KR20100012960A - I-line chemically amplified positive photoreist for microlens, microlens fabricated thereby and liquid crystal display device comprising the lens - Google Patents

Abstract

PURPOSE: An i-line chemically amplified positive photoreist is provided to easily form a positive micro lens with high resolution, high transmittance and excellent surface roughness. CONSTITUTION: An i-line chemically amplified positive photoreist for micro lens comprises a resin, a photoacid generator containing a compound represented by chemical formula 3, and a quencher. The resin comprises a polymerization unit of chemical formula 1 and a polymerization unit of chemical formula 2 in a molar ration of 2:8 - 5:5 and includes a compound with 150-170 °C glass transition temperature(Tg) and 9,000-11,000 average molecular weight, wherein 19.5-35 mole % of carboxylic acid group is protected with adamantyl group in the polymerization unit of chemical formula 1.

Description

I-line chemically amplified positive photoreist for microlens, microlens fabricated and and liquid crystal display device comprising the lens}

The present invention relates to an i-ray chemically amplified photoresist composition for microlenses that can be used as a micro condensing lens such as a color solid state image pickup device, a color liquid crystal display device, a microlens manufactured therefrom, and a liquid crystal display device including the lens. It is about. More specifically, the present invention relates to i-ray chemically amplified positive photoresist compositions suitable for the formation of microlenses by submicron lithography using radiation such as i-rays or far ultraviolet rays.

The liquid crystal display is manufactured by arranging two substrates on which the field generating electrodes are located so that the surfaces on which the two electrodes are located face each other, and injecting liquid crystal between the two substrates. Such a liquid crystal display device is a device that displays an image by controlling a light transmittance that varies depending on the liquid crystal by moving the liquid crystal by an electric field generated by applying voltage to two electrodes. Liquid crystal display devices are the most widely used among flat panel display devices because of their excellent features such as high precision display performance, low power consumption, flexibility in size, light weight, and thinness. Recently, with the spread and spread of facsimile, electronic copier, liquid crystal television, mobile phone, solid-state image pickup device and the like, research on performance and low power consumption of liquid crystal display devices has been actively conducted.

Meanwhile. As a method of improving the brightness and contrast of a liquid crystal display device, it is proposed to condense external light or a backlight in an opening by providing a micro lens array (Japanese Patent Laid-Open No. 2001-154181). The micro lens serves to condense the light coming into the small lens formed on the semiconductor chip.

Microlenses can generally be formed by applying a layer of microlens material on a semiconductor chip. As a method of forming a micro lens, a glass substrate is etched to form irregularities and filled with an ultraviolet curable resin having a high refractive index, a resist pattern corresponding to the lens is formed, and then melted and used as a lens or a melted lens. There is a method of transferring the lens shape on the background by dry etching using the pattern as a mask. Currently, various methods have been studied for forming a resist pattern corresponding to a lens and heating and melting the same to use the lens as it is. The resist used in the method requires various properties such as film thickness, high sensitivity, high resolution, high transmittance, high heat resistance, storage stability, desired micro lens formation (controlling the curvature radius of the lens), and surface roughness of the formed micro lens curvature. do. Conventional and ongoing research mainly uses photoresist compositions in which alkali-soluble resins and 1,2-quinonediazide compounds (PACs) are the main components.

However, the resist composition used for the conventional microlenses has a poor resolution and shows a result of poor transmittance and surface roughness of the formed microlens curvature. This acts as a cause of lowering the light condensing ability of the microlenses, thereby reducing the efficiency of the liquid crystal display. Accordingly, there is a demand for development of improving surface roughness of transmittance and lens curvature.

SUMMARY OF THE INVENTION An object of the present invention is an i-ray chemically amplified positive photoresist composition for a microlens having excellent resolution and transmittance performance, easy control of a radius of curvature of a lens, and excellent curvature roughness of a formed lens, a microlens manufactured therefrom, and the lens It is to provide a liquid crystal display device comprising a.

In order to achieve the above object, the present invention provides a polymerized unit of formula (1) and a polymerized unit of formula (2) in which 19.5 to 35 mol% of the carboxylic acid group (A) is protected by adamantyl group: 2: 8 to 5: 5 A resin comprising a compound having a molar ratio of and having a glass transition temperature (Tg) of 150 to 170 ° C. and a weight average molecular weight of 9,000 to 11,000; (B) a photoacid generator comprising a compound represented by the following formula (3); And (C) provides a micro-lens i-ray chemically amplified positive photoresist composition comprising a quencher.

<Formula 1>

<Formula 2>

<Formula 3>

로 표시되는 화합물이다.In Formula 1 and Formula 3, R ₁ is hydrogen or a methyl group, R ₂ is a straight or branched chain alkyl group having 1 to 10 carbon atoms unsubstituted or substituted with a halogen atom; Cycloalkyl groups having 5 to 10 carbon atoms; An aryl group having 6 to 11 carbon atoms unsubstituted or substituted with an alkyl group having 1 to 20 carbon atoms, alkoxy having 1 to 6 carbon atoms or a halogen atom; or

It is a compound represented by.

The present invention provides a micro lens, which is made of the i-ray chemically amplified positive photoresist composition for forming the micro lens.

The present invention provides a liquid crystal display device comprising the micro lens.

The i-ray chemically amplified positive photoresist composition for microlenses of the present invention can more easily form a positive type microlens with high resolution, relatively high transmittance and a surface roughness.

EMBODIMENT OF THE INVENTION Hereinafter, this invention is demonstrated in detail.

I. I-ray chemically amplified positive for microlenses Photoresist  Composition

The i-ray chemically amplified positive photoresist composition for a microlens of the present invention is (A) a resin. (B) photoacid generator and (C) quencher.

The resin (A) of the i-ray chemically amplified positive photoresist composition for microlenses of the present invention is insoluble or poorly soluble in aqueous alkali solution, but after the functional group unstable to acid dissociates by the action of acid, the aqueous alkaline solution It is resin which becomes soluble in. 19.5 to 35 mol% of the carboxylic acid group (A) includes a polymerized unit of the following Chemical Formula 1 and a polymerized unit of the following Chemical Formula 2 in a molar ratio of 2: 8 to 5: 5 and a glass transition temperature ( Tg) is 150 to 170 ℃ and the weight average molecular weight of 9,000 to 11,000.

<Formula 1>

<Formula 2>

In Formula 1, R ₁ is hydrogen or a methyl group, preferably R ₁ is a methyl group.

The resin (A) is one polymerized unit represented by the formula (1) and 2 to 6 polymerized units represented by the formula (2) are alternately arranged in a line, thereby the glass transition temperature is 150 to 170 ℃. Thus, the resin (A) can be seen that the polymerization unit represented by the formula (1) and the polymerization unit represented by the formula (2) is uniformly distributed.

The weight average molecular weight was measured by gel permeation chromatography using polystyrene as a conversion material. When the weight average molecular weight is 9,000 to 11,000, the molecular chain is not entangled, and thus, the protective group can be easily removed.

The resin similar to the resin (A), which is used in the related art, is a block copolymer separated by hydrophilic and hydrophobic groups in molecular units and separated according to their characteristics, so that the glass transition temperature (Tg) is 130 to 140 ° C. In contrast, the resin (A) of the present invention has a glass transition temperature (Tg) of 150 to 170 ° C. due to the homogeneous distribution of hydrophilic and hydrophobic groups from the molecular unit to the polymerized unit of each other. It has a structure that is advantageous for suppressing development defects and improving standing waves, profiles, residual film ratios, and the like.

Since the resin (A) has a high transmittance of 96% to 100% and a transparent color, the resin (A) is suitable for the i-ray photoresist process for microlenses requiring high light condensation.

In addition, when the adamantyl group is contained in the acetate, and the adamantyl group is desorbed by the photoacid generator, the polymerized unit represented by the formula (1) has better developability than the hydroxyl group of the polymerized unit represented by the formula (2). This has the advantage of being improved.

The resin (A) preferably has a protection rate of 19.5 to 35% in the acrylate polymerized unit. If the above range is satisfied, a good pattern can be formed, and there is an advantage that scum does not occur. Here, the acrylate polymer unit refers to two cases in which the compound represented by Formula 1 is an acrylate unit protected with an adamantyl group and an unprotected acrylate.

It is preferable that said (A) resin has a dispersity of 1.4-1.6.

In addition, the (A) resin can be manufactured directly or purchased commercially.

The photoacid generator (B) included in the i-ray chemically amplified positive photoresist composition of the present invention is a compound that generates an acid by the action of light or radiation, and the material itself or the ultraviolet light in the resist composition comprising such a material, It is a substance that generates acid by irradiating high energy radiation such as far ultraviolet rays, electron beams, X-rays, or radiant light. The acid generated from the photoacid generator (B) acts on the resin (A) to dissociate the functional group unstable to the acid present in the resin (A).

The photoacid generator (B) includes a compound represented by the following Chemical Formula 3, which is sensitive at i-ray (365 nm) and exhibits excellent absorbance.

<Formula 3>

로 표시되는 화합물이다.In Formula 3, R ₂ is a linear or branched alkyl group having 1 to 10 carbon atoms unsubstituted or substituted with a halogen atom; Cycloalkyl groups having 5 to 10 carbon atoms; An aryl group having 6 to 11 carbon atoms unsubstituted or substituted with an alkyl group having 1 to 20 carbon atoms, alkoxy having 1 to 6 carbon atoms or a halogen atom; or

It is a compound represented by.

Preferably, R ₂ is n-propyl group, n-butyl group, n-octyl group, toluyl group, trifluoromethyl group, 2,4,6-trimethylphenyl group, 2,4,6-triisopropylphenyl group, It is 1 type chosen from the group which consists of a 4-dodecylphenyl group, 4-methoxyphenyl group, 2-naphthyl group, and benzyl group.

The (B) photoacid generator is preferably included in 2.2 to 11.11 parts by weight based on 100 parts by weight of the (A) resin. When included, the development defect does not occur, the resolution is excellent, there is an advantage that the pattern profile is excellent. Outside the above-described range, the pattern shape collapses to hardly form a patterned resist layer.

The i-ray chemically amplified positive photoresist composition of the present invention comprises (C) a quencher. The (C) quencher prevents performance degradation caused by deactivation of acid associated with post-exposure release. The (C) quencher may further include basic compound (s), in particular basic nitrogen-containing organic compounds such as amines. Specific examples of the basic compound used as the (C) quencher may include a compound represented by the following Chemical Formulas 4a to 4j.

<Formula 4a>

<Formula 4b>

<Formula 4c>

<Formula 4d>

<Formula 4e>

<Formula 4f>

<Formula 4g>

<Formula 4h>

<Formula 4i>

<Formula 4j>

In Formulas 4a to 4j, R ₄ to R ₇ , R ₉ to R ₁₁ , R ₁₅ , R ₁₆ , R ₂₃ , R ₂₄ , R ₃₄ , R ₃₅ , and R ₃₈ to R ₄₀ each independently represent a hydrogen atom and an alkyl group. , A cycloalkyl group or an aryl group. The alkyl group, cycloalkyl group or aryl group may be substituted or unsubstituted with a hydroxyl group, an amino group or an alkoxy group having 1 to 6 carbon atoms, respectively. The amino group may be substituted with an alkyl group having 1 to 4 carbon atoms. The alkyl group may be an alkyl group having 1 to 6 carbon atoms, the cycloalkyl group may be an alkyl group having 5 to 10 carbon atoms, and the aryl group may be an aryl group having 6 to 10 carbon atoms.

R ₈ , R ₁₂ to R ₁₄ , R ₁₇ to R ₂₂ , and R ₂₅ to R ₃₃ are each independently a hydrogen atom, an alkyl group, a cycloalkyl group, an aryl group or an alkoxy group. The alkyl group, cycloalkyl group, aryl group or alkoxy group may be substituted or unsubstituted with a hydroxyl group, an amino group or an alkoxy group having 1 to 6 carbon atoms, respectively. The amino group may be substituted with an alkyl group having 1 to 4 carbon atoms. The alkyl group may be an alkyl group having 1 to 6 carbon atoms, the cycloalkyl group may be a cycloalkyl group having 5 to 10 carbon atoms, the aryl group may be an aryl group having 6 to 10 carbon atoms, and the alkoxy group may be an alkoxy having 1 to 6 carbon atoms It may be a flag.

R ₃₆ And R ₃₇ represents an alkyl group or a cycloalkyl group. The alkyl group or cycloalkyl group may be substituted or unsubstituted with a hydroxyl group, an amino group or an alkoxy group having 1 to 6 carbon atoms, respectively. The amino group may be substituted or unsubstituted with an alkyl group having 1 to 4 carbon atoms. The alkyl group may be an alkyl group having 1 to 6 carbon atoms, and the cycloalkyl group may be a cycloalkyl group having 5 to 10 carbon atoms.

A is alkylene, carbonyl, imino, sulfide or disulfide. It is preferable that the said alkylene is a C2-C6 alkylene.

The functional groups represented by any one of R ₄ to R ₄₀ may be straight or branched as long as they can take both straight and branched chain structures.

Specific examples of the compound represented by Formulas 4a to 4j include hexylamine, heptylamine, octylamine, nonylamine, decylamine, aniline, 2-, 3- or 4-methylaniline, 4-nitroaniline, 1- or 2 Naphthylamine, ethylenediamine, tetramethylenediamine, hexamethylenediamine, 4,4'-diamino-1,2-diphenylethane, 4,4'-diamino-3,3'-dimethyldiphenylmethane, 4,4'-diamino-3,3'-diethyldiphenylmethane, dibutylamine, dipentylamine, dihexylamine, diheptylamine, dioctylamine, dinonylamine, didecylamine, N-methyl Aniline, Peperidine, Diphenylamine, Triethylamine, Trimethylamine, Tripropylamine, Tributylamine, Tripentylamine, Trihexylamine, Triheptylamine, Trioctylamine, Trinonylamine, Tridecylamine, Methyldi Butylamine, methyldipentylamine, methyldihexylamine, methyldicyclohexylamine, methyldiheptylamine, methyldioctylamine, methyldinonylamine, methyl Decylamine, ethyldibutylamine, ethyldipentylamine, ethyldihexylamine, ethyldiheptylamine, ethyldioctylamine, ethyldinonylamine, ethyldidecylamine, dicyclohexylmethylamine, tris {2- (2 -Methoxyethoxy) ethyl} amine, triisopropanolamine, N, N-dimethylaniline, 2,6-isopropylaniline, imidazole, pyridine, 4-methylpyridine, 4-methylimidazole, bipyridine, 2 , 2'-dipyridylamine, di-2-pyridylketone, 1,2-di (2-pyridyl) ethane, 1,2-di (4-pyridyl) ethane, 1,3-di (4 -Pyridyl) propane, 1,2-bis (2-pyridyloxy) ethylene, 1,2-bis (4-pyridyl) ethylene, 1,2-bis (2-pyridyloxy) ethane, 4, 4-dipyridylsulfide, 4,4-dipyridyldisulfide, 1,2-bis (4-pyridyl) ethylene, 2,2'-dipicorylamine, 3,3'-dipicorylamine, Tetramethylammonium hydroxide, tetraisopropylammonium hydroxide, tetrabutylammonium hydroxide and the like.

It is preferable that the said (C) quencher is contained in 0.01-10 weight part with respect to 100 weight part of said (A) resins. When included in the above-described range, an appropriate amount of acid is diffused during the photoresist process, thereby developing only the exposed portion, thereby improving the pattern profile. In addition, since the sensitivity is excellent, excellent photosensitivity can be realized by preventing the pattern profile from being changed due to development defects. Here, the content of the (A) resin and (C) quencher is preferably converted to solid content.

In addition, the chemically amplified positive photoresist compositions of the present invention may further contain small amounts of various additives such as sensitizers, dissolution inhibitors, other resins, surfactants, stabilizers, dyes, and the like.

The i-ray chemically amplified positive photoresist composition of the present invention may be provided in the form of a resist liquid composition comprising components dissolved in conventional solvents. The solvent preferably dissolves the components, exhibits a suitable drying rate and provides a uniform and smooth coating after solvent evaporation, and may be used conventionally in this field. Examples thereof include glycol ether esters such as ethylcellosolve acetate, methylcellosolve acetate and propylene glycol monomethyl ether acetate; Esters such as ethyl lactate, butyl acetate, amyl acetate and ethyl pyruvate; Ketones such as acetone, methyl isobutyl ketone, 2-heptanone and cyclohexanone; cyclic esters such as γ-butyrolactone; Alcohol, such as 3-methoxy- 1-butanol, etc. are mentioned. These solvents may each be used alone or as a mixture of two or more.

II. How to form a micro lens pattern

Using the i-ray chemically amplified positive photoresist composition according to the present invention, the pattern of the microlenses can be formed by the following method.

The chemically amplified positive photoresist composition according to the present invention forms a photoresist film on the etched layer of the substrate, that is, on the substrate such as silicon wafer, glass, plastic, stainless steel or the like by using a spin coating method. The thickness of the resist film is preferably in the range of 1 to 30 µm. Pre-baking may be performed to form the photoresist film into a solid resist. After scanning the electron beam with an exposure source on the photoresist film, a post exposure bake (PEB) is performed to expose the exposed resist film for diffusion of the exposed acid. The baked photoresist film is developed with an alkaline developer to form a resist pattern. Examples of the alkaline developer include sodium hydroxide, potassium hydroxide, sodium carbonate, sodium silicate, sodium metasilicate, ammonia water, ethylamine, n-propylamine, triethylamine, tetramethylammonium hydroxide, tetraethylammonium hydroxide, (2 -Hydroxyethyl) trimethylammonium hydroxide and the like. Among these, tetramethylammonium hydroxide and (2-hydroxyethyl) trimethylammonium hydroxide (commonly called choline) are preferable.

Subsequently, a post bake process is performed to form the formed resist pattern into a micro lens shape. The process is carried out using a hot plate, the temperature and time is preferably 130 to 170 ℃ and 5 to 10 minutes.

The micro lens of the present invention may be included in the liquid crystal display device. The liquid crystal display device may be a conventional liquid crystal display device.

Next, Examples and Comparative Examples of the present invention are described. However, these examples are only for illustrating the present invention in more detail, the present invention is not limited to these examples.

Example 1  To 5 and Comparative Example 1  And 2: i-ray chemically amplified positive for microlenses Photoresist  Preparation of the composition

The components shown in Table 1 were mixed at the indicated composition ratios, dissolved in 815 parts by weight of propylene glycol monomethyl ether acetate, and then filtered through a fluorine resin filter having a pore diameter of 0.1 μm to prepare a resist solution.

Resin (part by weight) Photoacid Generator (parts by weight) Quencher (parts by weight) Example 1 A-1 (Protection rate: 25%) 100 B-1 3.7 C-1 / C-2 0.45 / 0.45 = 0.9 Example 2 A-1 (Protection rate: 25%) 100 B-1 4.5 C-1 / C-2 0.45 / 0.45 = 0.9 Example 3 A-1 (Protection rate: 25%) 100 B-1 5.2 C-1 / C-2 0.45 / 0.45 = 0.9 Example 4 A-1 (Protection rate: 25%) 100 B-1 5.8 C-1 / C-2 0.45 / 0.45 = 0.9 Example 5 A-1 (Protection rate: 25%) 100 B-1 6.7 C-1 / C-2 0.45 / 0.45 = 0.9 Comparative Example 1 A-2 (Protection rate: 25%) 100 B-1 5.2 C-1 / C-2 0.45 / 0.45 = 0.9 Comparative Example 2 A-2 (Protection rate: 25%) 100 B-2 5.2 C-1 / C-2 0.45 / 0.45 = 0.9

A-1: The polymerization units represented by the general formula (1) (R ₁ : methyl group) and the polymerization units represented by the general formula (2) are alternately arranged in a linear form, the molar ratio of the polymerization units is 2.5: 7.5, and the glass transition temperature (Tg) Is 150 ° C and has a molecular weight of 9,150 (manufacturer: Dupont, trade name: SRC-D90)

A-2: A resin having a molecular weight of 10,000, in which 25% of the hydroxyl groups in the polymerized unit represented by the formula (2) were protected with an ethoxyethyl protecting group

B-1: Maleimide type photoacid generator in which R ₃ is a trifluoromethyl group in Chemical Formula 3 (manufacturer: Ciba, trade name: CGI-NIT)

B-2: Diazo type photoacid generator (manufacturer: Ciba, trade name: CGI-NIT)

C-1: triisopropanolamine

C-2: 2,6-diisopropylaniline

Test Example : I-ray chemically amplified positive for microlenses Photoresist  Characterization of the Composition

(1) Litho evaluation

The resist solutions of Examples 1 to 5 and Comparative Examples 1 and 2 were applied to a silicon wafer using a spin coater, and the film thickness after drying was 0.6 µm. The substrate on which the dried resist film was formed was performed for 60 seconds on a hot plate at 100 ° C. The exposure dose of the wafer having the burned resist film was gradually changed using a stepper type exposure machine ['NSR-I11D' manufactured by Nikon Corp., NA = 0.63, sigma = 0.038], having an exposure wavelength of 365 nm (i line). Exposure was carried out while forming a fine-sized line pattern. Subsequently, post exposure bake at the hot plate was performed at 110 ° C. for 60 seconds. In addition, paddle development was performed for 60 seconds using an aqueous 2.38% tetramethylammonium hydroxide solution. The pattern after development was observed using the scanning electron microscope. The results are shown in Table 2.

BRIEF DESCRIPTION OF THE DRAWINGS It is the photograph which took the cross section of the microlens pattern shape obtained by carrying out the post-baking process of the resist composition of Example 1 with the scanning electron microscope.

Referring to Figure 1, it can be seen that the pattern shape of the lens made of the resist composition of the present invention is excellent.

(2) transmittance evaluation

The photoresist composition was coated on a 4 inch glass substrate using a spin coater (OFT, Inc.), preliminarily dried under conditions of 100 ° C. and 60 seconds, cooled at room temperature, and subjected to full exposure using a mask aligner. Again, the coating film heat-cured at 170 ° C. for 5 minutes was measured for transmittance of 300 nm to 800 nm using UV-Spectrum DU-800 (BECKMAN Co., Ltd.), and the results are shown in Table 2 below.

(3) surface roughness evaluation

After the post-baking process, the surface roughness of the finally formed microlens pattern was observed using AFM (THERMO MICROSCOPES, Inc.) equipment to check the surface roughness of the microlens curvature through the contact mode.

resolution Sensitivity (msec / ㎠) Transmittance (%) Micro lens pattern shape Surface Roughness (RMS, ㎚) Example 1 ○ 300 96 ○ 3> Example 2 ○ 310 96 ○ 3> Example 3 ◎ 320 96 ○ 3> Example 4 ◎ 350 96 ○ 3> Example 5 ◎ 400 96 ○ 3> Comparative Example 1 △ 380 95 X - Comparative Example 2 △ 400 92 X -

※ Resolution: ◎: Very high, ○: High, △: Low, X: Poor

※ Micro lens pattern shape: Refer to drawing 1

1 is a scanning electron microscope cross-sectional photograph of a micro lens.

Claims (8)

(A) 19.5 to 35 mol% of the carboxylic acid group containing a polymerized unit of the formula (1) and a polymerized unit of the formula (2) in a molar ratio of 2: 8 to 5: 5 protected by adamantyl group and the glass transition temperature (Tg ) Is a resin comprising a compound having a 150 to 170 ℃ and a weight average molecular weight of 9,000 to 11,000; (B) a photoacid generator comprising a compound represented by the following formula (3); And (C) i-ray chemically amplified positive photoresist composition for microlenses, comprising a quencher: <Formula 1>

<Formula 2>

<Formula 3>

In Formula 1 and Formula 3, R ₁ is hydrogen or a methyl group, R ₂ is a straight or branched chain alkyl group having 1 to 10 carbon atoms unsubstituted or substituted with a halogen atom; Cycloalkyl groups having 5 to 10 carbon atoms; An aryl group having 6 to 11 carbon atoms unsubstituted or substituted with an alkyl group having 1 to 20 carbon atoms, alkoxy having 1 to 6 carbon atoms or a halogen atom; or

It is a compound represented by. The method according to claim 1, Based on 100 parts by weight of the (A) resin converted into solids, 2.2 to 11.11 parts by weight of the (B) photoacid generator in terms of solid content; And I-ray chemically amplified positive photoresist composition for forming a microlens, comprising 0.01 to 10 parts by weight of the (C) quencher, converted into solids. The method according to claim 1, The transmittance of the resin (A) is 96% to 100% i-ray chemically amplified positive photoresist composition for forming a micro lens. The method according to claim 1, In Formula 3, R ₂ is n-propyl group, n-butyl group, n-octyl group, toluyl group, trifluoromethyl group, 2,4,6-trimethylphenyl group, 2,4,6-triisopropylphenyl group And 4-dodecylphenyl group, 4-methoxyphenyl group, 2-naphthyl group, and benzyl group. The method according to claim 1, The resin (A) is an i-ray chemically amplified positive photoresist composition for forming a microlens, wherein one polymerized unit represented by Chemical Formula 1 and two to six polymerized units represented by Chemical Formula 2 are alternately arranged in a linear shape. . The method according to claim 1, The (A) resin is an i-ray chemically amplified positive photoresist composition for forming a microlens, wherein the acrylate polymer unit has a protection ratio of 19.5 to 35%. A microlens made from the i-ray chemically amplified positive photoresist composition for forming a microlens according to claim 1. A liquid crystal display device comprising the microlens according to claim 7.

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