KR20090083213A - Track apparatus for semicondutor device fabricating and method for checking loading error using the same - Google Patents

Track apparatus for semicondutor device fabricating and method for checking loading error using the same Download PDF

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Publication number
KR20090083213A
KR20090083213A KR1020080009230A KR20080009230A KR20090083213A KR 20090083213 A KR20090083213 A KR 20090083213A KR 1020080009230 A KR1020080009230 A KR 1020080009230A KR 20080009230 A KR20080009230 A KR 20080009230A KR 20090083213 A KR20090083213 A KR 20090083213A
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KR
South Korea
Prior art keywords
spin chuck
substrate
home position
proximity sensor
transfer arm
Prior art date
Application number
KR1020080009230A
Other languages
Korean (ko)
Inventor
정구철
Original Assignee
주식회사 하이닉스반도체
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 하이닉스반도체 filed Critical 주식회사 하이닉스반도체
Priority to KR1020080009230A priority Critical patent/KR20090083213A/en
Publication of KR20090083213A publication Critical patent/KR20090083213A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

A track apparatus for semiconductor device fabricating and method for checking loading error using the same are provided to prevent the damage of the track system by performing the subsequent processes after rearranging the home position of the spin chuck when generating a loading error. The track system for the semiconductor device fabrication comprises the transfer arm, the spin chuck, the chemical dispense nozzle, and the proximity sensor. The transfer arm in which the proximity sensor is installed moves it to the home appointment point of the spin chuck(S10). The appointment point of the spin chuck is sensed by the proximity sensor(S20). It checks whether the home position location of the spin chuck is exact or not(S30). The substrate is loaded in the spin chuck in case the spin chuck is accurately located in the home position(S40). If the home position location of the spin chuck is incorrect, the home position of the spin chuck is arranged(S50).

Description

Track device for semiconductor device manufacturing and loading failure checking method using same {track apparatus for semicondutor device fabricating and method for checking loading error using the same}

The present invention relates to a semiconductor device and a method for manufacturing the same, and more particularly to a track device for manufacturing a semiconductor device and a loading failure checking method using the same.

In order to manufacture a semiconductor device, unit processes such as a deposition process, a photolithography process, an etching process, and a cleaning process are performed several times. In particular, the photolithography process is performed including an exposure and development process. In this case, the productivity is increased by connecting an exposure apparatus such as a scanner for an exposure process and a chemical liquid dispensing apparatus, for example, a track apparatus for resist coating or developer injection, in an in-line combination.

The track apparatus is provided with a spin chuck on which a substrate is seated on an upper surface, drive means for rotating the spin chuck, and spaced apart from the spin chuck by a predetermined distance, so as to form a developer or photoresist such as a chemical solution on the substrate. And chemical dispense nozzles for dispensing liquids. At this time, it comprises a robot arm (arm) for loading and unloading the substrate on the spin chuck.

However, even when a loading error occurs because the substrate and the spin chuck are incorrectly seated in the track device having such a structure, it is not recognized. For example, the home position of the spin chuck is changed due to a collision with the substrate or the robot arm or the spin chuck that loads and unloads the substrate during unloading of the substrate where the current resist coating or developer injection is performed in the track apparatus. Can lose.

Even if the home position of the spin chuck is distorted, the substrate to be subsequently processed is loaded on the spin chuck to cause a loading failure. Although the loading is bad and the substrate is incorrectly seated on the spin chuck, it is not properly recognized and the subsequent process is performed.

As a result, the pieces of the substrate that are bounced off and broken by the high-speed rotation of the spin chuck collide with the spin chuck, causing damage to the track device. In addition, the substrate fragments are scattered inside the trapping apparatus and act as a cause of foreign matter generation during the process, and cause loss of device defects and raw material damage.

On the other hand, although the sensor for detecting the substrate is installed in the track device, such a sensor only detects that the substrate is located on the spin chuck, the ability to detect whether the center of the substrate and the spin chuck is correctly placed is limited.

A track device for manufacturing a semiconductor device according to the present invention includes a spin chuck on which a substrate is seated; A chemical liquid dispensing nozzle disposed to be spaced apart from the spin chuck at a predetermined interval to distribute chemical liquid on a substrate; A transfer arm for moving the position of the chemical liquid dispensing nozzle; And a proximity sensor installed at the transfer arm.

A substrate loading failure checking method using a track device for manufacturing a semiconductor device according to the present invention is a track device for manufacturing a semiconductor device including a spin chuck, a chemical liquid dispensing nozzle, and a transfer arm provided with a proximity sensor. Moving to the home position designation point of the spin chuck; Sensing whether a home position of the spin chuck is correct by sensing a predetermined point of the spin chuck using the proximity sensor; And loading the substrate into the spin chuck when the check result indicates that the spin chuck is correctly positioned in the home position.

Aligning the home position of the spin chuck when the check position indicates that the home position of the spin chuck is misaligned; And loading a substrate on the spin chuck.

In the moving of the transfer arm, it is preferable to move in consideration of the sensing distance of the proximity sensor.

(Example)

Referring to FIG. 1, a track device for manufacturing a semiconductor device according to the present invention is provided with a spin chuck 100 on which a substrate is seated, and spaced apart from the spin chuck by a predetermined distance, and a developer such as a chemical solution on the substrate. Or a chemical dispense nozzle 110 for distributing the photoresist solution and a transfer arm 120 for moving the position of the chemical dispense nozzle 110. In this case, the transfer arm 120 is provided with a proximity sensor 130 and driving means (not shown) for rotating the spin chuck.

The spin chuck 100 is installed to be rotatable at a high speed, and a substrate on which a resist film is to be formed or a substrate on which a developer is to be injected is loaded or unloaded into a track device by a robot arm (not shown). .

The chemical liquid distribution nozzle 110 serves to inject a developer or a resist onto a substrate that is rotated at high speed by the spin chuck 100. The transfer arm 120 serves to move the position of the chemical liquid distribution nozzle. The transfer arm 120 may be moved to uniformly spray the developer or resist onto the substrate.

The proximity sensor 130 checks whether the home position of the spin chuck 100 is correct. In this case, the proximity sensor 130 may install an ultrasonic wave, a laser, or the like, which may be used as a sensor, on the transfer arm 120, and may install a distance sensor.

On the other hand, in the track apparatus, the home position of the spin chuck may be changed by the collision between the substrate and the robot arm or the spin chuck in the process of unloading the substrate on which the resist coating or the developer injection is performed.

However, when the home position of the spin chuck is misaligned, the subsequent substrate is loaded onto the spin chuck, causing loading failure. Although the loading failure occurs, the substrate is incorrectly seated on the spin chuck, but it is not recognized properly, and subsequent processes are performed.

As a result, the pieces of the substrate that are bounced off and broken by the high-speed rotation of the spin chuck collide with the spin chuck, causing damage to the track device. In addition, the substrate fragments are scattered inside the track device, which acts as a cause of foreign matter generation during the process, and causes loss of device defects and raw material damage.

The substrate loading failure check method using the track device for manufacturing a semiconductor device according to the present invention is as follows.

As shown in Fig. 2, in the track device shown in Fig. 1, the transfer arm for moving the position of the chemical liquid dispensing nozzle is moved to a designated point of the home position of the spin chuck ( S10).

After sensing a specified point of the spin chuck using the proximity sensor installed in the transfer arm (S20), it is checked whether the spin chuck is correctly positioned at the home position (S30). In this case, the sensing result may be transmitted to the main board of the track device to check whether the spin chuck is correctly positioned at the home position, thereby checking whether the loading is bad.

As shown in FIG. 3, when the spin chuck 100 is accurately positioned at the home position, the substrate is loaded in a subsequent process, for example, the spin chuck 100 (S40). Thereafter, while developing the spin chuck 100 loaded with the substrate at a high speed, the developer or the resist may be sprayed through the chemical liquid distribution nozzle 110 to perform a development process or a resist coating process.

On the other hand, as shown in Figure 4, when the home position position of the spin chuck 110 is determined to be bad loading, the home position of the spin chuck 11 (home position) is aligned (S50). Subsequently, after sensing a specified point of the spin chuck using a proximity sensor installed in the transfer arm (S20), it is checked whether the spin chuck is correctly positioned at the home position (S30).

When the spin chuck 100 is correctly positioned at the home position, the substrate is loaded in a subsequent process, for example, the spin chuck 100 (S40). Thereafter, while the spin chuck 100 loaded with the substrate is rotated at a high speed, the developer or the resist may be sprayed through the chemical liquid dispensing nozzle 110 to perform a developing process or a resist coating process.

According to the present invention, if a loading error occurs because the home position of the spin chuck is distorted in the track apparatus by installing a proximity sensor in the track apparatus, after recognizing this in advance, after rearranging the home position of the spin chuck, Follow-up process is performed. As a result, the pieces of the substrate that are bounced off and broken by the high-speed rotation of the spin chuck can be prevented from colliding with the spin chuck and damaging the track apparatus. Therefore, there is an effect that can reduce the raw material failure and damage such as raw material damage to reduce the raw materials and maintain the device stability.

Although the present invention has been described in detail with reference to specific examples, it is apparent that the present invention is not limited thereto and may be modified or improved by those skilled in the art within the technical idea of the present invention.

1 is a view showing for explaining a track device for manufacturing a semiconductor device according to the present invention.

2 to 4 are diagrams for explaining a substrate loading failure check method using a track device for manufacturing a semiconductor device according to the present invention.

Claims (4)

A spin chuck on which the substrate is seated; A chemical liquid dispensing nozzle disposed to be spaced apart from the spin chuck at a predetermined interval to distribute chemical liquid on a substrate; A transfer arm for moving the position of the chemical liquid dispensing nozzle; And Track device for manufacturing a semiconductor device comprising a proximity sensor installed in the transfer arm. A track device for manufacturing a semiconductor device comprising a spin chuck, a chemical liquid dispensing nozzle, and a transfer arm provided with a proximity sensor, Moving the transfer arm provided with the proximity sensor to a home position designation point of the spin chuck; Sensing whether a home position of the spin chuck is correct by sensing a predetermined point of the spin chuck using the proximity sensor; And And loading the substrate into the spin chuck when the spin chuck is correctly positioned at the home position. The method of claim 2, Aligning the home position of the spin chuck when the check position indicates that the home position of the spin chuck is misaligned; And The substrate loading failure check method using a track device for manufacturing a semiconductor device further comprising the step of loading a substrate on the spin chuck. The method of claim 2, In the moving of the transfer arm, a substrate loading failure checking method using a track device for manufacturing a semiconductor device to move in consideration of the sensing distance of the proximity sensor.
KR1020080009230A 2008-01-29 2008-01-29 Track apparatus for semicondutor device fabricating and method for checking loading error using the same KR20090083213A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020080009230A KR20090083213A (en) 2008-01-29 2008-01-29 Track apparatus for semicondutor device fabricating and method for checking loading error using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020080009230A KR20090083213A (en) 2008-01-29 2008-01-29 Track apparatus for semicondutor device fabricating and method for checking loading error using the same

Publications (1)

Publication Number Publication Date
KR20090083213A true KR20090083213A (en) 2009-08-03

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020080009230A KR20090083213A (en) 2008-01-29 2008-01-29 Track apparatus for semicondutor device fabricating and method for checking loading error using the same

Country Status (1)

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KR (1) KR20090083213A (en)

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