforcement plate 100 includes a plurality of screw holes 110 into which fixing screws are inserted, and the fixing screws inserted into the screw holes 110 include the reinforcing plate 100, the printed circuit board 200, and the probe block unit ( 500) to each other.

6 is a plan view of a printed circuit board according to an embodiment of the present invention.

As shown in FIG. 6, the printed circuit board 200 is formed in a substantially disk shape and has an upper surface and a lower surface opposing the upper surface. Probe circuit pads (not shown) for the inspection process are formed on the upper surface.

The printed circuit board 200 includes a substrate through hole 210, a plurality of screw holes 220, and a plurality of reference pin holes 230.

The substrate through hole 210 is formed through the printed circuit board 200 in the central region of the printed circuit board 200, and a part of the probe block unit 500 is inserted into and supported in the substrate through hole 210.

The screw hole 220 is formed by penetrating the printed circuit board 200 in the outer region of the substrate through-hole 210, the screw hole 220 for fixing the reinforcement plate 100 and the probe block unit 400 The fixing screw is inserted.

The reference pin hole 230 is formed through the printed circuit board 200 at a predetermined position on the printed circuit board 200, and the reference pin hole 230 is formed when the printed circuit board 200 is coupled with the space converter 300. It is a standard.

7 is an enlarged perspective view of a space converter according to an embodiment of the present invention, FIG. 8 is a rear view of the space converter according to an embodiment of the present invention, FIG. 9 is an enlarged perspective view of part A of FIG. 8, and FIG. 10 is a moving cross section along XX of FIG. 9.

As shown in FIGS. 7 to 10, the space converter 300 includes a main body 310, a plurality of first pads 320, a plurality of second pads 330, a plurality of conversion connectors 340, and one. The alignment unit 350, the connection unit 360, and the insulating layer 370 are included.

The main body 310 has a transparent plate shape and has an upper surface and a lower surface opposing the upper surface. The first pad 320 and the second pad 330 are formed on the lower surface of the main body 310.

The first pad 320 is formed in a central area on the bottom surface of the main body 310 and serves to contact the interposer parts 417 and 427 of the probes 410 and 420.

The second pad 330 is positioned at an outer region on the bottom surface of the main body 310 facing the first pad 320 and serves to contact the connection part 360.

The conversion connector 340 for connecting between the first pad 320 and the second pad 330 is connected. In this case, an interval between the plurality of neighboring first pads 320 is smaller than an interval between the plurality of neighboring second pads 330. In addition, a plurality of alignment units 350 are formed at a predetermined position on the lower surface of the main body 310 to align with the probe block unit 500.

The connection part 360 connects between the first pad 320 on the space converter 300 and a circuit pad (not shown) formed on the printed circuit board 200. The connection unit 360 may be implemented as a flexible printed circuit board (FPCB).

The insulating layer 370 is positioned on the main body part with the conversion connector 340 interposed therebetween, and has an opening 371 exposing the first pad 320 and the second pad 330. The insulating layer 370 covers the conversion connector 340, and serves to prevent the inflow of interference materials such as particles, which may be introduced from the outside and may cause a short circuit between neighboring conversion connectors 340. In addition, the insulating layer 370 is positioned between the neighboring conversion connectors 340, and the neighboring conversion by an electrical signal passing through the conversion connection unit 340 of the spatial transducer 300 during the inspection process of the probe card for the object under test. It serves to suppress the signal failure between the connection portion 340.

11 is a flowchart illustrating a method of manufacturing a space converter according to an embodiment of the present invention, and FIGS. 12 to 16 are views illustrating a method of manufacturing a space converter according to an embodiment of the present invention.

First, the main body 610 is provided (S100).

Next, the conductive layer 620 is formed on the main body 610 (S110), and then the first photoresist layer 630 is formed on the conductive layer 620 (S120).

Specifically, as shown in FIG. 12, the conductive layer 620 including gold (Au) is formed on the main body 610 using a sputtering process or the like, followed by a spin coating process or coating. When the light is received on the conductive layer 620 using a process or the like, a first photoresist layer 630 made of a positive photoresist material that is soluble in a developer during the development process is formed.

Next, as shown in FIG. 13, the first photoresist layer 630 is exposed and developed to form the first pad 320, the second pad 330, and the conversion connector 340 on the conductive layer 620. In operation S130, a first photoresist pattern 640 having an image corresponding thereto is formed.

Next, as illustrated in FIG. 14, the first layer 320, the second pad 330, and the conversion connector 340 are etched after the conductive layer 620 is etched using the mask of the first photoresist pattern 640. ) Is formed (S140).

Next, an alignment part 350 is formed on one surface of the main body part 610 to align with the probe block unit 500 (S150).

Next, as shown in FIGS. 15 and 16, the first photoresist pattern 640 is removed (S160), and then the first pad 320, the second pad 330, and the conversion connector 340 are interposed therebetween. In operation S170, the second photoresist layer 660 is formed on the main body 610.

Finally, the second photoresist layer 660 is exposed and etched to form an insulating layer 370 having an opening that exposes the first pad 320 and the second pad 330 (S180).

Through the above process, the space converter 300 having the first pad 320, the second pad 330, the conversion connector 340, the alignment unit 350, and the insulating layer 370 is manufactured.

17 is an enlarged perspective view illustrating some probes of a plurality of probes according to an exemplary embodiment of the present invention.

As shown in FIG. 17, the first probe 410 and the second probe 420 may include body parts 411 and 421, first support parts 412 and 422, beam parts 413 and 423, tip parts 414 and 424, and second support parts 415 and 425. ), Elastic parts 416 and 426, interposer parts 417 and 427, and elastic alignment parts 418 and 428, respectively.

The body parts 411 and 421 have a bar shape and extend in one direction.

The first supports 412 and 422 extend from one portion of the body portions 412 and 421 and include first elastic regions 412a and 422a between the body portions 412 and 421. The first elastic regions 412a and 422a allow the first support portions 412 and 422 to elastically respond when the first supports 412 and 422 are inserted into the first slits 433 formed in the probe block 430.

The beam parts 413 and 423 are bent and extended from one end of the body parts 411 and 421 spaced apart from the first support parts 412 and 422.

The tip portions 414 and 424 extend from the ends of the beam portions 413 and 423 and serve to contact the contact pads formed on the wafer during the inspection process.

The second supporting portions 415 and 425 are bent and extended from the other portions of the body portions 411 and 421 to face the first supporting portions 412 and 422, and the second elastic regions 415a and 425a and the first supporting portions 411 and 421 are disposed therebetween. Three elastic regions 415b and 425b. These second elastic regions 415a and 425a and the third elastic regions 415b and 425b may elastically correspond when the second support portions 415 and 425 are inserted into the second slits 434 formed in the probe block 430. It becomes possible.

The elastic parts 416 and 426 are respectively bent and extended from the second support parts 415 and 425, wherein the elastic parts 416 of the first probe 410 are bent and extended twice from the ends of the second support parts 415. The elastic part 426 of the second probe 420 extends bent between the body part 421 and the second support part 425.

The interposer portions 417 and 427 extend from the ends of the elastic portions 416 and 426 in the opposite directions from the tips 414 and 424, and contact the first pad 320 of the space transducer 300.

The elastic alignment parts 418 and 428 protrude in one direction from the body parts 411 and 421, and are inserted into the insertion part 435 of the probe block 430 to connect the first and second probes 410 and 420 to the probe block 430. Fix it.

In the above-described configuration, the first probe 410 and the second probe 420 are mounted adjacent to each other on the probe block 430, whereby each intercom of the first probe 410 and the second probe 420 is located. The fuzzers 417 and 427 are positioned to be offset from each other on the probe block 430. As such, when the distance between the neighboring interposer portions 417 and 427 increases, the interposer portions 417 and 427 may be generated by an electrical signal transmitted from the tester to each of the interposer portions 417 and 427 during the inspection process. Mutual interference by electromagnetic waves can be suppressed.

18 is a perspective view of a probe block according to an embodiment of the present invention, FIG. 19 is an exploded perspective view of a probe block equipped with a probe according to an embodiment of the present invention, and FIG. 20 is a view along XX-XX of FIG. 19. 21 is a cross-sectional view of a bottom surface of a probe block mounted with a probe according to an embodiment of the present invention.

As shown in FIG. 18, the probe block 430 includes a block body 431, a first slit 432, a second slit 433, a probe seat 434, and an insertion part 435. do.

The block main body portion 431 has a rod shape and extends in one direction. The first body slit 432 and the second slit 433 are formed in the block main body 431.

The first slit 432 is formed below the block main body 431, and the first supporting parts 412 and 422 of the probes 410 and 420 are inserted therein.

The second slit 433 is formed above the block main body 431, and the second supporting parts 415 and 425 of the respective probes 410 and 420 are inserted therein.

The pro seating portion 434 is positioned between the first slit 432 and the second slit 433 and is recessed from the block main body portion 431. Probe seating portion 434, the body portion (411, 421) of each probe (410, 420) is seated.

The insertion part 435 is inserted with the elastic alignment parts 418 and 428 of each probe 410 and 420 at a predetermined position on the probe seating part 434. A plurality of such insertion portions 435 are formed corresponding to the elastic alignment portions 418 and 428 of the probes 410 and 420.

As shown in FIG. 19, the probe block 430 may include a first sub probe block 430a, a second sub probe block 430b facing the first sub probe block 430a, and a second sub probe block 430b. The third sub probe block 430c is spaced apart from the second sub probe block 430b.

The first probe 410 and the second probe 420 are mounted adjacent to each other in the first sub probe block 430a, the second sub probe block 430b, and the third sub probe block 430c.

As shown in FIG. 20, the first probe 410 and the second probe 420 are mounted adjacent to each other in the probe block 430.

Specifically, the body portion 411 of the first probe 410 is seated on the probe seating portion 432 of the probe block 430, the elastic alignment portion 418 of the first probe 410 is the probe block 430 It is inserted into the insertion part 435 of (). The first support part 412 and the beam part 413 of the probe 410 are inserted into the first slit 433 of the probe block 430, and the tip part 414 is exposed to the outside of the first slit 433. have.

The second support part 415 and the elastic part 416 of the first probe 410 are inserted into the second slit 432 of the probe block 430, and the interposer part 417 of the probe block 430 Exposed to the outside of the second slit 432.

Also, like the first probe 410, the second probe 420 is also mounted to the probe block 430, and the interposer portion 427 of the second probe 420 is the second slit of the probe block 430. Exposed to the outside of 432.

In this case, the interposers 417 and 427 of the first probe 410 and the second probe 420 which are adjacent to each other are disposed to be offset from each other on the probe block 430.

In addition, the inside of the main body 431 of the probe block 430 is filled with epoxy 436 having a small thermal change even at a high temperature to prevent damage to each probe 410 and 420 seated on the probe block 430. can do.

As shown in FIG. 21, the probes 410 and 420 mounted on the first sub probe block 430a and the probes exposed on the second sub probe block 430b facing the first sub probe block 430a. Each tip portion 414, 424 of 410, 420 is alternately arranged with each other. As described above, the tip portions 414 and 424 exposed on the first sub probe block 430a and the second sub probe block 430b are densely arranged to easily correspond to the fine pitch interval formed on the wafer.

22 is an exploded perspective view of a probe block unit according to an embodiment of the present invention, FIG. 23 is an enlarged perspective view of a first sub probe block in the lower block assembly of FIG. 22, and FIG. 24 is a perspective view of the lower block assembly of FIG. 22. 25 is an enlarged perspective view of the second sub probe block, FIG. 25 is an enlarged perspective view of the third sub probe block in the lower block assembly of FIG. 22, and FIG. 26 is an enlarged perspective view of the fourth sub probe block in the lower block assembly of FIG. 22, and FIG. 27 is an enlarged perspective view of the first sub upper block in the upper block assembly of FIG. 22, FIG. 28 is an enlarged perspective view of the second sub upper block in the upper block assembly of FIG. 22, and FIG. 29 is on the lower block assembly of FIG. 22. It is a top view for demonstrating the mounted probe unit.

As shown in FIG. 22, the probe block unit 500 according to an embodiment of the present invention includes a lower block assembly 510, an alignment block 520, and an upper block assembly 530.

The lower block assembly 510 forms a seating space 511 in which the probe unit 400 is seated, and includes a first sub lower block 512, a second sub lower block 513, and a third sub lower block 514. And a fourth sub lower block 515.

The alignment block 520 is positioned in the seating space 511 formed by the lower block assembly 510, and serves to align the probe unit 400 in the seating space 511.

The alignment block 520 includes a first sub alignment block 521 facing the first side of the probe unit 400 and a second sub alignment block 522 facing the second side of the probe unit 400. . The first sub-alignment block 521 and the second sub-alignment block 522 are capable of sliding movement in the seating space 511, where extension lines in the sliding movement direction cross each other on a plane.

The upper block assembly 530 faces the lower block assembly 510 with the alignment block 520 interposed therebetween, and includes a first sub upper block 531 and a second sub upper block 532.

As shown in FIG. 23, the first sub lower block 512 includes a first seating portion 512a, a first partition 512b, a plurality of screw holes 512c, and a plurality of reference pin holes 512d. .

The probe seat 400 and the second sub-alignment block 522 are seated in the first seating part 512a.

The first partition wall 512b faces the third side surface of the probe unit 400 facing the first side surface of the probe unit 400, and serves to support the third side surface of the probe unit 400.

The screw hole 512c is formed at one side of the first sub lower block 512, and screws for screwing with the third sub lower block 514 are coupled thereto.

The reference pin hole 512d is formed at one side of the first sub lower block 512 and serves to align the alignment when the lower block assembly 510 is assembled.

Similarly, the other side of the first sub lower block 512 may be aligned to align the screw holes (not shown) and the lower block assembly 510 formed to screw the fourth sub lower block 515. A reference pin hole (not shown) is formed.

As shown in FIG. 24, the second sub lower block 513 faces the first sub lower block 512 and penetrates the second seat 513a, the second partition 513b, and one or more first alignments. The hole 513c includes one or more first alignment units 513d, a plurality of screw holes 513e, and a plurality of reference pin holes 513f.

The probe seat 400, the first sub-alignment block 521, and the second sub-alignment block 522 are mounted on the second seating portion 513a.

The second partition wall 513b faces the first side surface of the probe unit 400 with the first sub-alignment block 521 therebetween, and serves to support the first sub-alignment block 521.

The first alignment through hole 513c penetrates through the second partition wall 513b on the second partition wall 513b.

The first alignment unit 513d penetrates through the first alignment through hole 513c and is connected to the first sub alignment block 521, and the probe unit mounted in the seating space 511 of the probe block unit 500 ( It serves to slide the first sub-alignment block 521 toward the first side of the 400.

The screw hole 513e is formed at one side of the second sub lower block 513, and a screw for screwing with the fourth sub lower block 515 is fixed.

The reference pin hole 513f is formed at one side of the second sub lower block 513, and serves to align the alignment when the lower block assembly 510 is assembled.

Similarly, the other side of the second sub lower block 513 may be aligned to align the screw holes (not shown) and the lower block assembly 510 formed to screw the third sub lower block 514. A reference pinhole (not shown) is formed.

As illustrated in FIG. 25, the third sub lower block 514 includes a third partition 514a, a plurality of screw holes 514b, and a plurality of reference pin holes 514c.

The third partition wall 514a faces one end of the first sub lower block 512 and one end of the second sub lower block 513 and faces the second side of the probe unit 400. Facing the fourth side). The third partition 514a serves to support the fourth side surface of the probe unit 400.

The screw hole 514b is formed at a predetermined position of the third sub lower block 514 facing each side of the first sub lower block 512 and the second sub lower block 513, and the first sub lower block 514b. Screws for screwing with 512 and the second sub lower block 513 are respectively coupled.

The reference pin hole 514c is formed on the upper side of the screw hole 514b, and serves to align the alignment when the lower block assembly 510 is assembled.

In addition, a screw hole for screwing the first sub upper block 531 at a predetermined position of the third sub lower block 514 facing the lower surface of the first sub upper block 531 of the upper block assembly 530 ( A reference pin hole 514d is formed to align with the upper block assembly 530 when the 514e and the probe block 500 are assembled.

As shown in FIG. 26, the fourth sub lower block 515 includes a fourth partition 515a, one or more second alignment through holes 515b, and one or more second alignment portions 515c.

The fourth partition 515a faces the third sub lower block 514 with the first sub lower block 512 and the second sub lower block 513 interposed therebetween, and the second sub aligning block 522 interposed therebetween. In this example, the second side of the probe unit 400 is opposed. The fourth partition 515a serves to support the second sub-alignment block 522, and one or more second alignment through holes 515b are formed in the fourth partition 515a.

The second alignment through hole 515b is formed through the fourth partition 515a of the fourth sub lower block 515.

The second alignment unit 515c is connected to the second sub alignment block 522 by passing through the second alignment through hole 515b of the fourth sub lower block 515, and the seating space of the probe block unit 500. The second sub-alignment block 522 is slid toward the second side of the probe unit 400 seated at 511.

The first sub lower block 512 and the second sub lower block at predetermined positions of the fourth sub lower block 515 facing each side of the first sub lower block 512 and the second sub lower block 513. Reference pin holes 514d are formed to align the screw holes 515c and the lower block assembly 510 for screwing with the 513, respectively.

In addition, a screw hole for screwing the first sub upper block 531 at a predetermined position of the fourth sub lower block 515 facing the lower surface of the first sub upper block 531 of the upper block assembly 530 ( 515e) and a reference pin hole 515f for aligning with the upper block assembly 530 when the probe block unit 500 is assembled.

As shown in FIG. 27, the first sub upper block 531 of the upper block assembly 530 includes an insertion portion 531a, a plurality of screw holes 531b, a plurality of reference pin holes 531c, and one or more aligns. A portion 531d is included.

The insertion part 531a is formed through the central area of the first sub upper block 531, and the coupling part 532a of the second sub upper block 532 is inserted.

The screw hole 531b is formed through the first sub upper block 531, and a screw for screwing with the second sub upper block 532 is coupled when the upper block assembly 530 is assembled.

The reference pin hole 531c serves to align the alignment when the upper block assembly 530 of the screw hole 531b is assembled.

The alignment portion 531d is formed at a predetermined position of the first sub upper block 531, and the space converter 300 and the upper block assembly 530 positioned between the upper block assembly 530 and the lower block assembly 510. Aligns with).

As shown in FIG. 28, the second sub upper block 532 of the upper block assembly 530 includes a coupling part 532a and a plurality of screw holes 532b.

The coupling part 532a protrudes downward from the lower surface of the second sub upper block 532 and is inserted into the insertion part 531a of the first sub upper block 531.

The screw hole 532b is formed through the second sub upper block 532, and screws for screwing with the first sub upper block 531 are coupled thereto.

As illustrated in FIG. 29, the probe unit 400 mounted in the seating space 511 formed by the lower block assembly 510 may slide the first sub-alignment block 521 and the second sub-alignment block 522. By exercising, they are aligned in the lower block assembly 510.

30 is a bottom perspective view of a probe block unit according to an embodiment of the present invention.

As shown in FIG. 30, the probe unit 400 is aligned with the seating space 510 of the probe block unit 500 by the first sub alignment block 521 and the second sub alignment block 522. The tips 414 and 424 of each of the probes 410 and 420 exposed to each other are arranged in such a highly compact manner that they can easily correspond to the fine pitch spacing formed on the wafer.

As described above, the probe card according to an embodiment of the present invention can not only inspect various types of inspected objects, but also inspect in one inspection process in response to a change in the number of semiconductor devices formed on the wafer. The number of semiconductors can be adjusted.

The foregoing description of the present invention is intended for illustration, and those skilled in the art can understand that the present invention can be easily modified in other specific forms without changing the technical spirit or essential features of the present invention. There will be. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive. For example, each component described as a single type may be implemented in a distributed manner, and similarly, components described as distributed may be implemented in a combined form.

The scope of the present invention is shown by the following claims rather than the above description, and all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included in the scope of the present invention. do.

1 is a cross-sectional view of a probe card according to the prior art.

2 is an exploded perspective view of a probe card according to an embodiment of the present invention.

3 is a bottom view of a probe card according to an embodiment of the present invention.

4 is a cross-sectional view of a probe card according to an embodiment of the present invention.

5 is a perspective view of a reinforcing plate according to an embodiment of the present invention.

6 is a plan view of a printed circuit board according to an embodiment of the present invention.

7 is an enlarged perspective view of a space converter according to an embodiment of the present invention.

8 is a rear view of a space converter according to an embodiment of the present invention.

9 is an enlarged perspective view of a portion A of FIG. 8.

10 is a cross-sectional view taken along line X-X of FIG. 9.

11 is a flowchart illustrating a method of manufacturing a space converter according to an embodiment of the present invention.

12 to 16 are diagrams for explaining a method of manufacturing a space converter according to an embodiment of the present invention, respectively.

17 is an enlarged perspective view illustrating some probes of a plurality of probes according to an exemplary embodiment of the present invention.

18 is a perspective view of a probe block according to an embodiment of the present invention.

19 is an exploded perspective view of a probe block equipped with a probe according to an embodiment of the present invention.

20 is a cross-sectional view along XX-XX of FIG. 19.

21 is an enlarged perspective view illustrating an enlarged bottom surface of a probe block unit according to an exemplary embodiment of the present invention.

22 is an exploded perspective view of a probe block unit according to an embodiment of the present invention.

FIG. 23 is an enlarged perspective view of the first subprobe block in the lower block assembly of FIG. 22.

FIG. 24 is an enlarged perspective view of the second subprobe block in the lower block assembly of FIG. 22.

FIG. 25 is an enlarged perspective view of a third sub probe block in the lower block assembly of FIG. 22.

FIG. 26 is an enlarged perspective view of a fourth sub probe block in the lower block assembly of FIG. 22.

FIG. 27 is an enlarged perspective view of the first sub upper block in the upper block assembly of FIG. 22.

FIG. 28 is an enlarged perspective view of the second sub upper block in the upper block assembly of FIG. 22.

FIG. 29 is a plan view illustrating a probe unit mounted on a lower block assembly of FIG. 22.

30 is a bottom perspective view of a probe block unit according to an embodiment of the present invention.

Claims (15)

In the probe card for inspecting the subject, A printed circuit board on which a circuit pattern is formed, A spatial transducer having a first pad and a second pad for pitch conversion, A probe unit including a plurality of probes contacting the test object and a probe block on which the plurality of probes are mounted; Probe block unit in which a seating space in which the probe unit is seated is formed ≪ / RTI > The probe unit of the probe unit is a plurality, The interposer portion of any one of the plurality of probes faces the end of the second support portion, And the interposer portion of the other one of the plurality of probes faces between the body portion and the second support portion. The method of claim 1, The probe, Body portion extending in one direction, A first support portion bent from one portion of the body portion, A beam portion that is spaced apart from the first support portion and extends from one end of the body portion, A tip portion extending from the end of the beam portion, A second support portion which is bent from the other portion of the body portion to face the first support portion, An elastic portion that is bent and extended from the second support portion at least once; An interposer portion that is bent from the end of the elastic portion in a direction opposite to the tip portion; Probe card comprising a. The method of claim 2, The probe block, Block body part, A first slit formed under the block body part, into which the first support part and the beam part of the probe are inserted; A second slit formed on an upper side of the block body part, into which the second support part and the elastic part of the probe are inserted; Probe card comprising a. The method of claim 3, wherein The probe block is a plurality, And the body portion of the neighboring probe is positioned with the neighboring probe block therebetween. The method of claim 4, wherein And the first slits of the neighboring probe blocks are interchangeable. The method of claim 1, The space converter, Body, A plurality of first pads formed on a central region of one surface of the main body portion, A plurality of second pads formed on an outer region of the one surface of the body portion; A plurality of conversion connecting parts formed on the one surface of the main body to connect between the first pad and the second pad; Including; And the spacing of the neighboring first pads is narrower than the spacing of the neighboring second pads. The method of claim 6, The space converter, And a connection part connecting the circuit pad formed on the printed circuit board and the first pad. The method of claim 7, wherein The space converter, The probe card is formed on one surface of the main body portion, further comprising a plurality of alignment portions for aligning with the probe block unit. The method of claim 1, The probe block unit, A lower block assembly forming a seating space in which the probe unit is seated; An alignment block positioned in the seating space and aligning the probe unit; An upper block assembly facing the lower block assembly with the alignment block in between Probe card comprising a. The method of claim 9, The alignment block is, A first sub-alignment block facing the first side of the probe unit and A second sub-alignment block facing the second side of the probe unit ≪ / RTI > And the first sub-alignment block and the second sub-alignment block are slidable in the seating space, and extension lines in the sliding movement direction cross each other on a plane. The method of claim 9, The lower block assembly, A first sub lower block, A second sub lower block facing the first sub lower block, A third sub lower block facing one end of the first sub lower block and one end of the second sub lower block; A fourth sub lower block facing the third sub lower block with the first sub lower block and the second sub lower block interposed therebetween; Probe card comprising a. The method of claim 11, The first sub lower block, A first seating part on which the probe unit and the second sub-alignment block are seated; A first partition wall facing the third side surface of the probe unit opposite the first side surface of the probe unit Probe card further comprising. The method of claim 11, The second sub lower block is, A second seating part on which the probe unit, the first sub-alignment block, and the second sub-alignment block are seated; A second partition wall facing the first side surface of the probe unit with the first sub-alignment block therebetween, At least one first alignment through hole formed through the second partition wall; A first alignment part connected to the first sub alignment block through the first alignment through hole Probe card comprising a. The method of claim 11, The third sub lower block, A third partition wall facing the fourth side of the probe unit opposite the second side of the probe unit Probe card comprising a. The method of claim 11, The fourth sub lower block, A fourth partition wall facing the second side surface of the probe unit with the second sub-alignment block interposed therebetween At least one second alignment through hole formed through the fourth partition wall; A second alignment part connected to the second sub alignment block through the second alignment through hole Probe card comprising a.

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