KR20100004598A - Plastic article having a parylene polymer layer and method of the same - Google Patents

Abstract

PURPOSE: A plastic molding product and a manufacturing method thereof are provided to prevent a parylene polymer layer from being exfoliated by forming a transparent conductive layer whose surface is modified by a primer coating layer or plasma etching. CONSTITUTION: A plastic molding product is composed of a plastic base material(10) made of thermoplastic resin, a primer coating layer(20) in which the primer composition including the epoxy resin and acrylic monomer is coated and which is formed, and a parylene polymer layer(30) formed on the primer coating layer. The primer composition is composed of Epoxy resin of 20 ~ 60 weight%, Acrylic monomer of 2 ~ 20 weight%, hardener of 0.1 ~ 5 weight%, and extra organic solvent.

Description

Plastic article having a parylene polymer layer and a method for manufacturing the same

1 is a partial cross-sectional view of a plastic molded article formed with a parylene polymer layer according to one embodiment of the present invention.

2 is a view for explaining a method of forming a parylene polymer layer.

3 is a partial cross-sectional view of a plastic molded article formed with a parylene polymer layer according to another embodiment of the present invention.

Figure 4 is a cross-sectional view showing a dry etching apparatus of the RIE type used in the embodiment of the present invention.

Brief description of the main symbols in the drawings

10: plastic substrate 40: transparent conductive layer

20: primer coating layer 50: dry etching apparatus of the RIE type

30: parylene polymer layer

Field of invention

The present invention relates to a plastic molded article having a polymer protective film and a method of manufacturing the same. More specifically, the present invention relates to a plastic molded article having a parylene polymer layer formed thereon and having excellent chemical resistance, corrosion resistance, heat resistance and water resistance, and a manufacturing method thereof.

Background of the Invention

Plastics have excellent processability, are lighter than metals or glass, have excellent hardness, and are inexpensive, and are widely used in various industrial fields. Products, which have traditionally been made of glass or metal, are rapidly being replaced by plastic moldings.

For example, the physicochemical test apparatus made of glass is heavy, weak in strength, fragile, and inconvenient to use, and there have been attempts to replace it with plastic materials for a long time. In recent years, many physicochemical apparatuses have been manufactured from plastic resins.

However, since plastic is inferior in chemical resistance, corrosion resistance and heat resistance compared to glass, it is a means to improve the chemical resistance, corrosion resistance and heat resistance of plastic molded products exposed to strong acids, alkalis or organic solvents, such as plastic physicochemical apparatus. need.

One method of increasing the chemical resistance of a plastic molded article is to coat the surface of the plastic molded article with Teflon (Teflon). Teflon has a chemically inert property by forming a stable compound through a strong chemical bond of fluorine and carbon, thereby improving the chemical resistance of the plastic molded article. However, Teflon has a short lifespan and is difficult to uniformly coat, and thus the edge of the molded part is relatively thinner than other parts, so that the plastic molded part cannot be completely protected.

Another means to replace the Teflon coating method is Parylene (poly (para-xylylene)) coating method. Parylene coatings are known to be very resistant to chemicals such as acids, alkalis, or organic solvents because they have excellent chemical and corrosion resistance, and are insoluble in chemical solvents.

In addition, the parylene coating absorbs almost no moisture due to its excellent water resistance, and has excellent thermal stability, so that no thermal, mechanical deformation or property change occurs between -200 and 150 ° C., and pin-holes or pores ( There is an advantage that can be coated without generating air bubbles.

However, the parylene coating has a problem in that the parylene coating is easily peeled off due to weak adhesion to the plastic surface. In order to solve this problem, a method of treating a plastic surface with a silane-based compound before attempting to form a parylene coating on the plastic surface has been attempted, but a satisfactory effect has not been obtained, and the parylene coating has not been widely applied to plastic molded products. .

In order to solve this problem, the inventors have proposed a primer coating layer or a surface modified transparent conductive layer which can improve the adhesion of the parylene polymer layer to the plastic substrate between the surface of the plastic substrate and the parylene polymer layer. Forming prevents the parylene polymer layer from peeling off and develops a plastic molded article excellent in chemical resistance, corrosion resistance, thermal stability, waterproofness, and the like and a method of manufacturing the same.

An object of the present invention is to provide a plastic molded article having a parylene polymer layer is formed excellent in chemical resistance, corrosion resistance, heat resistance and waterproof.

Another object of the present invention is to provide a plastic molded article having a parylene polymer layer which is not easily peeled off.

Another object of the present invention is to provide a method for producing a plastic molded article formed with the parylene polymer layer as described above.

The above and other objects of the present invention can be achieved by the present invention described in detail below.

Summary of the Invention

The plastic molded article formed with the parylene polymer layer according to the present invention comprises a primer coating layer or a transparent conductive layer which improves the adhesion of the parylene polymer layer to the plastic substrate between the plastic substrate and the parylene polymer layer, whereby the parylene polymer layer is It prevents peeling and has excellent chemical resistance, corrosion resistance, heat resistance and water resistance by protection of the parylene polymer layer.

According to one embodiment of the present invention, a plastic molded article having a parylene polymer layer is formed of a plastic substrate (10) made of thermoplastic resin, an epoxy resin and a (meth) acrylic monomer on the surface of the plastic substrate (10). It comprises a primer coating layer 20 formed by coating a primer composition comprising a and a parylene polymer layer 30 formed on the primer coating layer (20).

The primer composition preferably comprises 20 to 60% by weight of the epoxy resin, 2 to 20% by weight of the (meth) acrylic monomer, 0.1 to 5% by weight of a curing agent and an extra organic solvent.

It is preferable that the said (meth) acrylic-type monomer is the (meth) acrylic-type monomer which has an epoxy group.

According to another embodiment of the present invention, the plastic molded article is formed on the surface of the plastic substrate 10 made of thermoplastic resin, the plastic substrate 10, and the surface-modified transparent conductive layer 40 and the surface modification by plasma etching And a parylene polymer layer 30 formed on the transparent conductive layer 40.

The transparent conductive layer 40 is preferably made of indium tin oxide (ITO), TiO ₂ or ZnO.

The plasma etching is preferably performed by a dry ion etching apparatus of a reactive ion etching (RIE) type using a reaction gas composed of CF ₃ , Cl ₂ , Ar, O _2, or a mixture thereof.

It is preferable that the thermoplastic resin which comprises the plastic base material 10 is a polypropylene (PP) resin, a polyethylene (PE) resin, or a mixture thereof, and it is preferable that the plastic base material 10 is a physics experiment apparatus.

The present invention also provides a method for producing a plastic molded article having a parylene polymer layer.

According to one embodiment of the present invention, a method for producing a plastic molded article includes washing a plastic substrate (10) made of a thermoplastic resin with alcohol and water; Coating a primer composition comprising an epoxy resin and a (meth) acrylic monomer on the surface of the washed plastic substrate 10 to form a primer coating layer 20; And condensing the gaseous parylene monomer on the primer coating layer 20 to form the parylene polymer layer 30; Steps.

In the forming of the primer coating layer 30, after spraying and applying the primer composition including the epoxy resin and the (meth) acrylic monomer on the surface of the washed plastic substrate 10, it is allowed to stand for 4 to 10 minutes ; And curing the applied primer composition at 20 to 80 ° C .; It is preferred to include the step.

According to another embodiment of the present invention, a method for producing a plastic molded article includes washing the plastic substrate 10 made of a thermoplastic resin using alcohol and water; Depositing ITO, TiO ₂ or ZnO on the surface of the cleaned plastic substrate 10 using vacuum deposition to form a transparent conductive layer 40; The transparent conductive layer 40 is plasma-etched by using a reactive ion etching (RIE) type dry etching apparatus using a reaction gas composed of CF ₃ , Cl ₂ , Ar, O _2, or a mixture thereof. Modifying the surface of; And condensing the gaseous parylene monomer on the surface-modified transparent conductive layer 40 to form the parylene polymer layer 30; Steps.

The vacuum deposition method is preferably a thermal deposition method, an electron beam deposition method or a sputtering method.

The modifying of the surface of the transparent conductive layer 40 may include putting the plastic substrate 10 on which the transparent conductive layer 40 is formed into the process chamber 51 of the dry etching apparatus 50 of the RIE type; The internal pressure of the process chamber 51 is adjusted to 0.1-30 mTorr; Supplying a reaction gas composed of CF ₃ , Cl ₂ , Ar, O _2, or a mixture thereof into the process chamber 51; And converting the reaction gas into a plasma state by applying an RF power of 100 to 500 W to an electrode of the process chamber; It is preferred to include the step.

Washing the plastic substrate 10 comprises ultrasonic cleaning the plastic substrate 10 using a mixture of isopropyl alcohol and methanol; And the ultrasonically cleaned plastic substrate 10 is washed with distilled water and then dried; It is preferable to include the step.

Hereinafter, with reference to the accompanying drawings will be described in detail the present invention in detail.

Detailed Description of the Invention

Plastic molded article with parylene polymer layer

1 is a partial cross-sectional view of a plastic molded article formed with a parylene polymer layer according to one embodiment of the present invention. 1, the plastic molded article formed with the parylene polymer layer according to one embodiment of the present invention, the plastic substrate (10), the primer coating layer 20 formed on the surface of the plastic substrate 10 and A parylene polymer (parylene: poly (para-xylylene)) layer 30 formed on the primer coating layer 20 is included.

Although there is no particular limitation on the range of the plastic base material 10, it is preferable that the physical and chemical experiment apparatus that can fully utilize the chemical resistance, corrosion resistance, heat resistance and water resistance of the parylene polymer layer 30. Examples of the physicochemical laboratory apparatus include beakers, flasks, measuring cylinders, sample bottles, funnels, spoons, tweezers, pipettes, droppers, burettes, chalets, test tubes, vials, desiccators and the like.

The plastic substrate 10 is preferably made of thermoplastic resin. The thermoplastic resin may be a polyvinyl chloride (PVC) resin, a polystyrene (PS) resin, a polyethylene (PE) resin, a polypropylene (PP) resin, a poly (meth) acrylate (poly ( meth) acrylate) resin, ABS resin, etc. may be used, but is not necessarily limited thereto. Among these, the thermoplastic resin is preferably a polyethylene resin, a polypropylene resin, or a mixture thereof.

There is no particular limitation on the method of molding the plastic substrate 10 with the thermoplastic resin, and for example, extrusion molding, injection molding, blow molding, vacuum molding, etc. may all be applied, which is common in the field of the present invention. It can be easily carried out by a person of knowledge.

The primer coating layer 20 is formed by coating a primer composition including an epoxy resin, a (meth) acrylic monomer, a curing agent, and an organic solvent on the surface of the plastic substrate 10.

As the epoxy resin, a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, a novolak epoxy resin, a phenoxy resin, or a mixture thereof may be used. The epoxy resin may have a viscosity at 25 ° C. of about 10,000 to 100,000 cps or a softening point of about room temperature to 100 ° C. so that the primer composition may be spray coated.

The content of the epoxy resin is preferably 20 to 60% by weight of the total weight of the primer composition. When the content of the epoxy resin is less than 20% by weight or more than 60% by weight, the adhesion of the primer coating layer 20 is lowered, and thus the adhesion between the plastic substrate 10 and the parylene polymer layer 30 may be deteriorated. not.

It is preferable to use the (meth) acrylic-type monomer which has an epoxy group as said (meth) acrylic-type monomer. Epoxy phase in the (meth) acrylic monomer having the epoxy group may participate in the formation of the primer coating layer 20 by the epoxy ring-opening reaction, the (meth) acrylate group serves to improve the adhesion to the parylene polymer layer 30 can do.

Examples of the (meth) acrylic monomer having the epoxy group include glycidyl acrylate, glycidyl methacrylate, 3,4-epoxybutyl acrylate, 3,4-epoxybutyl methacrylate, 6,7-epoxyheptyl Acrylate, 6,7-epoxyheptyl methacrylate or mixtures thereof, but is not necessarily limited thereto.

The (meth) acrylic monomer is preferably included in 2 to 20% by weight of the total weight of the composition. When the content of the (meth) acrylic monomer is less than 2% by weight, it is difficult to obtain an effect of increasing the adhesion by the (meth) acrylate group, and when the amount of the (meth) acrylic monomer is more than 20% by weight, the coating property of the primer composition may be lowered, which is not preferable.

Examples of the curing agent include alkylphenols, polyvalent polyamines, formaldehyde, diethyltoluenediamine, methylethylketone peroxide, benzoyl peroxide, t-butyl hydroxy peroxide, cumene hydroxy peroxide, lauryl peroxide, and acetyl peroxide. Oxides or mixtures thereof may be used, but are not necessarily limited thereto. The curing agent is preferably included in 0.1 to 5% by weight of the total weight of the composition.

It is preferable to use a solvent having good compatibility with the epoxy resin and the (meth) acrylic monomer as the organic solvent. For example, acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, toluene, xylene, ethyl acetate, butyl acetate, cellosolve, cellosolve acetate, methyl cellosolve, ethyl cellosolve or butyl cellosol It is preferable to use a bro. These can be used individually or in mixture of 2 or more types.

The primer composition has superior adhesion to plastic and parylene polymers compared to the silane-based compound, so that the parylene polymer layer 30 can be strongly adhered to the surface of the plastic substrate 10. The primer composition is also excellent in workability because it can be spray coated and cured at a relatively low temperature of about 20 to 80 ° C., preferably about 60 to 80 ° C.

The parylene polymer layer 30 is formed by chemical vapor deposition (CVD). 2 is a view for explaining a method of forming a parylene polymer layer.

Referring to FIG. 2, first, about 120 of parylene dimer and di-para-xylylene present in powder or granule form as starting materials for preparing the parylene polymer layer. Sublimate to gas phase in an evaporator at ˜180 ° C. Sublimed dimer gas is fed to a pyrolyzer maintained at about 650-700 ° C. and pyrolyzed into parylene monomers, para-xylylene in the pyrolyzer. Subsequently, the gaseous parylene monomer is introduced into the deposition chamber maintained at about room temperature and condensed on the deposits positioned in the deposition chamber to form a parylene polymer layer on the surface of the deposit.

In FIG. 2, n represents the number of repeating units and exceeds one. FIG. 2 illustrates an example of parylene N having no chlorine atom, but in the present invention, parylene N, parylene C in which one hydrogen atom of an aromatic ring is substituted with one chlorine atom, and an aromatic ring in the parylene polymer layer Any of parylene D in which two hydrogen atoms of are substituted with two chlorine atoms can be used.

In this way, the parylene polymer layer formed through the evaporation, pyrolysis and deposition process is strongly adhered to the plastic substrate 10 by the primer coating layer 20, so that there is no fear of peeling, and excellent chemical resistance, corrosion resistance, heat resistance and It gives waterproofness.

On the other hand, the plastic molded article formed with the parylene polymer layer according to another embodiment of the present invention, in order to improve the adhesion between the parylene polymer layer 30 and the plastic substrate 10, plasma etching instead of the above-described primer coating layer 20 It may include a transparent conductive layer 40 surface-modified by.

3 is a partial cross-sectional view of a plastic molded article formed with a parylene polymer layer according to another embodiment of the present invention. Referring to FIG. 3, the plastic molded article having the parylene polymer layer according to another embodiment of the present invention is formed on the surface of the plastic substrate 10 and the plastic substrate 10, and the surface-modified transparent conductive material by plasma etching. And a parylene polymer layer 30 formed on the layer 40 and the transparent conductive layer 40. Details of the plastic substrate 10 and the parylene polymer layer 30 are the same as described above.

The transparent conductive layer 40 is made of indium tin oxide (ITO), TiO ₂ or ZnO, and is formed by depositing ITO, TiO ₂ or ZnO on the surface of the plastic substrate 10 using a vacuum deposition method. The vacuum deposition method includes a thermal deposition method, an electron beam deposition method, a sputtering method and the like.

Plasma etching for surface modification of the transparent conductive layer 40 is performed by a dry etching apparatus of the reactive ion etching (RIE) type. The dry etching apparatus of the RIE type uses a reaction gas consisting of CF ₃ , Cl ₂ , Ar, O ₂ or a mixture thereof.

Since the transparent conductive layer 10 is conductive, the reaction gas converted into a plasma state can be induced to be concentrated in the transparent conductive layer 10.

When the transparent conductive layer 40 is plasma etched, the surface is roughened and physically and chemically modified. The surface modified transparent conductive layer 40 provides a rough surface to which the parylene polymer layer 30 can be strongly adhered, and reacts with a parylene monomer, a parylene polymer, or both. ) Gives increased adhesion. As a result, the transparent conductive layer 40 increases the adhesion of the parylene polymer layer 30 like the primer coating layer 20 to prevent the parylene polymer layer 30 from being peeled off from the plastic substrate 10.

Method for producing plastic molded article having a parylene polymer layer

Method for producing a plastic molded article formed with a parylene polymer layer according to an embodiment of the present invention comprises the steps of washing the plastic substrate 10 made of a thermoplastic resin using alcohol and water, the surface of the washed plastic substrate 10 Coating the primer composition onto the primer coating layer 20 and condensing the gaseous parylene monomer on the primer coating layer 20 to form the parylene polymer layer 30. Details of the plastic substrate 10, the primer composition, the primer coating layer 20 and the parylene polymer layer 30 are as described above, and will be omitted to avoid duplication.

The cleaning of the plastic substrate 10 is performed as follows. First, in order to remove the oil and foreign matter adhering to the surface of the plastic substrate 10, the plastic substrate 10 is ultrasonically cleaned using alcohol. In this case, the alcohol is preferably a mixture of isopropyl alcohol and methanol, and the ultrasonic cleaning is preferably performed for about 1 to 5 minutes.

Thereafter, the ultrasonically cleaned plastic substrate 10 is immersed in distilled water or the distilled water is sprayed to wash the plastic substrate 10 again, and then completely dried using an oven or a dryer.

As a method of coating the primer composition on the surface of the plastic substrate 10 subjected to the washing step, dip coating, flow coating, spin coating, spray coating, or the like may be used, and among these, spray coating may be used. desirable.

Specifically, after spraying the primer composition on the surface of the washed plastic substrate 10 to apply the primer composition, it is allowed to stand for about 4 to 5 minutes. At this time, the injection pressure is preferably about 4 to 5 kgf / cm 2, and the number of application is preferably about 2 to 4 times.

The applied primer composition is then cured at about 20-80 ° C., preferably at about 60-80 ° C. to form the primer coating layer 20 on the surface of the plastic substrate 10. When curing the primer composition, an oven or a dryer can be used.

Through the washing step and the primer coating layer 20 forming step, the plastic substrate 10 having the primer coating layer 20 formed thereon is put into a deposition chamber as shown in FIG. 2, and the above-described chemical vapor deposition method is used. By condensing the gaseous parylene monomer on the primer coating layer 20 to form the parylene polymer layer 30.

According to another embodiment of the present invention, a method for manufacturing a plastic molded article includes washing a plastic substrate 10 made of a thermoplastic resin with alcohol and water, and transparent on the surface of the plastic substrate 10 using a vacuum deposition method. Forming a conductive layer 40, plasma etching the transparent conductive layer 40 using a dry etching apparatus of a RIE type, and modifying the surface of the transparent conductive layer 40; Condensing on the surface modified transparent conductive layer 40 to form the parylene polymer layer 30.

The steps of washing the plastic substrate 10 and forming the parylene polymer layer 30 are as described above. Hereinafter, the steps of forming the transparent conductive layer 40 and the surface of the transparent conductive layer 40 are performed. The modification step will be described.

The plastic substrate 10 washed through the washing step is placed in a deposition chamber capable of performing a vacuum deposition method, and a metal oxide is deposited on the surface of the cleaned plastic substrate 10 to form a transparent conductive layer 40. . Preferably, the metal oxide is ITO, TiO ₂ or ZnO. Vacuum deposition methods used to form the transparent conductive layer 40 include thermal deposition, electron beam deposition, sputtering, and the like. The internal pressure of the deposition chamber in which the vacuum deposition process is performed is preferably about 0.1 to 10 mTorr. The deposition chamber and vacuum deposition method can be easily carried out by those skilled in the art.

As described above, after the metal oxide is deposited on the surface of the plastic substrate 10 to form the transparent conductive layer 40, the transparent oxide layer is transparent using a reactive ion etching (RIE) type dry etching apparatus using a reaction gas. The surface of the transparent conductive layer 40 is modified by plasma etching the conductive layer 40.

Figure 4 is a cross-sectional view showing a dry etching apparatus of the RIE type used in the embodiment of the present invention. Referring to FIG. 4, the RIE type dry etching apparatus 50 includes a process chamber 51 capable of converting a reaction gas into a plasma state to etch an etchant. An upper electrode 52 and a lower electrode 53 spaced at predetermined intervals are provided in the process chamber 51, the upper electrode 52 is grounded, and the lower electrode 53 is connected to the power source 54. do.

In addition, the dry etching apparatus 50 of the RIE type has a reaction gas supply source 55 for supplying the reaction gas to the process chamber 51, so that the reaction gas supply source 55 is connected to the process chamber through the supply pipe 56. 51). In the process chamber 51, a vacuum pipe 58 connected to the vacuum pump 57 is formed.

The method of modifying the surface of the transparent conductive layer 40 is as follows. First, the plastic substrate 10 having the transparent conductive layer 40 formed thereon is positioned on the lower electrode 53 of the process chamber 51. The vacuum pump 57 is operated to adjust the internal pressure of the process chamber 51 to about 0.1 to 30 mTorr.

Subsequently, a reaction gas made of CF ₃ , Cl ₂ , Ar, O _2, or a mixture thereof is supplied into the process chamber 51 through the vacuum pipe 58. Thereafter, the power source 54 is operated to apply RF power of about 100 to 500 W to the lower electrode 53 to form an electric field between the upper electrode 52 and the lower electrode 53 to convert the reaction gas into a plasma state. Let's do it.

The reaction gas converted to the plasma state is incident on the transparent conductive layer 40 formed on the surface of the plastic substrate 10 to roughly etch the transparent conductive layer 40 to roughen the surface of the transparent conductive layer 40, and to modify it. Let's do it.

Since the plastic molded article according to the embodiment of the present invention is protected by the parylene polymer layer, it is excellent in chemical resistance, corrosion resistance, heat resistance, and water resistance, and thus can be widely used as a plastic physicochemical test apparatus exposed to an organic solvent, an acid, or an alkali. In addition, the plastic molded article includes a primer coating layer or a transparent conductive layer surface-modified by plasma etching to improve the adhesion of the parylene polymer layer to the plastic substrate, thereby preventing the parylene polymer layer from being peeled off from the plastic substrate. have.

The invention may be better understood by the following examples, which are intended for purposes of illustration of the invention and are not intended to limit the scope of protection defined by the appended claims.

Example 1

The polyethylene resin was injection molded to prepare a beaker-shaped plastic substrate, and the plastic substrate was immersed in an alcohol mixture mixed with isopropyl alcohol and methanol in a volume ratio of 1: 1 and ultrasonically cleaned for about 3 minutes. Subsequently, the plastic substrate was immersed in distilled water, washed, and then completely dried in an oven.

Primer composition by mixing 40% by weight of bisphenol A epoxy resin (YD-017, Kukdo Chemical), 10% by weight of glycidyl methacrylate, 3% by weight of benzoyl peroxide, 35% by weight of methyl ethyl ketone and 12% by weight of toluene Was prepared and sprayed onto the washed plastic substrate at a pressure of about 4.5 kgf / cm 2 and then left for about 5 minutes.

Subsequently, the plastic substrate coated with the primer composition was placed in an oven maintained at about 70 ° C. and cured for about 50 minutes to prepare a plastic substrate on which a primer coating layer was formed.

The plastic substrate on which the primer coating layer was formed was introduced into a deposition chamber of a parylene polymer coating apparatus as shown in FIG. 2, and parylene monomer gas was deposited to form a parylene polymer layer on the primer coating layer to prepare a specimen.

Example 2

The washed plastic substrate prepared in Example 1 was placed in a sputtering deposition chamber, and ITO was deposited on the surface of the plastic substrate to form an ITO layer.

The plastic substrate on which the transparent ITO layer was formed was introduced into a process chamber of a dry etching apparatus of the RIE type as shown in FIG. 4 and plasma-etched to modify the surface of the ITO layer. At this time, the internal pressure of the process chamber was about 3 mTorr, CF ₃ gas was used as the reaction gas, RF power was about 300 W.

Subsequently, a parylene polymer layer was formed on the surface-modified ITO layer as in Example 1 to prepare a specimen.

Comparative Example 1

The specimen was prepared by injecting the plastic substrate prepared in Example 1 into the deposition chamber of the parylene polymer coating apparatus and forming a parylene polymer layer directly on the surface of the plastic substrate without any treatment.

Comparative Example 2

The plastic substrate prepared in Example 1 was not washed, but was immersed in a mixed solution of 97% by weight of xylene and 3% by weight of trichlorovinylsilane, followed by drying out. The plastic substrate treated with the mixed solution was introduced into a deposition chamber of a parylene polymer coating apparatus to form a parylene polymer layer to prepare a specimen.

The adhesion of the parylene polymer layer was evaluated for the specimens prepared in Examples 1 and 2 and Comparative Examples 1 and 2. The adhesion evaluation was performed in accordance with Test Method B of ASTM D3359 using the adhesive test tape, the number of the surfaces peeled off by the adhesive test tape is shown in Table 1 below.

As shown in Table 1, Example 1 having a primer coating layer and Example 2 having an ITO layer surface-modified by plasma etching were treated with a silane-based compound as well as Comparative Example 1 without any treatment. Compared with Comparative Example 2, it was found that the adhesion of the parylene polymer layer is very excellent.

The present invention prevents the parylene polymer layer from peeling by providing a primer coating layer or a transparent conductive layer surface-modified by plasma etching to improve the adhesion of the parylene polymer layer to the plastic substrate between the plastic substrate and the parylene polymer layer. And, it has the effect of providing a plastic molded article excellent in chemical resistance, etching resistance, heat resistance and waterproof and a method of manufacturing the same.

Simple modifications or changes of the present invention can be easily carried out by those skilled in the art, and all such modifications or changes can be seen to be included in the scope of the present invention.

Claims (15)

A plastic substrate 10 made of a thermoplastic resin; A primer coating layer 20 formed by coating a primer composition comprising an epoxy resin and a (meth) acrylic monomer on a surface of the plastic substrate; And A parylene polymer layer 30 formed on the primer coating layer; Plastic molded article, characterized in that it comprises a parylene polymer layer. The method of claim 1, wherein the primer composition, 20 to 60 wt% of the epoxy resin; 2 to 20 wt% of the (meth) acrylic monomer; 0.1 to 5 wt% of a curing agent; And A plastic molded article formed with a parylene polymer layer, comprising an extra organic solvent. The method of claim 1, wherein the (meth) acrylic monomer is a (meth) acrylic monomer having an epoxy group, and the (meth) acrylic monomer having the epoxy group is glycidyl acrylate, glycidyl methacrylate, 3,4- Parylene polymers selected from the group consisting of epoxybutyl acrylate, 3,4-epoxybutyl methacrylate, 6,7-epoxyheptyl acrylate, 6,7-epoxyheptyl methacrylate and mixtures thereof Layered plastic moldings. Plastic substrate 10 made of a thermoplastic resin; A transparent conductive layer 40 formed on the surface of the plastic substrate and surface-modified by plasma etching; And A parylene polymer layer 30 formed on the surface modified transparent conductive layer; Plastic molded article, characterized in that it comprises a parylene polymer layer. The plastic molded article according to claim 4, wherein the transparent conductive layer is made of indium tin oxide (ITO), TiO ₂ or ZnO. The method of claim 4, wherein the plasma etching is Paryl characterized in that performed by a dry etching apparatus of the reactive ion etching (RIE) type using a reaction gas consisting of CF ₃ , Cl ₂ , Ar, O ₂ or a mixture thereof. Plastic molded article formed with a styrene polymer layer. The plastic molded article according to claim 1 or 4, wherein the thermoplastic resin is a polypropylene (PP) resin, a polyethylene (PE) resin or a mixture thereof. The method of claim 1 or 4, wherein the plastic substrate is a physicochemical apparatus, the physicochemical apparatus is a beaker, flask, measuring cylinder, sample bottle, funnel, spoon, tweezers, pipette, dropper, burette, chalet, test tube, Plastic molded article formed with a parylene polymer layer, characterized in that it is selected from the group consisting of a vial and a desiccator. Washing the plastic substrate 10 made of thermoplastic resin with alcohol and water; Coating a primer composition comprising an epoxy resin and a (meth) acrylic monomer on the surface of the washed plastic substrate to form a primer coating layer 20; And Condensing a gaseous parylene monomer on the primer coating layer to form a parylene polymer layer 30; Method for producing a plastic molded article formed with a parylene polymer layer comprising the step. The method of claim 9, wherein the forming of the primer coating layer, Spraying and applying a primer composition comprising the epoxy resin and the (meth) acrylic monomer onto the surface of the washed plastic substrate, and then standing for 4 to 10 minutes; And Curing the applied primer composition at 20-80 ° C .; Method for producing a plastic molded article formed with a parylene polymer layer (30) characterized in that it comprises a step. Washing the plastic substrate 10 made of the thermoplastic resin with alcohol and water; Depositing ITO, TiO ₂ or ZnO on the surface of the cleaned plastic substrate using vacuum deposition to form a transparent conductive layer 40; Modifying the surface of the transparent conductive layer by plasma etching the transparent conductive layer using a dry etching apparatus of a RIE type using a reaction gas composed of CF ₃ , Cl ₂ , Ar, O ₂ or a mixture thereof; And Condensing a gaseous parylene monomer on the surface modified transparent conductive layer to form a parylene polymer layer 30; Method for producing a plastic molded article formed with a parylene polymer layer comprising the step. The method of manufacturing a plastic molded article having a parylene polymer layer according to claim 11, wherein the vacuum deposition method is thermal deposition, electron beam deposition, or sputtering. The method of claim 11, wherein the modifying the surface of the transparent conductive layer, Inserting the plastic substrate on which the transparent conductive layer is formed into the process chamber (51) of the RIE type dry etching apparatus (50); Adjusting the internal pressure of the process chamber to 0.1-30 mTorr; Supplying a reaction gas consisting of CF ₃ , Cl ₂ , Ar, O _2, or a mixture thereof into the process chamber; And Converting the reaction gas into a plasma state by applying RF power of 100 to 500 W to an electrode of the process chamber; Method for producing a plastic molded article formed with a parylene polymer layer comprising the step. The method of claim 9 or 11, wherein the washing step, Ultrasonically cleaning the plastic substrate made of the thermoplastic resin using a mixture of isopropyl alcohol and methanol; And Washing the ultrasonically cleaned plastic substrate with distilled water and then drying it; Method for producing a plastic molded article formed with a parylene polymer layer comprising the step. The method of claim 9 or 11, wherein the thermoplastic resin is a polypropylene (PP) resin, a polyethylene (PE) resin, or a mixture thereof.

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