KR20090083095A - Conductive gasket for surface mount device - Google Patents
Conductive gasket for surface mount device Download PDFInfo
- Publication number
- KR20090083095A KR20090083095A KR1020080009065A KR20080009065A KR20090083095A KR 20090083095 A KR20090083095 A KR 20090083095A KR 1020080009065 A KR1020080009065 A KR 1020080009065A KR 20080009065 A KR20080009065 A KR 20080009065A KR 20090083095 A KR20090083095 A KR 20090083095A
- Authority
- KR
- South Korea
- Prior art keywords
- conductive
- elastic body
- present
- gasket
- conductive gasket
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0015—Gaskets or seals
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
Abstract
According to the present invention, two circuits are electrically connected to each other, and the electrode unit is fixed by reflow soldering to a printed circuit board to perform functions such as signal processing and grounding, and the other circuit contacts the opposite side to transfer electrical signals between the two circuits. In addition, the present invention relates to a surface mount conductive gasket capable of effectively blocking electromagnetic waves, wherein the surface mount conductive gasket of the present invention comprises a non-conductive inner elastomer in the form of a polygonal tube of silicon material; A conductive sheet surrounding the inner elastic body; And a metal electrode attached to one surface of the conductive sheet.
The surface-mount conductive gasket of the present invention configured as described above has an excellent elastic restoring force and electrical resistance without thermal deformation even at high temperature by using an internal elastic body made of silicon, and enables reflow soldering. Since it is used as the inner hollow body of the shape not only has the effect of further improving the modulus of elasticity, especially when the inner hollow portion is a hexagon has a characteristic that the central portion of the left and right sides easily folded.
Description
The present invention relates to a surface-mount conductive gasket, and more particularly, to electrically connect two circuits so as to perform signal processing and grounding, and to fix the electrode part by reflow soldering to a printed circuit board, and the other circuit. The present invention relates to a surface mount conductive gasket capable of contacting the opposite side to transfer electrical signals between two circuits and effectively blocking electromagnetic waves.
In general, electromagnetic waves generated in the internal circuits of various electronic devices are discharged to the outside through the air or conducted through power lines. Such electromagnetic waves may cause noise and malfunction to neighboring components or devices, Even known to have a harmful effect. In addition, as the circuit becomes complicated due to the recent shortening and digitization of electronic devices, the possibility of electromagnetic wave is rapidly increasing, and the regulation of electromagnetic waves is strengthened not only in advanced countries but also in Korea.
Typically, the electronic device is composed of a front panel portion, a rear terminal portion, and a metal case surrounding the rest of the electronic apparatus. Since the metal case shields electromagnetic waves, electromagnetic waves do not leak, but electromagnetic waves are significantly leaked into the gap between the panel portion, the terminal portion, and the contact portion of the metal case. Conventionally, in order to prevent the leakage of electromagnetic waves, ring-wires are installed in the gaps and the ring-wires are grounded in various places inside the electronic devices. Therefore, the above-mentioned problem is easy to install, and a conductive gasket capable of effectively blocking electromagnetic waves while simplifying the internal structure, an elastically deformable elastic body; A flexible conductor surrounding the elastic body and conducting between the exterior parts of the electronic device; And a constitution of a conductive gasket having means for fixing an elastic body and a conductor, and arranged between the electronic device exterior parts.
However, such a conventional conductive gasket has a disadvantage that the blocking rate of electromagnetic waves is not high. Therefore, it solves this problem and provides a gasket that can increase the blocking rate of electromagnetic waves, thereby minimizing harm to the human body from electromagnetic waves. For the purpose of minimizing the prevention of malfunctions, Korean Utility Model Application No. 2000-0015240 states that "Slopes of rectangular polyurethane-based elastic bodies (1) have a conductor (2) plated with copper and nickel on P and E fibers. In a typical gasket formed by being wrapped and having an
However, according to the related art as well as the above-described invention, the conductive gasket is generally applied to the urethane sponge by wrapping the conductive fabric and attaching the conductive adhesive tape to the lower part to be fixed to the printed circuit board. It is difficult to maintain excellent conductivity due to time-dependent changes in conductive adhesion surface, and it is difficult to use for switching applications due to weak elastic resilience of non-conductive elastomers for long-term use.
Moreover, as a way to solve the above shortcomings, a method of enabling reflow soldering by bending a highly elastic metal plate into a press die has been proposed and used. However, this method requires various new molds according to shape and size. There is a disadvantage that a large manufacturing cost is required to satisfy the market demand for a product of size.
Accordingly, an object of the present invention is to provide a surface mount conductive gasket that solves the above problems, and in detail, the conductive and elasticity is continuously maintained due to excellent heat resistance, so that the two circuits are electrically connected to process and ground. It is to provide a surface mounting conductive gasket capable of reflow soldering and excellent electromagnetic shielding effect.
Another object of the present invention is to make it easy to adjust the length in the same shape, the surface mounting conductive gasket that can provide excellent conductivity by using a metal paste with excellent conductivity to minimize the potential difference between the conductive fabric and the electrode It is to provide.
Surface mounting conductive gasket of the present invention for achieving the above object;
A non-conductive inner elastomer in the form of a polygonal tube of silicon material;
A conductive sheet surrounding the inner elastic body; And
It is characterized by consisting of a metal electrode attached to one surface of the conductive sheet.
According to another configuration of the present invention, the elastic body is characterized in that the inside of the hollow rectangular tube shape.
According to another configuration of the present invention, the elastic body is characterized in that the thickness of the upper and lower surface is 1.5 to 3.0 times compared to the thickness of the left and right side.
According to another configuration of the present invention, the inner shape of the elastic body is characterized in that the hexagon.
According to another configuration of the present invention, the gasket is characterized in that the conductive sheet is coated with a surface of the liquid silicon using any one of metal plated fibers or metal foil, and then adhesively bonded to the elastic body.
According to another configuration of the present invention, the solder metal electrode is characterized in that it is attached to one side of the conductive sheet with a conductive paste.
The surface-mount conductive gasket of the present invention configured as described above can maintain stable conductivity by using uniformly plated fabric or metal foil, and excellent elastic restoring force without thermal deformation even at high temperature by using an internal elastic body made of silicon. And electrical resistance to enable reflow soldering. Also, since the inner elastic body is used as the inner hollow body having a certain shape, the elastic modulus can be further improved, and especially when the inner hollow part is hexagonal, the left and right sides The central part of has the property of being easily folded. Furthermore, the surface mount conductive gasket according to the present invention has a merit that it is possible to continuously produce in a series of processes, and that the production process is simple, thereby providing a cost-effective and safe quality product due to productivity improvement.
DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in more detail with reference to the accompanying drawings. However, these embodiments are provided for better understanding of the present invention and are not intended to limit the scope of the present invention.
1 is a perspective view showing a surface mount conductive gasket according to an embodiment of the present invention, Figure 2 is a cross-sectional view showing the shape and structure of a non-conductive silicon tube of the surface mount conductive gasket according to an embodiment of the present invention. .
As shown in FIG. 1, the non-conductive
The material of the non-conductive
In addition, as shown in FIG. 2, the thickness b of the upper and
Most preferably, the thickness ratio of the thickness a and the thickness b is 1.0: 1.5 to 3.0, and the hardness is preferably Shore A 60 or less.
The
The electrical resistance of the
In the case of using a metal foil such as aluminum foil as the
The
3 is a development view schematically illustrating a manufacturing process of the surface mounting conductive gasket according to the present invention.
The surface mount conductive gasket of the present invention configured as described above is more specifically provided on one surface of the
A
4 is a cross-sectional state diagram showing a state in which the surface mounting conductive gasket according to the embodiment of the present invention is actually applied.
As shown in FIG. 4, the
Therefore, the electric flow path is made of another circuit connection part 30-conductive sheet 2-conductive paste 12-copper foil electrode 3-solder 21-printed
1 is a perspective view showing a surface mounting conductive gasket according to an embodiment of the present invention,
2 is a cross-sectional view showing the shape and structure of a non-conductive silicon tube of a surface mounting conductive gasket according to an embodiment of the present invention;
3 is an exploded view schematically showing a manufacturing process of the surface mounting conductive gasket according to the present invention;
4 is a cross-sectional state diagram showing a state in which the surface mounting conductive gasket according to the embodiment of the present invention is actually applied.
* Explanation of symbols for main parts of the drawings
1
3: metal electrode 10: conductive gasket
11: silicone rubber 12: metal paste
20: printed circuit board
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080009065A KR20090083095A (en) | 2008-01-29 | 2008-01-29 | Conductive gasket for surface mount device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080009065A KR20090083095A (en) | 2008-01-29 | 2008-01-29 | Conductive gasket for surface mount device |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20090083095A true KR20090083095A (en) | 2009-08-03 |
Family
ID=41204089
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020080009065A KR20090083095A (en) | 2008-01-29 | 2008-01-29 | Conductive gasket for surface mount device |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR20090083095A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014022125A1 (en) * | 2012-07-28 | 2014-02-06 | Laird Technologies, Inc. | Metallized film-over-foam contacts |
KR102138782B1 (en) * | 2019-05-30 | 2020-07-29 | 주식회사 아이씨에이치 | Durable electromagnetic shielding conductive gasket |
US11751319B2 (en) | 2018-07-25 | 2023-09-05 | Samsung Electronics Co., Ltd. | Electronic device |
-
2008
- 2008-01-29 KR KR1020080009065A patent/KR20090083095A/en not_active Application Discontinuation
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014022125A1 (en) * | 2012-07-28 | 2014-02-06 | Laird Technologies, Inc. | Metallized film-over-foam contacts |
US9131616B2 (en) | 2012-07-28 | 2015-09-08 | Laird Technologies, Inc. | Metallized film-over-foam contacts |
US11751319B2 (en) | 2018-07-25 | 2023-09-05 | Samsung Electronics Co., Ltd. | Electronic device |
KR102138782B1 (en) * | 2019-05-30 | 2020-07-29 | 주식회사 아이씨에이치 | Durable electromagnetic shielding conductive gasket |
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A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E902 | Notification of reason for refusal | ||
E601 | Decision to refuse application |