KR20100040104A - High power light emitting diode lamp - Google Patents

High power light emitting diode lamp Download PDF

Info

Publication number
KR20100040104A
KR20100040104A KR1020080099176A KR20080099176A KR20100040104A KR 20100040104 A KR20100040104 A KR 20100040104A KR 1020080099176 A KR1020080099176 A KR 1020080099176A KR 20080099176 A KR20080099176 A KR 20080099176A KR 20100040104 A KR20100040104 A KR 20100040104A
Authority
KR
South Korea
Prior art keywords
casing
heat dissipation
module
cover
high power
Prior art date
Application number
KR1020080099176A
Other languages
Korean (ko)
Inventor
정현영
Original Assignee
정현영
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 정현영 filed Critical 정현영
Priority to KR1020080099176A priority Critical patent/KR20100040104A/en
Publication of KR20100040104A publication Critical patent/KR20100040104A/en

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/02—Arrangement of electric circuit elements in or on lighting devices the elements being transformers, impedances or power supply units, e.g. a transformer with a rectifier
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/15—Thermal insulation
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/507—Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
    • Y02B20/72—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps in street lighting

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Power Engineering (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

PURPOSE: A high power light emitting diode lamp is provided to emit heat which is generated from a driving module by forming radiating pins along the lateral side of a thermal conductive single body. CONSTITUTION: A lamp cover(100) is based on a transparent material which radiates light. A radiation casing(200) is formed by a thermal conductive single body. Radiation pins(212) are formed along the lateral side of the radiation casing. A receiving space is formed in the rear side of the radiation casing. An LED module(230) is installed on the surface of the radiation casing. Heat which is generated from the LED module is transferred to the radiation casing. A thermal conductive casing cover(300) is combined to the rear side of the radiation casing. A power module(330) is installed on the thermal conductive casing cover.

Description

High Power Light Emitting Diode Lamp

TECHNICAL FIELD The present invention relates to high power LED lamps, and more particularly to techniques for improving heat dissipation characteristics.

Recently, street lamps using light emitting diodes (LEDs) have been developed. The street lamps using light emitting diodes have much lower power consumption than conventional street lamps using sodium or mercury lamps, and have the same brightness as those of conventional street lamps. In addition, the service life is increased by several times as long as the maintenance cost can be greatly reduced.

Such advantages of high brightness, low power consumption and long lifespan are widely used in various fields such as indoor lighting, decorative lighting, and vehicle lighting in addition to street lamps.

However, the light emitting diode has a disadvantage in that it is vulnerable to heat despite this advantage. In particular, in the case of a street lamp that requires high brightness, since a plurality of high power light emitting diodes must be used, if the high heat generated by long time is not effectively emitted, the light emitting diode having low heat resistance is damaged by heat.

Accordingly, it is an object of the present invention to provide a high power LED lamp that can quickly and effectively release heat generated by lighting.

In order to achieve the above object, the lamp cover of the transparent material that the light is emitted; It is composed of a thermally conductive single body, a heat dissipation fin is formed along the side, and the receiving space is formed from the rear side to the inside, the LED module is mounted on the surface to receive the heat generated from each and the cover is sealingly coupled to the surface Heat dissipation casing; And a thermally conductive casing cover sealingly coupled to a rear surface of the heat dissipation casing and mounted with an integrated driving module including a power supply module.

According to the above structure, the heat generated from the LED module by the lighting and the heat generated from the drive module including the power supply module can be separated quickly without interference with each other.

Hereinafter, with reference to the accompanying drawings will be described in detail an embodiment of the present invention.

1 is an exploded perspective view showing an LED lamp according to an embodiment of the present invention.

According to a feature of the present invention, the heat generated from the LED module 230 and the driver module 240 during driving is discharged to the outside through the heat dissipation casing 20, the heat generated from the power supply module 330 is casing cover The power supply module 330 is thermally separated from the LED module 230 and the driver module 240 while simultaneously emitting to the outside through the 300.

1. Structure of the lamp

Lamp cover (100)

The cover 100 is formed of a single body of a transparent material having an elongated shape, for example, a central portion may have a bulging semi-elliptic shape, but is not limited thereto. In addition, a screw hole 110 for coupling with the heat dissipation casing 200 is formed along the edge of the body to couple the lamp cover 100 and the heat dissipation casing 200 using the screws 112.

Preferably, a plurality of heat dissipation fins 120 may be formed on the surface of the body so that heat transferred from the LED module 230 and the driver module 240 to the body is quickly released.

radiation Casing (200)

The heat dissipation casing 200 is formed of a single body 210 made of a thermally conductive metal such as aluminum, and has the same shape as the lamp cover 100.

On the surface of the body 210, a plurality of LED modules 230 and corresponding driver modules 240 are disposed.

In addition, the coupling hole 214 is formed at a position corresponding to the screw hole 110 of the lamp cover 100 along the edge of the body 210.

Preferably, a seal 215 such as an o-ring may be installed along the surface edge of the body 210. According to this structure, when the heat dissipation casing 200 and the lamp cover 100 are coupled, the cover 100 presses the sealing 215, so that foreign substances such as water or dust flow into the lamp cover 100. Can be prevented.

Preferably, a plurality of heat dissipation fins 212 protrude along the side of the body 210 to quickly discharge the heat transferred from the LED module 230 and the driver module 240 to the body 210 to the outside. Here, the radiating fins 212 at the boundary between the radiating fins 212 and the body 210 may have a constant radius of curvature R, thereby obtaining smooth cooling and heat dissipation.

According to the present invention, an accommodating space 218 is formed inward from a rear surface of the body 210, and a power supply module 330 described later is accommodated in the accommodating space 218.

Preferably, a heat insulating sheet 220 is installed on the bottom of the storage space 218 to prevent heat generated from the LED module 230 and the driver module 240 from convection into the storage space 218.

Here, the thickness of the portion 210a between the surface of the body 210 and the bottom of the storage space 218 is formed thicker than the thickness of the portion 210b between the outer surface of the body 210 and the inner surface of the storage space 218. can do. Accordingly, heat from the LED module 230 and the driver module 240 is hard to be transferred to the storage space 218, and the heat inside the storage space 218 may be quickly released through the side surface.

A step 211 is formed along an end edge of the storage space 218, and a screw hole 213 is formed in the step 211 to allow the casing cover 300 to be described later to be coupled thereto.

Casing  Cover (300)

The casing cover 300 is formed of a single body 310 made of a thermally conductive metal, for example, aluminum, and the power supply module 330 is mounted on a surface thereof.

The power supply module 330 includes a printed circuit board 332 mounted on the surface of the casing cover 300 and electronic components 334 including a power transistor mounted on the surface of the printed circuit board 332. .

A screw hole 312 is formed at a position corresponding to the screw hole 213 of the casing 200 on the surface of the body 310 to couple the heat dissipation casing 200 and the casing cover 300 by screws 314.

In addition, a plurality of heat dissipation fins 320 protrude from the rear surface of the body 310 to quickly release heat transferred from the power supply module 330 to the body 310 from the power transistor, in particular.

Preferably, when the sealing 315 such as an o-ring is installed along the surface edge of the body 310 to couple the heat dissipation casing 200 and the casing cover 300, the stepped portion 211 of the casing 200 is formed. Since the sealing 315 is pressurized, foreign matters such as water or dust can be prevented from flowing into the storage space 218.

2. The operation of the lamp

When power is applied, the LED module 230 is driven to generate light and heat, and heat is generated from the driver module 240 and the power supply module 330.

At this time, heat generated from the LED module 230 and the driver module 240 is discharged to the outside through the body portion 210a and the heat dissipation fin 212 of the casing 200, heat generated from the power supply module 330 Is discharged to the outside through the body portion 210b and the heat dissipation fin 212 of the casing 200 and through the body 210 and the heat dissipation fin 320 of the casing cover 300.

Therefore, the heat generated from the LED module 230 and the driver module 240 and the heat generated from the power supply module 330 are emitted through a separate path without interfering with each other, especially high heat generated from the LED module 230 Since it is not transmitted to the power supply module 330, it is possible to prevent the power supply module 330 from being burned due to high heat generated from the LED module 230. In addition, by applying the heat insulation sheet 220, the driving condition of the power supply module 330 may be controlled to 40 ° C. in the internal temperature of the accommodation space 218.

In the above description, the embodiment of the present invention has been described, but various changes can be made at the level of those skilled in the art.

For example, a driver module and a power supply module except for an LED module may be mounted on a single printed circuit board to configure an integrated driving module.

Therefore, the scope of the present invention should not be construed as being limited to the above embodiment, but should be interpreted by the claims described below.

1 is an exploded perspective view showing an LED lamp according to an embodiment of the present invention.

Claims (6)

A lamp cover made of a transparent material from which light is emitted; It is composed of a thermally conductive single body, a heat dissipation fin is formed along the side, and the receiving space is formed from the rear side to the inside, the LED module is mounted on the surface to receive the heat generated from each and the cover is sealingly coupled to the surface Heat dissipation casing; And And a thermally conductive casing cover sealingly coupled to a rear surface of the heat dissipation casing and mounted with an integrated driving module including a power supply module. The method according to claim 1, A high power LED lamp, characterized in that a plurality of heat dissipation fins are formed on the back surface of the casing cover. The method according to claim 1, In the heat dissipation casing, the high power LED lamp, characterized in that the thickness between the surface and the bottom of the storage space is thicker than the thickness between the outer surface and the inner surface of the storage space. The method according to claim 1, A high power LED lamp, characterized in that a plurality of heat dissipation fins are formed on the surface of the lamp cover. The method according to claim 4, The integrated drive module, the high power LED lamp comprising a drive module and a power supply module. The method according to claim 1, High power LED lamp, characterized in that the insulating sheet is installed on the bottom of the storage space.
KR1020080099176A 2008-10-09 2008-10-09 High power light emitting diode lamp KR20100040104A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020080099176A KR20100040104A (en) 2008-10-09 2008-10-09 High power light emitting diode lamp

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020080099176A KR20100040104A (en) 2008-10-09 2008-10-09 High power light emitting diode lamp

Publications (1)

Publication Number Publication Date
KR20100040104A true KR20100040104A (en) 2010-04-19

Family

ID=42216307

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020080099176A KR20100040104A (en) 2008-10-09 2008-10-09 High power light emitting diode lamp

Country Status (1)

Country Link
KR (1) KR20100040104A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012033280A1 (en) * 2010-09-06 2012-03-15 주식회사 자온지 Led lighting device and streetlight device having same
KR101310365B1 (en) * 2012-03-16 2013-09-23 주식회사 포스코엘이디 Light emitting module and illuminating apparatus comprising the same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012033280A1 (en) * 2010-09-06 2012-03-15 주식회사 자온지 Led lighting device and streetlight device having same
US8820975B2 (en) 2010-09-06 2014-09-02 Icepipe Corporation LED lighting device and streetlight device having same
EA024315B1 (en) * 2010-09-06 2016-09-30 Айспайп Корпорейшн Led lighting device and streetlight device having same
KR101310365B1 (en) * 2012-03-16 2013-09-23 주식회사 포스코엘이디 Light emitting module and illuminating apparatus comprising the same

Similar Documents

Publication Publication Date Title
KR100857058B1 (en) Cooling structure of street lamp utilizing a light emitting diode
US8167466B2 (en) LED illumination device and lamp unit thereof
US7988335B2 (en) LED illuminating device and lamp unit thereof
KR200450691Y1 (en) LED lamp using light source with LED
KR101682132B1 (en) Led lighting lamp for vehicle
US20100027266A1 (en) Illuminating Device
KR100899977B1 (en) Heat sink device of light emitting diode lamp
KR101556415B1 (en) High Power Light Emitting Diode Lamp
KR20100034262A (en) High power light emitting diode lamp
KR20110062822A (en) Led lamp with heat radiation mechanism using convection circulation
KR101780691B1 (en) Led lighting lamp for vehicle
KR200387269Y1 (en) Lighting device with high brightness light emitting diode
KR20060102796A (en) Lighting device with high brightness light emitting diode
KR20100040104A (en) High power light emitting diode lamp
KR100864585B1 (en) Lamp structure utilizing a light emitting diode
KR101019624B1 (en) Lighting Apparatus Using LED
KR20080058878A (en) Light emitting diode lighting apparatus
KR101794315B1 (en) Fishing lamp containing stabilizer with moisture elimination
KR101740651B1 (en) Marine lantern using modular LED lighting
KR20160129195A (en) Led lamp with heat radiation mechanism for convection circulation
KR20100019624A (en) Led lamp insided solar cell
KR20090090415A (en) A led lamp
RU167546U1 (en) LED LAMP
KR100946625B1 (en) Led lighting device
KR101620313B1 (en) Led lighting lamp for vehicle

Legal Events

Date Code Title Description
WITN Withdrawal due to no request for examination