KR20090110219A - Substrate processing apparatus and substrate processing method - Google Patents

Abstract

PURPOSE: A substrate processor and a substrate process method for improving throughput are provided to perform the heating processing of a substrate and improve throughput of the substrate process. CONSTITUTION: A substrate processor(500) includes a first processing unit and a second processing unit. The first processing unit performs a processing in the substrate. The second processing unit is arranged between the first processing unit and the exposure device(16). The second processing unit carries in a substrate about the exposure device processing in a substrate. The first processing unit includes the photosensitive film formation unit on the photosensitive film. The second processing unit includes a cleaning processing unit, a heat treatment unit, a first substrate transfer unit and a second substrate transfer unit.

Description

Substrate Processing Apparatus and Substrate Processing Method {SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD}

The present invention relates to a substrate processing apparatus and a substrate processing method for processing a substrate.

Substrate processing apparatus for processing various substrates such as semiconductor substrate, substrate for liquid crystal display, substrate for plasma display, substrate for optical disk, substrate for magnetic disk, substrate for magneto-optical disk, substrate for photomask, etc. Is being used.

In such a substrate processing apparatus, generally, several different processes are performed continuously with respect to one board | substrate. The substrate processing apparatus described in Japanese Patent Laid-Open No. 2003-324139 is composed of an indexer block, an antireflection film processing block, a resist film processing block, a development processing block, and an interface block. An exposure apparatus, which is an external device separate from the substrate processing apparatus, is disposed adjacent to the interface block.

In the above substrate processing apparatus, the substrate loaded from the indexer block is conveyed to the exposure apparatus through the interface block after the antireflection film formation and the resist film coating process are performed in the antireflection film processing block and the resist film processing block. After the exposure treatment is performed on the resist film on the substrate in the exposure apparatus, the substrate is conveyed to the developing block through the interface block. After the development process is performed on the resist film on the substrate in the development block, the substrate is conveyed to the indexer block.

In recent years, along with the higher density and higher integration of devices, the miniaturization of resist patterns has become an important problem. In the conventional general exposure apparatus, exposure processing is performed by reducing and projecting the pattern of the reticle onto the substrate through the projection lens. However, in such a conventional exposure apparatus, since the line width of the exposure pattern is determined by the wavelength of the light source of the exposure apparatus, there is a limit to the miniaturization of the resist pattern.

Therefore, a liquid immersion method has been proposed as a projection exposure method that enables further miniaturization of an exposure pattern (see, for example, International Publication No. 99/49504 pamphlet). In the projection exposure apparatus of International Publication No. 99/49504 pamphlet, liquid is filled between the projection optical system and the substrate, so that the exposure light on the substrate surface can be shortened. As a result, the exposure pattern can be further miniaturized.

In recent years, in accordance with the demand for miniaturization of an exposure pattern, a substrate processing step is complicated. This reduces the throughput of the substrate processing apparatus.

In addition, after the exposure treatment of the substrate, PEB (post-exposure bake) treatment of the substrate is performed to promote the chemical reaction by the exposure treatment in the resist film. In order to obtain a desired exposure pattern, it is preferable to perform the PEB treatment of the substrate more quickly after the exposure treatment to promptly accelerate the chemical reaction.

SUMMARY OF THE INVENTION An object of the present invention is to provide a substrate processing apparatus and a substrate processing method which are capable of performing a heat treatment of a substrate quickly after exposure while improving throughput.

(1) A substrate processing apparatus according to one aspect of the present invention is a substrate processing apparatus arranged to be adjacent to an exposure apparatus, and is disposed between a first processing unit for processing a substrate, a first processing unit, and an exposure apparatus, A second processing portion for processing the substrate and carrying the substrate in and out of the exposure apparatus; the first processing portion includes a photosensitive film forming unit for forming a photosensitive film made of a photosensitive material on the substrate; The processing unit includes a cleaning processing unit for cleaning the substrate before the exposure treatment, a heat treatment unit for performing a heat treatment on the substrate after the exposure treatment, and a first substrate conveyance conveying the substrate before the exposure treatment between the first processing portion, the cleaning treatment unit, and the exposure apparatus. And a second substrate transfer mechanism for transferring the substrate after the exposure treatment between the exposure apparatus and the heat treatment unit.

In this substrate processing apparatus, a photosensitive film is formed on a substrate by the photosensitive film forming unit in the first processing unit. The substrate is conveyed to the second processing unit, washed by the cleaning processing unit, and then loaded into the exposure apparatus. The substrate subjected to the exposure treatment in the exposure apparatus is returned to the second processing unit. Then, heat treatment is performed on the substrate by the heat treatment unit in the second treatment portion.

In this case, the substrate before the exposure treatment is transferred between the first processing unit, the cleaning processing unit and the exposure apparatus by the first substrate transfer mechanism, and the substrate after the exposure treatment is transferred between the exposure apparatus and the heat treatment unit by the second substrate transfer mechanism. do. That is, in the 2nd processing part, the conveyance path of the board | substrate before an exposure process, and the conveyance path of the board | substrate after an exposure process are each independently ensured.

Thereby, a board | substrate can be conveyed efficiently rather than the case where the conveyance path of the board | substrate before an exposure process and the conveyance path of the board | substrate after an exposure process cross | intersect. As a result, it becomes possible to improve the throughput. In addition, since the substrate before the exposure treatment and the substrate after the exposure treatment do not contact the same site, mutual contamination between the substrate before the exposure treatment and the substrate after the exposure treatment can be prevented.

Moreover, since the conveyance path | route of the board | substrate before an exposure process and the conveyance path | route of the board | substrate after an exposure process are independent, respectively, the board | substrate after an exposure process can be smoothly conveyed to a heat processing unit. Therefore, when processing several board | substrate continuously, the time from exposure processing to heat processing can be made substantially constant. As a result, variation in the accuracy of the exposure pattern can be prevented.

Moreover, since the heat processing unit is provided in the 2nd processing part adjacent to an exposure apparatus, the board | substrate after an exposure process can be conveyed to a heat processing unit quickly. Therefore, after an exposure process, heat processing of a board | substrate can be performed quickly. As a result, the chemical reaction in the photosensitive film can be promptly accelerated, and a desired exposure pattern can be obtained.

(2) The second processing unit includes a processing block for processing the substrate and a loading / exporting block for carrying in and out of the substrate with respect to the exposure apparatus, and the cleaning processing unit and the thermal processing unit are provided in the processing block. The first substrate transport mechanism is provided in the processing block, the first transport apparatus for transporting the substrate before the exposure treatment between the first processing unit, the cleaning processing unit, and the block for carrying in and out, and the block for carrying in and out. And a second transfer device for transferring the substrate before the exposure process between the processing block and the exposure apparatus, wherein the second substrate transfer mechanism is provided in the processing block, and carries the heat-treated substrate into the carrying-out block and heat treatment. You may include the 3rd conveying apparatus conveyed between units, and the 4th conveying apparatus provided in the block for carrying in and carrying out, and conveying the board | substrate after an exposure process between an exposure apparatus and a process block.

In this case, the board | substrate before an exposure process is conveyed from a 1st process part to a washing | cleaning processing unit by a 1st conveying apparatus, and then. It is conveyed to a block for carrying in / out from a washing process unit. And the board | substrate is carried in to an exposure apparatus by a 2nd conveyance apparatus.

Moreover, the board | substrate after an exposure process is carried out from an exposure apparatus with a 3rd conveying apparatus. And the board | substrate is conveyed to the heat processing unit from the block for carrying in / out by a 4th conveying apparatus.

Thereby, the conveyance path of the board | substrate before an exposure process and the conveyance path of the board | substrate after an exposure process are independent, and a board | substrate can be conveyed efficiently. As a result, the throughput can be sufficiently improved. In addition, it is possible to reliably prevent the substrate before the exposure treatment and the substrate after the exposure treatment from contacting the same site, thereby preventing mutual contamination between the substrate before the exposure treatment and the substrate after the exposure treatment.

(3) The carrying in / outing block may be movable with respect to the processing block. In this case, a work space for maintenance work can be secured by moving the block for import / export relative to the block for processing. Thereby, when a lot of power is used in a process block, maintenance work can be performed, maintaining the connection of a process block and a power installation. Therefore, work effort and work time can be greatly reduced.

(4) The first processing unit may further include a fifth transfer device for carrying out the substrate after the heat treatment from the heat treatment unit.

In this case, the board | substrate after an exposure process is carried in to a heat processing unit by a 4th conveying apparatus, and is carried out from a heat processing unit by a 5th conveying apparatus. In this way, the transfer efficiency of the substrate can be further improved by carrying the substrate from the first processing portion to the second processing portion through the heat treatment unit.

(5) The heat treatment unit includes a first placing portion for temporarily placing the substrate carried by the third conveying apparatus, a second placing portion for temporarily placing the substrate carried by the fifth conveying apparatus, and a substrate. You may have a heating part which heats a heating part, a 1st mounting part, a 2nd mounting part, and the conveyance part which conveys a board | substrate between a heating part.

In this case, a board | substrate is carried in to a 1st mounting part by a 3rd conveying apparatus, and the board | substrate is conveyed to a heating part by a conveyance part. Heat processing is performed to a board | substrate by a heating part, and the board | substrate after heat processing is conveyed from a heating part to a 2nd mounting part by a conveyance part. And a board | substrate is carried out from a 2nd mounting part by a 5th conveying apparatus.

Thus, by providing a 1st mounting part and a 2nd mounting part separately, carrying out of the board | substrate carrying by the 3rd conveying apparatus and carrying out of the board | substrate by a 5th conveying apparatus can be performed smoothly. As a result, the throughput can be further improved.

(6) The second processing unit further includes a drying processing unit for drying the substrate after the exposure treatment by the exposure apparatus and before the heat treatment by the heat treatment unit, and the second substrate transfer mechanism includes an exposure apparatus and drying the substrate after the exposure treatment. You may convey between a processing unit and a heat processing unit.

In this case, even if the liquid adheres to the substrate in the exposure apparatus, the liquid can be prevented from falling into the substrate processing apparatus. As a result, malfunction of the substrate processing apparatus can be prevented.

(7) The first processing unit, the second processing unit, and the exposure apparatus are arranged along the first direction, and the cleaning processing unit, the heat processing unit, and the drying processing unit are arranged in a second direction perpendicular to the first direction and the horizontal plane in the second processing unit. The heat treatment unit is disposed in a substantially central portion of the second treatment portion, and the cleaning treatment unit and the drying treatment unit are disposed on one side and the other side of the heat treatment unit in the second direction. It may be arranged.

In this case, the size of the second processing unit can be reduced and the space can be reduced while ensuring sufficient transfer efficiency of the substrate in the second processing unit.

(8) A substrate processing method according to another aspect of the present invention is a substrate processing method for processing a substrate in a substrate processing apparatus that is disposed adjacent to an exposure apparatus and includes a first processing unit and a second processing unit. A process of forming a photosensitive film made of a photosensitive material on the substrate, a process of conveying the substrate after the photosensitive film formation from the first processing unit to the second processing unit by the first substrate transport mechanism, and a process of cleaning the substrate in the second processing unit; The process of conveying the board | substrate after washing | cleaning from a 2nd process part to an exposure apparatus by a 1st board | substrate conveyance mechanism, and the process of conveying the board | substrate after exposure processing by an exposure apparatus from a exposure apparatus to a 2nd process part by a 2nd board | substrate transport mechanism. And a step of performing heat treatment on the substrate in the second processing unit.

In this substrate processing method, a photosensitive film is formed on a substrate in the first processing unit. The substrate is conveyed to the second processing unit, and washed and then loaded into the exposure apparatus. The substrate subjected to the exposure treatment in the exposure apparatus is returned to the second processing unit. Then, heat treatment is performed on the substrate in the second processing unit.

In this case, the substrate before the exposure process is conveyed between the first processing unit, the second processing unit and the exposure apparatus by the first substrate transport mechanism, and the substrate after the exposure process is transported between the exposure apparatus and the second processing unit by the second substrate transport mechanism. Is returned. That is, in the 2nd processing part, the conveyance path of the board | substrate before an exposure process, and the conveyance path of the board | substrate after an exposure process are each independently ensured.

Thereby, a board | substrate can be conveyed efficiently rather than the case where the conveyance path of the board | substrate before an exposure process and the conveyance path of the board | substrate after an exposure process cross | intersect. As a result, it becomes possible to improve the throughput. In addition, since the substrate before the exposure treatment and the substrate after the exposure treatment do not come into contact with the same site, mutual contamination between the substrate before the exposure treatment and the substrate after the exposure treatment can be prevented.

Moreover, since the conveyance path | route of the board | substrate before an exposure process and the conveyance path of the board | substrate after an exposure process are independent, respectively, the heat treatment of the board | substrate after an exposure process can be performed smoothly. Therefore, when processing several board | substrate continuously, the time from exposure processing to heat processing can be made substantially constant. As a result, variation in the accuracy of the exposure pattern can be prevented.

In addition, since the heat treatment is performed in the second processing unit, the substrate can be heat-treated quickly after the exposure treatment. As a result, the chemical reaction in the photosensitive film can be promptly accelerated, and a desired exposure pattern can be obtained.

EMBODIMENT OF THE INVENTION Hereinafter, the substrate processing apparatus which concerns on embodiment of this invention is demonstrated using drawing. In the following description, a substrate refers to a semiconductor substrate, a liquid crystal display device substrate, a plasma display substrate, a photomask glass substrate, an optical disk substrate, a magnetic disk substrate, a magneto-optical disk substrate, a photomask substrate, and the like. Say.

(1) Structure of Substrate Processing Apparatus

1 is a plan view of a substrate processing apparatus according to an embodiment of the present invention. In addition, the arrow which shows the X direction, Y direction, and Z direction orthogonal to each other is attached | subjected to FIG. 1 and FIGS. The X and Y directions are perpendicular to each other in the horizontal plane, and the Z direction corresponds to the vertical direction. Moreover, the direction which an arrow points in each direction makes a + direction, and the opposite direction makes a-direction. Moreover, the rotation direction centering on a Z direction is made into (theta) direction.

As shown in FIG. 1, the substrate processing apparatus 500 includes an indexer block 9, an antireflection film processing block 10, a resist film processing block 11, a development processing block 12, and a resist cover film processing block. (13), the resist cover film removal block 14, and the interface block 15. The interface block 15 includes a cleaning heating block 15a and an import / export block 15b. The exposure apparatus 16 is disposed adjacent to the carry-in / out block 15b of the interface block 15. In the exposure apparatus 16, the exposure process is performed to the board | substrate W by the liquid immersion method.

Hereinafter, the indexer block 9, the anti-reflection film processing block 10, the resist film processing block 11, the development processing block 12, the resist cover film processing block 13, the resist cover film removing block 14 and Each of the interface blocks 15 is called a processing block.

The indexer block 9 includes a main controller (control unit) 30, a plurality of carrier mounting tables 40, and an indexer robot IR that control the operation of each processing block. The indexer robot IR is provided with a hand IRH for sending and receiving the substrate W. As shown in FIG.

The antireflection film processing block 10 includes the antireflection film heat treatment parts 100 and 101, the antireflection film coating part 50, and the first center robot CR1. The antireflection film coating unit 50 is provided to face the heat treatment units 100 and 101 for antireflection film with the first center robot CR1 interposed therebetween. In the first center robot CR1, hands CRH1 and CRH2 for exchanging the substrate W are provided above and below.

Between the indexer block 9 and the anti-reflection film processing block 10, a partition 17 for blocking the atmosphere is provided. The partition walls 17 are provided with substrate placing portions PASS1 and PASS2 close to the top and bottom to exchange the substrate W between the indexer block 9 and the anti-reflection film processing block 10. The upper substrate placing part PASS1 is used to convey the substrate W from the indexer block 9 to the anti-reflection film processing block 10, and the lower substrate placing part PASS2 is used to convey the substrate W. It is used when conveying from the anti-reflection film processing block 10 to the indexer block 9.

In addition, the optical sensor (not shown) which detects the presence or absence of the board | substrate W is provided in board | substrate mounting part PASS1, PASS2. This makes it possible to judge whether or not the substrate W is placed in the substrate placing portions PASS1 and PASS2. Further, a plurality of support pins fixed to the substrate placing parts PASS1 and PASS2 are provided. In addition, the said optical sensor and a support pin are similarly provided also in the board | substrate mounting part PASS3-PASS12 mentioned later.

The resist film processing block 11 includes a resist film heat treatment unit 110 and 111, a resist film coating unit 60, and a second center robot CR2. The resist film coating unit 60 is provided to face the resist film heat treatment units 110 and 111 with the second center robot CR2 interposed therebetween. In the second center robot CR2, hands CRH3 and CRH4 for exchanging the substrate W are provided above and below.

Between the anti-reflection film processing block 10 and the resist film processing block 11, a partition wall 18 for blocking the atmosphere is provided. On the partition wall 18, substrate placing portions PASS3 and PASS4 for transferring the substrate W between the anti-reflection film processing block 10 and the resist film processing block 11 are provided close to each other. do. The upper substrate placing part PASS3 is used to convey the substrate W from the anti-reflection film processing block 10 to the resist film processing block 11, and the lower substrate placing part PASS4 is used as the substrate W. FIG. ) Is used to transfer from the resist film processing block 11 to the anti-reflection film processing block 10.

The developing block 12 includes a developing heat treatment unit 120 and 121, a developing unit 70, and a third center robot CR3. The developing unit 70 is provided to face the developing heat treatment units 120 and 121 with the third center robot CR3 interposed therebetween. In the third center robot CR3, hands CRH5 and CRH6 for exchanging the substrate W are provided above and below.

Between the process block 11 for resist film and the development process block 12, the partition 19 for blocking an atmosphere is provided. The partitions 19 are provided with substrate placing portions PASS5 and PASS6 for transferring the substrate W between the resist film processing block 11 and the development processing block 12 close up and down. The upper substrate placing part PASS5 is used to convey the substrate W from the resist film processing block 11 to the developing processing block 12, and the lower substrate placing part PASS6 carries the substrate W. It is used when conveying from the developing processing block 12 to the processing block 11 for resist film.

The resist cover film processing block 13 includes a resist cover film heat treatment section 130, 131, a resist cover film coating section 80, and a fourth center robot CR4. The resist processing film coating processing section 80 is provided to face the heat treatment sections 130 and 131 for resist cover films with the fourth center robot CR4 interposed therebetween.

In the fourth center robot CR4, hands CRH7 and CRH8 for exchanging the substrate W are provided above and below.

Between the developing block 12 and the resist cover film processing block 13, a partition 20 for blocking the atmosphere is provided. The partition wall 20 is provided with substrate placing portions PASS7 and PASS8 for transferring the substrate W between the developing block 12 and the resist cover film processing block 13 up and down. . The upper substrate placing portion PASS7 is used to convey the substrate W from the developing block 12 to the processing block 13 for resist cover film, and the lower substrate placing portion PASS8 is used for the substrate W. FIG. Is used when conveying from the processing block 13 for resist cover film to the developing processing block 12.

The resist cover film removing block 14 includes a heat treatment part 140, a substrate placing part PASS11, an edge exposure part EEW, a resist cover film removing processing part 90, and a fifth center robot CR5. . The substrate placing portion PASS11 and the edge exposure portion EEW are disposed above and below the cleaning heating block 15a. The resist cover film removal processing unit 90 is provided to face the heat treatment unit 140, the substrate placing unit PASS11, and the edge exposure unit EEW with the fifth center robot CR5 interposed therebetween. In the fifth center robot CR5, hands CRH9 and CRH10 for exchanging the substrate W are provided above and below.

Between the process block 13 for resist cover film and the resist cover film removal block 14, a partition 21 for blocking the atmosphere is provided. In the partition wall 21, substrate placing portions PASS9 and PASS10 for transferring the substrate W between the resist cover film processing block 13 and the resist cover film removing block 14 are located close to the top and bottom. Is installed. The upper substrate placing portion PASS9 is used to convey the substrate W from the resist cover film processing block 13 to the resist cover film removing block 14, and the lower substrate placing portion PASS10 is used as the substrate ( It is used to convey W) from the resist cover film removal block 14 to the processing block 13 for a resist cover film.

The cleaning heating block 15a of the interface block 15 includes the cleaning / drying processing units SD1 and SD2, the sixth center robot CR6, the mounting and baking unit P-PEB, and the seventh center robot CR7. It includes. In addition, the cleaning / drying processing unit SD1 performs the cleaning treatment and the drying treatment of the substrate W before the exposure treatment. The cleaning / drying processing unit SD2 performs the cleaning treatment and the drying treatment of the substrate W after the exposure treatment. In the cleaning processing in the cleaning / drying processing units SD1 and SD2, a cleaning liquid such as pure water is used.

The sixth center robot CR6 has hands CRH11 and CRH12 for exchanging the substrate W up and down, and the hands CRH13 for exchanging the substrate W for the seventh center robot CR7. CRH14) is provided above and below.

The carry-in / out block 15b of the interface block 15 includes a bevel inspection unit IM, a mounting and cooling unit P-CP, a sending buffer section SBF, an interface conveyance mechanism IFR, a substrate placing section PASS12) and a return buffer portion (RBF). In the interface transfer mechanism IFR, hands H1 and H2 for exchanging the substrate W are provided above and below. The hands H1 and H2 are driven independently of each other.

The carry-in / out block 15b is provided so that it can move to + X direction and -X direction with respect to the washing heating block 15a. At the time of maintenance of the interface block 15 or the exposure apparatus 16, the carry-in / out block 15b is moved to + X direction or -X direction, and a working space is secured. In addition, the carry-in / out block 15b is lighter than other blocks and can be easily moved.

In addition, in the washing heating block 15a, a large amount of washing liquid is used in the washing / drying processing units SD1 and SD2. Therefore, it is necessary to reliably connect the cleaning heating block 15a to a facility for supplying cleaning solution (such as cleaning solution supply source R1 in FIG. 6 described later). On the other hand, in the carry-in / out block 15b, little power is used. Therefore, the carry-in / out block 15b can be easily connected to the thermal power facility. As a result, separation and reconnection can be easily performed between the carry-in / out block 15b and the thermal power facility.

Therefore, it is easier to move the carry-in and take-out block 15b than to move the cleaning heating block 15a. Therefore, at the time of maintenance, only the carry-in / out block 15b is moved, without moving the washing-heating block 15a, and a worker's effort and work time can be largely reduced.

2 is a schematic side view of the substrate processing apparatus 500 of FIG. 1 seen in the + X direction, and FIG. 3 is a schematic side view of the substrate processing apparatus 500 of FIG. 1 viewed in the -X direction. In addition, in FIG. 2, what is installed in the + X side of the substrate processing apparatus 500 is mainly shown, and in FIG. 3, what is installed in the -X side of the substrate processing apparatus 500 is mainly shown.

First, the structure of the + X side of the substrate processing apparatus 500 is demonstrated using FIG. As shown in FIG. 2, three coating units BARC are laminated | stacked up and down in the anti-reflective film coating process part 50 (refer FIG. 1) of the anti-reflective film processing block 10. As shown in FIG. Each coating unit BARC supplies the coating liquid of the antireflection film to the spin chuck 51 and the substrate W held on the spin chuck 51 by rotating the suction and holding the substrate W in a horizontal position. The supply nozzle 52 is provided.

Three coating units RES are stacked on top of each other in the resist film coating unit 60 (see FIG. 1) of the resist film processing block 11. Each coating unit RES supplies the coating liquid of the resist film to the spin chuck 61 and the substrate W held on the spin chuck 61 by rotating the suction and holding the substrate W in a horizontal position. A supply nozzle 62 is provided.

In the developing processing unit 70 of the developing processing block 12, five developing processing units DEV are stacked up and down. Each developing processing unit DEV supplies a developing nozzle to the spin chuck 71 which rotates by holding and holding the substrate W in a horizontal position and the substrate W held on the spin chuck 71. 72 is provided.

Three coating units COV are stacked on top of each other in the coating unit 80 for the resist cover film of the processing block 13 for the resist cover film. Each coating unit COV supplies the coating liquid of the resist cover film to the spin chuck 81 and the substrate W held on the spin chuck 81 by rotating the suction and holding the substrate W in a horizontal position. The supply nozzle 82 is provided. As a coating liquid of a resist cover film, the material (material with low reactivity with a resist and water) with low affinity with a resist and water can be used. For example, hydrofluoric acid resin. The coating unit COV forms a resist cover film on the resist film formed on the substrate W by applying the coating liquid onto the substrate W while rotating the substrate W. FIG.

In the resist cover film removal processing unit 90 of the resist cover film removal block 14, three removal units REM are stacked up and down. Each removal unit REM is a spinner 91 which is rotated by adsorption holding and holding the substrate W in a horizontal position and a stripping liquid (for example, the substrate W is held on the spin chuck 91). And a supply nozzle 92 for supplying hydrofluoric acid resin). The removal unit REM removes the resist cover film formed on the substrate W by applying a stripping liquid onto the substrate W while rotating the substrate W. As shown in FIG.

In addition, the removal method of the resist cover film in the removal unit REM is not limited to said example. For example, the resist cover film may be removed by supplying a peeling liquid onto the substrate W while moving the slit nozzle above the substrate W. FIG.

On the + X side of the cleaning heating block 15a of the interface block 15, five cleaning / drying processing units SD2 are stacked up and down. On the + X side of the carry-in / out block 15b, the board | substrate mounting part PASS12 and the return buffer part RBF are arrange | positioned up and down.

Next, the structure of the -X side of the substrate processing apparatus 500 is demonstrated using FIG. As shown in Fig. 3, two heating units (hot plates) HP and two cooling units (cooling plates) (CP) are provided in the anti-reflection film heat treatment parts 100 and 101 of the anti-reflection film processing block 10. ) Are each stacked. Further, in the heat treatment parts 100 and 101 for the antireflection film, local controllers LC for controlling the temperatures of the heating unit HP and the cooling unit CP are arranged at the top.

In the resist film heat treatment parts 110 and 111 of the resist film processing block 11, two heating units HP and two cooling units CP are laminated. Further, in the heat treatment units 110 and 111 for resist films, local controllers LC for controlling the temperatures of the heating unit HP and the cooling unit CP are arranged at the top.

In the developing heat treatment parts 120 and 121 of the developing block 12, two heating units HP and two cooling units CP are laminated. Further, in the developing heat treatment parts 120 and 121, local controllers LC for controlling the temperatures of the heating unit HP and the cooling unit CP are disposed at the top.

In the heat treatment portions 130 and 131 for the resist cover film processing block 13, two heating units HP and two cooling units CP are laminated. Further, in the heat treatment parts 130 and 131 for the resist cover film, a local controller LC for controlling the temperature of the heating unit HP and the cooling unit CP is disposed at the top.

In the heat treatment part 140 of the resist cover film removal block 14, two heating units HP and two cooling units CP are stacked up and down. Further, the substrate placing portion PASS11 and the two edge exposure portions EEW are stacked up and down so as to be adjacent to the cleaning heating block 15a.

On the -X side of the cleaning heating block 15a of the interface block 15, five cleaning / drying processing units SD1 are stacked up and down. On the + X side of the carry-in / out block 15b, the bevel inspection unit IM, four mounting and cooling units P-CP, and the sending buffer part SBF are arrange | positioned up and down.

Further, coating unit BARC, RES, COV, developing unit DEV, removing unit REM, heating unit HP, cooling unit CP, edge exposure unit EEW, cleaning / drying processing unit ( The number of SD1, SD2), bevel inspection unit (IM), mounting and cooling unit (P-CP) and mounting and heating unit (P-PEB) may be changed as appropriate.

(2) operation of substrate processing apparatus

Next, operation | movement of the substrate processing apparatus 500 which concerns on this embodiment is demonstrated, referring FIGS.

On the carrier mounting base 40 of the indexer block 9, the carrier C which accommodates the several board | substrate W in multiple stages is carried in. The indexer robot IR takes out the unprocessed board | substrate W accommodated in the carrier C using the hand IRH. Thereafter, the indexer robot IR is rotated in the ± θ direction while moving in the ± X direction, and the unprocessed substrate W is placed on the substrate placing part PASS1.

In this embodiment, although front opening unified pod (FOUP) is used as carrier C, it is not limited to this, The OC (open which exposes SMIF (Standard Mechanical Inter Face) pod and storage board | substrate W to outside air) is open. cassette) or the like.

In addition, the indexer robot IR, the first to seventh center robots CR1 to CR7, and the interface transfer mechanism IFR, respectively, linearly slide linearly with respect to the substrate W to perform the hand movement of the hand. Although a linear robot is used, an articulated robot may be used that is not limited to this, and moves the joint linearly to move the hand forward and backward.

The unprocessed substrate W placed on the substrate placing unit PASS1 is received by the first center robot CR1 of the anti-reflection film processing block 10. The first center robot CR1 carries the substrate W into the antireflection film heat treatment units 100 and 101.

Thereafter, the first center robot CR1 takes out the heat-treated substrate W from the anti-reflection film heat treatment units 100 and 101 and carries the substrate W into the anti-reflection film coating unit 50. In this anti-reflection coating unit 50, an anti-reflection film is formed on the substrate W by the coating unit BARC in order to reduce standing waves and halation occurring during exposure.

Next, the first center robot CR1 takes out the coated substrate W from the antireflective coating treatment unit 50 and carries the substrate W into the antireflective coating heat treatment units 100 and 101. do. Thereafter, the first center robot CR1 takes out the heat-treated substrate W from the antireflection film heat treatment units 100 and 101, and places the substrate W on the substrate placing unit PASS3.

The substrate W placed on the substrate placing part PASS3 is received by the second center robot CR2 of the processing film 11 for resist film. The second center robot CR2 carries the substrate W into the heat treatment units 110 and 111 for resist films.

Thereafter, the second center robot CR2 takes out the heat-treated substrate W from the heat treatment units 110 and 111 for the resist film, and carries the substrate W into the coating film 60 for the resist film. In this resist film coating processing section 60, a resist film is coated and formed on the substrate W on which the antireflection film is formed by the coating unit RES.

Next, the second center robot CR2 takes out the coated substrate W from the resist film coating unit 60 and carries the substrate W into the resist film heat treatment units 110 and 111. Thereafter, the second center robot CR2 takes out the heat-treated substrate W from the heat treatment units 110 and 111 for the resist film, and mounts the substrate W on the substrate placing unit PASS5.

The substrate W placed on the substrate placing unit PASS5 is received by the third center robot CR3 of the developing block 12. The 3rd center robot CR3 mounts the board | substrate W in the board | substrate mounting part PASS7.

The substrate W placed on the substrate placing unit PASS7 is received by the fourth center robot CR4 of the processing block 13 for resist cover film. The 4th center robot CR4 carries the board | substrate W into the coating process part 80 for resist covers films. In this resist cover film coating processing section 80, a resist cover film is coated and formed on the substrate W on which the resist film is formed by the coating unit COV.

Next, the fourth center robot CR4 takes out the coated substrate W from the coating member 80 for resist cover film and carries the substrate W into the heat treatment parts 130 and 131 for the resist cover film. do. Thereafter, the fourth center robot CR4 takes out the heat-treated substrate W from the heat treatment portions 130 and 131 for the resist cover film, and places the substrate W on the substrate placing portion PASS9.

The substrate W placed on the substrate placing unit PASS9 is received by the fifth center robot CR5 of the resist cover film removing block 14. The fifth center robot CR5 carries the substrate W into the edge exposure portion EEW. In this edge exposure part EEW, an exposure process is performed to the periphery of the board | substrate W. As shown in FIG. Thereafter, the fifth center robot CR5 takes out the substrate W having been subjected to the edge exposure processing from the edge exposure portion EEW, and places the substrate W on the substrate placing portion PASS11.

The substrate W placed on the substrate placing unit PASS11 is received by the sixth center robot CR6 of the cleaning heating block 15a. The sixth center robot CR6 carries the substrate W into one of the cleaning / drying processing units SD1. In the cleaning / drying processing unit SD1, as described above, cleaning and drying processing of the substrate W before the exposure processing are performed.

Next, the sixth center robot CR6 takes out the cleaned and dried substrate W from the cleaning / drying processing unit SD1, and moves the substrate W to the bevel inspection unit of the carry-in / out block 15b. Bring in (IM) In the bevel inspection unit IM, the bevel portion (outer circumferential end) of the substrate W is inspected to confirm that there is no abnormality such as peeling off of the bevel portion of the substrate W. FIG.

When abnormality of the bevel part is confirmed by the bevel inspection unit IM, the board | substrate W is separately arranged desired. For example, the board | substrate W is taken out from the bevel inspection unit IM by the 6th center robot CR6, and is carried in the sending buffer part SBF. Then, after the lot is finished, it is recovered by the worker.

The substrate W having no abnormality in the bevel portion is taken out from the bevel inspection unit IM by the sixth center robot CR6, and then processed as follows.

The exposure processing time by the exposure apparatus 16 is usually longer than other processing steps and conveyance steps. Therefore, the exposure apparatus 16 may not be able to accommodate the next board | substrate W in many cases. In this case, the substrate W is temporarily stored in the sending buffer portion SBF of the carry-in / out block 15b. In this embodiment, 6th center robot CR6 conveys the test | inspection completed board | substrate W taken out from the bevel inspection unit IM to the sending buffer part SBF.

Next, the 6th center robot CR6 takes out the board | substrate W accommodated in the sending buffer part SBF, and loads the board | substrate W to a mounting and cooling unit P-CP. The substrate W carried in the mounting and cooling unit P-CP is maintained at the same temperature (eg, 23 ° C.) in the exposure apparatus 16.

When the exposure apparatus 16 has a sufficient processing speed, the substrate W is not stored and stored in the sending buffer portion SBF, but is placed on the mounting and cooling unit P-CP from the bevel inspection unit IM. You may convey the board | substrate W.

Subsequently, the substrate W held at the desired temperature in the mounting and cooling unit P-CP is received by the hand H1 above the interface transfer mechanism IFR of the carry-in / out block 15b and exposed. It is carried in the board | substrate loading part 16a in the apparatus 16. As shown in FIG.

The substrate W subjected to the exposure treatment in the exposure apparatus 16 is carried out from the substrate carrying out portion 16b by the hand H2 below the interface transfer mechanism IFR. The interface conveyance mechanism IFR mounts the board | substrate W in the board | substrate mounting part PASS12.

The substrate W placed on the substrate placing unit PASS12 is received by the seventh center robot CR7 of the cleaning heating block 15a. The seventh center robot CR7 carries the substrate W into any one of the cleaning / drying processing units SD2. In the cleaning / drying processing unit SD2, the cleaning and drying processing of the substrate W after the exposure processing is performed as described above.

Next, the seventh center robot CR7 removes the cleaned and dried substrates W from the cleaning / drying processing unit SD2 and places the substrates W on the heating unit P-PEB. Bring in In the placement and heating unit P-PEB, post-exposure bake PEB processing is performed on the substrate W. As shown in FIG. Details of the mounting and heating unit (P-PEB) will be described later.

In this embodiment, the operation process of the 6th center robot CR6 transfers the board | substrate W from the board | substrate mounting part PASS11 to the washing | cleaning / drying processing unit SD1, and from the washing | cleaning / drying processing unit SD1. Transfer of the substrate W to the bevel inspection unit IM, transfer of the substrate W from the bevel inspection unit IM to the sending buffer portion SBF, and the mounting and cooling unit P- from the sending buffer portion SBF. 5 steps of conveyance of the board | substrate W to CP, and rotational movement from the mounting and cooling unit P-CP to the board | substrate mounting part PASS11.

In this case, for example, when the sixth center robot CR6 capable of performing one step in 3.6 seconds can carry 200 substrates W in one hour.

In addition, the operation process of the seventh center robot CR7 is carried on the substrate W from the substrate placing unit PASS12 to the cleaning / drying processing unit SD2, and is placed and heated from the cleaning / drying processing unit SD2. 3 steps of conveyance of the board | substrate W to the unit P-PEB, and rotational movement from the mounting and heating unit P-PEB to the board | substrate mounting part PASS12.

In this case, for example, when the 7th center robot CR7 which can perform one process in 3.6 second is used, 333 board | substrates W can be conveyed in 1 hour.

In addition, the operation process of the interface conveyance mechanism IFR is carried out from the mounting and cooling unit P-CP to the board | substrate W to the exposure apparatus 16, and from the exposure apparatus 16 to the board | substrate mounting part PASS12. 3 steps of conveyance of the board | substrate W and rotational movement from the board | substrate mounting part PASS12 to a mounting and cooling unit P-CP.

In this case, if the interface conveyance mechanism IFR which can perform one process in 4.8 second, for example, 250 board | substrates W can be conveyed in 1 hour.

As a result, the plurality of substrates W can be conveyed efficiently by the interface block 15 in a short time.

The substrate W subjected to the post-exposure bake treatment is received from the mounting and heating unit P-PEB by the fifth center robot CR5 of the resist cover film removal block 14. The fifth center robot CR5 carries the substrate W into the resist cover film removal processing unit 90. In the resist cover film removal processing unit 90, the resist cover film is removed.

In addition, when the resist cover film removal block 14 cannot temporarily receive the substrate W due to a failure of the removal unit REM or the like, the substrate W after the exposure process is placed in the return buffer portion RBF. Can be temporarily stored.

Next, the fifth center robot CR5 takes out the processed substrate W from the resist cover film removing processing unit 90 and places the substrate W on the substrate placing unit PASS10.

The substrate W placed on the substrate placing portion PASS10 is placed on the substrate placing portion PASS8 by the fourth center robot CR4 of the processing block 13 for resist cover film.

The substrate W placed on the substrate placing unit PASS8 is received by the third center robot CR3 of the developing block 12. The third center robot CR3 carries the substrate W into the developing unit 70. In the development processing unit 70, development processing is performed on the exposed substrate W. FIG.

Next, the third center robot CR3 takes out the development completed substrate W from the development processing unit 70 and carries the substrate W into the development heat treatment units 120 and 121. Thereafter, the third center robot CR3 takes out the substrate W after the heat treatment from the developing heat treatment sections 120 and 121, and places the substrate W on the substrate placing section PASS6.

The substrate W placed on the substrate placing portion PASS6 is placed on the substrate placing portion PASS4 by the second center robot CR2 of the resist film processing block 11. The substrate W mounted on the substrate placing part PASS4 is placed on the substrate placing part PASS2 by the first center robot CR1 of the anti-reflection film processing block 10.

The substrate W placed on the substrate placing unit PASS2 is accommodated in the carrier C by the indexer robot IR of the indexer block 9. Thereby, each process of the board | substrate W in the substrate processing apparatus 500 is complete | finished.

(3) Details of mounting and heating unit

4 is an external perspective view of the mounting and heating unit P-PEB, and FIG. 5 is a cross-sectional view of the mounting and heating unit P-PEB in the YZ plane.

As shown in FIG. 4 and FIG. 5, the placing-and-heating unit (P-PEB) includes a placing portion 200 for carrying out, a placing portion 210 for carrying in, a heating portion 220, and a conveying mechanism 230. do. The carrying-out base part 200, the carrying-in base part 210, and the heating part 220 are arrange | positioned side by side along the Y direction.

The dismounting unit 200 for carrying out includes a cooling plate 201. Inside the cooling plate, a cooling pipe WP is provided. The cooling plate 201 can be cooled by circulating a cooling medium (for example, cooling water) through the cooling pipe WP. A plurality of lift pins 202 are provided so as to protrude upward from the cooling plate 201.

The carrying-in unit 210 for carrying in includes the mounting plate 211. A plurality of lifting pins 212 (three in this example) are provided so as to project upward from the mounting plate 211.

The heating unit 220 includes a heating plate 221. A plurality of lifting pins 222 are provided so as to protrude upward from the heating plate 221. An upper cover 224 is provided above the heating plate 221. The upper cover 224 is attached to the upper cover elevating drive unit 225. The upper cover 224 is driven up and down by the upper cover elevating drive unit 225.

As shown in FIG. 5, the plurality of lifting pins 202 are attached to the pin support plate 203, and the plurality of lifting pins 212 are attached to the pin support plate 213. The plurality of lifting pins 222 are attached to the pin support plate 223. The pin support plates 203, 213, and 223 are lifted and lowered independently by the lift pin drive mechanism 240, respectively.

As shown in FIG. 4, the guide rail 231 is provided in the side of the carrying-out base part 200, the carrying-in base part 210, and the heating part 220 along the Y direction. The conveyance mechanism 230 is provided to be movable along the guide rail 231.

The conveyance mechanism 230 has a conveyance hand 232 and a hand drive part 233. The conveyance hand 232 is lifted by the hand driver 233 and moves integrally with the hand driver 233 along the Y direction. The transfer hand 232 moves between the carrying-out base part 200, the carrying-in base part 210, and the heating part 220 in the state which hold | maintained the board | substrate W. FIG. The notch is formed in the transfer hand 232 so as not to interfere with the lifting pins 202, 212, and 222.

Next, the operation of the placing and heating unit P-PEB will be described. First, the 7th center robot CR7 of FIG. 1 carries in the board | substrate W to the mounting-and-heating unit P-PEB along the X direction by the hand CRH13 or the hand CRH14, and a carrying-in part It is mounted on the lifting pin 212 of 210.

After the hand CRH13 or the hand CRH14 of the seventh center robot CR7 is withdrawn, the transfer hand 232 is moved between the substrate W and the mounting plate 211 so that the substrate on the support pin 212 ( Receive W)

Subsequently, with the top cover 224 spaced apart from the heating plate 221, the transfer hand 232 moves on the heating plate 221 to place the substrate W on the support pins 222. .

Subsequently, the transfer hand 232 retracts from the heating unit 220, and the top cover 224 descends to close the space on the heating plate 221. Then, the lifting pins 222 are lowered to place the substrate W on the heating plate 221. In this state, the substrate W is heated by the heating plate 221.

After the predetermined time elapses, the heating of the substrate W is stopped, and the upper lid 224 is raised. Subsequently, the lifting pins 222 are raised to separate the substrate W from the heating plate 221. Then, the transfer hand 232 moves between the heating plate 221 and the substrate W to receive the substrate W on the lifting pins 222.

Subsequently, in a state where the substrate W after heating is held, the transfer hand 232 moves on the cooling plate 201 of the dismounting unit 200 for carrying out, thereby placing the substrate W on the support pins 202. Wit Subsequently, the support pin 202 is lowered to mount the substrate W on the cooling plate 201. In this state, the cooling plate 201 is cooled, whereby the substrate W is cooled.

After a predetermined time has elapsed, cooling of the substrate W is stopped, and the support pins 202 are raised to separate the substrate W from the cooling plate 201. Then, the fifth center robot CR5 of FIG. 1 receives the substrate W from the support pins 202 by the hand CR9 or the hand CR10, and is placed and mounted along the Y direction. P-PEB).

In the placement-and-heating unit P-PEB, the placement unit 210 for carrying in is installed at a position close to the seventh center robot CR7, and the placement unit for carrying out is located at a position close to the fifth center robot CR5. 200 is installed. Thereby, the board | substrate W is carried in to the loading part 210 for carrying in by the 7th center robot CR7, and the board | substrate W from the mounting part 200 for carrying out by the 5th center robot CR5 is carried out. Export is easy. As a result, the loading and unloading of the substrate W to the placing and heating unit P-PEB can be performed quickly.

In addition, in this embodiment, although the board | substrate W is cooled by the cooling plate 201, the cooling method of the board | substrate W is not limited to this, The cooling for cooling the board | substrate W in the conveyance hand 232 is carried out. You may give a function.

(4) cleaning / drying processing unit

Next, the washing / drying processing unit SD1 will be described in detail with reference to the drawings. 6 is a side view showing the configuration of the cleaning / drying processing unit SD1. In addition, the cleaning / drying processing unit SD2 has the same configuration as the cleaning / drying processing unit SD1.

As shown in FIG. 6, the cleaning / drying processing unit SD1 holds the substrate W horizontally and rotates the substrate W around a vertical rotation axis passing through the center of the substrate W. As shown in FIG. A spin chuck 621 is provided.

The spin chuck 621 is fixed to the upper end of the rotating shaft 625 rotated by the chuck rotation driving mechanism 636. In addition, an intake air (not shown) is formed in the spin chuck 621, and the inside of the intake air is exhausted in a state where the substrate W is placed on the spin chuck 621. ) Is vacuum-adsorbed to the spin chuck 621 to hold the substrate W in a horizontal position.

The motor 660 is provided outside the spin chuck 621. The rotation shaft 661 is connected to the motor 660. In addition, the arm 662 is connected to the rotation shaft 661 so as to extend in the horizontal direction, and a nozzle 650 for cleaning treatment is provided at the tip of the arm 662.

The rotating shaft 661 rotates at the same time as the rotating shaft 661 is rotated by the motor 660, and the cleaning nozzle 650 moves above the substrate W held by the spin chuck 621. .

A cleaning processing supply pipe 663 is provided to pass through the inside of the motor 660, the rotation shaft 661, and the arm 662. The cleaning processing supply pipe 663 is connected to the cleaning liquid supply source R1 and the rinse liquid supply source R2 through the valve Va and the valve Vb.

By controlling the opening and closing of these valves Va and Vb, it is possible to select the processing liquid to be supplied to the cleaning processing supply pipe 663 and to adjust the supply amount. In the configuration of FIG. 6, the cleaning liquid can be supplied to the cleaning processing supply pipe 663 by opening the valve Va, and the rinsing liquid is supplied to the cleaning processing supply pipe 663 by opening the valve Vb. Can supply

The cleaning liquid or the rinse liquid is supplied to the cleaning nozzle 650 from the cleaning liquid supply source R1 or the rinse liquid supply source R2 via the cleaning processing supply pipe 663. Thereby, the washing | cleaning liquid or the rinse liquid can be supplied to the surface of the board | substrate W. FIG. As the washing liquid, for example, a liquid obtained by dissolving a complex (ionized) in pure water or pure water, a hydrofluoric acid chemical liquid, or the like is used. As the rinse liquid, any one of pure water, carbonated water, hydrogen water, electrolytic ion water and HFE (hydrofluoroether) is used, for example.

The motor 671 is provided outside the spin chuck 621. The rotation shaft 672 is connected to the motor 671. In addition, the arm 673 is connected to the rotation shaft 672 so as to extend in the horizontal direction, and a drying nozzle 670 is provided at the tip of the arm 673.

The rotating shaft 672 is rotated by the motor 671 and the arm 673 is rotated so that the drying nozzle 670 is moved above the substrate W held by the spin chuck 621. do.

A drying processing supply pipe 674 is provided to pass through the inside of the motor 671, the rotation shaft 672, and the arm 673. The drying process supply pipe 674 is connected to the inert gas supply source R3 through the valve Vc. By controlling the opening and closing of this valve Vc, the supply amount of the inert gas supplied to the drying process supply pipe 674 can be adjusted.

Inert gas is supplied to the drying process nozzle 670 from the inert gas supply source R3 through the drying process supply pipe 674. Thereby, an inert gas can be supplied to the surface of the board | substrate W. As shown in FIG. As an inert gas, nitrogen gas is used, for example.

When the cleaning liquid or the rinse liquid is supplied to the surface of the substrate W, the cleaning nozzle 650 is located above the substrate. When the inert gas is supplied to the surface of the substrate W, the cleaning nozzle 650 is Evacuate to the desired location.

When the cleaning liquid or the rinse liquid is supplied to the surface of the substrate W, the drying nozzle 670 is evacuated to a desired position. When the inert gas is supplied to the surface of the substrate W, the drying nozzle ( 670 is located above the substrate (W).

The substrate W held by the spin chuck 621 is accommodated in the processing cup 623. Inside the processing cup 623, a cylindrical partition wall 633 is provided. Further, a drainage space 631 for draining the processing liquid (cleaning liquid or rinse liquid) used for the processing of the substrate W is formed so as to surround the spin chuck 621. A recovery liquid space 632 for recovering the processing liquid used for the processing of the substrate W is formed between the processing cup 623 and the partition wall 633 so as to surround the drainage space 631.

A drainage tube 634 is connected to the drainage space 631 for guiding the processing liquid to a drainage processing apparatus (not shown), and a recovery liquid space 632 for guiding the processing liquid to a recovery processing apparatus (not shown). The recovery pipe 635 is connected.

On the upper side of the processing cup 623, a guard 624 for preventing the processing liquid from the substrate W from scattering to the outside is provided. The guard 624 has a shape that is rotationally symmetrical with respect to the rotation shaft 625. On the inner surface of the upper end of the guard 624, a drain guide groove 641 having a cross section is formed in a ring shape.

Moreover, the recovery liquid guide part 642 which consists of the inclined surface inclined to the outer side downward is formed in the inner surface of the lower end part of the guard 624. As shown in FIG. In the vicinity of the upper end of the recovery liquid guide part 642, a partition wall storage groove 643 for accommodating the partition wall 633 of the processing cup 623 is formed.

This guard 624 is provided with a guard lift drive mechanism (not shown) composed of a ball screw mechanism or the like. The guard lifting and driving mechanism includes a guard 624 having a recovery position where the recovery liquid guide portion 642 opposes an outer circumferential end face of the substrate W held by the spin chuck 621, and the drain guide groove 641. It moves up and down between the drain positions which oppose the outer periphery end surface of the board | substrate W hold | maintained by the spin chuck 621. As shown in FIG. When the guard 624 is in the recovery position (the position of the guard shown in FIG. 6), the processing liquid scattered outward from the substrate W is led to the recovery liquid space 632 by the recovery liquid guide part 642. Then, it is recovered through the recovery pipe 635. On the other hand, when the guard 624 is in the drainage position, the processing liquid scattered outward from the substrate W is led to the drainage space 631 by the drainage guide groove 641, and the drainage pipe 634 is closed. Drained through. With the above configuration, the processing liquid is drained and recovered.

Next, the processing operation of the cleaning / drying processing unit SD1 having the above configuration will be described. In addition, the operation | movement of each component of the washing | cleaning / drying processing unit SD1 demonstrated below is controlled by the main controller (control part) 30 of FIG. The processing operation of the washing / drying processing unit SD2 is the same as the processing operation of the washing / drying processing unit SD1.

First, at the time of carrying in the board | substrate W, the guard 624 falls and the 6th center robot CR6 of FIG. 1 mounts the board | substrate W on the spin chuck 621. FIG. The substrate W mounted on the spin chuck 621 is sucked and held by the spin chuck 621.

Next, the guard 624 moves to the above-mentioned drainage position, and the cleaning nozzle 650 moves above the center of the substrate W. Next, as shown in FIG. Thereafter, the rotation shaft 625 rotates, and the substrate W held by the spin chuck 621 rotates according to the rotation. Thereafter, the cleaning liquid is discharged from the cleaning nozzle 650 to the upper surface of the substrate W. As shown in FIG. Thereby, the board | substrate W is wash | cleaned.

In the cleaning / drying processing unit SD1, the components of the resist cover film on the substrate W are eluted into the cleaning liquid during the cleaning. In the cleaning of the substrate W, the cleaning liquid is supplied onto the substrate W while the substrate W is rotated. In this case, the cleaning liquid on the substrate W always moves to and scatters around the periphery of the substrate W by centrifugal force. Therefore, it is possible to prevent the components of the resist cover film eluted in the cleaning liquid from remaining on the substrate W. FIG.

The resist cover film may be eluted by, for example, raising pure water on the substrate W and holding it for a predetermined time. The cleaning liquid onto the substrate W may be supplied by a soft spray method using a two-fluid nozzle.

After a predetermined time elapses, the supply of the cleaning liquid is stopped, and the rinse liquid is discharged from the cleaning nozzle 650. Thereby, the washing | cleaning liquid on the board | substrate W washes off.

In addition, after a predetermined time elapses, the rotation speed of the rotation shaft 625 decreases. Thereby, the quantity of the rinse liquid shaken off by the rotation of the board | substrate W reduces, and the liquid layer L of the rinse liquid is formed in the whole surface of the board | substrate W as shown to FIG. The liquid layer L may be formed over the entire surface of the substrate W by stopping the rotation of the rotation shaft 625.

Next, the supply of the rinse liquid is stopped, the cleaning nozzle 650 retracts to a desired position, and the drying nozzle 670 moves above the center of the substrate W. As shown in FIG. Thereafter, the inert gas is discharged from the drying nozzle 670. Thereby, as shown in FIG.7 (b), the rinse liquid of the center part of the board | substrate W moves to the periphery of the board | substrate W, and the liquid layer L exists only in the periphery of the board | substrate W. As shown in FIG.

Next, while the rotation speed of the rotating shaft 625 (refer FIG. 6) rises, as shown in FIG.7 (c), the drying process nozzle 670 moves gradually from upper part of the center part of the board | substrate W to upper peripheral part. . As a result, a large centrifugal force acts on the liquid layer L on the substrate W, and inert gas can be blown out over the entire surface of the substrate W, so that the liquid layer L on the substrate W can be reliably removed. As a result, the substrate W can be reliably dried.

Next, the supply of inert gas is stopped, the drying nozzle 670 is retracted to a desired position, and the rotation of the rotation shaft 625 is stopped. Thereafter, the guard 624 descends and the sixth center robot CR6 of FIG. 1 unloads the substrate W. As shown in FIG. As a result, the processing operation in the cleaning / drying processing unit SD1 is completed. In addition, it is preferable to change the position of the guard 624 in washing | cleaning and drying process suitably according to the need of collection | recovery or drainage of a process liquid.

Moreover, in the said embodiment, the structure which shares the washing | cleaning liquid processing nozzle 650 with the supply of a washing | cleaning liquid and the supply of a rinse liquid is employ | adopted so that any one of a washing | cleaning liquid and a rinse liquid can be supplied from the washing | cleaning liquid processing nozzle 650, However, a configuration may be employed in which the nozzle for supplying the cleaning liquid and the nozzle for supplying the rinse liquid are separated.

In addition, when supplying a rinse liquid, you may supply pure water from the back rinse nozzle which is not shown with respect to the back surface of the board | substrate W so that a rinse liquid may not return to the back surface of the board | substrate W.

In addition, when pure water is used as a washing | cleaning liquid which wash | cleans the board | substrate W, it is not necessary to supply a rinse liquid.

In addition, in the said embodiment, although the drying process is performed to the board | substrate W by the spin drying method, you may dry-process the board | substrate W by other drying methods, such as a reduced pressure drying method and an air knife drying method.

In the above embodiment, the inert gas is supplied from the nozzle 670 for drying while the liquid layer L of the rinse liquid is formed, but the liquid layer L of the rinse liquid is not formed or the rinse liquid is not used. In this case, the liquid layer of the cleaning liquid may be shaken off once by rotating the substrate W and immediately supplied with an inert gas from the drying nozzle 670 to dry the substrate W completely.

(5) Effect of this embodiment

In this embodiment, in the cleaning heating block 15a of the interface block 15, the substrate W before the exposure treatment is conveyed by the sixth center robot CR6, and the substrate W after the exposure treatment is transferred to the seventh center. It is conveyed by the robot CR7. In addition, in the carry-in / out block 15b of the interface block 15, the hands H1 and H2 of the interface conveyance mechanism IFR are respectively driven independently, and the board | substrate W before exposure process is carried out to the hand H1. It conveys and the board | substrate W after an exposure process is conveyed by the hand H2.

In this way, in the interface block 15, the conveyance path of the substrate W before the exposure process and the conveyance path of the substrate W after the exposure process are each independently secured. In this case, the operations of the sixth center robot CR6 and the seventh center robot CR7 are simplified compared with the case where the conveyance path of the substrate W before the exposure process and the conveyance path of the substrate W after the exposure process cross each other. do. Thereby, the conveyance efficiency of the board | substrate W improves and it becomes possible to improve a throughput.

In the cleaning heating block 15a and the carry-in / out block 15b, the substrate W before the exposure treatment and the substrate W after the exposure treatment do not contact the same site. Therefore, cross contamination (mutual contamination) between the substrate W before the exposure treatment and the substrate W after the exposure treatment can be prevented.

In addition, since the placing and heating unit P-PEB is provided in the interface block 15 adjacent to the exposure apparatus 16, the placing and heating unit P-PEB can be quickly placed and placed on the substrate W after the exposure treatment. You can return to. Therefore, the PEB process of the board | substrate W can be performed quickly after an exposure process. As a result, the chemical reaction in the resist film can be promptly promoted, and a desired exposure pattern can be obtained.

Moreover, since the conveyance path of the board | substrate W before an exposure process and the conveyance path of the board | substrate W after an exposure process are independent, respectively, the board | substrate W after an exposure process is smoothly conveyed to a heating unit P-PEB. can do. Therefore, when processing several board | substrate W continuously, the time from exposure processing to PEB process can be made substantially constant. As a result, variation in the accuracy of the exposure pattern can be prevented.

In addition, the placing and heating unit P-PEB plays a role of placing part for transferring the substrate W from the seventh center robot CR7 to the fifth center robot CR5. In this case, the transfer path of the substrate W from the interface block 15 to the resist cover film removal block 14 can be simplified. As a result, the throughput can be further improved.

In addition, in this embodiment, the cleaning process of the board | substrate W is performed by the washing | cleaning / drying processing unit SD1 before the exposure process of the board | substrate W is performed by the exposure apparatus 16. Moreover, as shown in FIG. At the time of this washing | cleaning process, a part of the component of the resist cover film on the board | substrate W elutes in a washing | cleaning liquid or a rinse liquid, and is wash | cleaned. Therefore, even when the substrate W is in contact with the liquid in the exposure apparatus 16, the components of the resist cover film on the substrate W hardly elute into the liquid. Moreover, the dust etc. which adhered to the board | substrate W before exposure process can be removed. As a result, contamination in the exposure apparatus 16 is prevented.

In addition, in the washing / drying processing unit SD1, the drying treatment of the substrate W is performed after the washing treatment of the substrate W. FIG. Thereby, since the washing | cleaning liquid or rinse liquid which adhered to the board | substrate W at the time of a washing | cleaning process is removed, it is prevented that dust etc. in atmosphere reattach to the board | substrate W after a washing process. As a result, contamination in the exposure apparatus 16 can be reliably prevented.

Further, in the cleaning / drying processing unit SD1, the drying process of the substrate W is performed by blowing inert gas from the center portion of the substrate W to the peripheral portion while rotating the substrate W. As shown in FIG. In this case, since the washing | cleaning liquid and rinse liquid on the board | substrate W can be removed reliably, it can reliably prevent dust and the like from adhering to the board | substrate W after washing | cleaning. As a result, contamination of the substrate W can be reliably prevented, and dry spots can be prevented from occurring on the surface of the substrate W. FIG.

In addition, in the washing / drying processing unit SD2, a drying treatment of the substrate W after the exposure treatment is performed. Thereby, the liquid adhering to the board | substrate W at the time of an exposure process is prevented from falling into the substrate processing apparatus 500. FIG. In addition, by performing the drying treatment of the substrate W after the exposure treatment, dust or the like in the atmosphere is prevented from adhering to the substrate W after the exposure treatment, so that contamination of the substrate W can be prevented.

In addition, since the substrate W with the liquid attached to the substrate processing apparatus 500 can be prevented from being transported, the liquid attached to the substrate W during the exposure treatment affects the atmosphere in the substrate processing apparatus 500. It can prevent giving. Thereby, the temperature-humidity adjustment in the substrate processing apparatus 500 becomes easy.

In addition, the liquid adhering to the substrate W during the exposure treatment is prevented from adhering to the indexer conveyance mechanism IFR and the first to seventh center robots CR1 to CR7. Therefore, the liquid is prevented from adhering to the substrate W before the exposure treatment. As a result, dust or the like in the atmosphere is prevented from adhering to the substrate W before the exposure treatment, so that contamination of the substrate W is prevented. As a result, deterioration of the resolution performance during the exposure process can be prevented and contamination in the exposure apparatus 16 can be prevented.

During the transfer of the substrate W from the cleaning / drying processing unit SD2 to the developing unit 70, the components of the resist or the components of the resist cover film are eluted into the cleaning liquid and the rinse liquid remaining on the substrate W. It can certainly prevent things. Thereby, deformation of the exposure pattern formed in the resist film can be prevented. As a result, the fall of the line width precision at the time of image development process can be prevented reliably.

As a result, an operation failure such as an abnormality in the electrical system of the substrate processing apparatus 500 can be prevented, and a processing failure of the substrate W can be reliably prevented.

Further, in the cleaning / drying processing unit SD2, the substrate W is dried by blowing inert gas from the center of the substrate W to the peripheral portion while rotating the substrate W. As shown in FIG. In this case, since the washing | cleaning liquid and rinse liquid on the board | substrate W can be removed reliably, it can reliably prevent dust and the like from adhering to the board | substrate W after washing | cleaning. As a result, contamination of the substrate W can be reliably prevented, and dry spots can be prevented from occurring on the surface of the substrate W. FIG.

In addition, in the cleaning / drying processing unit SD2, the cleaning processing of the substrate W is performed before the drying treatment. Can be removed. Thereby, the contamination of the board | substrate W can be prevented. As a result, poor processing of the substrate can be reliably prevented.

(6) other embodiment

8 is a plan view of a substrate processing apparatus according to another embodiment of the present invention. The point different from the substrate processing apparatus 500 of the said embodiment is demonstrated about the substrate processing apparatus 500a shown in FIG.

In the substrate processing apparatus 500a, the interface conveyance mechanisms IFRa and IFRb are provided in the carry-in / out block 15b of the interface block 15 instead of the interface conveyance mechanism IFR. Further, the substrate placing portion PASS12 and the return buffer portion RBF are disposed above and below the region within the cleaning heating block 15a between the interface transfer mechanism IFRb and the seventh center robot CR7.

The interface conveyance mechanism IFRa receives the substrate W mounted on the placing and cooling unit P-CP, and carries the substrate W into the substrate loading portion 16a of the exposure apparatus 16. . The interface conveyance mechanism IFRb carries out the substrate W after the exposure process from the substrate carrying section 16b of the exposure apparatus 16, and replaces the substrate W with the substrate placing section of the cleaning heating block 15a. It is mounted on PASS12). The board | substrate W mounted on the board | substrate mounting part PASS12 is received by 7th center robot CR7, and is processed similarly to the said embodiment.

Thus, in the substrate processing apparatus 500a, the board | substrate W before an exposure process is conveyed by the interface conveyance mechanism IFRa in the carrying-in / out block 15b of the interface block 15, and the board | substrate after an exposure process ( W) is conveyed by the interface conveyance mechanism IFRb.

In this case, since the interface conveyance mechanisms IFRa and IFRb can carry out the conveyance operation | movement of the board | substrate W independently, respectively, the board | substrate W can be conveyed more efficiently. Therefore, the throughput can be further improved.

In addition, in the carry-in / out block 15b, since the board | substrate W before an exposure process and the board | substrate W after an exposure process are conveyed by the separate interface conveyance mechanism, the board | substrate W before an exposure process and the board | substrate after an exposure process are carried out. Crossconference between (W) is more reliably prevented.

(7) another embodiment

In the said embodiment, although the case where the exposure apparatus 16 which performs the exposure process of the board | substrate W by the immersion method was provided as an external apparatus of the substrate processing apparatus 500 was demonstrated, it is not limited to this, A liquid is used. The conventional exposure apparatus which performs the exposure process of the board | substrate W may be provided as an external apparatus, without doing this. In that case, it is not necessary to provide the cleaning / drying processing unit SD2 in the cleaning heating block 10.

(8) Correspondence between each component of the claim and each component of the embodiment

Hereinafter, although the corresponding example of each component of an claim and each element of embodiment is demonstrated, this invention is not limited to the following example.

In the above embodiment, the indexer block 9, the antireflection film processing block 10, the resist film processing block 11, the development processing block 12, the resist cover film processing block 13, and the resist cover film removing block ( 14 is an example of the first processing unit, the interface block 15 is an example of the second processing unit, the coating unit RES is an example of the photosensitive film forming unit, and the cleaning / drying processing unit SD1 is an example of the cleaning processing unit. An example is the mounting and baking unit P-PEB, which is an example of the heat treatment unit, and the hand H1 of the sixth center robot CR6 and the interface transfer mechanism IFR is an example of the first substrate transfer mechanism. 7 The center robot CR7 and the hand H2 of the interface transfer mechanism IFR are examples of the second substrate transfer mechanism.

In addition, the cleaning heating block 15a is an example of a processing block, the carry-in / out block 15b is an example of a carry-in and export block, the 6th center robot CR6 is an example of a 1st conveying apparatus, and an interface conveyance The hand H1 of the mechanism IFR is an example of the second conveyance apparatus, the seventh center robot CR7 is an example of the third conveyance apparatus, and the hand H2 of the interface conveyance mechanism IFR is the fourth conveyance. Example of the device.

In addition, the fifth center robot CR5 is an example of the fifth conveying apparatus, the loading placing unit 210 is an example of the first placing unit, the carrying out placing unit 200 is an example of the second placing unit, and the transfer mechanism 230 is an example of a conveyance part, and the washing | cleaning / drying processing unit SD2 is an example of a drying processing unit.

As each component of a claim, you may use other various elements which have the structure or function which were described in a claim.

1 is a plan view of a substrate processing apparatus according to an embodiment of the present invention;

FIG. 2 is a schematic side view of the substrate processing apparatus of FIG. 1 as seen in the + X direction. FIG.

3 is a schematic side view of the substrate processing apparatus of FIG. 1 seen in the -X direction;

4 is an external perspective view of the mounting and heating unit,

5 is a cross-sectional view of the mounting and heating unit in the YZ plane,

6 is a side view showing the structure of the cleaning / drying processing unit,

7 is a view for explaining the operation of the cleaning / drying processing unit,

8 is a plan view of a substrate processing apparatus according to another embodiment of the present invention.

Claims (8)

A substrate processing apparatus arranged to be adjacent to an exposure apparatus, A first processing unit for processing the substrate; A second processing unit disposed between the first processing unit and the exposure apparatus and performing processing on the substrate and carrying in and out of the substrate to the exposure apparatus; The first processing unit, A photosensitive film forming unit for forming a photosensitive film made of a photosensitive material on a substrate, The second processing unit, A cleaning processing unit for cleaning the substrate before the exposure treatment; A heat treatment unit for performing heat treatment on the substrate after the exposure treatment; A first substrate transfer mechanism for transferring the substrate before the exposure treatment between the first processing portion, the cleaning processing unit, and the exposure apparatus; And a second substrate transfer mechanism for transferring the substrate after the exposure treatment between the exposure apparatus and the heat treatment unit. The method of claim 1, The second processing unit includes a processing block for processing a substrate and an import / export block for carrying in and out of the substrate with respect to the exposure apparatus, The cleaning processing unit and the heat treatment unit are installed in the processing block, The first substrate transport mechanism, A first conveying apparatus which is provided in the processing block and conveys the substrate before the exposure process between the first processing unit, the cleaning processing unit, and the carry-in / out block; A second conveying apparatus which is provided at the block for carrying in and carrying out and conveys the substrate before the exposure process between the processing block and the exposure apparatus; The second substrate transport mechanism, A third conveying apparatus which is provided in the processing block and conveys the substrate after the exposure process between the carry-in / out block and the heat treatment unit; And a fourth conveying device which is provided in the carry-in / out block for conveying the substrate after the exposure process between the exposure apparatus and the processing block. The method of claim 2, The said carry-in / out block is movable with respect to the said processing block. The method of claim 2, And the first processing unit further includes a fifth transfer device for carrying out the substrate after the heat treatment from the heat treatment unit. The method of claim 4, wherein The heat treatment unit, A first placing unit for temporarily placing the substrate loaded by the third conveying apparatus; A second placing portion for temporarily placing the substrate carried out by the fifth conveying apparatus; A heating unit for heating the substrate, The substrate processing apparatus which has a conveyance part which conveys a board | substrate between the said 1st mounting part, the 2nd mounting part, and the said heating part. The method of claim 1, The second processing unit further includes a drying processing unit for drying the substrate after the exposure treatment by the exposure apparatus and before the heat treatment by the heat treatment unit, And the second substrate transfer mechanism transfers the substrate after the exposure treatment between the exposure apparatus, the drying processing unit, and the heat treatment unit. The method of claim 6, The first processing unit, the second processing unit, and the exposure apparatus are arranged along the first direction; The cleaning treatment unit, the heat treatment unit and the drying treatment unit are disposed in the second processing unit along a second direction orthogonal to the first direction and in a horizontal plane, The heat treatment unit is disposed in an approximately center portion of the second processing portion, And the cleaning processing unit and the drying processing unit are disposed on one side and the other side of the heat treatment unit in the second direction. A substrate processing method for processing a substrate in a substrate processing apparatus disposed adjacent to an exposure apparatus and including a first processing unit and a second processing unit, Forming a photosensitive film made of a photosensitive material on the substrate in the first processing unit; Conveying the substrate after the photosensitive film formation from the first processing portion to the second processing portion by a first substrate transport mechanism; Cleaning the substrate in the second processing unit; Conveying the substrate after cleaning from the second processing unit to the exposure apparatus by the first substrate transport mechanism; Conveying the substrate after the exposure treatment by the exposure apparatus from the exposure apparatus to the second processing portion by a second substrate transfer mechanism; The substrate processing method provided with the process of heat-processing a board | substrate in a 2nd process part.

Images