KR20100021333A - Carbon nanotube network-based nano-composites - Google Patents

Abstract

PURPOSE: A carbon nanotube network-based nano-composite is provided to form a uniform conductive bridge on a CNT network by relaying electrical energy flow. CONSTITUTION: An apparatus for preparing a carbon nanotube network-based nano-composite comprises: a power supply unit(402) for generating electrical energy; an electroplating solution(416) including any one selected from the group consisting of metallic ion, conductive polymer and their combination; an anode(406) which is dipped in the electroplating solution and is connected to the power supply unit; at least two electrodes(408,410) dipped in the electroplating solution; and a relay(418) for switching electrical energy flow.

Description

Nanocomposites based on carbon nanotube networks {CARBON NANOTUBE NETWORK-BASED NANO-COMPOSITES}

The present disclosure relates generally to nanocomposites and more particularly to nanocomposites based on carbon nanotube (CNT) networks.

In recent years, CNTs have attracted considerable interest in many fields of research due to their excellent mechanical, thermal and electrical properties, which make them potentially useful for various applications in nanotechnology, electronics, optics and other fields.

CNTs are generally synthesized by chemical vapor deposition (CVD), laser ablation, or arc discharge methods, and single-walled carbon nanotubes (SWNTs) and multiwall nanotubes ( multi-walled carbon nanotubes (MWNs). Multi-walled nanotubes include concentric cylinders in which the smallest intermediate cylinder is adjacently surrounded by a larger cylinder, which in turn is surrounded by a larger cylinder. Here, each cylinder represents the "wall" of the CNT, hence the name "multi-walled" nanotubes.

CNTs have been used extensively in many applications because of their exceptional physical properties, but the major drawbacks in CNT based applications are non-reproducibility. The diversity in the chirality and structure of the CNTs makes it difficult to consistently reproduce one CNT device. However, this individual variation can be suppressed in the CNT network by ensemble averaging over a large number of CNTs. CNT networks are fabricated and reproduced at high efficiency and low cost by using processes such as dip coating, spraying and vacuum filtration. This feature allows CNT networks to be ideal candidates for a variety of applications. For example, CNT networks are being studied for thin film transistors, diodes, strain sensors, chemical sensors, field emission devices, and transparent conductive electrodes. In particular, CNT transparent conducting electrodes (CNT-TCE) can provide the major components of next-generation flexible displays due to their excellent electrical properties and mechanical flexibility.

TCE may be used in various applications such as a liquid crystal display (LCD), a plasma display panel (PDP), and a touch pad. Indium tin oxide (ITO) is a common TCE material suitable for most applications, but indium is a rare material currently produced only in Russia. As the demand for TCE continues to increase, the price of indium is increasing rapidly. TCE is generally produced by coating an ITO layer on a glass substrate or a flexible polymer substrate. However, since ITO is a brittle material, it is disadvantageous in that it is not suitable for a flexible display, which has recently received considerable attention. Therefore, there is a need to develop a low-cost TCE with sufficient flexibility.

In addition, even though individual CNTs have high electrical conductivity, the resistance that occurs at the junction between one CNT and the other CNT is a major obstacle to commercializing CNT-TCE with low resistivity. In addition, there is a barrier that the synthesis technology required to utilize the excellent physical properties of CNTs is complex and inefficient.

Provided herein are nanocomposites, methods and devices for making nanocomposites. In one embodiment, an apparatus for manufacturing a nanocomposite includes a power supply, an electroplating solution, an anode, two or more electrodes arranged at predetermined intervals to be immersed in the electroplating solution, and connected to the power supply and the two or more electrodes. And a relay configured to divert electrical energy flow from some of the two or more electrodes to another of the two or more electrodes.

In another embodiment, an apparatus for manufacturing a nanocomposite is connected between a power supply, an electroplating solution, an anode, an electrode, and between the power supply and two or more portions of the electrode, and from the portion of two or more portions of the electrode. A relay configured to divert electrical energy flow to another portion of the two or more portions of the electrode.

In another embodiment, a method of making a nanocomposite includes forming a CNT network, immersing the CNT network in an electroplating solution, applying electrical energy, and having a uniform conductive bridge over the CNT network. And relaying the electrical energy flow to produce a.

In another embodiment, the present disclosure provides nanocomposites based on CNT networks.

The above summary of the embodiments is intended to introduce conceptually by briefly extracting the contents described in more detail in the following detailed description. The above summary is not intended to identify key features or essential features of the claims or to limit the claims.

In the following detailed description, reference is made to the accompanying drawings, which form a part of this disclosure. Unless indicated otherwise, like reference numerals in the drawings generally refer to like elements. The illustrative embodiments described in the detailed description, drawings, and claims are not meant to limit the scope of the disclosure. Other embodiments may be utilized, and other changes may be made, without departing from the spirit or scope of the claims presented in this disclosure. As generally described in the present disclosure and illustrated in the figures, the disclosed components may be arranged, substituted, combined and designed in various types of other structures, all of which are expressly considered part of this disclosure and are part of this disclosure. It will be easy to understand that it makes sense.

As used in this disclosure, “junction point” means the portion at which the CNTs connect or cross each other. The term "junction point" also includes states in which the CNTs are adjacent to each other at intervals such that the CNTs form a bridge by the conductive material. At this time, the size and density of the conductive bridge is in a range that does not seriously impair its transparency for various uses of the prepared nanocomposite. In addition, the size and density of the conductive bridges are in a range that reduces the resistance between the CNTs in the CNT network.

1 is a diagram illustrating an apparatus 100 for manufacturing a nanocomposite according to an embodiment. As shown, the apparatus 100 includes a power supply 102, a vessel 104, an anode 106, an electrode 108, a substrate 112, and an electroplating solution 114. The power supply 102 is electrically connected to the anode 106 and the electrode 108. In some embodiments, the device 100 for manufacturing the nanocomposite may be an electroplating device. The CNT network 110 attached to the electrode 108 is immersed in the electroplating solution 114 to perform electroplating thereon. Electrical energy is applied across the anode 106 and the electrode 108 immersed in the electroplating solution 114 such that the CNT network 110 is formed of a metal in the electroplating material, e. Nanocomposites are produced by deposition on the M). Various kinds of metals and conductive polymers may be used to form the electroplating solution 114. In this way the electroplating material can act as a bridge between the CNTs, thereby reducing the resistance between the CNTs crossing within the CNT network 110.

2 and 3 show scanning electron microscopy (SEM) images of different regions of the nanocomposite fabricated using the device 100 of FIG. 1 according to one embodiment. As shown in FIG. 2, the region near the electrode 108 of the nanocomposite has a high electroplating material (eg, Cu) density over the CNT network 110. On the other hand, the other portions farther away from the electrode 108, the CNT density distribution on the CNT network 110 is uniform, as shown in FIG. 3, but the density of the electroplating material is low. 2 and 3, since the CNT network 110 has been electroplated in the electroplating solution 114 for a long time, as a result, a significant amount of electroplating material is deposited on the CNT network 110, in particular the CNT network 110. ), And the CNTs of FIG. 2 become more opaque than the CNTs of FIG. 3. Given that electroplating materials, such as metals or conductive polymers, tend to gather around electrode 108, the density distribution of electroplating materials for nanocomposites fabricated using device 100 of FIG. 110) is not uniform, resulting in nonuniform electrical resistance and transparency depending on the site of the nanocomposites produced.

4 illustrates an apparatus 400 for manufacturing a nanocomposite according to another embodiment. As shown, the device 400 includes a power supply 402, a container 404, an anode 406, two electrodes 408, 410, a substrate 414, an electroplating solution 416, and a relay 418. ). The power supply 402 is electrically connected to the anode 406 and the relay 418. Relay 418 is electrically connected to two electrodes 408 and 410. Two electrodes 408 and 410 are attached to two opposite ends of CNT network 412.

Relay 418 may be a changeover switch having two switch positions. Relay 418 causes the first electrical circuit between electrode 408 and anode 406 to be converted to a second electrical circuit between electrode 410 and anode 406, where the second electrical circuit is a first electrical circuit. Can be separated from the circuit.

The electroplating solution 416 may include metal ions, conductive polymers, or a combination thereof. Various types of metals and conductive polymers may be used for the electroplating solution 416 to form conductive bridges between the CNTs at junctions between the CNTs. Electroplating solution 416 may comprise a composition suitable for electroplating a particular conductive material.

The electroplating material (denoted by the symbol “ES”) of the electroplating solution 416 includes a metal, a conductive polymer, or a combination thereof. This means that metal ions, conductive polymers or combinations thereof in the electroplating solution 416 act as electroplating materials. If the electroplating material comprises a metal, which forms a conductive bridge between different CNTs at the junction between the tubes, the metal as the electroplating material is Al, Cr, Co, Ni, Cu, Zn, Rh, Pd, Ag, Sn, W, Pt, Au, Ti, Mn, Cd and Pb is at least one selected from the group consisting of. In some embodiments, the metal bridge is made by the process described above using metals such as Cu, Au, Ni, and the like. For example, Cu may be used as the electroplating material, wherein a bath of sulfuric acid (0.75 M CuSO ₄ .5H ₂ O + 74 g / L sulfuric acid + 0.2 g / L gelatin) is used as the electroplating solution 416. Can be prepared. In another embodiment, Au may be used as the electroplating material, where Au bath (12 g / L KAu (CN) ₂ + 90 g / LC ₆ H ₅ Na ₃ O ₇ .2H ₂ O) is added to the electroplating solution 416 Can be prepared as). According to another embodiment, Ni may be used as the electroplating material, in which sulfamate-chloride baths (600 g / L Ni (SO ₃ NH ₂ ) ₂ .4H ₂ O + 5 g / L NiCl ₂ .6H ₂ O. + 45 g / LH ₃ BO ₃ ) may be prepared as the electroplating solution 416.

If the electroplating material comprises a conductive polymer, the conductive polymer may be polyaniline, polyimide, polyester, polyacetylene, polypyrrole, polythiophene, poly-p-phenylenevinylene, polyepoxide, polydimethylsiloxane, One or more selected from the group consisting of polyacrylates, polymethylmethacrylates, cellulose acetates, polystyrenes, polyolefins, polymethacrylates, polycarbonate polysulfones, polyethersulfones, and polyvinyl acetates.

The anode 406 is selected from the group consisting of Al, Cr, Co, Ni, Cu, Zn, Rh, Pd, Ag, Sn, W, Pt, Au, Ti, Mn, Cd and Pb. In the electroplating process, a metal of the same kind as the electroplating material may be used as the anode 406. If the electroplating material is a conductive polymer, Pt, Ag, Cu or Ni may be used as the anode 406, but is not limited thereto.

Any metal with good conductivity can be used as the electrode 408, 410 material. For example, Cu, Ni, or Al may be used as the electrodes 408 and 410, but is not limited thereto.

The substrate 414 may be selected from the group consisting of glass, glass wafers, silicon wafers, quartz, plastics, and transparent polymers, but is not limited thereto.

As shown in FIG. 4 for the preparation of the nanocomposite, the CNT network 412 attached to the two electrodes 408, 410 is immersed in the electroplating solution 416 contained in the vessel 404. In another embodiment, the CNT network 412 attached to the two electrodes 408, 410 may be supported in the electroplating solution 416 by a support mechanism (not shown in FIG. 4).

The potential generated by the power supply 402 is applied across the anode 406 and the two electrodes 408, 410 immersed in the vessel 404, causing the CNT network 412 to be electroplated with an electroplating material. . According to another embodiment, the CNT network 412 itself may act as an electrode alone without the need for other electrodes. In this case, the power supply 402 may be directly connected to two ends of the CNT network 412.

The power supply setting may be a voltage setting or a current setting. Furthermore, one or more rectifiers (not shown in FIG. 4) are disposed between the power supply 402 and the relay 418, disposed between the power supply 402 and the anode 406, or with the power supply 402. It may be placed both between the relay 418 and between the power supply 402 and the anode 406. The density, shape and size of the conductive bridge electroplated over the CNT network 412 can be controlled by voltage level, current level, amount of electroplating material, or a combination thereof. In the preparation of the nanocomposites, the current density can range from about 1 nA / cm ² to about 1000 mA / cm ² .

When a potential is applied to the CNT network 412, a potential drop may occur at the junction between the different CNTs, causing a temperature difference within the CNT network 412. That is, the temperature around the junction between the different CNTs may be higher than the temperature of other portions in the CNT network 412. Due to the potential drop, the temperature difference, or both, the electroplating material, such as a metal or conductive polymer, is selectively attracted to the junction location between the different CNTs, predominantly electroplating over the junction, resulting in Make different CNTs bridge with each other.

After a predetermined time, the relay 418 is switched to supply electrical energy from one electrode, for example electrode 408, to another electrode, for example electrode 410. Electroplating forms a uniform conductive bridge between different CNTs by relaying the electrical energy flow one or more times through a relay between two electrical circuits formed by two electrodes 408 and 410. The length of the relay time and the relay frequency can be determined by routine experimentation. As a result, the contact resistance between different CNTs can be significantly reduced. The transparency of the prepared nanocomposite can be controlled within the range useful for its use by adjusting the electroplating conditions.

In some embodiments, one or more detectors, for example detectors 420 and 422 of FIG. 4, may be connected between anode 406 and two electrodes 408 and 410 to measure electrical values such as voltage and current. Can be. The resistance value, transparency value or both can be calculated from this measured electrical value and used to adjust the electroplating conditions. Furthermore, the resistance value, the transparency value or both can be used to check whether the electroplating has been performed to have the desired physical properties and / or to determine the completion time of the electroplating.

In some embodiments, device 400 may include, but is not limited to, a controller 424, such as a computer. The controller 424 can operate under the control of a computer program stored on a hard disk drive or by another computer program, such as a program stored on a removable disk. In some embodiments, controller 424 may be a programmable logic computer (PLC) such as an Allen-Bradley Controllogix processor or a Modicon PLC. The controller 424 may receive input signals from various other components of the apparatus 400 and control certain parameters of the apparatus 400 based on these signals. For example, to adjust electroplating conditions such as voltage, current, electroplating time, switching cycles, etc., the controller 424 may include one or more of the power supply 402 and the relay 418, and optionally the detector 420. 422). By automatically controlling parameters relating to voltage, current, relay time, etc. by the controller in this manner, within the device 400 the controller can adjust the electroplating conditions relatively immediately after receiving the input signal.

Since the direction of electrical energy flow alternates from one electrical circuit to another via two electrodes 408, 410, the device 400 allows the conductive bridge to prevail in a particular area of the CNT network 412. It can be prevented from forming. In this way, it is possible to produce nanocomposites with uniform conductive bridges over the CNT network 412 in a simple and efficient manner without compromising physical properties such as resistance and transparency.

Depending on the design requirements and / or application, the number and arrangement of electrodes can have a variety of ways. For example, in another exemplary embodiment of an apparatus 500 for manufacturing nanocomposites, four electrodes 508, 510, 512, 514 attached to the CNT network 516, as shown in FIG. 5. ) As shown, apparatus 500 includes power supply 502, vessel 504, anode 506, four electrodes 508, 510, 512, 514, substrate 518, electroplating solution 520. And relay 522. The power supply 502 is electrically connected to the node 506 and the relay 522. Relay 522 is electrically connected to four electrodes 508, 510, 512, 514.

Relay 522 may be a changeover switch having four switch positions. The relay 522 has an electrical circuit between one of the four electrodes 508, 510, 512, 514 and the anode 506, the anode and the other of the four electrodes 508, 510, 512, 514. To selectively switch to other electrical circuits between 506, where these electrical circuits can be separated from each other. Any one of a number of approaches for relaying the flow of electrical energy between the plurality of electrodes 508, 510, 512, 514 can be employed, where the relay 522 allows two electrical circuits to act simultaneously. It can then be switched to the remaining two electrical circuits. For example, at the beginning of electroplating, relay 522 may be set to electrically connect anode 506 and two electrodes 508, 512 such that two electrical circuits occur simultaneously. After a predetermined time, the relay 522 is switched to a position connecting the anode 506 and the remaining two electrodes 510 and 514.

The type of material used for the electroplating material (denoted by the symbol “ES”), the anode 506, the electrodes 508, 510, 512, 514 and the substrate 518 of the apparatus 500 is described in connection with FIG. 4. May be identical to In addition, the apparatus 500 may further include a support mechanism, one or more rectifiers, or both.

The power supply setting may be a voltage setting or a current setting. The voltage level, current level, amount of electroplating material, or a combination thereof is adjusted to control the density and size of the electroplating material electroplated over the CNT network 516.

In some embodiments, one or more detectors (524, 526, 528, 530 of FIG. 5) provide anode 506 and four electrodes 508, 510, 512, 514 to measure electrical values such as voltage and current. Can be connected between. In another embodiment, the apparatus 500 may include a controller 532. The controller 532 may include one or more of the power supply 502 and the relay 522, and optionally a detector (524, 526 of FIG. 5) to adjust electroplating conditions such as voltage, current, electroplating time, switching cycles. , 528, 530 may be electrically connected. In some embodiments, two or more power supplies may be used instead of one power supply 502.

The density, shape and size of the conductive bridges electroplated over the CNT network 516 can be adjusted by voltage level, current level, amount of electroplating material, or a combination thereof.

According to another embodiment, relay 522 may have a greater number of switch contact sets, and the direction, order, and number of relayed electrical energy flows may vary as needed.

In some embodiments, various post-treatments, such as UV irradiation, thermal anneal, electroplating, and the like may be employed to further improve the properties of the nanocomposites according to the application.

6 shows a schematic diagram of an example of a CNT network 412 that includes a metal (denoted by the symbol “M”) bridge manufactured according to one embodiment. The size of the metal bridge may range from about 0.5 nm to about 10 nm, but is not limited thereto.

7 shows a schematic diagram of an example of a CNT network 412 that includes a conductive polymer (denoted by “CP”) bridge made according to one embodiment. As shown in FIG. 7, the conductive polymer easily penetrates into the narrow space between the CNTs at the junction due to capillary action. The conductive polymer is inserted into or wrapped around the junction between the different CNTs to create a nanocomposite comprising the conductive bridge.

As shown in FIGS. 6 and 7, the nanocomposite includes a CNT network 412 having one or more intertube junctions between two or more CNTs and an electroplating material associated with the CNT network 412. At this time, a major content of the electroplating material, for example about 70% to about 100% of the electroplating material associated with the CNT network, may be present at one or more intertube junctions, but is not limited thereto. The electroplating material provides one or more conductive bridges between two or more CNTs.

According to the present disclosure, in order to evenly distribute the conductive bridges over the CNT network, by changing the position of the working electrode through the relay, the electroplating material is uniformly electroplated at the junction between the CNTs, resulting in an electroplating coating. Erosion can be improved. Contact resistance between different CNTs can also be uniform for the nanocomposite. The nanocomposite according to the present disclosure may have a sheet resistance of about 1 Ω / sq to about 1000 Ω / sq, depending on its use. Furthermore, the transparency of the prepared nanocomposites can be adjusted to have a narrow standard deviation.

8 is a flowchart for manufacturing a nanocomposite based on the CNT network according to one embodiment.

In step 820, the CNT network is subjected to dip coating, spin coating, bar coating, spraying, self assembly, Langmuir-Blodgett deposition, vacuum filtration and the like. It can be formed using various techniques.

To form a CNT network, a CNT colloidal solution can be prepared by dispersing the purified CNT in deionized water or a solvent such as, for example, 1,2-dichlorobenzene, dimethyl formamide, benzene, methanol, and the like. . Since CNTs prepared by currently available methods may contain impurities, it may be necessary to purify them before dispersing them in solution. Purification can be carried out by wet oxidation or dry oxidation in acid solutions. Suitable purification methods are refluxed in nitric acid solution (eg about 2.5 M) and then neutralized with deionized water. At this time, it may include a method for filtering the CNT using a cross-flow filtration system. The purified CNT suspension can then be passed through a filter, such as a polytetrafluoroethylene filter. Alternatively, purified CNTs can be purchased directly.

Purified CNTs may be in powder form, which may be dispersed in a solvent. In some embodiments, ultrasonic or microwave treatment may be performed to ensure that the purified CNTs are well dispersed in the solvent. Dispersion can be carried out in the presence of a surfactant. Various kinds of surfactants can be used, for example sodium dodecyl sulfate, sodium dodecylbenzenesulfonate, sodium dodecylsulfonate, sodium n-lauroyl sarcosinate, sodium alkyl allyl sulfosuccinate, Polystyrene sulfonate, dodecyltrimethylammonium bromide, cetyltrimethylammonium bromide, Brij, Tween, Triton X, and poly (vinylpyrrolidone) may be used, but is not limited thereto. In this way, a well dispersed and stable CNT colloidal solution is prepared.

The substrate may be surface treated for high wettability. Considering the need for a post-wet-process after the CNT network has been fabricated, a hydrophilic self assembled monolayer (SAM) coating to increase adhesion between the CNT and the substrate Or a piranha (H ₂ SO ₄ : H ₂ O ₂ = 4: 1) treatment may be employed. CNT is a colloidal solution prepared and may be coated on a substrate by various methods such as dip coating, spraying, spin coating, and the like. A CNT network is then formed over the substrate.

In step 840, to perform the electroplating, the CNT network is immersed in the electroplating solution. The CNT network may be attached to two or more electrodes disposed at predetermined intervals, or may serve as electrodes to which the power supply is electrically connected through two or more portions of the CNT network at their own intervals. The electroplating solution includes metal ions, conductive polymers, or a combination thereof.

In step 860, electrical energy is applied across the anode and two or more electrode portions immersed in the electroplating solution, and the electroplating material of the electroplating solution is applied to the CNT network.

In step 880, the electrical energy flow relays from some of the two or more electrodes to another of the two or more electrodes such that the electrical energy flow creates a nanocomposite having a uniform conductive bridge of electroplating material at the junction between the different CNTs. Or from a portion of two or more portions of the carbon nanotube network directly connected to the power supply to another portion of the two or more portions of the carbon nanotube network.

This electroplated metal or conductive polymer acts as a bridge between the different CNTs, thereby reducing the electrical resistance of the CNT network and increasing the adhesion between the CNT network and the substrate. Furthermore, the transparency of the nanocomposite can be controlled to a desired level based on the amount, density, shape and size of the conductive bridge. The amount, density, shape and size of the conductive bridges can be controlled here by varying the electroplating conditions, such as voltage levels, current levels, amounts of electroplating materials or combinations thereof.

In the present disclosure there is provided a TCE comprising the nanocomposites described above, which can replace brittle and expensive ITO electrodes. Furthermore, the nanocomposite according to the present disclosure may be applied to various fields such as a flexible display, an electromagnetic shielding material (EMI), and organic light emitting diodes (OLEDs).

The following examples are intended to illustrate some of the exemplary embodiments of the disclosure and are not intended to limit the scope of the disclosure in any way.

Example 1 Preparation of Nanocomposites

CNT  Manufacture of networks

Sonication is performed for about 30 minutes in nitric acid to purify CNT (Product No. ASP-100F, Iljin Nanotech Co., Ltd.). The CNTs are neutralized with deionized water after wet oxidation and then purified via vacuum filtration. Purified CNTs are dispersed in 1,2-dichlorobenzene. Sonication is carried out for about 10 hours so that the purified CNTs are well dispersed in the solvent. This produces a well dispersed and stable CNT colloidal solution. Soda lime glass is used as the substrate. Increases adhesion between CNTs and substrates by employing a piranha (H ₂ SO ₄ : H ₂ O ₂ = 4: 1) treatment to remove impurities on the substrate surface and modify the surface of the substrate to be polar . The glass substrate is immersed vertically in the CNT colloidal solution, and then dip coating is performed at a draw rate of 3 mm / min at room temperature to form a CNT network.

Preparation of Nanocomposites Using Electroplating

Nanocomposites comprising conductive bridges on CNT networks are prepared by the following process. Cu is used as an anode, and a sulfuric acid bath (0.75 M CuSO ₄ H ₂ O + 74 g / LH ₂ SO ₄ + 0.2 g / L gelatin) is prepared as an electroplating solution. The CNT network attached to the ends where the two electrodes face each other is immersed in the electroplating solution. Nanocomposite containing a uniform Cu bridge at the junction between different CNTs by applying electrical energy to one of the two electrodes and the anode, and then converting the flow of electrical energy into an electrical circuit between the anode and the other electrode. Create Electroplating is carried out at a current density of 10 mA / cm ² at room temperature. Electrical resistance was measured using a 4-point probe (model: CMT-SR2000N, AIT), and transparency was measured using an ultraviolet-visible spectrophotometer (model: Lambda-20, Perkin Elmer). Observe. The prepared nanocomposites have a resistance of 90Ω / sq and a transparency of about 85%.

Those skilled in the art will appreciate that the processes and methods performed in the processes and methods disclosed herein may be performed in a different order. Furthermore, the outlined steps are merely exemplary, and some of the steps and operations may be optional, incorporated into fewer steps or operations, or may be extended to include additional steps or operations without departing from the core of the present disclosure. have.

The subject matter disclosed in this document can illustrate different components, sometimes included within or connected to other different components. It will be appreciated that the configurations shown are merely exemplary and that many other configurations may be practiced that achieve the same functionality. Within the conceptual scope, any arrangement of components to achieve the same functionality is effectively “associated” to achieve the desired functionality. Thus, any two components combined to achieve certain functionality in this disclosure may be viewed as “associated” with each other such that the desired functionality can be achieved, regardless of the configuration or intermediate components. Likewise, any two components so associated may be viewed as “operably linked” or “operably coupled” to each other to achieve the desired functionality, and any two that can be associated as such The components may be viewed as “operably coupled” to each other to achieve the desired functionality. Specific examples that are operatively coupled include, but are not limited to, physical correspondence and / or physically interacting components and / or wireless interactions and / or wirelessly interacting components and / or logical interactions and / or logical interactions. It includes, but is not limited to the component.

With respect to the use of virtually any plural and / or singular term in this disclosure, one of ordinary skill in the art may interpret the plural to singular and / or the singular to plural, as appropriate to the context and / or application. Various singular / plural modifications can be clearly described for clarity.

Those skilled in the art will generally understand that terms used in this disclosure, in particular, in the appended claims (eg, the text of the appended claims) are generally “open” terms (eg For example, the term "comprising" should be interpreted as "including but not limited to", the term "having" should be interpreted as "having at least" and the term "comprising" includes "including but not limited to." Should be interpreted as Those skilled in the art will understand that, if a particular number in the claims is intended, such intent will be expressly set forth in the claims, and without such a description, such intent will not be present. Further, where conventional phrases such as “at least one of A, B, and C” are used, such phrases are generally referred to in the sense that a person of ordinary skill in the art would understand the phrases (eg, A "system comprising at least one of A, B and C" means A alone, B alone, C alone, A and B together, A and C together, B and C together, and / or A, B, and Including but not limited to C). Where conventional phrases such as “at least one of A, B, or C” are used, such phrases are generally referred to in the sense that a person of ordinary skill in the art would understand the phrases (eg “A , A system comprising at least one of B or C ”means A alone, B alone, C alone, A and B together, A and C together, B and C together, and / or A, B, and C Including but not limited to). In any of the specification, claims, or drawings, virtually any adjacent word and / or phrase that represents two or more optional terms includes one of the terms, each of the terms, or both terms by one of ordinary skill in the art. It should be understood so that you can think of the possibilities. For example, the phrase “A or B” will be understood to include the possibility of “A”, “B” or “A and B”.

 From the foregoing, it will be appreciated that the various embodiments described in this disclosure have been described for purposes of illustration and that various modifications may be made without departing from the scope and spirit of the disclosure. Accordingly, various embodiments of the present disclosure are not intended to limit the subject matter of the present disclosure, and the true scope and spirit of the present disclosure are indicated by the following claims.

1 is a diagram illustrating an apparatus for manufacturing a nanocomposite according to an embodiment.

FIG. 2 is a SEM photograph of a portion of a nanocomposite electroplated with metal using the device of FIG. 1, according to one embodiment. FIG.

3 is an SEM image of another portion of a nanocomposite electroplated with metal using the device of FIG. 1 according to one embodiment.

4 is a diagram illustrating an apparatus for manufacturing a nanocomposite according to another embodiment.

5 is a diagram illustrating an apparatus for manufacturing a nanocomposite according to another embodiment.

6 is a schematic diagram of an example of a carbon nanotube network having a metal bridge fabricated in accordance with one embodiment.

7 is a schematic diagram of an example of a carbon nanotube network having a conductive polymer bridge made in accordance with one embodiment.

8 is a flowchart for preparing a nanocomposite based on a carbon nanotube network according to one embodiment.

Claims (19)

In the device for producing a nanocomposite, A power supply configured to generate electrical energy; An electroplating solution comprising any one selected from the group consisting of metal ions, conductive polymers, and combinations thereof; An anode connected to said power supply and immersed in said electroplating solution; Two or more electrodes arranged at predetermined intervals to be immersed in the electroplating solution; And A relay coupled to the power supply and the at least two electrodes, the relay being configured to divert electrical energy flow from some of the at least two electrodes to another of the at least two electrodes. In the device for producing a nanocomposite, A power supply configured to generate electrical energy; An electroplating solution comprising any one selected from the group consisting of metal ions, conductive polymers, and combinations thereof; An anode connected to said power supply and immersed in said electroplating solution; An electrode connected to the power supply through two or more portions at predetermined intervals and immersed in the electroplating solution; And A relay coupled between the power supply and two or more portions of the electrode and configured to divert electrical energy flow from a portion of the two or more portions of the electrode to another portion of the two or more portions of the electrode. The device of claim 2, wherein the electrode is a carbon nanotube network. 3. The anode of claim 1, wherein the anode consists of Al, Cr, Co, Ni, Cu, Zn, Rh, Pd, Ag, Sn, W, Pt, Au, Ti, Mn, Cd and Pb. Device selected from the group. The apparatus of claim 1, further comprising one or more detectors positioned to measure electrical values between the anode and the two or more electrodes. 3. The apparatus of claim 2, further comprising one or more detectors positioned to measure electrical values between the anode and at least two portions of the electrode. The apparatus of claim 1 or 2, further comprising a controller coupled to at least one of the power supply and the relay. In the method for producing a nanocomposite, Forming a carbon or tube network having one or more intertube junctions between different carbon nanotubes; Immersing the carbon nanotube network with two or more electrodes arranged at predetermined intervals in an electroplating solution; Applying electrical energy between an anode and some of the at least two electrodes to apply the electroplating material of the electroplating solution to the carbon nanotube network; Relaying electrical energy flow from some of the two or more electrodes to another of the two or more electrodes to create a nanocomposite having a uniform conductive bridge of the electroplating material at the one or more intertube junctions. Manufacturing method. In the method for producing a nanocomposite, Forming a carbon nanotube network having one or more intertube junctions between different carbon nanotubes; Immersing the carbon nanotube network in the electroplating solution connected to the power supply through at least two portions at predetermined intervals; Applying electrical energy between an anode and a portion of the two or more portions of the carbon nanotube network to apply the electroplating material of the electroplating solution to the carbon nanotube network; The other of the two or more portions of the carbon nanotube network from a portion of the two or more portions of the carbon nanotube network to create a nanocomposite having a uniform conductive bridge of the electroplating material at the one or more intertube junctions. Method of producing a nanocomposite comprising the step of relaying the electrical energy flow in part. 10. The method of claim 8 or 9, wherein the time period and frequency of relaying the electrical energy flow are adjusted to reduce the contact resistance of the carbon nanotube network. The group of claim 8 or 9, wherein the anode is composed of Al, Cr, Co, Ni, Cu, Zn, Rh, Pd, Ag, Sn, W, Pt, Au, Ti, Mn, Cd and Pb. Method of producing a nanocomposite selected from. The method of claim 8, wherein applying the electrical energy and relaying the electrical energy flow are performed at a current density in the range of about 1 nA / cm ² to about 1000 mA / cm ² . Manufacturing method. 10. The method of claim 8 or 9, wherein the electroplating material is selected from the group consisting of metals, conductive polymers, and combinations thereof. The method of claim 13, wherein the metal is selected from the group consisting of Al, Cr, Co, Ni, Cu, Zn, Rh, Pd, Ag, Sn, W, Pt, Au, Ti, Mn, Cd, and Pb. Method of preparation of the composite. The method of claim 13, wherein the conductive polymer is polyaniline, polyimide, polyester, polyacetylene, polypyrrole, polythiophene, poly-p-phenylenevinylene, polyepoxide, polydimethylsiloxane, polyacrylate, poly A method of making a nanocomposite comprising at least one selected from the group consisting of methyl methacrylate, cellulose acetate, polystyrene, polyolefin, polymethacrylate, polycarbonate polysulfone, polyethersulfone, and polyvinyl acetate. 10. The method of claim 8 or 9, wherein when the electroplating material is a metal, the size of the conductive bridge is in the range of about 0.5 nm to about 10 nm. The method of claim 8 or 9, wherein the forming of the carbon nanotube network comprises a dip coating method, a spin coating method, a bar coating method, a spray method, a self-aligning method, a Langmuir-Blodgett deposition method, And a vacuum filtration method. A method for producing a nanocomposite carried out by any one selected from the group consisting of vacuum filtration. The method of claim 8, further comprising measuring an electrical value between the anode and the two or more electrodes. The method of claim 9, further comprising measuring an electrical value between the anode and at least two portions of the carbon nanotube network.

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