KR20100033910A - Module of light emitting device and method of manufacturing the module - Google Patents

Abstract

PURPOSE: A light emitting module and a method for manufacturing the same are provided to reduce manufacturing costs by forming a wavelength conversion layer without a phosphor sheet using a liquid wavelength conversion material. CONSTITUTION: A light emitting module includes a substrate(100), a housing(200), and a wavelength conversion layer(300). The substrate mounts at least one light emitting diode chip(110) or more. The substrate is mounted on the housing. The housing includes a light emission hole(230) for emitting the light from the light emitting diode chip and a reflection hole(240) with an inlet for inputting the light emitting diode chip. A wave conversion layer is formed on the section with the light emission hole.

Description

LIGHT MODULE AND MANUFACTURING METHOD OF MANUFACTURING MODULE {MODULE OF LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE MODULE}

The present invention relates to a light emitting module and a method of manufacturing a light emitting module, and more particularly, to form a wavelength conversion layer in an exit hole formed in a housing on which a substrate on which a light emitting diode chip is mounted is formed to emit light of uniform color, and to emit light. The present invention relates to a light emitting module for a display device and a method of manufacturing the light emitting module capable of selectively forming a wavelength conversion layer on a sphere.

In general, a display device using a light emitting diode chip can design a free design according to a request of a user (CUSTOMER), thereby enabling a display that can completely reproduce all the functions to be expressed. Accordingly, a display device using a light emitting diode chip is used as a display means for various industrial devices including display means and measuring instruments for home appliances such as refrigerators, washing machines, air conditioners, VCRs, DVDs, microwave ovens, and the like.

In the display device using the light emitting diode, a plurality of light emitting diodes are mounted on a printed circuit board, a housing on which the printed circuit board is mounted, and a plurality of reflection holes through which light emitted from the light emitting diode is emitted are formed on the housing. . Then, a display film on which letters, numbers, symbols, and patterns are printed is disposed on one side of the housing according to the request of the orderer.

In this case, in order to implement the light emitted from the light emitting diode as white light, a method of attaching a sheet coated or mixed with phosphor on one surface of the housing, that is, one surface in the direction in which the display film is disposed has been generally used.

However, since the phosphor sheets coated or mixed with phosphors are expensive, they contribute to increase the production cost of the product, and although they are expensive, there is a problem that the reliability of the white light is poor.

The present invention has been made to solve the above-mentioned conventional problems, and implements a variety of light, including white light without using a phosphor sheet used to implement white light in a display device used in various home appliances, excellent light emission Its purpose is to provide a module and a light emitting module providing method.

The light emitting module according to the present invention for achieving the above object comprises a substrate on which at least one light emitting diode chip is mounted; A reflection hole in which the substrate is mounted, at least one exit hole for emitting light emitted from each of the light emitting diode chips is formed, and an inlet hole for enclosing each exit hole and having the light emitting diode chip therein is formed; A housing having; And a wavelength conversion layer formed in a region including at least one of the exit opening regions.

The housing includes a base surface and a entrance surface formed at an edge of the base surface, wherein the exit hole and the reflection hole are formed in the base surface, and at least one injection hole is formed in the reflection hole. .

The base surface of the housing is characterized in that the flow path for connecting the injection hole formed in the reflective hole is formed.

The housing may further include a molding part that protects one or both surfaces selected from front or rear surfaces of the substrate.

The light emitting diode chip may include at least one light emitting diode chip emitting blue light, and the wavelength conversion layer may be formed in at least one of reflection holes in which the light emitting diode chip emitting at least blue light is disposed.

The wavelength conversion layer is characterized in that any one selected from phosphor powder or quantum dot phosphor or a mixture thereof is blended with a molding resin.

In addition, the light emitting module manufacturing method according to the present invention comprises the steps of preparing a substrate on which at least one LED chip is mounted at a predetermined position; Preparing a housing having at least one exit hole for emitting light emitted from each of the light emitting diode chip is formed, the reflection hole surrounding the respective exit port is formed in the inlet for entering the light emitting diode chip Wow; Forming a wavelength conversion layer in which the wavelength conversion means is mixed in the exit port; Mounting a substrate to the housing such that a light emitting diode chip is introduced into the inlet.

The forming of the wavelength conversion layer may include selectively forming a wavelength conversion layer in which wavelength conversion means is mixed in at least one of the plurality of exit holes.

The forming of the wavelength conversion layer may include preparing a liquid phase wavelength conversion product by mixing wavelength conversion means with a liquid molding resin; Taping the exterior of the outlet of the housing with molding tape; Injecting the prepared liquid wavelength converting material into the reflection hole and filling the exit hole, and curing the liquid wavelength converting material after forming the wavelength conversion layer or mounting the substrate in a housing. It characterized in that it further comprises the step of.

In the forming of the housing, preparing the housing so that an injection hole is formed in the reflection hole surrounding the exit hole in which the wavelength conversion layer is formed among the reflection holes, and filling the exit hole with the liquid wavelength conversion step, the liquid phase wavelength conversion Water is filled into the outlet through the injection hole.

In the forming of the housing, the housing is prepared to further form a flow path between the injection holes formed in the reflection hole, and in the filling of the liquid-wavelength converting material into the exit port, the liquid-wavelength converting material flows along the flow path. It is characterized in that the filling to the exit port.

And removing the molding tape after curing the liquid phase wavelength converting material.

After mounting the substrate in a housing, the method may further include forming a molding part encapsulating and protecting the substrate.

The wavelength converting means is any one selected from phosphor powder or quantum dot phosphor, or a mixture thereof.

According to the present invention, by uniformly forming a wavelength conversion layer required to implement white light in the housing in which the reflection hole is formed, it is possible to implement a uniform white light without using an expensive phosphor sheet can provide a highly reliable light emitting module It works.

In addition, since the wavelength conversion layer is formed by using the liquid wavelength converting material, it is possible to reduce the production cost of the light emitting module without using a phosphor sheet which is relatively expensive than the liquid wavelength converting material.

In addition, by using a light emitting diode chip that emits red, green, or blue light, and selectively forming a wavelength conversion layer in a plurality of reflection holes to selectively implement white light, various colors such as white light, red, green, and blue can be obtained. There is an effect that can be easily implemented.

Further, by selectively using the phosphor powder and the quantum dot phosphor as the wavelength conversion means blended in the wavelength conversion layer, it is possible to easily implement various colors than when only the light emitting diode chip and the phosphor powder are used.

Hereinafter, a light emitting module and a method of manufacturing the light emitting module according to the present invention will be described in detail with reference to the accompanying drawings.

The light emitting module according to the present invention is a light emitting module used in a display device of various industrial devices including a display unit and a measuring instrument of a home appliance such as a refrigerator, a washing machine, an air conditioner, a VCR, a DVD, a microwave oven, etc. An example of a light emitting module used in the following is described.

1 is a schematic exploded perspective view of a display apparatus using a light emitting module according to the present invention, FIG. 2 is a cross-sectional view showing a light emitting module according to a first embodiment of the present invention, and FIG. 3 is a first embodiment of the present invention. A cutaway perspective view showing a housing of a light emitting module according to the invention.

As shown in the figure, the light emitting module according to the first embodiment of the present invention comprises: a substrate 100 on which a light emitting diode chip 110 is mounted; A housing (200) on which the substrate (100) is mounted and having an exit opening (230) and a reflection hole (240); The wavelength conversion layer 300 is formed in a region including at least the emission opening 230.

As the substrate 100, for example, a printed circuit board is used, an electrode (not shown) on which the light emitting diode chip 110 is mounted is formed, and a driving circuit (not shown) for driving the light emitting diode chip 110 is provided. Is mounted.

The light emitting diode chip 110 is mounted on an electrode (not shown) formed on the substrate 100. In this case, the size of the light emitting diode chip 110 and the color of the light may be variously adjusted. For example, if only white light is to be implemented, a light emitting diode chip emitting blue light may be used as the light emitting diode chip 110. Thus, blue light emitted from the light emitting diode chip 110 is excited in the wavelength conversion layer 300 to be described later, so that white light is realized.

The housing 200 is a frame having a predetermined shape as shown in FIG. 3, and is typically manufactured by an injection process. For example, the housing 200 includes a base surface 210 and a standing surface 220 which is placed at an edge of the base surface 210. A plurality of exit holes 230 and reflection holes 240 are formed on the base surface 210.

The exit port 230 is a through-hole for emitting the light emitted from the light emitting diode chip 110 to the outside of the housing 200, the shape, size, arrangement and number of the order is changed in various ways. In the drawing, a plurality of exit holes 230 having a substantially rectangular shape are regularly arranged, and a display film 500 on which letters, numbers, symbols, and patterns are printed is arranged on the upper part thereof according to the request of the purchaser. Instead, the display film 500 may be omitted, and the shape and arrangement of the exit port 230 may be formed so that letters, numeral symbols, and patterns may be expressed according to the request of the orderer.

In addition, the reflection hole 240 is formed in a wall shape surrounding the exit port 230 so that one side communicates with the exit port 230, and an entrance 241 into which the light emitting diode chip 110 enters is formed. Is formed. In this case, the reflection hole 240 is preferably formed to have a constant inclination so that its inner diameter gradually increases from the inlet 241 toward the outlet 230 in order to efficiently emit light emitted from the light emitting diode chip 110. Do. Thus, the light emitted from the LED chip 110 is reflected from the inner peripheral surface of the reflective hole 240 is emitted toward the exit port 230.

In addition, at least one injection hole 243 into which the liquid-wavelength converting material used to form the wavelength conversion layer 300 to be described later may be injected or flow may be formed in the reflection hole 240. The injection hole 243 is formed in the horizontal direction as shown in the figure, but is not limited thereto, and may be any liquid phase converting liquid may be injected or flowed. For example, when the housing 200 is manufactured by a mold coupled up and down, the injection hole 243 may be formed in the vertical direction.

In addition, the formation of the wavelength conversion layer 300 may be provided with a means for minimizing the loss of the liquid phase wavelength conversion.

4 is a cutaway perspective view illustrating a housing of a light emitting module according to a modification of the first exemplary embodiment of the present invention. As shown in FIG. 4, the base surface 210 of the housing 200 is disposed in the reflection hole 240. A flow path 250 connecting the formed injection holes 243 may be formed. The flow path 250 is preferably formed in a "V" or "U" shape, but its shape and arrangement may be variously changed. Thus, when the liquid phase wavelength conversion material is filled in the exit port 230 to form the wavelength conversion layer 300, the liquid phase wavelength conversion liquid is injected into one of the reflection holes 240 or the flow path 250. The wavelength conversion material may be filled only in the region of the exit port 230 of the flow path 250 and the reflection hole 240 to minimize the filling of the liquid phase wavelength conversion material.

The wavelength conversion layer 300 is formed in at least one of the reflection holes 240 to excite the primary light emitted from the LED chip 110 to implement the secondary light, for example, to implement white light In order to use a light emitting diode chip emitting blue light as the light emitting diode chip 110, the wavelength conversion layer 300 is formed by including a wavelength conversion means having a yellow light emission characteristic. For example, yellow light emitting properties are obtained by using a powder of about 5 to 30 μm or a nano-size quantum dot phosphor alone or in combination with a molding resin such as an epoxy resin or a silicone resin. It can be formed by mixing the wavelength conversion means selected to have. In particular, the quantum dot phosphor, which is a nano-sized particle, is small enough so that the electrical structure is influenced or controlled by the particle size. Accordingly, by controlling the particle size of the quantum dot phosphor, the absorption and reflection spectroscopy of the quantum dot phosphor can be variously adjusted, thereby realizing secondary light of various colors. In addition, since they have nano-sized particles, they can be blended into the molding resin fairly uniformly, and there is an advantage in that the secondary light can be uniformly excited.

The housing 200 may further include a molding part 400 that protects the substrate 100. The molding part 400 is formed using a molding resin, and encapsulates the substrate 100 and is fixed to the housing 200. In this case, the molding part 400 is formed on the front surface of the substrate 100 (the surface on which the light emitting diode chip is mounted) together with the rear surface of the substrate 100 (the opposite side of the surface on which the light emitting diode chip is mounted), as shown in the drawing. It is preferred to be molded. However, the present invention is not limited thereto, and the molding part 400 may be formed on only one surface selected from the rear surface or the front surface of the substrate 100.

A process of manufacturing the light emitting module according to the first embodiment configured as described above will be described.

Method of manufacturing a light emitting module according to the present invention comprises the steps of preparing a substrate 100 on which the light emitting diode chip 110 is mounted; An exit port 230 for emitting light emitted from the light emitting diode chip 110 is formed, and an inlet port 241 is formed to surround the exit port 230 and to enter the light emitting diode chip 110. Preparing a housing having a reflection hole 240; Forming a wavelength conversion layer (300) having wavelength conversion means mixed in the exit opening (230); And mounting the substrate 100 to the housing 200 to allow the LED chip 110 to be introduced into the inlet 241.

This will be described in detail with reference to the accompanying drawings.

5A to 5F are cross-sectional views illustrating a method of manufacturing a light emitting module according to a first embodiment of the present invention.

First, as shown in FIG. 5A, a substrate 100 on which at least one LED chip 110 is mounted is prepared. In addition, a housing 200 having an exit port 230 and a reflection hole 240 is prepared.

Then, any one or a mixture thereof selected from wavelength converting means such as phosphor powder or quantum dot phosphor is mixed with the liquid resin to prepare the liquid phase converting body 310. In this case, a molding resin such as an epoxy resin or a silicone resin may be used as the resin. In this embodiment, the liquid epoxy resin and the quantum dot phosphor are mixed.

Then, as shown in FIG. 5B, the housing 200 is disposed such that the exit port 230 formed in the housing 200 is positioned downward, and then the exit formed in the lower surface of the housing 200, that is, the housing 200. The molding tape 600 is taped to the outside of the sphere 230. So it seals the outside of one side of the exit port (230).

Then, the liquid wavelength conversion 310 prepared as shown in FIG. 5C is injected into the reflection hole 240 and filled in the exit port 230. In this case, the injection of the liquid crystal wavelength 310 is injected into any one of the plurality of reflective holes 240 or the base surface 210 of the housing 200, and the liquid wavelength converting 310 is the reflective hole 240. It is injected into the exit port 230 through the injection hole 243 formed at the same time and flows to the adjacent reflection hole 240. Then, the liquid phase wavelength converter 310 is filled in the base surface 210, the exit port 230, and the reflection hole 240 of the housing 200 at a height higher than at least the height of the injection hole 243. If the housing 200 in which the flow path 250 is connected to the injection hole 243 is used as shown in FIG. 4, the liquid-wavelength converting material 310 passes through the flow path 250 and the injection hole 243. As it is filled only in the adjacent reflection hole 240 and the exit port 230, it is possible to prevent the liquid phase conversion 310 is not filled to the base surface 210 to save the raw material and lower the manufacturing cost.

The liquid wavelength converting body 310 is filled in a desired position and the liquid wavelength converting body 310 is cured by passing a predetermined time or performing a predetermined treatment to form the wavelength converting layer 300. Then, as illustrated in FIG. 5D, the curing of the liquid phase wavelength converting 310 is completed to form the wavelength conversion layer 300.

As illustrated in FIG. 5E, the substrate 100 on which the light emitting diode chip 110 is mounted is mounted on the housing 200. In this case, the LED chips 110 mounted on the substrate 100 may be disposed to be introduced into the reflection holes 240 through the inlets 241 of the corresponding reflection holes 240.

Thereafter, as illustrated in FIG. 5F, a molding part 400 may be further formed to fix the substrate 100 to the housing 200 using the molding resin. Of course, the molding part 400 may be omitted.

When the light emitting module is completed, the molding tape 600 is removed as shown in FIG. 5G. As the molding tape 600 is attached to the base surface 210 of the housing 200, the molding tape 600 protects the wavelength conversion layer 300 formed in the housing 200 and the exit port 230 during the manufacturing process of the light emitting module. To perform. However, the present invention is not limited thereto, and as shown in FIG. 5D, the molding tape 600 may be removed at any time after the liquid phase wavelength conversion is hardened to form the wavelength conversion layer 300.

In another embodiment, the present invention can manufacture a light emitting module that emits a variety of colors, including white light. In this case, a combination of light emitting diode chips (100a, 100b, 100c) emitting various colors and the wavelength conversion layer 300 including various phosphor powders or quantum dot phosphors may be used to implement various colors desired by an orderer. Can be.

6 is a cross-sectional view illustrating a light emitting module according to a second embodiment of the present invention. The second embodiment of the present invention describes a light emitting module that emits red, green, blue, and white light as an example.

As shown in FIG. 6, the reflection holes 240 are mounted on the substrate to emit the red, green, or blue light emitting diode chips 100a, 100b, and 100c, and the light emitting diode chips 110a emitting the blue light are disposed. The wavelength conversion layer 300 including the wavelength conversion means having a yellow light emission characteristic is selectively formed in the reflection hole 240 for realizing the white light, thereby expressing a variety of red, green, blue, and white light. have. Of course, the arrangement of the light emitting diode chip 110, the wavelength conversion means and the wavelength conversion layer 300 is not limited thereto, and the type and wavelength conversion layer of the light emitting diode chip, the phosphor powder and the quantum dot phosphor according to the order of the orderer. By selectively applying layouts, more colors can be achieved.

A method of manufacturing the light emitting module according to the second embodiment is as follows.

Except for forming the wavelength conversion layer 300, the method of manufacturing the light emitting module according to the first embodiment described above is applied in the same manner, and thus, redundant description of the same process will be omitted.

However, when manufacturing a light emitting module for implementing a variety of light according to the second embodiment of the present invention, in the step of preparing a housing, the reflection surrounding the exit port 230 to form the wavelength conversion layer 300 The injection hole 243 is formed only in the hole 240, and when the flow path 250 is formed, it is preferable to prepare a housing 200 in which a flow path 250 connecting only the reflection hole 240 is formed.

Thus, as the wavelength conversion layer 300 is formed, the plurality of exit holes 230 may be formed by using the housing 200 in which the injection hole 243 and the flow path 250 formed in the reflection hole 240 are selectively formed. The wavelength conversion layer 300 may be formed only in the exit port 230 required by the purchaser.

In another embodiment, the light emitting module may be manufactured by not forming the injection hole 243 in the reflection hole 240.

7 is a cross-sectional view illustrating a light emitting module according to a third embodiment of the present invention.

As shown in FIG. 7, in the light emitting module according to the third embodiment, the injection hole 243 is not formed in the reflection hole 240. However, when the liquid phase wavelength conversion 310 is injected, the liquid phase wavelength conversion portion 310 is filled to a position higher than a position where the reflection hole 240 is formed, so that the base surface 210 and the exit port 230 of the housing 200 are filled. ) And the wavelength conversion layer 300 is formed in all regions of the reflection hole 240. In addition, the light emitting module is completed by mounting the substrate 100 on which the light emitting diode chip 110 is mounted on the wavelength conversion layer 300. However, in the third embodiment, the substrate 100 is mounted on the housing 200 before the liquid phase wavelength conversion 310 is cured. Of course, at this time, it is preferable to arrange the LED chip 110 mounted on the substrate 100 to be introduced into the reflection hole 240 through the inlet 241 of the corresponding reflection hole 240. After the substrate 100 is disposed, the liquid phase wavelength converting 310 is cured to complete the wavelength converting layer 300.

As in the first embodiment, the molding part 400 may be formed to encapsulate the substrate 100 in the housing 200.

1 is a schematic exploded perspective view of a display device using a light emitting module according to the present invention;

2 is a cross-sectional view showing a light emitting module according to a first embodiment of the present invention;

3 is a cutaway perspective view illustrating a housing of a light emitting module according to a first embodiment of the present invention;

4 is a cutaway perspective view illustrating a housing of a light emitting module according to a modification of the first embodiment of the present invention;

5A to 5F are cross-sectional views illustrating a method of manufacturing a light emitting module according to a first embodiment of the present invention.

6 is a cross-sectional view showing a light emitting module according to a second embodiment of the present invention;

7 is a cross-sectional view illustrating a light emitting module according to a third embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

100 substrate 110 light emitting diode chip

200: housing 230: exit port

240: reflection hole 243: injection hole

250: Euro 300: wavelength conversion layer

Claims (14)

A substrate on which at least one light emitting diode chip is mounted; A reflection hole in which the substrate is mounted, at least one exit hole for emitting light emitted from each of the light emitting diode chips is formed, and an inlet hole for enclosing each exit hole and having the light emitting diode chip therein is formed; A housing having; A light emitting module comprising a wavelength conversion layer formed in a region including at least one of the exit port region. The method of claim 1, wherein the housing A base surface and a standing surface placed on an edge of the base surface, The exit hole and the reflection hole is formed on the base surface, At least one injection hole is formed in the reflective hole. The method according to claim 2, The light emitting module, characterized in that a flow path for connecting the injection hole formed in the reflection hole is formed on the base surface of the housing. The method according to claim 1, The housing further comprises a molding unit for protecting any one or both surfaces selected from the front or back of the substrate. The method according to claim 1, The light emitting diode chip includes at least one light emitting diode chip emitting blue light, The wavelength conversion layer is a light emitting module, characterized in that formed in at least one of the reflection holes in which the light emitting diode chip emitting at least blue. The method according to claim 1 or 5, The wavelength conversion layer is a light emitting module, characterized in that any one selected from phosphor powder or quantum dot phosphor or a mixture thereof is blended with a molding resin. Preparing a substrate on which at least one light emitting diode chip is mounted at a predetermined position; Preparing a housing having at least one exit hole for emitting light emitted from each of the light emitting diode chip is formed, the reflection hole surrounding the respective exit port is formed in the inlet for entering the light emitting diode chip Wow; Forming a wavelength conversion layer in which the wavelength conversion means is mixed in the exit port; And mounting a substrate in a housing such that a light emitting diode chip is introduced into the inlet. The method of claim 7, wherein forming the wavelength conversion layer, And selectively forming a wavelength conversion layer in which wavelength conversion means is mixed in at least one of the plurality of exit holes. The method according to claim 7 or 8, Forming the wavelength conversion layer, Mixing the wavelength conversion means with the liquid molding resin to prepare a liquid phase wavelength conversion product; Taping the exterior of the outlet of the housing with molding tape; Injecting the prepared liquid wavelength conversion into the reflection hole and filling the exit hole, And curing the liquid wavelength converting material after forming the wavelength conversion layer or mounting the substrate to a housing. The method according to claim 9, In the step of forming the housing, Prepare a housing so that an injection hole is formed in the reflection hole surrounding the exit hole in which the wavelength conversion layer is formed among the reflection holes. In the step of filling the exit wavelength liquid phase conversion, The liquid crystal wavelength conversion method is a light emitting module manufacturing method, characterized in that the filling through the injection hole through the injection hole. The method according to claim 10, In the step of forming the housing, Prepare a housing such that a flow path is further formed between the injection holes formed in the reflection hole, In the step of filling the exit wavelength liquid phase conversion, The liquid crystal wavelength conversion method is a light emitting module manufacturing method characterized in that the flow along the flow path is filled with the exit port. The method according to claim 9, And removing the molding tape after curing the liquid phase wavelength converting material. The method of claim 7, After mounting the substrate in a housing, forming a molding portion encapsulating and protecting the substrate. The method according to claim 9, The wavelength conversion means is a light emitting module manufacturing method, characterized in that any one selected from phosphor powder or quantum dot phosphor (or a mixture thereof).

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