KR20090089173A - Memory module - Google Patents
Memory module Download PDFInfo
- Publication number
- KR20090089173A KR20090089173A KR1020080014584A KR20080014584A KR20090089173A KR 20090089173 A KR20090089173 A KR 20090089173A KR 1020080014584 A KR1020080014584 A KR 1020080014584A KR 20080014584 A KR20080014584 A KR 20080014584A KR 20090089173 A KR20090089173 A KR 20090089173A
- Authority
- KR
- South Korea
- Prior art keywords
- heat sink
- memory module
- substrate
- heat
- module
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The memory module according to the present invention includes a first substrate and a second substrate on which a plurality of unit packages are mounted, and a heat sink interposed between the first substrate and the second substrate and having a hollow structure.
Description
The present invention relates to a memory module, and more particularly, to a memory module that can reduce the thickness and height, as well as improve the heat dissipation characteristic capability.
In general, semiconductor chips are manufactured into individual semiconductor packages through a series of processes, and the semiconductor chips packaged as described above are mounted on a printed circuit board to implement a semiconductor module.
Semiconductor module products can be equipped with multiple semiconductor memory chips on a single circuit board, eliminating the inconvenience of mounting memory devices as individual chips, increasing memory capacity of memory devices, and increasing utilization of products that are out of market cycles. Widely used in
In addition, when producing the above-described semiconductor module using the Surface Mount Technology (SMT), a series of printed circuit boards (PCBs) in which several identical circuit boards are connected may be used.
On the other hand, a packaged semiconductor chip mounted on a semiconductor module inevitably generates heat during its operation, and if such heat does not quickly escape to the outside of the package, serious damage occurs.
For example, Rambus DRAMs operate at much higher speeds than conventional synchronous DRAMs (SDRAMs), so heat dissipation is particularly desired.
For this purpose, a heat sink or a heat spreader is generally used to quickly release heat generated during operation of the semiconductor chip.
Such heat sinks typically release thermal interface materials (TIMs) to improve the reliability of the heat sink's contact.
In general, the application of the heat sink or heat spreader is performed by arranging a module substrate on which a plurality of semiconductor packages are mounted on a top surface and a bottom surface thereof, and attaching a heat sink or heat spreader to both sides of the module substrate. .
However, although not shown and described in detail, the application of the heat sink or heat spreader using the above-described method additionally generates a thickness ranging from a minimum of 6 mm to a maximum of 15 mm. There is a problem that does not meet the trend to reduce the distance between modules in order to insert a large amount of memory in the increased space accordingly.
On the other hand, in order to prevent the increase in thickness as described above, by placing a metal core in the center portion to perform the role of a heat sink or heat spreader, and to form a heat sink of the fin (Fin) shape on the upper side of the metal core to further release heat In this case, the application of an additional heat sink having a fin shape using the above method requires another additional space expansion of the upper portion of the entire memory module, thereby increasing the height of the entire memory module.
The present invention provides a memory module in which the thickness and height of the entire memory module are reduced when the memory module to which the heat sink or the heat spreader is applied is formed.
In accordance with another aspect of the present invention, a memory module includes: a first substrate and a second substrate on which a plurality of unit packages are mounted; And a heat sink interposed between the first substrate and the second substrate and having a hollow structure.
The first and second substrates include a flexible substrate.
The heat sink is characterized in that it has a size equal to or smaller than the first and second substrates.
The heat sink is characterized in that consisting of a metal tube.
The heat sink is characterized in that consisting of a metal tube of a polygonal structure.
The heat sink is characterized in that it comprises a structure in which a diaphragm is installed so that the interior is divided into a plurality of spaces.
The heat sink is characterized in that consisting of copper or aluminum and alloys including the same.
The heat sink is characterized in that a plurality of projections formed therein.
The protrusion is characterized in that the concave and convex shape.
According to the present invention, a heat sink formed of a metal core and having a space therebetween is formed between each of first and second flexible substrates on which a plurality of unit packages are mounted on a top surface when a memory module to which a heat sink is applied is formed. By forming the memory module through the through, it is possible to reduce the thickness of the entire memory module by not having to attach a heat sink or heat spreader on both sides of the module substrate.
In addition, the present invention by forming a heat module between the flexible substrate as described above to form a memory module, it is possible to reduce the height of the entire memory module according to the need not to form an additional heat sink above the module substrate.
In addition, the present invention can improve the structural stability of the heat sink by forming the inner space of the heat sink so as to be partitioned into at least two by the diaphragm, and by the partitioned heat sink inner space Fin Excellent heat dissipation characteristics such as heat sink in shape can be obtained.
According to an embodiment of the present invention, in the formation of a memory module to which a heat sink is applied, a heat formed of a metal core and a space formed therebetween between first and second flexible substrates having a plurality of unit packages mounted on an upper surface thereof. A memory module is formed through the sink.
At this time, the inner space of the heat sink is divided into at least two by the diaphragm formed in the space.
In this way, the heat sink is disposed between the flexible substrates on which the plurality of unit packages are mounted as described above, thereby placing a module substrate on which a plurality of semiconductor packages are mounted on the upper and lower surfaces of the related art, in the center portion, Compared to a memory module to which a heat sink or heat spreader is attached to a side surface, the thickness of the entire memory module can be reduced by not having to attach the heat sink or heat spreader.
In addition, compared to the same method as a memory module that additionally forms a fin-shaped heat sink to dissipate heat, a heat sink is formed between the flexible substrates as described above to form a memory module, thereby providing the additional heat sink. The height of the entire memory module can be reduced as it does not need to be formed.
In addition, by forming the inner space of the heat sink to be partitioned into at least two or more by the diaphragm as described above, it is possible to improve the structural stability of the heat sink and fins by the partitioned heat sink inner space. Excellent heat dissipation characteristics such as heat sink in shape can be obtained.
Hereinafter, with reference to the accompanying drawings will be described in detail a preferred embodiment of the present invention.
In detail, FIGS. 1 to 4 are cross-sectional views illustrating processes for describing a memory module according to an exemplary embodiment of the present invention.
As shown in FIG. 1, a
Here, the
In addition, the
Meanwhile, as shown in FIGS. 3 and 4, the
As described above, the memory module to which the heat sink according to the present invention is applied is formed of a metal core between each of the first and second flexible substrates having a plurality of unit packages mounted on an upper surface thereof. By forming a memory module by interposing a heat sink having a space therebetween, a module substrate having a plurality of semiconductor packages mounted on the top and bottom surfaces thereof is disposed at a central portion thereof, and heat sinks or heat spreaders are disposed on both sides of the module substrate. Compared to the memory module to which the memory module is applied, the thickness of the entire memory module can be reduced by not having to attach the heat sink or the heat spreader.
In addition, compared to the same method as a memory module that additionally forms a fin heat sink to dissipate heat, a heat sink is formed between the flexible substrates as described above to form a memory module, thereby providing the additional heat sink. The height of the entire memory module can be reduced as it does not need to be formed.
In addition, by forming the inner space of the heat sink to be partitioned into at least two or more by the diaphragm as described above, it is possible to improve the structural stability of the heat sink and fins by the partitioned heat sink inner space. Excellent heat dissipation characteristics such as heat sink in shape can be obtained.
In the above-described embodiments of the present invention, the present invention has been described and described with reference to specific embodiments, but the present invention is not limited thereto, and the scope of the following claims is not limited to the scope of the present invention. It will be readily apparent to those skilled in the art that the present invention may be variously modified and modified.
1 to 4 are cross-sectional views illustrating memory modules according to embodiments of the present invention.
Claims (9)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020080014584A KR20090089173A (en) | 2008-02-18 | 2008-02-18 | Memory module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020080014584A KR20090089173A (en) | 2008-02-18 | 2008-02-18 | Memory module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20090089173A true KR20090089173A (en) | 2009-08-21 |
Family
ID=41207520
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020080014584A KR20090089173A (en) | 2008-02-18 | 2008-02-18 | Memory module |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR20090089173A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113644187A (en) * | 2021-07-14 | 2021-11-12 | 深圳市定千亿电子有限公司 | High-reliability integrated packaging LED chip |
-
2008
- 2008-02-18 KR KR1020080014584A patent/KR20090089173A/en not_active Application Discontinuation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113644187A (en) * | 2021-07-14 | 2021-11-12 | 深圳市定千亿电子有限公司 | High-reliability integrated packaging LED chip |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6756669B2 (en) | Heat spreader with down set leg attachment feature | |
| US9941251B2 (en) | 3DIC packages with heat dissipation structures | |
| KR102005313B1 (en) | Semiconductor device | |
| US7606035B2 (en) | Heat sink and memory module using the same | |
| KR200448519Y1 (en) | Heat sink for protrusion type ic package | |
| WO2013091441A1 (en) | Pop encapsulation structure | |
| US7254033B2 (en) | Method and apparatus for heat dissipation | |
| US20130068509A1 (en) | Method and apparatus for connecting inlaid chip into printed circuit board | |
| JPWO2019043835A1 (en) | Electronic device | |
| US7269018B1 (en) | Method and apparatus for attaching multiple heat sinks to multiple non-coplanar components | |
| KR20090089173A (en) | Memory module | |
| US20100032136A1 (en) | Cooler module | |
| CN218827075U (en) | Chip packaging structure beneficial to warping and heat dissipation | |
| KR100984857B1 (en) | Memory module and method of fabricating the same | |
| JP3874888B2 (en) | Memory module and memory system | |
| KR20090051987A (en) | Memory module | |
| JP2006140203A (en) | Sip heat dissipation package | |
| US20240112983A1 (en) | Semiconductor device and manufacturing method thereof | |
| JP6823283B2 (en) | Cooling device, mounting method | |
| KR20100052311A (en) | Method of manufacturing module substrate | |
| KR20080061012A (en) | Semiconductor package | |
| JP2001352018A (en) | Heat transfer member for semiconductor device and cooling structure thereof | |
| KR20090026613A (en) | Heat sink used semiconductor module | |
| JP2020077808A (en) | Heat dissipation structure of semiconductor component | |
| JPH04287348A (en) | Semiconductor device and its mounting method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E902 | Notification of reason for refusal | ||
| E601 | Decision to refuse application |