KR20100045686A - Devices for particle concentration and separation using electric current density differences in plate electrodes - Google Patents

Abstract

PURPOSE: A particle concentration and separation device using an electric current density difference of plate electrodes is provided to enable particle concentration and separation over a large area using two plate electrodes. CONSTITUTION: A particle concentration and separation device using an electric current density difference of plate electrodes comprises a power supply(10), plate electrodes(20) and a ground electrode(30). The power supply provides AC or DC voltage to the particle concentration and separation device. The plate electrodes are electrically connected to one end of the power supply to receive a driving voltage from the power supply.

Description

Devices for Particle Concentration and Separation using Electric Current Density Differences in Plate Electrodes

The present invention relates to an apparatus for concentrating and separating particles using a difference in current density of a flat plate electrode, thereby forming a non-uniform electric field by patterning a material having a difference in current density with the flat plate on an upper surface of a flat electrode to which voltage is applied. The present invention relates to a particle concentration and separation device that enables patterning, concentration, and separation of fine particles based on electrodynamic principles.

Recently, with the development of microfabrication technology, research has been actively conducted to manufacture microelectronic devices for concentrating, assembling, and separating fine particles and applying them to biological, chemical, and new material fields.

In such microelectronic devices, various electrokinetic principles such as electrophoresis, dielectrophoresis, and electroosmosis are used to precisely drive or isolate microparticles, proteins, cells, and bacteria. Can be used mainly.

Electrophoresis is a phenomenon in which fine particles having positive and negative charges are moved by a coulomb force in an electric field. The movement characteristics of the particles by electrophoresis may vary depending on the amount of charge, the size of the particles, the electrical, chemical, physical properties of the medium, or the strength of the electric field.

Dielectric behavior here is a phenomenon in which a dielectric is polarized by electromagnetic induction in a non-uniform electric field and is moved by force. The nature of the electrophoresis may vary depending on the type of fluid, the type of microparticles and molecules, and the frequency of the AC voltage signal.

Herein, electroosmotic means that ions in the fluid form a thin electric double layer on the surface of the electrode and the liquid in a non-uniform electric field, and under the influence of a tangential electric field formed by voltage This is a phenomenon in which the fluid moves in the strong direction along the electric field. The flow characteristics of the electroosmosis depend on various physical and chemical properties such as the type of voltage signal, frequency, type of material and medium, size and amount of charge.

As described above, in order to drive the fine particles using the electrokinetic principle, it is necessary to fabricate the fine electronic device in which the fine electrodes are patterned using the fine processing technology. In this case, the microelectronic device requires an electrode pattern for applying power in addition to the electrode for driving the fine particles, and in the case of the general two-dimensional electrode pattern, the electric field is very inefficient and it is difficult to concentrate and separate the fine particles effectively. There is a more complex process and a process that requires a long time to produce it in a more effective form. In the case of a three-dimensional electrode, even though an effective electric field can be formed, the manufacturing process is very complicated and it is difficult to obtain an electrode shape efficiently.

Such complex process steps make device fabrication very complicated and difficult, and there is a problem in that process time and process cost are also greatly increased. Youn-Suk Choi et al., Proceedings of The 19th IEEE International Conference on Micro Electro Mechanical Systems, pp. 466-469 (2006)]

As such, in order to manufacture the microelectronic device for the effective concentration and separation of the fine particles, a complicated process must be performed, which causes a problem in that the process time and the unit cost increase.

In addition, the conventional two-dimensional pattern electrode structure has a problem that the concentration and separation of the fine particles is inefficient, even when forming the three-dimensional electrode structure, it is difficult to efficiently produce the electrode pattern, a problem that must go through a very complex process There was this.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems. An electric field that is uneven when a voltage is applied to a flat plate electrode is patterned by patterning a material having a current density difference from the flat plate electrode on a top surface of the flat plate electrode to which a voltage is applied. It is an object of the present invention to provide a particle concentrating and separating device that allows the formation of the particles, which enables fast and effective concentration and separation of fine particles by electrodynamic principles.

Particle enrichment and separation apparatus using the current density difference of the plate electrode according to the present invention to achieve the object as described above, the power supply unit for applying a voltage, and is electrically connected to one end of the power supply unit from the power supply unit A plate electrode receiving a driving voltage, a ground electrode electrically connected to the other end of the power supply device, and receiving a reference voltage from the power supply device, and formed on the upper surface of the plate electrode to be smaller than an area of the plate electrode, It may include a material pattern having a higher current density than the electrode, and a microfluidic flow path formed between the plate electrode and the ground electrode and including a sample including particles.

The power supply device may be a DC voltage source or an AC voltage source.

The plate electrode may be formed of one of gold, silver, aluminum, copper, platinum, a silicon substrate, and ITO.

The ground electrode may be formed of one of gold, silver, aluminum, copper, platinum, a silicon substrate, and ITO.

The material pattern may be formed of one of a gold thin film, a silver thin film, an aluminum thin film, a copper thin film, a platinum thin film, silicon nitride, silicon oxide, and ITO. In this case, the material pattern should be selected as a material having a higher current density than the flat electrode, and the greater the difference in current density, the higher the particle concentration and separation efficiency of the microelectronic device.

When an alternating voltage is applied from the power supply device, the fluid in the microfluidic flow path flows in the direction of the material pattern by electroosmotic, and particles moving by negative dielectric action move in the opposite direction of the material pattern. Particles moved by the electrophoresis may move in the direction of the material pattern or in the direction of the edge of the material pattern.

When a direct current voltage is applied from the power supply device, the positively charged particles may move toward the negative electrode by electrophoresis, and the negatively charged particles may move toward the positive electrode by electrophoresis.

The particle concentration and separation device may further form a protective layer on the upper surface of the plate electrode and the material pattern, and the protective layer may prevent electrolysis of the sample due to overcurrent due to a high voltage.

The protective layer may be formed of nitrogen silicon or silicon oxide.

The particle concentration and separation device may further form an intermediate layer between the plate electrode and the material pattern, and the intermediate layer may reduce the contact resistance between the plate electrode and the material pattern.

The intermediate layer may be made of one of doped silicon, chromium and titanium.

The apparatus for concentrating and separating particles may further include a spacer spaced apart from the plate electrode and the ground electrode, and a microchannel structure forming the microfluidic flow path between the plate electrode and the ground electrode.

In addition, the particle concentration and separation device using the current density difference of the flat plate electrode according to the present invention, a power supply for applying a voltage, and a flat electrode electrically connected to one end of the power supply device receives a driving voltage from the power supply device And a ground electrode electrically connected to the other end of the power supply device and receiving a reference voltage from the power supply device, and formed on the upper surface of the plate electrode to be smaller than the area of the plate electrode, and having a lower current density than the plate electrode. The pattern may include a microfluidic flow path formed between the plate electrode and the ground electrode and having a sample including particles therein.

The power supply device may be a DC voltage source or an AC voltage source.

The plate electrode may be formed of one of gold, silver, aluminum, copper, platinum, a silicon substrate, and ITO.

The ground electrode may be formed of one of gold, silver, aluminum, copper, platinum, a silicon substrate, and ITO.

The material pattern may be formed of one of a gold thin film, a silver thin film, an aluminum thin film, a copper thin film, a platinum thin film, silicon nitride, silicon oxide, and ITO. In this case, the material pattern should be selected as a material having a lower current density than the flat electrode, and the greater the difference in current density, the fine particle concentration and separation efficiency of the microelectronic device increases.

When an alternating voltage is applied from the power supply device, the fluid in the microfluidic flow path flows in the opposite direction of the material pattern by electroosmotic, and the particles moving by the negative electrophoresis move in the material pattern direction, and Particles moved by the electrophoresis of may move in the opposite direction of the material pattern or in the direction of the edge of the material pattern.

When a direct current voltage is applied from the power supply device, the positively charged particles may move toward the negative electrode by electrophoresis, and the negatively charged particles may move toward the positive electrode by electrophoresis.

The particle concentration and separation device may further form a protective layer on the upper surface of the plate electrode and the material pattern, and the protective layer may prevent electrolysis of the sample due to overcurrent due to a high voltage.

The protective layer may be formed of nitrogen silicon or silicon oxide.

The particle concentration and separation device may further form an intermediate layer between the plate electrode and the material pattern, and the intermediate layer may reduce the contact resistance between the plate electrode and the material pattern.

The intermediate layer may be made of one of doped silicon, chromium and titanium.

The apparatus for concentrating and separating particles may further include a spacer spaced apart from the plate electrode and the ground electrode, and a microchannel structure for forming the microfluidic flow path between the plate electrode and the ground electrode.

As described above, according to the particle concentration and separation device using the current density difference of the plate electrode according to the present invention, electrodynamic fine particle concentration and separation is performed by patterning a material having a current density difference from the plate electrode on the top surface of the plate electrode. There is an effect that can be easily and simply manufacturing a three-dimensional microelectronic device for.

In addition, the efficiency of fine particle concentration and separation is greatly increased, and the manufacturing time and cost of the microelectronic device are greatly reduced.

In addition, since the use of two flat electrodes allows the concentration and separation of fine particles in a large area, the efficiency and effect are greatly increased.

In addition, as well as fine solid particles, there is an effect that can be used for the concentration, assembly and separation of various particles, such as nanoparticles, proteins, bacteria.

Hereinafter, with reference to the accompanying drawings will be described an embodiment of the present invention; First, it should be noted that the same components or parts in the drawings represent the same reference numerals as much as possible. In describing the present invention, detailed descriptions of related well-known functions or configurations are omitted in order not to obscure the gist of the present invention.

1 to 4 is a conceptual diagram showing a particle concentration and separation device according to the first to fourth embodiments of the present invention. As shown in FIGS. 1 to 4, the apparatus for concentrating and separating particles according to the present invention includes a power supply device 10, a plate electrode 20, a ground electrode 30, a microfluidic flow path 40, and a material pattern 50. It includes.

The power supply 10 applies a voltage to the particle concentration and separation device.

The power supply device 10 may be an AC voltage source or a DC voltage source, and in the case of using an AC voltage source, not only the voltage magnitude of the frequency but also the shape and offset voltage of the signal may be adjusted.

The plate electrode 20 is electrically connected to one end of the power supply device 10 and receives a driving voltage from the power supply device 10.

The flat electrode 20 may be made of any one selected from gold, silver, aluminum, copper, platinum, and a silicon substrate. When observing the particles concentrated and separated through the flat electrode 20, the flat electrode 20 may be made of a transparent conductive material such as a thin gold film or indium tin oxide (ITO).

The ground electrode 30 is electrically connected to the other end of the power supply device 10 and receives a reference voltage from the power supply device 10.

The ground electrode 30 may be made of any one selected from gold, silver, aluminum, copper, platinum, and a silicon substrate. When the particles are concentrated and separated through the ground electrode 30, the ground electrode 30 may be made of a transparent conductive material such as a thin gold film or indium tin oxide (ITO).

The material pattern 40 is formed on the top surface of the plate electrode 20 and is formed to have a current density different from that of the plate electrode 20. The material pattern 40 is formed smaller than the area of the flat electrode 20.

1, one material pattern 40 is formed on the top surface of the plate electrode 20 as shown in FIG. 1, or two or more patterns are formed on the top surface of the plate electrode 20 as shown in FIG. 2. It may be formed to be spaced apart.

When the particles are concentrated and separated through the material pattern 40, the material pattern 40 may be formed of a gold thin film, silicon nitride, silicon dioxide, or ITO. Tin Oxide) can be made of a transparent material with a specific current density. At this time, the current density of the material pattern should be larger or smaller than the current density of the plate electrode, and the greater the difference in current density, the more effectively the concentration and separation of the fine particles occur.

When a voltage is applied to the plate electrode 20 and the ground electrode 30, when the current density of the material pattern 40 is different from that of the plate electrode 20, it exists in the microfluidic flow path 50. Particles are moved in the direction of the material pattern 40 or vice versa by electrokinetic principles such as electrophoresis, electrophoresis and electroosmotic.

The microfluidic flow path 50 is formed between the plate electrode 20 and the ground electrode 30, and a sample including particles is located in the microfluidic flow path 50.

 In addition, the microfluidic flow path 50 is a space in which the sample moves, and the height of the microfluidic flow path 50 determines the strength of the electric field due to the voltage applied between the flat electrode 20 and the ground electrode 30. The lower the height, the stronger the field strength.

Herein, the sample includes a variety of substances such as polymer microparticles, metal nanoparticles, semiconductor nanoparticles, proteins, DNA and other biomolecules, and microparticles to which molecules are bound.

In particular, the sample is prepared such that these substances are present in various liquid droplets such as distilled water, cell culture medium, PBS buffer, and the like, the movement of the substances occurs within the liquid droplets present in the microfluidic flow path.

Particles in the microfluidic flow path 50 are moved by an electrokinetic principle, the direction of movement is the direction of the material pattern 40 or vice versa.

The electrokinetic principle may include electrophoresis, dielectric electrophoresis and electroosmotic.

The electrophoresis refers to a phenomenon in which colloidal particles move toward either electrode when an electrode is placed in a colloidal solution and a DC voltage is applied.

Dielectrophoresis (DEP) is a phenomenon in which a dielectric exhibits an electric dipole due to electromagnetic induction and moves under a force in a non-uniform electric field. The movement of these particles is determined by the difference in permittivity between the particles and the liquid around them, and the size of the particles (proportional to the cube of the radius) and the magnitude of the electric field gradient (proportional to the gradient of the square of the electric field). This will affect the speed of movement.

The dielectrophoresis includes negative dielectrophoresis in which fine particles move in a direction in which the electric field is weak, and positive dielectrophoresis in which fine particles move in a direction in which the electric field is strong. The nature of the electrophoresis may vary depending on the type of fluid, the type of microparticles and molecules, and the frequency of the AC voltage signal.

The electroosmosis includes AC electroosmosis (ACEO), induced-charge electroosmosis (ICEO), Faradaically-coupled electroosmosis (FCEO), and the like.

AC electroosmosis (ACEO) refers to a tangential electric field formed by a voltage in a non-uniform electric field, in which ions in the fluid form a thin electric double layer on the electrode surface and the liquid interface. This is a phenomenon in which fluid moves along an electrode surface due to the influence of an electric field.

This electroosmotic phenomenon causes the electric field to flow in the strong direction, leading to rapid concentration of materials. The concentration characteristics of the electroosmosis depend on various physical and chemical properties such as the frequency of the AC voltage signal and the type, size, and charge amount of the material or medium.

The induced-charge electroosmosis (ICEO) is an electroosmotic flow generated on the surface of the microparticles by electric charges induced by the microparticles in the electric field, and pushes the microparticles located near the electrode surface to the wall and assembles them. There is this. This phenomenon can cause the microparticles to self-assemble (aggregate) with a crystal structure (crystal structure).

Faradaically-coupled electroosmosis (FCEO) is an electroosmotic flow generated by an electric field of a horizontal component generated on an electrode surface, which cannot ignore the Faraday reaction at an electrode in a low frequency region. There is a characteristic that generates the upward flow of the particles float up from the bottom of the near-fine particles.

Meanwhile, a protective layer (not shown) may be further included on the top surface of the flat electrode 20 and the material pattern 40. The protective layer prevents electrolysis of the sample due to overcurrent by high voltage. The protective layer may be made of silicon nitride, silicon dioxide, or the like.

In addition, an intermediate layer (not shown) may be further included between the plate electrode 20 and the material pattern 40. The intermediate layer may reduce contact resistance between the plate electrode 20 and the material pattern 40. This intermediate layer may use a conductive material, such as doped silicon, chromium, titanium.

In addition, a spacer (not shown) and a fine channel structure (not shown) may be further included to form the microfluidic flow path 50. The spacer separates the plate electrode 20 from the ground electrode 30, and the microchannel structure forms a microfluidic flow path between the plate electrode 20 and the ground electrode 30.

The spacer and the microchannel structure may use a photoresist such as SU-8 or a polymer such as polydimethylsoloxane (PDMS).

1 is a conceptual diagram illustrating a particle concentration and separation device according to a first embodiment of the present invention. Particle enrichment and separation device according to a first embodiment of the present invention is composed of a power supply device 10, a flat plate electrode 20, a ground electrode 30, a material pattern 40 and a microfluidic flow path (50), An AC voltage source is used in the case of the power supply device 10, and in the case of the material pattern 40, a smaller area is patterned on the upper surface of the flat electrode 20. In addition, two or more material patterns may be arranged in an array form. The two material patterns 40 are formed to have a higher current density than the plate electrode 20.

When an alternating voltage is applied from the power supply device 10 through the plate electrode 20 and the ground electrode 30, the electrophoresis occurs when the particles in the microfluidic flow path 50 have weak charges or are dielectrics. Or by electroosmosis.

As in the first embodiment of the present invention, when the current density of the material pattern 40 is higher than the current density of the plate electrode 20, the fluid in the microfluidic flow path 50 may be formed of the material pattern by electric osmosis. Flow is generated in the direction of 40, particles moving by negative dielectrophoresis move in the opposite direction of the material pattern 40, and particles moving by positive dielectrophoresis move the material pattern 40 Will be moved in the direction. In the case of nanoparticles and proteins, which are relatively weak in electrophoresis, they are more affected by electroosmotic and electrostatic interactions, and are formed in the region of the patterned current density material pattern 40 on the plate electrode 20. Concentrated and assembled.

The electrokinetic kinetic characteristics are different depending on the characteristics of the particle size, material, surface conductivity, and the like. For example, in the case of relatively large microparticles, the electrophoresis mainly occurs, and in the case of small microparticles, the concentration by electroosmotic mainly occurs. In addition, the motion varies depending on the frequency of the applied voltage. At low frequencies below 10 kHz, the concentration is mainly caused by electroosmotic, and at high frequencies above 10 kHz, the movement is mainly caused by the electrophoresis. Therefore, at 10 kHz, large microparticles are separated from the high-density material pattern by negative dielectrophoresis, and only relatively small nanoparticles can be separated and concentrated by electroosmosis. In addition, at 100 Hz, large microparticles are concentrated by electroosmotic, and in the case of nanoparticles, the microparticles can be separated and concentrated by Faraday paired electroosmotic.

2 is a conceptual diagram illustrating a particle concentration and separation device according to a second embodiment of the present invention. Particle concentration and separation device according to a second embodiment of the present invention is composed of a power supply device 10, a flat plate electrode 20, a ground electrode 30, a material pattern 40 and a microfluidic flow path (50), In the case of the power supply device 10, an AC voltage source is used, and in the case of the material pattern 40, the upper surface of the plate electrode 20 is formed to be smaller than the area of the plate electrode 20, and a part of the plate electrode 20 is formed. Patterned to expose. The material pattern 40 is formed to have a lower current density than the plate electrode 20.

When an alternating voltage is applied from the power supply device 10 through the plate electrode 20 and the ground electrode 30, the microparticles in the microfluidic flow path 50 have weak charges or are dielectrics. It is moved by electrophoresis or electroosmosis.

As in the second embodiment of the present invention, when the current density of the material pattern 40 is lower than the current density of the flat electrode 20, the fluid in the microfluidic flow path 50 may be formed of a material pattern by electroosmosis. Flow is generated in the direction of the exposed flat electrode 20 without being obscured by 40), and particles moving by negative dielectric phoresis move toward the material pattern 40 and moving by positive dielectric phoresis. They move in the opposite direction of the material pattern 40 or in the most direction of the pattern.

In the case of nanoparticles and proteins in which relatively weak dielectric phenomena occur, the nanoparticles and proteins are more sensitive to electroosmotic and electrostatic interactions and are concentrated and assembled in the exposed areas of the flat electrode 20 having a relatively high current density.

3 is a conceptual diagram illustrating a particle concentration and separation device according to a third embodiment of the present invention. Particle concentration and separation device according to a third embodiment of the present invention is composed of a power supply device 10, a flat plate electrode 20, a ground electrode 30, a material pattern 40 and a microfluidic flow path (50), An AC voltage source is used in the case of the power supply device 10, and in the case of the material pattern 40, a smaller area is patterned on the upper surface of the flat electrode 20. In addition, two or more material patterns may be arranged in an array form. The two material patterns 40 are formed to have a higher current density than the plate electrode 20.

When a direct current voltage is applied from the power supply device 10 through the plate electrode 20 and the ground electrode 30, when the microparticles in the microfluidic flow path 50 have a strong charge, the electrophoresis is positive. The positively charged particles move in the direction of the negative electrode, and the negatively charged particles move in the direction of the positive electrode.

When the current density of the material pattern 40 is higher than the current density of the plate electrode 20, the particles in the microfluidic flow path 50 are in the direction of the material pattern 40 having a high current density or vice versa. Will move.

4 is a conceptual diagram illustrating a particle concentration and separation device according to a fourth embodiment of the present invention. Particle enrichment and separation device according to a fourth embodiment of the present invention is composed of a power supply device 10, a flat plate electrode 20, a ground electrode 30, a material pattern 40 and a microfluidic flow path (50), An AC voltage source is used in the case of the power supply device 10, and in the case of the material pattern 40, an area smaller than an area of the plate electrode 20 is formed on the top surface of the plate electrode 20, and the plate electrode 20 is formed. Patterned to expose a portion of the. The material pattern 20 is formed to have a lower current density than the flat electrode 20.

When a direct current voltage is applied from the power supply device 10 through the plate electrode 20 and the ground electrode 30, when the microparticles in the microfluidic flow path 50 have a strong charge, the electrophoresis is positive. The positively charged particles move in the direction of the negative electrode, and the negatively charged particles move in the direction of the positive electrode.

When the current density of the material pattern 40 is lower than the current density of the plate electrode 20, the particles in the microfluidic flow path 50 are directed toward the exposed plate electrode 20 having a high current density or vice versa. Will be moved to.

On the other hand, when the current density of the material pattern 40 is lower than the current density of the plate electrode 20, as in the second and fourth embodiments of the present invention, the material pattern 40 is silicon nitride And it can be produced by depositing silicon oxide.

Also, as in the first and third embodiments of the present invention, when the current density of the material pattern 40 is higher than the current density of the plate electrode 20, the material pattern 40 may be formed of gold, It can produce by depositing metal thin films, such as silver and the like.

FIG. 5 shows electric field simulation results of the particle concentrating and separating apparatus according to the first embodiment of the present invention, and FIG. 6 shows electric field simulation results of the particle concentrating and separating apparatus according to the second embodiment of the present invention. have.

Referring to FIG. 5, in the particle concentrating and separating apparatus according to the first embodiment of the present invention, an AC voltage source is used as the power supply device 10, and an AC voltage of 10 V at 100 kHz is supplied from the power supply device 10. The electric field simulation results when applied are shown. In this case, it can be seen that an electric field is formed by conducting more current through the material pattern 40.

Referring to FIG. 6, in the particle concentration and separation device according to the second embodiment of the present invention, an AC voltage source is used as the power supply device 10, and an AC voltage of 10 V at 100 kHz is supplied from the power supply device 10. The electric field simulation results when applied are shown. In this case, it can be seen that an electric field is formed by conducting more current through the exposed flat plate electrode 20.

The particle concentration and separation device using the current density difference of the flat plate electrode according to the present invention is integrated with other material analysis equipment such as fluorescence spectrum or Raman scattering spectrum analysis equipment to separate substances present at very low concentrations. And concentrated to be used for quick analysis. In addition, by using the material pattern as a metal, a surface plasmon resonance effect can be simultaneously obtained to amplify a signal.

As described above with reference to the drawings illustrating a particle concentration and separation device using the current density difference of the flat electrode according to the present invention, the present invention is not limited by the embodiments and drawings disclosed herein, the present invention Of course, various modifications can be made by those skilled in the art within the scope of the technical idea.

1 is a conceptual diagram illustrating a particle concentration and separation device according to a first embodiment of the present invention.

2 is a conceptual diagram illustrating a particle concentration and separation device according to a second embodiment of the present invention.

3 is a conceptual diagram illustrating a particle concentration and separation device according to a third embodiment of the present invention.

4 is a conceptual diagram illustrating a particle concentration and separation device according to a fourth embodiment of the present invention.

5 is a view showing the electric field simulation results of the particle concentration and separation device according to the first embodiment of the present invention.

6 is a view showing the electric field simulation results of the particle concentration and separation device according to a second embodiment of the present invention.

<Description of Symbols for Main Parts of Drawings>

10: power supply device 20: plate electrode

30: ground electrode 40: material pattern

50: microfluidic flow path

Claims (24)

A power supply for applying a voltage; A flat electrode electrically connected to one end of the power supply device and receiving a driving voltage from the power supply device; A ground electrode electrically connected to the other end of the power supply device and receiving a reference voltage from the power supply device; A material pattern formed on an upper surface of the plate electrode to be smaller than an area of the plate electrode and having a higher current density than the plate electrode; And And a microfluidic flow path formed between the plate electrode and the ground electrode, wherein the sample including the particles includes a microfluidic flow path. The method according to claim 1, The power supply device is a particle concentration and separation device using the current density difference of the flat plate electrode, characterized in that the DC voltage source or AC voltage source. The method according to claim 1, The flat electrode is a particle concentration and separation device using the current density difference of the flat electrode, characterized in that formed of one of gold, silver, aluminum, copper, platinum, silicon substrate and ITO. The method according to claim 1, The ground electrode is formed of one of gold, silver, aluminum, copper, platinum, silicon substrate and ITO particle concentration and separation device using the current density difference of the flat electrode. The method according to claim 1, The material pattern is formed of one of a gold thin film, a silver thin film, an aluminum thin film, a copper thin film, a platinum thin film, silicon nitride, silicon oxide, and ITO, and is selected as a material having a higher current density than the flat electrode, and a current density difference Particle enrichment and separation apparatus using the current density difference of the flat electrode, characterized in that the larger the fine particle concentration and separation efficiency of the fine electronic device increases. The method according to claim 1, When an alternating voltage is applied from the power supply device, the fluid in the microfluidic flow path flows in the direction of the material pattern by electroosmotic, and particles moving by negative dielectric action move in the opposite direction of the material pattern. Particle concentration and separation device using the current density difference of the plate electrode, characterized in that the particles are moved by the electrophoresis of the material pattern direction or the edge direction of the material pattern. The method according to claim 1, When a DC voltage is applied from the power supply device, particles having positive charges move in the direction of the negative electrode by electrophoresis, and particles having negative charges move in the direction of the positive electrode by electrophoresis. Particle concentration and separation device using the current density difference of the plate electrode. The method according to claim 1, The particle concentration and separation device further forms a protective layer on the upper surface of the flat electrode and the material pattern, the protective layer is the current density difference of the flat electrode, characterized in that to prevent the electrolysis of the sample due to the over-current due to high voltage Particle concentration and separation apparatus using. The method according to claim 8, The protective layer is a particle concentration and separation device using the current density difference of the plate electrode, characterized in that formed of silicon silicon or silicon oxide. The method according to claim 1, The particle concentrating and separating device further forms an intermediate layer between the plate electrode and the material pattern, and the intermediate layer reduces the particle concentration using the current density difference of the plate electrode, characterized in that to reduce the contact resistance between the plate electrode and the material pattern. Separation device. The method according to claim 10, The intermediate layer is a particle concentration and separation device using the current density difference of the flat electrode, characterized in that consisting of doped silicon, chromium and titanium. The method of claim 1, wherein the particle concentration and separation device A spacer spaced apart from the plate electrode; Particle concentration and separation device using the current density difference of the flat electrode further comprises a micro-channel structure for forming the microfluidic flow path between the flat electrode and the ground electrode. A power supply for applying a voltage; A flat electrode electrically connected to one end of the power supply device and receiving a driving voltage from the power supply device; A ground electrode electrically connected to the other end of the power supply device and receiving a reference voltage from the power supply device; A material pattern formed on an upper surface of the plate electrode to be smaller than an area of the plate electrode and having a lower current density than the plate electrode; And a microfluidic flow path formed between the plate electrode and the ground electrode, wherein the sample including the particles includes a microfluidic flow path. 14. The method of claim 13, The power supply device is a particle concentration and separation device using the current density difference of the flat plate electrode, characterized in that the DC voltage source or AC voltage source. 14. The method of claim 13, The flat electrode is a particle concentration and separation device using the current density difference of the flat electrode, characterized in that formed of one of gold, silver, aluminum, copper, platinum, silicon substrate and ITO. 14. The method of claim 13, The ground electrode is formed of one of gold, silver, aluminum, copper, platinum, silicon substrate and ITO particle concentration and separation device using the current density difference of the flat electrode. 14. The method of claim 13, The material pattern is formed of one of a gold thin film, a silver thin film, an aluminum thin film, a copper thin film, a platinum thin film, silicon nitride, silicon oxide, and ITO, and is selected as a material having a lower current density than the flat electrode, and a current density difference Particle concentration and separation apparatus using the current density difference of the flat electrode, characterized in that the larger the fine particle concentration and separation efficiency of the fine electronic device increases. 14. The method of claim 13, When an alternating voltage is applied from the power supply device, the fluid in the microfluidic flow path flows in the opposite direction of the material pattern by electroosmotic, and the particles moving by the negative electrophoresis move in the material pattern direction, and Particle concentration and separation device using the current density difference of the plate electrode, characterized in that the particles moving by the electrophoresis of the material pattern is moved in the opposite direction or the edge of the material pattern. 14. The method of claim 13, When a DC voltage is applied from the power supply device, particles having positive charges move in the direction of the negative electrode by electrophoresis, and particles having negative charges move in the direction of the positive electrode by electrophoresis. Particle concentration and separation device using the current density difference of the plate electrode. 14. The method of claim 13, The particle concentration and separation device further forms a protective layer on the upper surface of the flat electrode and the material pattern, the protective layer is the current density difference of the flat electrode, characterized in that to prevent the electrolysis of the sample due to the over-current due to high voltage Particle concentration and separation apparatus using. The method of claim 20, The protective layer is a particle concentration and separation device using the current density difference of the plate electrode, characterized in that formed of silicon silicon or silicon oxide. 14. The method of claim 13, The particle concentrating and separating device further forms an intermediate layer between the plate electrode and the material pattern, and the intermediate layer reduces the particle concentration using the current density difference of the plate electrode, characterized in that to reduce the contact resistance between the plate electrode and the material pattern. Separation device. The method according to claim 22, The intermediate layer is a particle concentration and separation device using the current density difference of the flat electrode, characterized in that consisting of doped silicon, chromium and titanium. The method of claim 13, wherein the particle concentration and separation device A spacer spaced apart from the plate electrode; Particle concentration and separation device using the current density difference of the flat electrode further comprises a micro-channel structure for forming the microfluidic flow path between the flat electrode and the ground electrode.

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