KR20090065719A - Protection gainst heat structure of back light units that use led light source - Google Patents

Protection gainst heat structure of back light units that use led light source Download PDF

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Publication number
KR20090065719A
KR20090065719A KR1020070133175A KR20070133175A KR20090065719A KR 20090065719 A KR20090065719 A KR 20090065719A KR 1020070133175 A KR1020070133175 A KR 1020070133175A KR 20070133175 A KR20070133175 A KR 20070133175A KR 20090065719 A KR20090065719 A KR 20090065719A
Authority
KR
South Korea
Prior art keywords
bottom chassis
substrate
led
backlight unit
light source
Prior art date
Application number
KR1020070133175A
Other languages
Korean (ko)
Inventor
김은수
Original Assignee
한솔엘씨디 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 한솔엘씨디 주식회사 filed Critical 한솔엘씨디 주식회사
Priority to KR1020070133175A priority Critical patent/KR20090065719A/en
Publication of KR20090065719A publication Critical patent/KR20090065719A/en

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
    • G02B6/0023—Means for improving the coupling-in of light from the light source into the light guide provided by one optical element, or plurality thereof, placed between the light guide and the light source, or around the light source
    • G02B6/0031—Reflecting element, sheet or layer
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
    • G02B6/0073—Light emitting diode [LED]
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133615—Edge-illuminating devices, i.e. illuminating from the side
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2320/00—Control of display operating conditions
    • G09G2320/04—Maintaining the quality of display appearance
    • G09G2320/041—Temperature compensation

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Nonlinear Science (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Device Packages (AREA)

Abstract

The present invention relates to a heat dissipation structure of a backlight unit using an LED light source.

The present invention is to change the shape of the substrate to increase the bonding force between the bottom chassis and the substrate, thereby maximizing the heat dissipation efficiency of the LED backlight unit without using a heat-affected sheet affected by heat through the LED module unit to heat This is to prevent the failure or breakage.

Description

Protection gainst heat structure of Back light units that use LED light source}

The present invention relates to a heat dissipation technology of a backlight unit using a LED light source, and more particularly, to a heat dissipation structure of a backlight unit using an LED light source to maximize heat dissipation efficiency of the LED backlight unit.

Cold Cathode Fluorescent Lamp (CCFL), which was used as a light source for general LCD backlights, uses mercury gas, which can cause environmental pollution, slow response speed, low color reproducibility, and short and thin LCD panels. Had disadvantages that are not appropriate.

On the other hand, Light Emitting Diodes (LEDs) are environmentally friendly, have fast response times of several nanoseconds, and are effective in video signal streams, enabling impulsive driving, and color reproducibility. Is more than 100% and can adjust the light quantity of red, green, and blue LEDs arbitrarily to change the brightness, color temperature, etc., and also has advantages that are suitable for light and small reduction of LCD panel. The situation is actively adopted.

In general, a backlight unit employing an LED may be classified into an edge type backlight unit and a direct type backlight unit according to a position of a light source.

In this case, the edge type backlight unit adopts a method in which a light source having a long horizontal length is positioned at the side of the light guide plate to irradiate light to the front side of the liquid crystal panel through the light guide plate. The top frame 1 and the bottom chassis 2 mounted on the top frame of the backlight unit of the liquid crystal display device, the reflection sheet 3 mounted on the top of the bottom chassis 2 and reflecting light, and the reflection sheet ( 3) is mounted on the top of the diffusion part (light guide plate) 4 for diffusing light, and mounted on both sides of the bottom chassis (2), LED module unit for emitting light to both sides of the diffusion (4) The LED module unit includes a plurality of LEDs 5 and a substrate 6 on which the plurality of LEDs 5 are mounted.

At this time, when the LED module unit is mounted on both side portions of the bottom chassis 2, first attaching a thermal seat (7) to the substrate 6 of the LED module unit, and then attaching the substrate 6 with a screw By fixing to both sides of the bottom chassis 2 using the same fastening member, the heat dissipation sheet 7 is in close contact with each other, and thus the heat dissipation sheet 7 is mounted on the substrate 6. It is to release the heat generated from to the outside.

However, the heat dissipation sheet 7 has a disadvantage in that the heat dissipation sheet 7 is deformed by heat when the heat dissipation function is performed. As a result, a gap is generated between the substrate 6 and the bottom chassis 2 so that the heat dissipation efficiency of the LED module unit decreases. There is a problem that the LED module unit is broken or broken by heat.

Accordingly, the present invention has been made to improve the above-mentioned conventional problems, the object of which is to change the shape of the substrate so that the bottom chassis and the bonding force is increased, even if the heat-resistant sheet is not affected by heat LED It is to provide a heat dissipation structure of the backlight unit using the LED light source to maximize the heat dissipation efficiency of the backlight unit.

The heat dissipation structure of the backlight unit using the LED light source of the present invention for achieving the above object, the top frame and the bottom chassis; A reflection sheet mounted on the top of the bottom chassis and reflecting light; A diffusion unit mounted on an upper end of the reflective sheet to diffuse light; It is mounted on both sides of the bottom chassis, and comprises an LED module including a LED and a substrate to emit light to both sides of the diffusion,

Coupling ribs are formed at both side portions of the bottom chassis, and the substrate is formed with a U-shaped coupling groove to enable fitting to the bottom chassis through the coupling ribs, and a heat sink is formed at one side of the substrate. Characterized in that.

In addition, the coupling ribs are characterized in that the protrusion configuration at a predetermined distance apart.

In addition, the coupling rib is characterized in that the protruding configuration in a straight line.

The present invention is to change the shape of the substrate to increase the bonding force between the bottom chassis and the substrate, thereby maximizing the heat dissipation efficiency of the LED backlight unit by heat even if the heat-resistant sheet is not affected by the heat through the LED module unit by the heat The effect of preventing a breakdown from occurring or breaking is obtained.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

2 is an exploded perspective view of the bottom chassis and the substrate in the configuration of the LED backlight unit in the embodiment of the present invention, Figure 3 is a perspective view of a combination of the bottom chassis and the substrate in the configuration of the LED backlight unit in the embodiment of the present invention 4 is a cross-sectional view of the bottom chassis and the substrate in the configuration of the LED backlight unit according to an embodiment of the present invention.

2 to 4, the heat dissipation structure of the backlight unit using the LED light source according to the embodiment of the present invention, the top frame 11 and the bottom chassis 12, the reflective sheet 13, the diffusion portion 14 In the configuration of the LED module including the LED 15 and the substrate 16, the coupling rib 21, the coupling groove 22 and the heat sink 23 is further included.

The reflective sheet 13 is mounted on the top of the bottom chassis 12 to reflect light, and the diffuser 14 is mounted on the top of the reflective sheet 13 as a light guide plate to diffuse light. The LED module unit including the LED 15 and the substrate 16 is mounted on both sides of the bottom chassis 12 to emit light to both sides of the diffusion unit 14.

In this case, the coupling ribs 21 having a linear structure are formed on both side portions of the bottom chassis 12 so that the LED module portions can be mounted on both side portions of the bottom chassis 12. The coupling ribs 21 form a coupling groove portion 22 in a U shape to enable the fitting to the bottom chassis 12 and the heat sink portion 23 is formed at one side of the substrate 16. It is made up.

That is, the heat dissipation structure of the LED backlight unit according to the embodiment of the present invention, as shown in Figures 2 to 4 attached to the U-shaped design of the shape of the substrate 16 to expand the thickness, and then the coupling ribs ( 21 is configured to the coupling groove 22 to enable the coupling, so that the substrate 16 is fitted to the bottom chassis 12 to maintain a close state.

At this time, the heat sink portion 23 is formed at one side of the substrate 16, and the heat sink portion 23 is in close contact with the substrate 16 and the bottom chassis 12 by fitting. When heat is emitted from the LED 15 mounted on the substrate 16, the heat is effectively radiated to the outside.

Here, Figure 5 is another embodiment of the present invention, which shows that the coupling ribs 21 formed in the bottom chassis 12 protruding at a predetermined distance apart, an embodiment of the present invention below Since the operation is the same as in the redundant description will be omitted.

Hereinafter, the present invention is not limited to the above-described specific preferred embodiments, and various modifications can be made by those skilled in the art without departing from the gist of the present invention as claimed in the claims. Of course, such changes are within the scope of the claims.

1 is a cross-sectional view of a conventional bottom chassis and a substrate.

Figure 2 is an exploded perspective view of the bottom chassis and the substrate in the configuration of the LED backlight unit in an embodiment of the present invention.

3 is a perspective view of the bottom chassis and the substrate in the configuration of the LED backlight unit in an embodiment of the present invention.

4 is a cross-sectional view of the bottom chassis and the substrate in the configuration of the LED backlight unit in an embodiment of the present invention.

Figure 5 is an exploded view of a state in which the substrate is coupled to the coupling ribs protruding at a predetermined distance apart in another embodiment of the present invention.

* Description of the symbols for the main parts of the drawings *

11; Top frame 12; Bottom chassis

13; Reflective sheet 14; Diffuser

15; LED 16; Board

21; Coupling rib 22; Coupling groove

23; Heat sink part

Claims (4)

Top frame and bottom chassis; A reflection sheet mounted on the top of the bottom chassis and reflecting light; A diffusion unit mounted on an upper end of the reflective sheet to diffuse light; It is mounted on both sides of the bottom chassis, and comprises an LED module including a LED and a substrate to emit light to both sides of the diffusion, Forming ribs on both side portions of the bottom chassis, The substrate forms a coupling groove to be fitted to the bottom chassis through the coupling ribs, Heat dissipation structure of the backlight unit using the LED light source, characterized in that the heat sink is formed on one side of the substrate. The heat dissipation structure of a backlight unit using an LED light source according to claim 1, wherein the substrate has a U-shape to be fitted to the bottom chassis through the coupling ribs. The heat dissipation structure of a backlight unit using an LED light source according to claim 1 or 2, wherein the coupling ribs protrude at a predetermined interval. The heat dissipation structure of a backlight unit using an LED light source according to claim 1 or 2, wherein the coupling ribs protrude in a straight shape.
KR1020070133175A 2007-12-18 2007-12-18 Protection gainst heat structure of back light units that use led light source KR20090065719A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020070133175A KR20090065719A (en) 2007-12-18 2007-12-18 Protection gainst heat structure of back light units that use led light source

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070133175A KR20090065719A (en) 2007-12-18 2007-12-18 Protection gainst heat structure of back light units that use led light source

Publications (1)

Publication Number Publication Date
KR20090065719A true KR20090065719A (en) 2009-06-23

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Family Applications (1)

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KR1020070133175A KR20090065719A (en) 2007-12-18 2007-12-18 Protection gainst heat structure of back light units that use led light source

Country Status (1)

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KR (1) KR20090065719A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101046561B1 (en) * 2009-08-07 2011-07-05 주식회사 디에스 Lamp module of backlight unit and its manufacturing method
KR20110096857A (en) * 2010-02-23 2011-08-31 엘지디스플레이 주식회사 Liquid crystal display device
KR101294505B1 (en) * 2011-06-30 2013-08-07 엘지이노텍 주식회사 The radiant heat circuit board and the chassis structure having the same
KR200469840Y1 (en) * 2011-05-11 2013-11-07 조추 테크날러지 코포레이션 리미티드 Light source device for backlight module and liquid crystal display
KR20200073011A (en) 2018-12-13 2020-06-23 문규식 LED Module for Back Light with Heat Dissipating PCB

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101046561B1 (en) * 2009-08-07 2011-07-05 주식회사 디에스 Lamp module of backlight unit and its manufacturing method
KR20110096857A (en) * 2010-02-23 2011-08-31 엘지디스플레이 주식회사 Liquid crystal display device
KR200469840Y1 (en) * 2011-05-11 2013-11-07 조추 테크날러지 코포레이션 리미티드 Light source device for backlight module and liquid crystal display
KR101294505B1 (en) * 2011-06-30 2013-08-07 엘지이노텍 주식회사 The radiant heat circuit board and the chassis structure having the same
KR20200073011A (en) 2018-12-13 2020-06-23 문규식 LED Module for Back Light with Heat Dissipating PCB

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