KR20090102170A - Apparatus and method for electro plating of coated conductor - Google Patents

Abstract

PURPOSE: An electrolytic plating apparatus and a method thereof are provided to transfer metal wire in reel to reel method and maximize the unit length of plating. CONSTITUTION: An electrolytic plating apparatus for manufacturing conductor wire comprises a plating baths (410a,410b,410c,410d), and reel to reel member (500). The plating bath contains plating liquid. The reel to reel member is dipped in an electrolytic plating liquid several times and make a metal wire multi-turn. The reel to reel member comprises a first reel member (510a) and second reel member (510b).

Description

Electrolytic plating apparatus and method for superconducting wires {APPARATUS AND METHOD FOR ELECTRO PLATING OF COATED CONDUCTOR}

The present invention relates to a plating apparatus for forming a stabilization layer of a second generation superconducting (Coated conductor). In particular, the present invention relates to an electroplating apparatus and method for producing a thin wire superconducting wire having a length of several kilos.

In general, high temperature superconducting (thin film) wire has no electric resistance below a certain temperature, so it can flow thousands of times more current than general copper wire, and has great potential in power, electronics, and medical fields. In particular, in the case of high temperature superconducting thin film wires (coated conductor), which has been actively researched and developed recently, high-temperature superconducting materials such as YBa2Cu3O7-x (YBCO) are coated on metal substrates to show excellent critical current density characteristics of 1MA / cm2 or more.

YBCO, which is mainly applied as a superconducting layer in the high temperature superconducting thin film wire (or superconducting thin film wire) as described above, is vulnerable to moisture in the air, and critical current characteristics are greatly affected by oxygen content in the lattice. As a result, silver (Ag), which has good oxygen permeability and can block moisture in the air, is applied as a protective layer to prevent deterioration of the wire rod according to the use environment. However, large-capacity power devices and high-magnet electromagnets, which are expected to be applied to high-temperature superconducting thin-film wires, need to flow a large amount of current through the wire rods. It should also be stable in terms of mechanical strength. In particular, when a faulted current occurs, a current of more than a threshold current value of the wire flows, and thus, if there is no proper shunt, a large amount of heat may be generated to break the wire. Therefore, it has low electrical resistance and acts as a shunt, and it is a material that can easily emit heat generated due to its excellent thermal conductivity to the outside of the wire. To manufacture.

As a material of a stabilization layer, silver, copper, etc. are mentioned as a material with low electrical resistance and excellent thermal conductivity. In the case of silver (Ag), the electrical resistance (ρ = 1.6μΩcm) is the lowest among metals and the thermal conductivity (K = 430W / mK) is excellent, but copper (ρ = 1.7μΩcm, K having similar characteristics because it is an expensive metal material = 400W / mK) is introduced as a stabilization layer to stabilize the properties of wire rods even in high current applications.

In the prior art, a soldering method, an electroless plating method, and an electroplating method are used to form the stabilization layer 4 of copper or the like as described above in the high temperature superconducting thin film wire.

In the case of the soldering method, there is an advantage in that the process is simple by attaching a copper stabilization layer in a short time using a suitable molten metal. However, because the molten metal is used, the superconducting layer may deteriorate due to temperature rise, and the side of the wire rod may not easily form a stabilization layer, and thus, a discharge may occur when a high voltage is applied.

And, in the electroless plating method, it is possible to plate on a non-conductor or powder capable of supplying electricity to a base layer, and there is an advantage of obtaining a uniform thickness because there is no influence of current density, but the plating speed is very slow and If the plating proceeds at a high speed by increasing the concentration, the surface roughness becomes rough and rather it is not uniformly deposited. In addition, the plating conditions are sensitively changed depending on the composition of the plating solution, and the plating solution has a short life and is difficult to manage.

In addition, in the case of the electroplating method, since all the processes are performed at room temperature, it does not adversely affect the characteristics of the superconducting layer, and since the plating is performed on the side of the wire rod, it is stable even when high voltage is applied. However, electroplating requires a certain size or more for the production rate compared to the plating speed, and there is a disadvantage in terms of space utilization and cost to install and maintain such a facility.

An object of the present invention is to provide an electroplating apparatus and method for manufacturing a superconducting wire that can maximize the unit plating length in the minimum space.

SUMMARY OF THE INVENTION An object of the present invention is to provide an electroplating apparatus and method for manufacturing a superconducting wire which can improve the yield compared to the electroplating rate.

Electrolytic plating apparatus for producing a superconducting wire of the present invention is a plating bath containing a plating solution; And a reel to reel member for multiturning the metal wire such that the metal wire, which is a base material of the superconducting wire, is immersed in the electroplating solution of the plating bath several times.

According to an embodiment of the present invention, the reel to reel member includes a first reel member for guiding a metal wire to the plating bath; And a second reel member for guiding the metal wire passed through the plating bath to the first reel member.

Electrolytic plating apparatus for producing a superconducting wire of the present invention comprises a first, second, third, fourth plating bath disposed in four directions; And a reel for providing a moving path in which the metal wire, which is a base material of the superconducting wire, is multiturned back to the first plating bath through the second plating tank, the third plating tank, and the fourth plating tank, starting with the first plating tank. It includes a turing member.

Electrolytic plating apparatus for producing a superconducting wire of the present invention is a winding portion for providing a metal wire that is the base material of the superconducting wire; A plating part immersing the metal wire provided from the unwinding part in an electrolytic plating solution to form a stabilization layer on the surface of the metal wire; A pretreatment section for washing with water before a metal wire is provided to the plating section; A post treatment unit for washing and drying a metal wire rod having a stabilization layer formed in the plating unit; It includes a winding unit wound around the metal wire to finish drying in the post-processing unit; First, second, third and fourth plating baths arranged in four directions; And a reel to reel for providing a moving path in which a metal wire, which is a base material of a superconducting wire, is multiturned to the first plating tank through the second plating tank, the third plating tank, and the fourth plating tank, starting with the first plating tank. Member.

According to an embodiment of the present invention, the reel to reel member includes a first reel member disposed between the fourth plating tank and the first plating tank to guide the metal wire to the first plating tank; A second reel member disposed between the first plating tank and the second plating tank to guide the metal wire to the second plating tank; A third reel member disposed between the second plating tank and the third plating tank to guide the metal wire to the third plating tank; And a fourth reel member disposed between the third plating tank and the fourth plating tank to guide the metal wire to the fourth plating tank.

According to an embodiment of the present invention, the first, second, third, fourth, plating baths are provided with a metal electrode used as an anode, and the reel-to-reel member is used as a cathode.

According to an embodiment of the present invention, the electrolytic plating solution includes at least one or more of silver, nickel, iron, tin, zinc or an alloy containing at least one of the above elements, the main material of which is copper or copper as a metal material.

Electrolytic plating method for producing a superconducting wire of the present invention includes a loading step of providing a metal wire that is the base material of the superconducting wire from the unwinding portion; An electroplating step of forming a stabilization layer on the surface of the metal wire while passing the metal wire through the plating bath containing the electroplating solution; An unloading step of winding the electroplated metal wires on the winding part; In the electrolytic plating step, the metal wire is multiturned by the reel to reel member so as to be immersed several times in the electroplating solution of the plating bath.

According to an embodiment of the present invention, in the electrolytic plating step, the metal wire is multiturned while sequentially passing through the first, second, third and fourth plating baths arranged in four directions, and the metal wire is first, second and third. It is conveyed by four reel members arranged between the four plating baths.

As described above, the present invention has a special effect of maximizing the unit plating length in the minimum space because the electroplating is carried out while transferring the metal wire in a reel to reel method.

In addition, the present invention has a special effect that can improve the yield compared to the electroplating rate.

1 is a plan view showing an electroplating apparatus for manufacturing a superconducting wire according to a preferred embodiment of the present invention.

Figure 2 is a plan view showing a plated portion in the electroplating apparatus for producing a superconducting wire.

3 is a side configuration view showing a plating part in an electroplating apparatus for manufacturing a superconducting wire.

4 is a plan configuration diagram of an electrolytic plating part having one plating bath.

5 is a flowchart for explaining an electroplating method of a metal wire.

Explanation of symbols on the main parts of the drawings

100: unwinding part

200: preprocessing unit

400: electrolytic plating

500: reel to reel member

600: post-processing unit

800: winding part

Hereinafter, exemplary embodiments of the present invention will be described in more detail with reference to FIGS. 1 to 5. The embodiments of the present invention can be modified in various forms, and the scope of the present invention should not be construed as being limited to the following embodiments. This embodiment is provided to more completely explain the present invention to those skilled in the art. Therefore, the shape of the elements in the drawings are exaggerated to emphasize a more clear description.

1 is a plan view showing an electroplating apparatus for manufacturing a superconducting wire according to a preferred embodiment of the present invention. Figure 2 is a plan view showing a plated portion in the electroplating apparatus for producing a superconducting wire. 3 is a side configuration view showing a plating part in an electroplating apparatus for manufacturing a superconducting wire.

1 to 3, the electroplating apparatus 10 for manufacturing the superconducting wire of the present invention is an electroplating solution in which the metal wire, which is the base material of the superconducting wire, is kept in a line in a long order according to the electroplating process sequence. It is a continuous electrolytic plating apparatus which grows a metal layer (stabilization layer) on the surface by immersing in a reel to reel system.

The metal wire may be defined as a superconducting thin film wire having a superconducting layer or a superconducting thin film wire having a protective layer.

The electroplating apparatus 10 includes a winding unit 100, a pretreatment unit 200, an electroplating unit 400, a post-treatment unit and a winding unit 800.

Although not shown, since the electroplating apparatus 10 of the present invention may cause changes in composition and electrolytic conditions due to cross-contamination due to the metal wire passing through various treatment parts, a nitrogen gas injection nozzle is installed in each treatment part to provide a neighborhood. It is desirable to minimize the contamination by the components of the processing unit.

In the unwinding part 100, a metal wire 20 for electroplating is wound around a feeding reel 110, and the metal wire 20 drawn out from the unwinding part 100 passes through the guide rollers 120. It is provided to the preprocessor 200.

The metal wire 20 is preferably provided by the feeding reel 110. Feeding reel 110 is a continuous supply reel that provides a metal wire at a constant speed. The feeding reel 110 may prevent the metal wire from sagging (when the tension is too small) or the metal wire extends (or breaks) by adjusting the tension with the winding reel 810.

On the other hand, contaminants on the surface of the metal wire 20 for the electroplating may cause a decrease in the electroplating properties. Therefore, before entering the electroplating unit 400, the pretreatment unit 200 undergoes a process of removing contaminants on the surface of the metal wire. In the pretreatment unit 200, a process of removing contaminants, etc., deposited on the surface of the metal wire 20 before the metal wire 20 is supplied to the electroplating unit 400 where the electroplating process is performed is performed.

The pretreatment unit 200 includes a pickling treatment 210 for treating the metal wire with a weak acid to remove an oxide film which may be present on the surface of the metal wire to be plated, and the first water washing to clean the surface of the metal wire with pure water. The treatment unit 220, an activation treatment unit 230 for activating the surface of the metal wire rod and a second washing treatment unit 240 for washing the surface of the metal wire with pure water.

In this way, the metal wire that has been pretreated in the pretreatment unit 200 is provided to the electrolytic plating unit 400.

2 and 3, in the electroplating part 400, a metal wire 20 is precipitated in a plating bath containing an electrolytic plating solution, and a negative electrode is provided on a reel member for transporting the copper anode electrode and the metal wire formed in the plating bath. Is applied to deposit copper (stabilization layer) on the metal wire. In particular, when electroplating the metal wire 20 in the form of a long wire as in the present invention is to use the Reel-to-Reel method.

The electroplating part 400 includes first, second, third and fourth plating baths 410a, 410b, 410c and 410d arranged in four directions and a reel to reel member 500. The reel to reel member 500 is made of metal wire 20 again through the first plating tank 410a, the second plating tank 410b, the third plating tank 410c, and the fourth plating tank 410d. It provides a multiturn movement path that is circulated to the one plating bath 410a. The reel to reel member 500 includes a first reel member 510a, a second reel member 510b, a third reel member 510c, and a fourth reel member 510d. The first reel member 510a is disposed between the fourth plating tank 410d and the first plating tank 410a to guide the metal wire to the first plating tank 410a. It is disposed between the first plating tank 410a and the second plating tank 410b to guide the metal wire to the second plating tank 410b, and the third reel member 510c includes the second plating tank 410b and the third plating tank. It is disposed between the plating bath 410c to guide the metal wire to the third plating bath 410c. The fourth reel member 510d is disposed between the third plating tank 410c and the fourth plating tank 410d to guide the metal wire to the fourth plating tank 410d. Meanwhile, the first reel member 510a and the third reel member 510c serve as a cathode as well as a guide for guiding the metal wire 20. In addition, a driving member is connected to the second reel member 510b and the fourth reel member 510d to provide a moving force necessary for the movement of the metal wire. Although not shown in detail in the drawings, the reel members 510a-510d preferably have an angular displacement of at least 1 / 2-1 pitch to prevent twisting of the metal wire.

As described above, in the present invention, the metal wire 20 is repeatedly transported by the reel to reel member 500 in a multiturn manner to sequentially circulate the first, second, third and fourth plating baths 410a to 410d. Since the electroplating process, the unit plating length can be maximized in the minimum space.

4 is a plan configuration diagram of an electrolytic plating part having one plating bath.

As shown in FIG. 4, the first reel member 510a and the second reel member 510b are disposed at the front and rear ends of the plating bath 410, and the metal wire 20 is formed of the first reel member 510a. ) And is plated in the plating bath 410 while being multiturned by the second reel member 510b. As such, the electrolytic plating unit 400 is characterized by being plated while the metal wire is multiturned by the reel to reel member 500 regardless of the number of plating tanks.

The first, second, third and fourth plating baths 410a-410d of the electroplating part 400 are all made of the same configuration, and the configuration of the third plating bath 410c will be described by way of example. As shown in FIG. 3, the third plating bath 410c includes a circulation member 440 circulating and supplying the electrolytic plating solution to the bath 420, the copper electrode 430, and the bath 420 filled with the electrolytic plating solution. do.

The bath 420 includes an inner tub 422 and an outer tub 424, and a copper electrode 430 serving as an anode is installed in the inner tub 422. The copper electrode 430 is installed to face each other with a moving path through which the metal wire 20 passes.

The circulation member 440 includes a storage tank 442 filled with the electrolytic plating solution and a circulation pump 444 for resupplying the electrolytic plating solution filled in the storage tank 442 into an inner tank; It includes a circulation line 446 for providing a circulation path of the electrolytic plating liquid consisting of the outer tank 424, the storage tank 442 and the inner tank 422, and a filter 447 installed in the circulation line.

The flow of the electrolytic plating liquid in the first plating tank 410c is, first, the electrolytic plating liquid overflowing from the inner tank 422 is collected in the outer tank 424, and the electrolytic plating liquid collected in the outer tank 424 is stored in the storage tank 442 of the circulation member 440. Is provided. The electrolytic plating solution stored in the storage tank 442 is supplied back to the inner tank 422 through the circulation line 446 by the circulation pump 444. The metal wire 20 is immersed in the electrolytic plating solution through the doorway 418 formed on the sidewall of the third plating bath 410c and then exits through the doorway 418 formed on the opposite sidewall, and is immersed in the electrolytic plating solution. A metal layer (stabilization layer) is deposited on the surface of the metal wire. A part of the electrolytic plating solution contained in the inner tank 422 is drawn out through the entrance 418 through which the metal wire 20 passes, but is filled by the circulation member 440 by the amount flowing out of the inner tank, thereby causing the The water level can be maintained to the extent that the metal wire can be submerged.

The electrolytic plating solution may include at least one or more of silver, nickel, iron, tin, zinc, or an alloy containing at least one of the above elements, the main material of which is copper or copper.

In the present exemplary embodiment, the metal wire 20 is immersed in the electrolytic plating solution by passing through the entrance 418 formed on the sidewall of the third plating bath 410c. However, the metal wire 20 is disposed by guiding the guide rollers. It can also be configured by changing the transport path so that it is immersed in the tank.

The metal wire 20 after the electroplating in the electrolytic plating unit 400 is provided to the post-treatment unit 600.

The post-treatment unit 600 includes a third water treatment unit 610, a discoloration preventing unit 620 for preventing discoloration of the metal layer (stabilization layer) formed on the surface of the metal wire, a fourth washing unit 630, and a drying unit 640. ). The drying treatment unit 640 may spray hot air (nitrogen gas) to remove moisture from the metal wire. Of course, the drying method in the drying unit 640 may be variously applied to a drying method using a heat source. In this way, the metal wire 20 from which water is removed by the drying treatment unit 640 is provided to the gusseting unit 800.

The winding part 800 includes a winding reel 810 in which the metal wire 20 after electroplating is wound, and guide rollers 820 for guiding the metal wire to the winding reel.

5 is a flowchart for explaining an electroplating method of a metal wire.

The electroplating process in the electroplating apparatus of the metal wire rod which has the above-mentioned structure is performed as follows.

1 and 5, the electroplating of the metal wire is divided into a loading step (s100), a pretreatment step (s200), an electrolytic plating step (s400), a post-processing step (s600), and an unloading step (s800). Is done.

The metal wire 20 is drawn out from the feeding reel 110 of the unwinding part 100 and provided to the pretreatment part 200 (S100). In the pretreatment step (s200), a pickling treatment step of treating the metal wire with a weak acid to remove any oxide film on the surface of the metal wire to be plated (s210), and a washing step of washing the surface of the metal wire with pure water (S220), the activation process step (s230) for activating the surface of the metal wire and the washing step (s240) for washing the surface of the metal wire with pure water.

And the metal wire rod after the pretreatment step is provided to the electrolytic plating portion is subjected to the electrolytic plating step (s400). The electroplating process is repeatedly performed while the metal wire 20 is transported in a multiturn manner in which the first, second, third, and fourth plating tanks 410a-410d are sequentially circulated by the reel to reel member 500.

After the electroplating step, the metal wire is washed with water in the post-treatment unit (s610), the discoloration prevention process for preventing discoloration of the metal layer (stabilization layer) formed on the surface of the metal wire (s620), and again washed with water (s630). After finishing) is subjected to a post-treatment process (s640) consisting of a drying process.

In this way, the metal wire rod after finishing the surface drying is wound on the winding reel of the winding part (unloading step, s800).

Although described with reference to the embodiments above, those skilled in the art will understand that the present invention can be variously modified and changed without departing from the spirit and scope of the invention as set forth in the claims below. Could be.

Claims (9)

In the electroplating apparatus for manufacturing a superconducting wire rod: A plating bath containing a plating solution; An electroplating apparatus for manufacturing a superconducting wire, characterized in that it comprises a reel to reel member for multi-turning the metal wire so that the metal wire, which is the base material of the superconducting wire is plural times immersed in the electrolytic plating solution of the plating bath. The method of claim 1 wherein: The reel to reel member is A first reel member for guiding a metal wire to the plating bath; And Electrolytic plating apparatus for producing a superconducting wire, characterized in that it comprises a second reel member for guiding the metal wire passed through the plating tank to the first reel member. In the electroplating apparatus for manufacturing a superconducting wire rod: First, second, third and fourth plating baths arranged in four directions; And A reel-to-reel providing a moving path in which a metal wire, which is a base material of a superconducting wire, is multiturned from the first plating tank to the first plating tank and then to the first plating tank. Electrolytic plating device for producing a superconducting wire, characterized in that it comprises a member. In the electroplating apparatus for manufacturing a superconducting wire rod: Winding unit for providing a metal wire that is the base material of the superconducting wire; A plating part immersing the metal wire provided from the unwinding part in an electrolytic plating solution to form a stabilization layer on the surface of the metal wire; A pretreatment section for washing with water before a metal wire is provided to the plating section; A post treatment unit for washing and drying a metal wire rod having a stabilization layer formed in the plating unit; It includes a winding unit wound around the metal wire to finish drying in the post-processing unit; The plating part First, second, third and fourth plating baths arranged in four directions; And A reel-to-reel member for providing a moving path in which a metal wire, which is a base material of a superconducting wire, is multiturned from the first plating bath to the first plating bath and then to the first plating bath and then to the first plating bath. Electrolytic plating device for producing a superconducting wire, characterized in that it comprises a. The method of claim 3 or 4 wherein: The reel to reel member is A first reel member disposed between the fourth plating tank and the first plating tank to guide the metal wire to the first plating tank; A second reel member disposed between the first plating tank and the second plating tank to guide the metal wire to the second plating tank; A third reel member disposed between the second plating tank and the third plating tank to guide the metal wire to the third plating tank; And And a fourth reel member disposed between the third plating tank and the fourth plating tank to guide the metal wire to the fourth plating bath. The method of claim 4 wherein: The first, second, third and fourth plating baths are provided with metal electrodes used as anodes. The reel to reel member is an electroplating apparatus for producing a superconducting wire, characterized in that used as a cathode. The method of claim 4 wherein: The electroplating solution is a metal material, the copper or copper as a main material to produce a superconducting wire, characterized in that it comprises at least one or more of silver, nickel, iron, tin, zinc or an alloy containing at least one of the above elements. For electroplating device. In the electroplating method for producing superconducting wires: A loading step of providing a metal wire as a base material of the superconducting wire from the unwinding unit; An electroplating step of forming a stabilization layer on the surface of the metal wire while passing the metal wire through the plating bath containing the electroplating solution; An unloading step of winding the electroplated metal wires on the winding part; In the electrolytic plating step, the electroplating method for manufacturing a superconducting wire, characterized in that the metal wire is multi-turned by the reel to reel member so as to be immersed in the electroplating solution of the plating bath several times. The method of claim 8 wherein: In the electrolytic plating step The metal wire is multiturned while sequentially passing through the first, second, third and fourth plating baths arranged in four directions, and the metal wire is four reel members disposed between the first, second, third and fourth plating baths. Electrolytic plating method for producing a superconducting wire, characterized in that the transfer by.