KR20100021897A - Method for manufacturing multi-layer printed circuit board - Google Patents

Abstract

PURPOSE: A method for manufacturing multi-layer circuit substrate is provided to shorten total procedure by removing release paper during compression of laminated plate on a circuit substrate. CONSTITUTION: A laminated plate is formed by adhering copper foil with an insulating plate(221) containing a circuit substrate(111) and insulating material. More broader remainder part than the insulating plate is formed at both sides of the copper foil. A laminated plate is laminated at the upper portion of the circuit substrate or upside and downside. Two roll laminators are arranged in a uniform interval. The laminated circuit substrate and laminated plate pass gap between the two roll laminators. The laminated plates are compressed by the two roll laminators. The remainder part of the copper foil is cut.

Description

Method for manufacturing multi-layer printed circuit board

The present invention relates to a method of manufacturing a printed circuit board, and more particularly, to a method of manufacturing a printed circuit board composed of a multilayer.

With the development of electronic and communication technologies, electronic / communication devices such as mobile phones are becoming smaller and higher in performance. As a result, printed circuit boards embedded in electronic / communication devices are increasingly composed of multilayer printed circuit boards to handle many functions.

 In general, in order to manufacture a multilayer printed circuit board, a multilayer is implemented by using a lamination process through heating and pressing in a panel process. The multilayer printed circuit board is manufactured in such a manner that a semi-cured insulating material and a copper foil (Cu-foil) are laminated to form an inner layer material and an insulating material that are formed by laminating the circuit. have. As described above, a circuit is formed on a copper clad laminate through a layup process, and a vacuum press or a semi-cured material and copper foil on which glass cloth is impregnated with epoxy is placed on it. It is manufactured by a method of forming a multilayer using a vacuum laminator (Vacuum Laminator).

At this time, when the insulating material that implements the multilayer is bonded to the inner layer material by heat and pressure, the resin of the insulating material flows out. The flowed resin contaminates the surface of the pressurized stainless steel plate. Or residues on the surface of the copper foil, resulting in poor product quality. In addition, in order to remove the contaminated resin on the surface of the pressurized SUS plate, the resin is removed by sanding or grinding the pressurized SUS plate surface, which shortens the life of the expensive SUS plate and prevents it. In order to prevent the surface contamination phenomenon by using a release film (Release film), which leads to the defects of manual work and increase the manufacturing cost.

An object of the present invention is to provide a method for manufacturing a multilayer printed circuit board to prevent contamination due to the resin generated during the lamination process.

Another object of the present invention is to provide a method for manufacturing a multilayer printed circuit board which reduces cost when using a roll to roll method.

Another object of the present invention is to provide a method for manufacturing a multilayer printed circuit board which shortens the process when using a roll method.

The present invention to achieve the above object,

A method of manufacturing a multilayer printed circuit board in a roll method, the method comprising: (a) a circuit board, and an insulating plate composed of an insulating material and a laminated plate bonded to a copper foil composed of copper, wherein the insulating plate is formed on both sides of the copper foil. Having a wider excess; (b) stacking the laminate on top of the circuit board, and pressing the circuit board and the laminate using two roll laminators; And (c) provides a method of manufacturing a multilayer printed circuit board comprising the step of cutting the excess of the copper foil.

In order to achieve the above objects, the present invention also provides

A method of manufacturing a multilayer printed circuit board in a roll method, the method comprising: (a) a circuit board and two laminated plates bonded to an insulating plate made of an insulating material and a copper foil made of copper, each of which is formed on both sides of the copper foil. Providing a redundant portion wider than the insulating plate therein; (b) stacking the laminates on top and bottom of the circuit board, and pressing the circuit board and the laminate using two roll laminators; And (c) cutting each surplus of the copper foils.

The present invention to achieve the above object,

A method of manufacturing a multilayer printed circuit board in a sheet method, the method comprising: (a) a circuit board, and an insulating plate made of an insulating material and a laminated plate bonded to a copper foil made of copper, the edges of the copper foil being wider than the insulating plate. Providing a surplus; (b) adhering the laminate on top of the circuit board; And (c) provides a method of manufacturing a multilayer printed circuit board comprising the step of cutting the excess.

The present invention to achieve the above object,

A method of manufacturing a multilayer printed circuit board in a sheet method, the method comprising: (a) a circuit board and two laminated plates bonded to an insulating plate made of an insulating material and a copper foil made of copper, wherein the laminates each have an edge of the copper foil. Providing a redundant portion wider than the insulating plate therein; (b) bonding the laminates to the top and bottom of the circuit board; And (c) cutting each excess of the copper foils to provide a method of manufacturing a multilayer printed circuit board.

According to the present invention, the laminated plates 201 and 301 are formed by bonding the insulating plates 221 and 321 to the copper foils 211 and 311 and then compressing the insulating plates 221 and 321 to the circuit board 111 to manufacture the multilayer printed circuit board 901. The excess portions 231 and 331 are formed by making the areas of the copper foils 211 and 311 wider than the areas of the insulating plates 221 and 321. Then, when the laminates 201 and 301 are pressed onto the circuit board 111, the resins 511 protruding from the insulation plates 221 and 321 are buried in the excess portions 231 and 331 of the copper foils 211 and 311. Surplus portions 231 and 331 are cut during the process and removed from the laminates 201 and 301.

As such, by cutting and removing the excess portions 231 and 331 of the copper foils 211 and 311 contaminated by the resin 511, the multilayer printed circuit board 901 may be prevented from being contaminated. In addition, since it is not necessary to use a release paper when the laminates 201 and 301 are pressed onto the circuit board 111, the cost is reduced. In addition, the process of removing the contamination on the copper foils 211 and 311 and the process of using the release paper are not required, thereby reducing the overall process.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. Like reference numerals in the drawings denote like elements.

1 to 7 are diagrams for sequentially explaining a method of manufacturing a multilayer printed circuit board according to the present invention.

First, FIG. 1 is a side cross-sectional view of a circuit board for a core embedded in a multilayer printed circuit board of the present invention. Referring to FIG. 1, circuit patterns 121 and 122 are formed on the upper and lower portions of the circuit board 111, and the circuit patterns 121 and 122 are via lines formed between the upper and lower portions of the circuit board 111. 131 may be electrically connected to each other. The circuit patterns 121 and 122 may include a plurality of electrical elements (not shown) that perform a control function and wiring patterns (not shown) that connect the plurality of electrical elements to each other.

1 illustrates a double-sided circuit board having circuit patterns 121 and 122 formed on both surfaces of a circuit board 111 as a circuit board for a core, but a single-sided circuit board having a circuit pattern formed on only one surface may be used.

FIG. 2A is a top perspective view of one embodiment of a laminate used in the multilayer printed circuit board of the present invention, and FIG. 2B is a rear perspective view of the laminate shown in FIG. 2A. 2A and 2B, the laminate 201 is formed by bonding an insulating plate 221 made of an insulating material and a copper foil 211 made of copper to each other. The insulating plate 201 is preferably a dielectric layer material composed of a prepreg sheet composed of prepreg, which is a kind of insulating material, and is kept in a semi-cured state, and the copper foil is composed of copper. desirable. In addition, the laminate 201 is preferably made of Prepreg Coated Copper (PCC) in which the prepreg sheet and the copper foil 211 are bonded to each other.

The laminate 201 is preferably configured in the form of a quadrilateral roll having a short horizontal side and a long vertical side. At this time, the copper foil 211 is configured to be larger than the insulating plate 221. That is, the copper foil 211 has redundant portions 231 configured to be wider than the insulating plate 221 on both sides. The area of the surplus portion 231 is preferably configured to about 10% of the area of the insulating plate 221. 2A and 2B is a structure used when manufacturing a multilayer printed circuit board (901 of FIG. 9) in a roll to roll manner.

3 is a rear perspective view of another embodiment of a laminate used in the multilayer printed circuit board of the present invention. Referring to FIG. 3, the laminate 301 is formed by bonding an insulating plate 321 made of an insulating material and a copper foil 311 made of copper to each other. The insulating plate 321 is preferably a dielectric layer material composed of a prepreg sheet composed of a prepreg which is a kind of insulating material, and is kept in a semi-cured state, and the copper foil 311 is preferably composed of copper. In addition, the laminate 301 is preferably composed of a PCC in which the prepreg sheet and the copper foil 311 are bonded to each other.

It is preferable that the laminated board 301 is comprised by a quadrangular shape, At this time, the copper foil 311 is comprised more widely than the insulating plate 321. As shown in FIG. That is, the copper foil 311 is provided with an excess portion 331 having four surfaces wider than the insulating plate 321. At this time, the area of the excess portion 331 is preferably configured to about 20% of the area of the insulating plate 321. The laminated board 301 shown in FIG. 3 is a structure used when manufacturing a multilayer printed circuit board (901 of FIG. 9) in a sheet system.

FIG. 4 is a view for explaining a method of compressing the circuit board 111 of FIG. 1 and the laminate 201 of FIGS. 2A and 2B. 4 shows a method of manufacturing a multilayer printed circuit board (901 of FIG. 9) by a roll process. Referring to FIG. 4, the laminates 201 are disposed on the upper and lower portions of the circuit board 111 and passed between the two roll laminators 411 and 412. Then, the roll laminators 411 and 412 rotate in the same direction to compress the laminates 201 from the top and bottom sides to the center. Thus, the laminates 201 are integrally compressed to the circuit board 111. The roll laminators 411 and 412 are installed vertically at regular intervals, and are fixed to the roll laminator facility (not shown) to operate under the control of the roll laminator facility.

By compressing the laminates 201 and the circuit board 111 using the roll laminators 411 and 412 as described above, a void that may occur between the laminates 201 and the circuit board 111 may be vacuumed. Removed at source, thereby improving the flatness of the multilayer printed circuit board (901 of FIG. 9).

In addition, by using the roll laminators 411 and 412 instead of the SUS plate (not shown), there is no need to use a release paper. Therefore, the cost incurred due to the release paper is not necessary and the cost is reduced.

In addition, the process of using the release paper is unnecessary, and the manufacturing process of the multilayer printed circuit board (901 of FIG. 9) is also shortened.

4 illustrates a crimping process when the core circuit board 111 is a double-sided circuit board, and the process of FIG. 4 may be applied to the case where the core circuit board 111 is a single-sided circuit board.

FIG. 5 is an enlarged front view of the result formed by the method of FIG. 4. FIG. Referring to FIG. 5, the resin 511 may be pushed out from the insulating plates 221 while the laminates 201 are pressed onto the circuit board 111, and the resin 511 may be copper foils 211. The surplus parts 231 will be asked. Therefore, by cutting the excess portions 231 embedded in the resin 511 as shown in FIG. 6, the resin 511 does not contaminate the multilayer printed circuit board 901 of FIG. 9.

As described above, the process of removing the contamination on the copper foil 211 or the SUS has been performed separately. However, in the present invention, the contamination is prevented only by cutting off the excess portion 231 on which the resin 511 is stained. The process of the circuit board 901 of FIG. 9 is simplified.

6 is an enlarged front view illustrating a state in which excess portions of the copper foil of FIG. 5 are cut out. Referring to FIG. 6, the circuit board 111 is prevented from being contaminated by the resin (511 of FIG. 5).

FIG. 7 is a side sectional view in which via holes 721 are formed in the laminates 201 illustrated in FIG. 6. The via holes 711 and 721 expose some of the circuit patterns 121 and 122 formed on the circuit board 111 to the outside. Laser processing may be used to form the via holes 711 and 721. That is, after arranging a laser (not shown) on the upper and lower portions of the laminates 211 and 221, the via holes 711 and 721 may be formed by irradiating the laser, or the via holes 711 and 721 using a mechanical drill. May be formed.

FIG. 8 is a side cross-sectional view in which via lines are formed in the laminates shown in FIG. 6. Via lines 811 and 812 are formed in the via holes 711 and 721 of FIG. 6 by filling an electrode material such as solder, copper, or the like. The via lines 811 and 812 are for electrically connecting the circuit patterns 121 and 122 of the circuit board 111 to the wiring patterns 911 and 912 of FIG. 9 formed by the copper foils 211.

9 is a side cross-sectional view of a multilayer printed circuit board on which a wiring pattern is formed on an insulating plate and completed. In order to form the wiring patterns 911 and 912 on the insulating plate 221, first, the wirings are patterned by using a mask on the copper foils 211 of FIG. 8. Subsequently, unnecessary portions of the copper foils (211 of FIG. 8) are removed. Then, the multilayer printed circuit board 901 having the wiring patterns 911 and 912 as shown in FIG. 9 is completed. The method of forming the wiring patterns 911 and 912 on the copper foils 211 of FIG. 8 may use a method of forming a circuit pattern on a semiconductor chip (not shown). Will be omitted.

7 and 8 may be performed by reversing the order of the process shown in FIG. 9, and the result is the same.

Although the present invention has been described with reference to the embodiments shown in FIGS. 1 to 9, this is merely exemplary, and various modifications and equivalent other embodiments may be made by those skilled in the art. I will understand. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

1 is a side cross-sectional view of a circuit board for a core embedded in a multilayer printed circuit board of the present invention.

2A is a top perspective view of one embodiment of a laminate used in a multilayer printed circuit board of the present invention.

FIG. 2B is a rear perspective view of the laminate shown in FIG. 2A.

3 is a rear perspective view of another embodiment of a laminate used in the multilayer printed circuit board of the present invention.

FIG. 4 is a view for explaining a method of compressing the circuit board of FIG. 1 and the laminate of FIGS. 2A and 2B.

FIG. 5 is an enlarged front view of the result formed by the method of FIG. 4. FIG.

As a result, the process of the multilayer printed circuit board is simplified.

6 is an enlarged front view illustrating a state in which excess portions of the copper foil of FIG. 5 are cut out.

FIG. 7 is a side cross-sectional view in which via holes are formed in the laminates illustrated in FIG. 6.

FIG. 8 is a side cross-sectional view in which via lines are formed in the laminates shown in FIG. 6.

FIG. 9 is a side cross-sectional view of a multilayer printed circuit board on which a wiring pattern is formed on an insulating plate, thereby completing fabrication.

<Description of the symbols for the main parts of the drawings>

111; Circuit board, 121,122; Circuit patterns

131; Empty lines, 201,301; Laminate

211,311; Copper foil, 221,321; Insulation plate

231,331; Excess, 411,412; Roll laminators

511; Resins, 711,721; Beer Hall

811,812; Empty line, 901; Multilayer Printed Circuit Board

911,912; Wiring pattern

Claims (10)

In the method of manufacturing a multilayer printed circuit board in a roll (roll) method, (a) having a circuit board, an insulating plate made of an insulating material, and a laminated plate bonded to a copper foil made of copper, and having redundant portions wider than the insulating plate on both sides of the copper foil; (b) stacking the laminate on top of the circuit board, and pressing the circuit board and the laminate using two roll laminators; And (c) cutting the excess part of the copper foil. In the method of manufacturing a multilayer printed circuit board in a roll method, (a) having a circuit board and two laminated plates to which an insulating plate made of an insulating material and a copper foil made of copper are bonded, each of which has a wider portion on both sides of the copper foil than the insulating plate; (b) stacking the laminates on top and bottom of the circuit board, and pressing the circuit board and the laminate using two roll laminators; And (c) cutting each excess of the copper foils. The method of claim 1, wherein the insulating material is made of prepreg. The method of claim 1 or 2, wherein step (b) (b-1) stacking the laminates on top or top of the circuit board; And (b-2) two roll laminators are arranged at regular intervals, and the laminated circuit board and the laminated plate are passed between the two roll laminators, at which time the two toll laminators rotate and the laminated plate is rotated. And applying pressure to the laminated substrate and advancing the laminated substrate and advancing the laminated sheets. The method of manufacturing a multilayer printed circuit board according to claim 1 or 2, wherein the surplus portion constitutes about 10% of the area of the plate made of the insulating material. In the method of manufacturing a multilayer printed circuit board by a sheet method, (a) having a circuit board and a laminated plate bonded with an insulating plate made of an insulating material and a copper foil made of copper, and having an excess portion wider than the insulating plate at an edge of the copper foil; (b) adhering the laminate on top of the circuit board; And (c) a method of manufacturing a multilayer printed circuit board, comprising the step of cutting the excess part. In the method of manufacturing a multilayer printed circuit board by a sheet method, (a) having a circuit board and two laminated plates bonded to an insulating plate made of an insulating material and a copper foil made of copper, each of which has a wider portion at the edge of the copper foil than the insulating plate; (b) bonding the laminates to the top and bottom of the circuit board; And (c) cutting each excess of the copper foils. The method of manufacturing a multilayer printed circuit board according to claim 6 or 7, wherein the insulating material comprises prepregs. The method of manufacturing a multilayer printed circuit board according to claim 6 or 7, wherein the excess part constitutes about 20% of the area of the plate made of the insulating material. A multilayer printed circuit board formed by the manufacturing method of any one of claims 1 to 9.

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