KR20090053915A - Reduced capacity carrier, transport, load port, buffer system - Google Patents

Abstract

According to an embodiment, a semiconductor workpiece processing system is composed of a processing tool (one or more) required for processing a workpiece, a container containing a semiconductor workpiece for input and output transfer to the processing tool (one or more), and a long first transfer section. Define the direction. The first transfer section has an interface with the container to support the container and to transfer the container to the processing tool (one or more) along the direction of movement. When the container is in the first conveyance section, a continuous conveyance of constant velocity occurs in the direction of movement. The second transfer section connects the container to one or more processing tools for input and output transfer to the processing tool (one or more).

Wafer, Carrier, Transfer, Load Port, Buffer System

Description

Reduced capacity carrier, transport, load port, buffer system}

Embodiments described herein relate to substrate processing facilities, and in particular, to substrate transfer systems, transfer carriers, transfer device-processing tool interfaces and placement.

(See related application)

This application is a pending application for US Provisional Patent Application No. 60 / 838,906, dated 8/18/06, and is part of the ongoing application of US Patent Application No. 11 / 803,077 and dated 5/11/07, which is a US patent application number. 11 / 787,981, filed partly on file date 4/18/07, which is part of the filed U.S. patent application number 11 / 594,365 and filed on file date 11/7/06, which was filed on US Provisional Patent Application No. 60 / 733,813. US Patent Application No. 11 / 556,584, filed 11/7/05, filed on 11/3/06. All applications are hereby incorporated by reference in their entirety.

Initially Related Examples

An important factor influencing electronics manufacturing is the desire of consumers to get more powerful but smaller electronics at lower prices. This consumer desire is a stimulus for manufacturers to strive for miniaturization and improved manufacturing efficiency, and manufacturers make profits wherever possible. In the case of semiconductor products, the core equipment (ie, basic tissue structure) of an existing manufacturing facility, the FAB, is a separate processing tool (eg, cluster tool) that performs one or more processes on a semiconductor substrate. Thus, traditional FABs are built around processing tools, which can be placed in configurations necessary to process semiconductor substrates to create the desired electronics. For example, traditional FABs can arrange processing tools into processing bays. Substrates being processed move between tools in carriers such as SMF and FOUPs to keep them as clean as they are in the tool even when moving between tools. Processing facilities (eg, automated material handling systems, AMHS) capable of transferring the substrate carrier to the desired processing tool in the FAB may also be responsible for communication between the tools. For example, an interface between a processing system and a processing tool is generally considered to be two parts. One is an interface that connects the processing system to a tool that loads / unloads a carrier at the loading station of the processing tool, and the other is a tool that loads / unloads the carrier (individually or in groups) or a substrate between the carrier and the tool. The interface to connect to. Many existing interface systems for connecting processing tools to carrier and material handling systems are already known. Because many existing interface systems are complex, unnecessary functions in one or more processing tool interfaces, carrier interfaces, or material handling system interfaces can increase costs and make loading / unloading substrates into the processing tools inefficient. Embodiments to be described in detail below overcome the problems of existing systems.

Industry trends suggest that future IC devices will use sub-45nm architectures, which require the use of as large semiconductor substrates or wafers as possible to increase efficiency and reduce manufacturing costs when manufacturing IC devices of this density. Existing FABs usually handle 200mm or 300mm wafers, and industry trends suggest that FABs will be able to handle more than 300mm wafers, including 450mm wafers. The problem is that the larger the wafer, the longer the processing time per wafer. Therefore, when using a wafer larger than 300 mm, it is advisable to use a smaller lot for wafer processing in order to reduce the work in process (WIP) of the FAB. Small wafer lots are also useful for special lot processing of wafers of any size, or for flat substrates such as other substrates or flat screen display plates. Although smaller lots allow for WIP reduction and efficient special lot handling, the use of small processing lots in a FAB can negatively impact existing FAB throughput. For example, smaller lots tend to be more burdened with a given capacity transfer system (wafer lot transfer) than larger lots. This is shown in the graph of FIG. 51A. The graph of FIG. 51A shows the relationship between lot size and feed rate (expressed in motion per hour) for various FAB speeds (expressed as desired wafer start over time such as monthly (WSPM)). In addition, the graph of FIG. 51A is a diagram showing the maximum capacity of the existing FAB processing system (eg, about 6000-7000 movements per hour). Thus, the intersection of the treatment system dose line and the FAB velocity curve represents the available lot size. For example, running a FAB rate of about 24,000 WSPM in any existing transfer system results in the smallest lot size of about 15 wafers. The smaller the wafer lot, the lower the FAB speed. Therefore, a wafer carrier, a carrier-processing tool interface, and a carrier transfer system (transfer carriers connecting tools in the FAB, storage locations, etc.) must provide a system arranged to use a wafer of a desired size without compromising FAB speed.

Example Summary

According to an embodiment, a semiconductor workpiece processing system comprises a processing tool (one or more) required for processing a workpiece, a container containing the semiconductor workpiece for input and output transfer to the processing tool (one or more), and an elongated first transfer section. It defines the direction of movement. The first transfer section has an interface with the container to support the container and to bring the container to and from the processing tool (one or more) along the direction of movement. When the container is in the first conveyance section, a continuous conveyance of constant velocity occurs in the direction of movement. The second transfer section is connected to one or more processing tools for input / output transfer of containers to the processing tools (one or more). The second conveying section is a separate section separate from the first conveying section, which loads or unloads the container into a part of the first conveying section via an interface with the first conveying section.

Also provided is a semiconductor workpiece processing system according to another embodiment. The system consists of a processing tool for processing semiconductor workpieces (one or more) and a container for transporting (processing) one or more semiconductor workpieces (one or more). The first conveying section is long and defines the direction of movement. The first transfer section has an interface with the container to support the container and to transfer the container to the processing tool (one or more) along the direction of movement. The system has a second transfer section connected to the processing tool (one or more) and the first transfer section to handle container movement between the processing tool and the first transfer section. When the container is in the first conveying section it moves at a constant speed in a predetermined direction of movement. The constant moving speed of the container is independent of the speed of the interface between the second transfer section and the processing tool (one or more).

The following is a description of the above-mentioned aspects and other functions of the present invention by corresponding drawings:

1 is an elevational view of a workpiece carrier having the features of an embodiment and having a workpiece or substrate S in the carrier. 1A-1B are partial plan and elevation views, respectively, of a carrier workpiece support according to another embodiment;

2A is a cross-sectional elevation view of the carrier of FIG. 1 and a tool port interface according to another embodiment;

2B is a cross-sectional elevation view of a tool port interface and a carrier according to another embodiment;

3A-3C are cross-sectional elevation views showing a tool port interface and a carrier in three positions, respectively, according to another embodiment;

4 is an elevation view of a carrier and tool interface according to another embodiment and FIGS. 4A-4C are enlarged cross sectional views showing a portion of a carrier-tool interface, each showing an interface configuration according to another embodiment;

5A-5C show the carrier-tool interface in three positions in partial elevation of the carrier-tool interface according to another embodiment.

6A-6B are elevation views of a workpiece carrier, respectively, according to another embodiment;

7A-7B show carriers in different positions in elevation of the workpiece carrier according to another embodiment;

8 is another elevation view of a tool interface and a carrier according to another embodiment;

9 is another elevation view of a tool interface and a carrier according to another embodiment;

10 is an elevation view of a carrier and a tool interface according to another embodiment and FIG. 10A is a partial elevation view of a carrier to interface with a processing tool according to another embodiment;

11 is an elevation view of a processing tool section and a carrier to interface in accordance with another embodiment;

12A-12B are front views of the carrier opening and carrier door of the carrier (workpiece transfer) of FIG. 11;

13A-13B are top plan views of the interface of the tool section of FIG. 11 and the tool-carrier door interface;

14 is an elevation view of a processing tool and a carrier to interface according to another embodiment;

15 is an elevation view of a tool interface and a carrier according to another embodiment;

16A-16B are elevation views of a tool interface and a carrier shown at two different locations in accordance with another embodiment;

17 is a side view of a carrier and FIGS. 17A-17C are an elevation view of a carrier and tool interface and a plan view of the tool interface according to another embodiment;

18-19 are elevation views of a tool interface and a carrier according to another embodiment;

20 is a plan view of a transport system according to another embodiment;

20A-20B are partial plan views of the transport system track portion of FIG. 10, and FIGS. 20C-20D are front views of another payload of the transport system according to another embodiment;

21 is a partial plan view of a portion of a transport system according to another embodiment;

22-24 are partial plan views of a portion of a transport system according to another embodiment;

25A-25B are elevation views of a transfer system and a processing tool, respectively, according to another embodiment;

26A-26B are elevation views of a transmission interface system for carrier transmission between a transport system and a tool, respectively, according to another embodiment;

27 is a partial elevation view of a transfer system according to another embodiment and FIGS. 27A-27B are a partial elevation view of a transfer system viewed from another position;

28 is an elevation view of a transport system according to another embodiment;

29A-29B are top views of a transfer system according to another embodiment;

29C is a top view of a transfer system and a processing tool according to another embodiment;

30 is a partial elevation view of the transfer system and processing tool of FIG. 29C;

31 is another partial elevation view of a transfer system;

32 is a partial elevation view of a transport system according to another embodiment;

33-34 are plan and elevation views, respectively, of a transport system according to another embodiment;

35 is another top view of a transport system according to another embodiment;

36A-36C are bottom perspective, elevation and front views, respectively, of a transfer element according to another embodiment;

36D is another front view of a transfer element according to another embodiment;

36E is a cross sectional view of a portion of a standard dynamic coupling;

37A-37D are perspective, cross-sectional and side elevation, and top plan views, respectively, of a tool loading station according to an embodiment;

37E is a top view of another tool load station according to another embodiment;

37F is a top view of another tool load station, according to another embodiment;

37G is also a top view of another tool load station according to another embodiment;

38A-38C are graphical flow diagrams illustrating different processes, respectively, in accordance with different embodiments;

39 is a cross sectional view of a tool load station according to another embodiment;

40A-40D are cross sectional views of substrate supports, respectively, according to another embodiment;

41, 41A-41B are a perspective view, a top elevation view and a top plan view, respectively, of a process system according to yet another embodiment;

FIG. 42 is an exploded perspective view of the system section of FIG. 41; FIG.

42A-42B are partial perspective views of a carrier viewed from different sections and different positions of the transport system of FIG. 41, respectively, and FIGS. 42C-42D are a perspective and top plan view, respectively, of the carrier gripper section of the transport system of FIG. 41;

43-47 are structural diagrams illustrating a selectable system arrangement according to another embodiment;

48 is an elevation view of a system according to another embodiment;

49 is a partial perspective view of a system according to another embodiment;

50 is another top view of a processing system according to another embodiment;

51 is a plan view of a transport system according to another embodiment;

51A is a graph showing the relationship between lot size and feed rate.

52-52A are partial plan views each showing a portion of a transport system according to another embodiment;

52B is a partial plan view of a transfer system according to another embodiment;

53 is a plan view of a transport vehicle for the transport system of FIG. 51,

54 is a cross-sectional elevation view of a transport system according to another embodiment.

55 is also a front elevational view of a transport system according to another embodiment.

55A-55D are partial side perspective views, respectively, of a transfer system, a partial plan view of a transfer system showing a carrier to be transferred by a transfer system, and a side elevation view of an interface portion of the transfer system, viewed from another position.

56-56A are plan and elevation elevation views, respectively, of a transfer system according to yet another embodiment.

FIG. 57 is an elevation view of a carrier according to another embodiment, and FIG. 57A is a partial structural view showing a portion of a carrier door interface.

58 is another elevation view of a carrier according to another embodiment;

59A-59D are cross sectional views of a carrier / load port interface, respectively, according to another embodiment;

60-62 are partial cross sectional views of the carrier and load port viewed from three different positions of the carrier and load port;

63 is a partial cross sectional view of another carrier / load port interface according to another embodiment;

64A-E are cross-sectional views of a carrier / load port interface, respectively, according to another embodiment.

Example Method Description

In FIG. 1 the workpiece carrier 200 defines a chamber 202 in which the workpiece S can move in an environment isolated from the outside of the chamber. The shape of the carrier 200 of FIG. 1 is just one example and may have a different shape according to the embodiment. The carrier 200 may accommodate the cassette 210 for supporting the workpiece (S) carried in the carrier as shown in the chamber. Cassette 210 generally has an elongated support 210S (in the embodiment there are two), and the workpiece support shelf 210V is arranged on the elongated support 210S to support the workpiece or one or more workpieces thereon. The shelves holding each of them form a row (or stack). The cassette is mounted or attached to the carrier structure as will be described in detail below. In some embodiments, there may be no cassette in the carrier and the workpiece support may be integrally manufactured as part of the carrier structure. Workpieces are marked with flat / substrate elements such as 350 mm, 300 mm, 200 mm or semiconductor wafers of the desired size and shape, reticles / masks or flat plates for displays or other suitable items. The carrier can be reduced to a carrier with a smaller lot size than a conventional 13 or 25 wafer carrier. The carrier may be configured to move a small lot with only one workpiece, or may be configured to move a lot with fewer than ten workpieces. Suitable examples of reduced carriers of similar capacity to carrier 200 are described in US Patent Application No. 11 / 207,231, filed 8/19/2005, entitled "Reduced Capacity Carrier and Method of Use." And are incorporated herein by reference in their entirety. Suitable examples of interfaces between a carrier similar to carrier 200 and processing tools (eg, semiconductor fabrication tools, stockers, sorters, etc.) and transfer systems are described. US Patent Application No. 11 / 210,918, filed 8/23/05, titled "Elevator Bases Tool Loading and Buffering System" and Application No. 11 / 211,236, filed 8/24/05, The title “Transportation System.” Both patents are hereby incorporated by reference in their entirety. Another suitable example of a carrier having properties similar to carrier 200 is a US patent. 10 / 697,528, filed 10/30/03, entitled “Automated Material Handling System,” which is also incorporated herein by reference in its entirety. Similar in size to carrier 200 Reduced carriers can transfer workpieces that make up a small lot immediately (as soon as processing is completed at that workstation) to the next workstation in the FAB without having to wait for other workpieces to finish, such as in a large lot. Although the characteristics of the embodiment are described with specific reference to a low capacity carrier, the characteristics of the embodiment apply equally to other carriers that can accommodate 13, 15 or other desired number of workpieces. do.

In the embodiment of FIG. 1, the carrier 200 is designed to stack and hold workpieces vertically (ie, Z-axis). The carrier 200 has a bottom or top open or bottom and top open carrier. In the illustrated embodiment, the top and bottom are arranged along the vertical axis or the Z axis, but in other examples the top and bottom may be arranged along other axes. The top and bottom opening functions are described in detail below, in which the carrier opening 204 (the passage through which workpiece S enters or exits chamber 202 according to the carrier definition) coincides with the plane of the workpiece contained in the carrier (this implementation In this example, it is perpendicular to the Z axis. Carrier 200 will also be discussed below, generally with a casing 212 having a base and a retractable or removable door. When the door is closed, it is locked and the base is sealed. Sealing between the door and the base can isolate the chamber 202 from the outside. The sealed chamber 202 may keep clean air, inert gas, etc. in an isolated state or maintain a vacuum state. Once the door is open, the workpiece can be loaded / unloaded from the carrier. In embodiments, the door may be removable or detachable to open the carrier and access the workpiece / work support shelf. In the embodiment of FIG. 1, there is a concave or hollow portion (hereinafter referred to as a shell) 214 and a wall (cap / cover, etc.) 216 that can contain a workpiece in the casing 212. As detailed below, the wall 216 or the shell 214 act as a carrier door. The engagement of the wall with the shell seals the carrier, and the separation opens the carrier. In an embodiment the shell and wall are metals such as aluminum alloy or stainless steel that have undergone suitable processes. The wall or shell or both are one component (in one piece). Depending on the embodiment, the carrier casing may be made of other materials, including suitable nonmetal materials. Cassette 210 is mounted to wall 216, which in some embodiments may be mounted to a shell. The choice of mounting the cassette to the shell or to the door allows for easy separation of the cassette or the substrate in the cassette from the carrier when the door is opened. In an embodiment the wall 216 is located at the top of the shell, but depending on the embodiment the carrier casing configuration may be at the top of the shell and at the bottom of the wall. In another embodiment, the shell may have removable walls at both top and bottom (eg, carriers with top and bottom openings). In some embodiments, a movable wall may be disposed on the side of the carrier. In an embodiment the door is a passive element (for example, detailed below, but not moving parts or components for opening and closing between the door and the carrier and between the door and the tool interface).

2A, the carrier 200 is disposed at the tool port interface 2010 of a suitable processing tool. The processing tool is one or more process modules, such as a classifier, stocker, or material deposition, lithography, masking, etching, polishing, metrology, tool or load lock capable of processing one or more processes. Or any type of tool with a chamber. The processing tool requires a controlled environment, at least in part, and the tool interface 2010 can load / unload the workpiece between the tool and the carrier 200 without damaging the controlled environment of the tool or carrier 200. In an embodiment, the port interface 2010 generally has a port or opening 2012 through which the substrate is loaded into the processing tool, and the door, cover or separating portion 2014 closes the port. In another embodiment, the portion to be separated blocks some of the opening. In FIG. 2A the port door 2014 is shown in the closed or open position by way of example. As detailed below, in the embodiment of FIG. 2A, the carrier 200 is loaded at the bottom (eg, moves in the Z direction) to interface with the tool port 2012. In FIG. 2A the top wall 216 serves as the door of the carrier 200. For example, the wall 216 is connected to the port door 2014 and is detached at once when the port door is detached and open to the tool port interface. When the wall 216 is detached, the cassette mounted thereon and the workpiece thereon (making the workpiece transport / robot accessible) separate from the carrier. Returning back to FIG. 1, in the configuration of the cassette 210 with the support 210S, access areas 210A and 210B are created on two or more cassette faces (two sides in the embodiment), thereby creating a workpiece robot (see FIG. 2A). The workpiece can be loaded / unloaded into this cassette shelf. According to embodiments, as many workpiece access areas as desired can be made in the carrier. The access regions may be arranged symmetrically around the carrier or in an asymmetrical configuration. In the embodiment of FIG. 2A the tool has two or more workpiece handling robots 2016A, 2016B to access the workpiece V in two or more access areas 210A, 210B. In embodiments, the tool may have several workpiece transfer robots. When the robot accesses the cassette in different directions, the workpiece can be transferred between the cassettes and the robot. In addition, when the robot accesses the workpiece in different directions, the carrier's tool port can be transferred or limit the range of carrier direction when the tool port interfaces. Accordingly, the carrier 200 may interface with the tool interface in two or more directions based on the tool interface. The carrier closes when the port door is returned to the closed position, and the carrier wall 216 returns to position to engage the shell 214.

2B is an interface of tool port interface 2010 'and carrier 200 according to another embodiment. In this embodiment, the shell 214 of the carrier serves as a door. According to an embodiment the shape of the tool port door 2014 'is matched with the carrier shell to surround and seal the shell to prevent the interior of the tool from being exposed to contaminants on the outside of the shell. In an embodiment the carrier 200 is loaded on top (ie, moves in the negative Z direction) as if the carrier descends from the overhead transport system. In order to open the carrier 200, for example, the port door is moved downwards towards the inside of the tool (in the (-) Z direction) while the shell 214 is detached from the carrier. This is referred to as the bottom open carrier because the carrier door (ie shell 214) is located at the bottom and moves down to open the carrier. Opening the carrier exposes the workpiece in the cassette and remains intact with the wall 216. In this embodiment, the robot (similar to the robots 2016A and 2016B in FIG. 2A) moves freely in the Z axis to access vertically arranged cassette shelves or workpieces therein. The robot is equipped with a mapper (not shown). In some embodiments, when the shell is separated from the shell 216, a mapper such as a through beam mapper capable of cassette mapping may be built in the shell 216. 2A-2B show a case in which the carrier 200 is a top open type and a bottom open type. In another embodiment, the shell and wall are in opposite orientation (cells are above the wall), the carrier is similar to FIG. 2B but on the contrary the top is open (ie the shell is raised) and similar to FIG. 2A but in the opposite way It may also be an open type (ie the wall is lowered).

In FIG. 1, the wall 216 and the shell 214 are said to be passive elements without a movable element such as a lock. Moving parts can potentially contaminate clean spaces in tools or containers. For example, walls and shells are magnetically locked together. Magnetic locks, for example, require permanent or electromagnetic elements 226 and 228, or a combination of both in wall 216 and shell 214 to lock or open the walls and shells. The magnetic lock device refers to a reversible magnetic element or the like whose state is switched (open or closed) when electric charge flows through the magnetic element. For example, the wall 216 includes a magnetic element 228 (eg, iron material) and the magnetic switch element 226 acts on the shell 214 to lock or unlock the wall and the shell. In the embodiment of Figures 2A and 2B, the magnetic elements of the wall and the magnet of the shell are configured to interlock with the magnetic lock devices 2028 'and 2026' at the port door interfaces 2010 and 2010 ', thereby forming a carrier door (wall Or lock one of the shells, see FIGS. 2A-2B, to the port door to release the carrier door from the rest of the carrier. Depending on the embodiment, the magnetic lock between the wall and the shell may use a different configuration. In the embodiment of Figure 23, the carrier has a mechanical coupling element 230, such as an actuated pin, a piezo coupling device, or a shape memory device, so that the mating coupling to the port interface. (mating coupling) function 2030 and performs a locking function between the carrier-port interface. In this embodiment, the device is located in the wall portion but may be locked in the shell depending on the embodiment. As in FIG. 24, the active element can be enclosed in a hermetic interface between the separating portion of the wall and the port door to trap particulates resulting from the operation of the internal element. Manual carriers and carrier doors are clean and washable vacuum carriers.

As mentioned earlier, the carrier door and base (ie, wall 216 and shell 224) are sealed to isolate carrier chamber 202. In addition, when the carrier interfaces with the tool port (eg load port module), each of the carrier door and base has a sealing interface for sealing the carrier door to the port door and the carrier base to the port, respectively. In addition, the port door has a sealing interface to the port.

3A-3C show interfacing with tool port 2220 in accordance with an embodiment of carrier 200 ′ similar to carrier 200. Here, the carrier door of each sealing interface 221 'is connected to the carrier, the carrier 222' is connected to the port, the port door 223 'is connected to the port, and the port door 224' is connected to the carrier door. X) form an integrated seal 222 ′ with what is configured (best seen in FIG. 3B). In an embodiment the carrier sealing interface is shown as top open for illustrative purposes, but in other embodiments where the carrier has multiple openings (similar to the opening 204 in FIG. 1, ie, top and bottom opening), the sealing interface is each Is provided for each opening. The general X configuration merely illustrates the structure of the sealing interface surface and in other embodiments the sealing interface surface may be arranged in another suitable form (eg, the sealing interface surface is curved). In general, an X-shaped sealing configuration defines several sealed interfaces (eg, reference numerals 221'-222 ') with zero (0) trapped volume between the interfaces. Thus, opening the sealed interface does not release contaminants into the open space upon opening the sealing interface. In addition, it is also possible to set the desired orientation for the seal depending on the embodiment (ie to orient the seal interface horizontally or vertically in an approximately + pattern). In an embodiment the carrier 200 'is open at the top (the wall 216' is a door that opens up similarly to the embodiment of Figure 2A), and the port 2220 consists of a bottom rod as an example (lifter Lift carrier 220 'up to tool port dock). In this embodiment the shell 214 'has a sealing interface 214I' and the sealing surfaces 221C ', 222C' are usually inclined. Although the sealing surfaces 222C 'and 221C' of the shell are shown flat, in other embodiments the surface is angled or otherwise shaped inward or outward on the sealing surface to enhance the sealing effect even though the surface exhibits an approximately X-shaped sealing configuration. do. The wall 216 'of the carrier of this embodiment is oriented with the sealing interface 216I' (beveled as in the embodiment of Figure 3A) so that the sealing surfaces 221CD ', 224CD' are determined. As shown in FIG. 3A, the shell and wall sealing surfaces 221C 'and 221CD' complement the sealing interface 221 'when the wall and shell are closed, respectively. The surface 221C 'of the carrier interface 214' forms a common wedge and serves as a guide when the wall 216 'rests on the shell (see example 3C). Also in an embodiment the carrier door connected to the carrier sealing interface 221 ′ is arranged in such a way that the weight of the wall 216 ′ can increase the sealing pressure on the interface. In this embodiment, the cassette and the workpiece supported by the wall 216 'more strongly seal the carrier door to the carrier. 3A-3B, sealing surfaces 222C 'and 224CD' are disposed to complement the role of sealing surfaces 222P 'and 224PD' on port 2220 and port door 2214, respectively. 3B is a carrier 200 'docked at port 2220 and seals 221', 224 'are closed. Closing the seals 222 ', 224' blocks and isolates all exposed surfaces (i.e., the outer surfaces of the controlled and isolated chambers inside the carrier or tool) from which contamination may occur from the tool and the carrier interior / chamber. . As shown in FIG. 3B, a typical X-shaped seal 220 'maintains an optimal clean state because it forms a zero lost volume interface state. This means that as mentioned earlier, the sealing structure of the seal 220 'does not create a pocket or space where the outer surface is exposed when the carrier door or port door is opened (ie becomes an inner surface). This is illustrated well in Figure 3C. When the port door 2214 is removed here, the carrier door 216 'is detached so that an unsealed surface or an outer surface is not exposed to the inside of the carrier / processing tool.

As shown in FIG. 3C, in this embodiment the top opening of the carrier door causes the carrier chamber 202 'to be placed under a raised cassette that is supported by the wall 216'. Carrier chamber 202 ′ is connected to the interior of the tool, which has a forced air circulation facility (not shown) to create general turbulence within the carrier chamber. In this embodiment, the air flow circulating in the carrier chamber is made under the workpiece in the raised cassette (hanging on the wall 216 '), so that the circulation is likely to disturb the particle arrangements and away from the workpiece above. Is the minimum level. In the embodiment shown in Figures 3A-3C, the carrier 200 'is raised and connected to the port 2220 and docked to the port 2220 by a suitable lifting device (LD). Since the carrier and lifting device have an appropriate registration feature (LDR), the carrier can be placed on the device and the carrier can be positioned relative to the port. In another embodiment, the carrier is secured to the port in another suitable way. The carrier door 216 'is bitten by the port door 2214 via a magnetic lock, a mechanical interlock (e.g., disposed on a sealed interface between the doors), or a vacuum suction force generated at the sealed interface between the doors, and the like. Lose. The port door 2214 is opened and closed by a suitable device capable of indexing a cassette (similar to the cassette 210 of FIG. 1) passing through a mapping sensor (not shown).

Referring now to FIG. 4, there is shown a carrier 300 according to another embodiment. Carrier 300 is similar to carrier 200 but shell 314 is on top of wall 316 as opposed to carrier 200. Similar to the carrier 200, the carrier 300 may be top open (shell acts as a door) or bottom open (wall acts as a door). In the embodiment shown, there is a core conveying component 300M in the carrier 300. For example, the carrier shell (or wall) 314, 316 has a movable support of a transfer device, such as a roller or air bearing, or a reactive part that can be actuated by a drive or motor, so that the carrier is Can move on its own) For example, FIG. 4 shows a carrier 300 disposed at a load port 3010 (generally similar to port 2010 described above). In the illustrated embodiment, the carrier 300 loads into the port interface from above. The carrier door 316 can be placed (and thus connected) on or adjacent to the port door 3014, and the shell 314 can be connected to the port 3012. In addition, the carrier 300 and port interface may have a three-way, four-way or five-way "cross" type (ie, lossless volume) seal similar to the typical X seal 220 'shown in FIG. 3B. 4A is a cross-sectional view of seal 320 according to one embodiment. Seal 320 is a four-way seal for the bottom opening configuration in this embodiment, but similar to seal 220 'except that.

4B is another cross sectional view showing an interface between a carrier and a port and a seal therebetween according to another embodiment. In this embodiment, the seal 320 'is almost similar to the seal 320. 4B, there are also supporting flanges / parts 326 ', 328' at the shell interface 314I '. In this embodiment the flange 326 'can actuate the wall 316'. For example, a flange overlaps a portion of the carrier door (in the illustrated embodiment this feature determines the door contact surface, but in other embodiments the feature may not contact the door) and the magnetic lock 326M 'is The wall 316 'engages the shell 314' when the carrier door is closed. Also, feature 326 'may overlap with magnetic lock 3040' of port door 3014. The magnetic lock 3040 'of the port door can be operated to pin the wall 316' to the port door 3014 'so that the carrier door can also be removed. The carrier shell feature 326 'is arranged to actuate the port door lock 3040' (ie, the wall 316 'is bitten by the port door), so that the interlocking wall 316' and the shell 314 ' Can be unlocked / deactivated at about the same time. Conversely, closing the port door 3014 'locks the magnetic latch 326M' between the wall 316 'and the shell 314' while the port door lock 3040 'is unlocked / unlocked. In this embodiment, the outer feature 328 'of the shell locates the carrier installed in engagement with the locating / centering feature 3012C' of the port 3010 '. The shape of the outer feature 328 ′ shown in FIG. 4B is just one example, and in other embodiments the carrier may have the desired locating feature. As mentioned earlier, the X configuration of the seal 320 'eliminates the need to purge the seal interface before opening the carrier door. This is because the sealing interface is virtually zero purge volume. In other embodiments (eg, see FIG. 4B), a port may include a purge line 3010A. Purge line 3010A may be at the sealing interface and may be in between. 4C is another cross-sectional view showing a carrier-tool port interface according to another embodiment. The carrier-port interface has a seal 320 " that is generally similar to the seal 320 described above. In this embodiment, the carrier shell 314 " has a support 328 " to support the carrier door (wall) 316 ". Carrier 300 " at the port without loading the port door 3014 " (i.e. without distributing the carrier weight to the port door 3014 "). Can be. The state of sealing the contact of the port door to the carrier door seal 321 " remains almost constant when the carrier door is opened and closed.

5A-5C, it can be seen that a carrier 300A, similar to carrier 300, is bitten in the tool port in accordance with another embodiment. The carrier 300A of this embodiment is of the top open bottom rod type (direction indicated by arrow + z in Fig. 5A). The carrier shell 316A may serve as a carrier door. The sealing interface shown in FIG. 5B (almost zero purge or lossless volume, similar to the seals 320 and 220 described above) can be referred to as a three-way seal, a typical Y configuration (interface 321A (wall-shell)). , An interface 322A (wall-port), and an interface 323A (port 3021A-port door 3014A). In this embodiment, the port door 3014A substantially coincides with the shell 316A. For example, the shell 316A may be nested in the port door 3014A. In this embodiment, the shell 316A and the port door 3014A fit together so that the volume of the interface between them is It is a minimum level A seal (not shown) can be provided between the shell 316A and the port door to seal the interface therebetween, as shown in Fig. 5B, the port door, that is, the port door 3014A of the present embodiment. Port purging port door-carrier door interface volume There is an empty port 3010V.

2A-2B, there is shown a carrier-port interface according to another embodiment configuration. The interfaces 220, 220 'are almost similar to the embodiment shown in Figures 2A, 2B (bottom rod / top open and top rod / bottom open respectively). Sealing interfaces 220 and 220 'are generally "cross", i.e., X configuration (interface 221 (wall 216-shell 214), interface 222 (shell 214-port), interface 223 ) (Port 2012-port door 2014) and interface 224 (port door-wall 216). As shown in Fig. 2A, the sealing interfaces 222, 224 can be arranged in this embodiment almost parallel (i.e. vertically) with respect to the relative direction of movement of the connection surface (e.g., in the carrier rod, the port door can be Closing). In other words, the seal does not close even when the carrier or the carrier door is moved to the closed position. For example, in this embodiment, one or more sealing surfaces constituting the sealing interfaces 222 and 224 are provided with an actuated seal such as an inflatable seal, a piezo actuated seal, a shape memory component, or the like to provide a large frictional contact with the seal interface. Without this, the sealing section can be operated to close the sealing interface. The sealing arrangement described here is just one example.

Referring again to FIG. 1, the carrier shell 214 has an external support 240 for handling the carrier. The support 240 is drawn with a handle in the figure, but may be anything if it is a suitable shape. In this embodiment, the support 240 may be placed at an opposite distance from the shell as desired to optimize the handling stability of the carrier. In other embodiments, the number of supports provided may vary. Referring again to FIG. 6A, the carrier shell 220A may be provided with a perforated or recessed component, membrane or filter 260A adjacent the bottom of the shell. Holes or recesses in the part can be sized and shaped to mitigate or reduce the flow intensity of turbulent or vortices entering the shell when the carrier door is opened. In other embodiments, components that mitigate turbulent or vortex may be placed in other suitable locations on the carrier. In this example the carrier 200A is shown in the shell at the bottom, and in other embodiments the carrier may be at the top. Spaces and / or wings (not shown) to rectify the flow can be further provided inside the tool to maintain very smooth flow / laminar flow over the workpieces placed inside the tool. 6B is a carrier 200B according to another embodiment. The carrier 200B may include a heat regulating device 250 to maintain the workpiece in the chamber at a temperature different from the ambient temperature. For example, a thermoelectric module connected to a workpiece through a cassette support or the like in the carrier shell or walls 214B and 216B can be heated to a higher temperature than the surroundings. If the temperature of the workpiece is higher than the surroundings, particles and water molecules are separated from the workpiece due to thermophoresis, which prevents contamination when the workpiece is outside the carrier or the carrier door is open. In other embodiments, other desired thermal control devices, such as microwave energy, may be used. In another embodiment, an electrostatic field is generated around each of the workpieces to prevent contamination by water molecules and particles.

Referring now to the embodiment of FIGS. 1A-1B, the shelf 210V is stacked on the cassette 210 (see FIG. 1), whereby the workpieces supported by the shelf can be reliably suppressed 360 °. Each shelf 210V may be formed by one or more shelf sheets or supports 210C. As shown in Fig. 1A, in this embodiment, the cassette shelf support can generally be arranged such that the workpiece spans the support. Each shelf 210V has a raised surface to ensure that the workpiece S placed on the shelf does not leave the position. The raised surface is tilted (relative to the vertical) to become a locating guide 210L to find a place to place the workpiece S. The side on which the shelf 210V is placed can be tilted (relative to the bottom of the workpiece) (eg, with a pitch angle of about 1 ° relative to the bottom of the workpiece) to contact the bottom of the workpiece within the boundary area. In another embodiment, the workpiece shelf is suitably configured such that an area for passively restraining the workpiece is created. In another embodiment, no area is created on the lathe to manually define the workpiece.

Turning now to FIGS. 7A-7B, according to another embodiment similar to the carrier 200 shown in FIG. 1, the carrier 200C is shown in a closed position and an open position, respectively. The cassette 210B of this embodiment can adjust the height. When the carrier 200B is closed, the cassette 210B is at its minimum height, and when the carrier door (eg, wall 216B) is opened, the cassette is unfolded to its maximum height. When the cassette is unfolded from the minimum height to the maximum height, the pitch angle between the workpiece / shelf of the cassette increases, so that the height of the carrier is minimum, and the space between the workpieces to be accessed is maximum. In this embodiment, the cassette support 210SB uses a common bellows configuration. The support may be made of aluminum sheet or other suitable material (eg, shape memory material) to have sufficient flexibility without joints. As shown, the top of the cassette support can be supported by the carrier wall 216B. When the top of the carrier is open (removing the wall 216B as shown in Figure 7B) or the bottom is opened (removing the shell 214B similar to that shown in Figure 2B), the cassette (bellows) support 210SB is supported by the force of gravity. It will unfold. Closing the carrier door compresses the cassette bellows. As shown in FIG. 7C, the bellows 210SB has a workpiece support 210VB on which the workpiece is placed. In this embodiment, the shape of the workpiece support 210VB maintains a substantially constant radial position when the bellows is unfolded or folded relative to the adjacent portion 210PB of the bellows. As you might guess, as the bellows cassette is folded, the workpiece of the cassette is securely fixed between the adjacent pleated sections 210PB of the bellows. As you might guess, the upper clamping part abuts the peripheral edge of the workpiece. As shown in FIG. 7B, in the present embodiment, a through beam mapper 2060B or other suitable device is provided on a tool or carrier so that the position of the workpiece S can be determined when the cassette is unfolded. In addition, the workpiece robot (not shown) has a sensor for sensing the position adjacent to the workpiece to properly select the position to hold the workpiece.

As previously mentioned, the passive carrier door and the sealed carrier are suitable for direct connection with a vacuum chamber such as a load lock. FIG. 8 illustrates a direct engagement of carrier 200 '(top open) to port interface 4010 of vacuum chamber 400 (referred to as load lock for convenience) in accordance with another embodiment. The carrier 200 ′ shown in FIG. 8 is generally similar to the carriers 200, 300 described above. In this embodiment, the load lock acts to open and close the port door 4014, thereby opening and closing the carrier door (top wall 216 'in this embodiment) and raising or lowering the cassette 210'. There is an indexer 410 that acts. In this embodiment, the indexer 410 may be configured such that the Z-height of the load lock chamber is low or at a minimum level. For example, the indexer 410 may be disposed along the load lock chamber outside the load lock chamber 400C to lower the overall height of the chamber and the load lock. In this embodiment, the indexer 410 has a drive section 412 and a coupling section 414. In the illustrated embodiment, the drive section 414 has an electromechanical drive arrangement with a motor drive belt or a screw drive to raise or lower the shuttle 416. In this embodiment the coupling section 414 is a magnetic coupling that connects the shuttle 416 of the drive section to the port door 4014. For example, a magnet (permanent magnet or electric magnet) or magnetic material may be placed on the port door to form the inner portion 414I of the magnetic coupling 414. The magnetic portion 414I of the door 4014 may also secure the port door to the port frame 4012. For example, by placing a suitable magnet (similar to magnet 2028 'in FIG. 2B) on the port frame 4012 to work with the magnetic portion / magnet 414I of the port door, the door is in the closed position. And ports can be locked. In this embodiment, the magnetic lock element of the port frame works with the magnetic coupling portion 414I of the door 4014. In other embodiments, the magnetic coupling between the door and the drive and the magnetic lock between the door and the frame can be configured differently as appropriate. As shown in FIG. 8, the drive section 412 is separated from the interior of the chamber 400C by the chamber wall 400W. In another embodiment (see FIGS. 18-19), a linear motor (eg, a linear induction motor) actuates the reactive section 414I 'of the port door 4014' to move the port door. , linear induction moter, LIM). The LIM is external to the chamber wall and separate from the interior of the chamber. In the embodiment shown in FIGS. 18-19, the drive includes a magnetic material section 4122 'or a permanent magnet, fail-safe to lock the port door 4014' to the open position when the chamber is powered off. It becomes a lock. In another embodiment, a suitable accumulator is connected to the drive to provide the necessary control to lower the port door to the closed position. As can be seen in Figures 8 and 18-19, in this embodiment a seal is placed between the port door and the port frame so that the weight of the door assists in sealing the interface.

In the embodiment shown in FIG. 8, the corresponding section 414I of the magnetic coupling can cause the port door 4014 and the carrier door 216 ′ to mesh with each other. For example, the carrier door may have a suitable magnet (eg, permanent magnet) or magnetic material 228 ′ (eg, permanent magnet) disposed to engage the port and carrier door with each other in conjunction with the actuated coupling section 414I (eg, To include an electromagnet or a variable magnetic field magnet). In this embodiment, the operation of the port door is also in accordance with the guide, which is also separated from the chamber. For example, in the illustrated embodiment, the bellows 400B connects the port door to the chamber wall and detaches the port door movement guide 4006 from the chamber. The guide of this embodiment generally has a telescoping section. The telescoping guide is depicted as being made of a hollow cylindrical telescoping section, although other embodiments may be configured in other forms as appropriate. In other embodiments, the indexer may be configured in other forms as desired. For example, as shown in US patent application Ser. No. 10 / 624,987, filed 7/22/03, and incorporated herein by reference in its entirety, an appropriate indexing motor can be placed on the chamber wall and separated from the interior of the chamber to provide a door door. It can be moved while controlling the port door without a mechanical guide. The bellows 400B may be pressurized to help close the port door. The bellows may also include conduit systems such as vacuum lines, power / signal lines connected to the port doors, and the like. In this embodiment, the port door has a port PD10 connected to the vacuum source to form a chamber pump down port as described in detail below.

Referring now to FIG. 9, a carrier 300 ′ in a vacuum chamber 400 ′ according to another embodiment is shown. In the illustrated embodiment, the carrier 300 'is a bottom open carrier (similar to the carrier 300 described above, see FIG. 3). In this embodiment, the port door 4014 'is lowered into the chamber when the chamber is opened. An indexer (not shown) is similar to that shown in FIGS. 8, 18-19 but is arranged to move the port door down. The chamber and port doors have magnetic locks 4028 'and 4026' that engage the closed door to the chamber frame. In this embodiment, the port frame has one or more coil elements 4028 '(which define what is represented by the frame-side portion of the magnetic lock). Coil element (s) 4028 'may be placed in a desired position and generate a magnetic field that acts on door lock component 4026'. The magnetic lock part 4026 'of the door is a permanent magnet or a magnetic material. In this embodiment, the coil element 4028 'is marked as being in a chamber. In other embodiments, the coil element may be outward. The chamber wall is separated inside the chamber. The coil element may be fixed or may be maintained in a constant position relative to the frame. If necessary, the magnetic field strength can be reduced by reducing the magnetic field strength, making the port doors easier to move. In another embodiment, the coil element is mounted and movable in the shuffle of the drive system and forms part of the magnetic coupling between the port door and the indexer. In another embodiment, the magnetic lock is similar to causing the carrier door to be snapped onto the carrier as described above. Permanent magnets or magnetic materials 4026 'of the port door 4014', which are magnetically snapped to the frame, are also coupled to the indexer, similar to that shown in FIG. The chamber of the embodiment shown in FIG. 9 also has a bellows and port door guide similar to that shown in FIG. 8. Applying pressure to the bellows will help to lift the port door up and hold it in the closed position, especially when the carrier door and cassette are placed on the port door. In another embodiment, there may be a bellows without a port door guide in the chamber. A vacuum device can be connected to the port door to cause the chamber pump to descend through the port door-carrier door interface. Thus, as in the embodiment shown in FIG. 8, in this embodiment the chamber pump down port is in the port door.

Referring again to the embodiment of FIG. 8, load lock chamber pump down is performed with the carrier connected to the chamber port and the indexer 410 moving the port door out of the closed position. As can be seen in FIG. 8, pumping down the load lock chamber to the vacuum port PD10 of the port door in this embodiment is carried out via the carrier door 216 ′ -port door 4014 interface. The chamber / carrier gas flow sucked through the carrier door-port door interface creates a negative pressure at the interface to prevent contaminants from entering the chamber accidentally. 10 shows a load lock chamber pump down through port door 5014 according to another embodiment. In this embodiment, the port door-carrier door space 5430 and the carrier chamber 202 are purged before pumping down the load lock chamber. For example, a vacuum may be applied and the port door-port seal 5223 may be cracked (or using an appropriate valve) to allow purge gas to enter the space 5430. The carrier door 216 may be cracked to cause the load lock chamber 5400 gas to enter the carrier or to operate the appropriate valve to purge the carrier 200. For example, the gas supplied from the chamber (dimmed in FIG. 10) may be delivered to the carrier so that the desired gas enters the carrier 200. As shown in FIG. 10A showing the load lock chamber 5400 and the carrier 200 with the port door and carrier door moved to the open position, the load lock chamber 5400 has a vent exposed in the desired shape to the wall of the load lock. (I.e., gas supply) 4550 to vent the load lock chamber. Therefore, in this embodiment, the purge line is used for purging, and the ventilation of the chamber can be performed independently of the carrier door-port door interface.

11 shows a mechanical “failsafe” lock on carrier door 316A and port door 6414 to engage carrier door with carrier 314D and port door to port 6412 or chamber 640D, respectively. An example is shown. Carrier 314D, carrier door 316D, port 6412 and port door 6414 are passive (no clear locking portion). In this embodiment, the indexer can perform both the Z axis indexing of the port door and the rotation of the port door to engage / disengage the lock tabs of the port door and the carrier door. In another embodiment, the Z axis movement and rotation of the port door are each through different drive shafts. 12A-12B show the carrier shell 314D and the carrier door 316D from the bottom, respectively. 13A-13B are top plan views of ports 6412 and port doors 6414 of (load lock) chambers 6400, respectively. In this embodiment, the bottom surface of the carrier shell has a mating tab / surface 360D, which is engaged with a mating surface 362D in the carrier door 316D. Accordingly, the engagement / separation between the engagement surfaces 360D and 362D is made while the carrier door is rotated relative to the carrier 314D. Rotation of the carrier door is transmitted by the port door 6414 as described below. In other embodiments, the engagement surface between the door and the carrier can be configured in any desired form. The carrier door 316D has a female / male torque coupling feature 365D that complements the torque coupling member of the carrier door 6414T. In the illustrated embodiment, the port 6412 and the port door 6414 generally have an interlocking surface, ie a mating surface, similar to the mating features of the carrier and the carrier door. 13A and 13B, the port has a mating surface 6460 (e.g., projecting inward), and the port door 6414 complements the mating surface 6462 and overlaps and engages with the port surface 6460. All. Accordingly, in this embodiment, the engaging surfaces 3600 and 3620 of the carrier and the engaging surfaces 6560 and 6462 of the port are disposed relative to each other so that the port between the carrier and the carrier door and when the port door rotates Simultaneous coupling / disengagement between the door and the port door is possible.

14 shows load lock chamber 400E, indexer 6410E, and carrier 300E. In this embodiment, the indexer is arranged in series in substantially axial direction with the load lock chamber. Similar to the pods 200, 300, 3000, the pod 300E of this embodiment shown in FIG. 4 is a vacuum enabled top / bottom open pod with features similar to those described above. Chamber 6400E is similar to the chamber previously described. 15 shows the load lock chamber and carrier 300F in a reduced pump down volume configuration. In the illustrated embodiment, the carrier door 316F has a door-carrier shell 314F seal at the top 350F and the bottom 321F. Bottom seal 3270F (similar to seal 221) engages shell 314F when the carrier door is closed, as shown in FIG. 15. Top seal 350F seals against the carrier shell when the carrier door is opened (eg, seal 350F is mounted to and seals on carrier sheet surface 351F). The top seal 350F separates the carrier chamber from the load lock chamber, reducing the pump down volume when pumping the load lock chamber into a vacuum.

16A-16B are carrier 300G and load lock chamber 6400G in docked and undocked positions, respectively, according to another embodiment. The carrier 300G has a bottom wall 316G, an annular section 314G and a top wall 314PD. In this embodiment, the annular section 314G or one or more portions of the section serve as a carrier door. The top and bottom walls 316G and 314PD are fixed together, and the moving section 314G defining the door area has seals 350G and 321G at the top and bottom. The seal seals the top wall and the bottom wall 316G and 314PD, respectively. There is an open port 6402G in the load lock chamber 6400G. As shown in FIG. 16B, the carrier 300G enters the load lock chamber through the port. Since the load lock chamber 6400G has a recess 6070G, the carrier door 314G can be lowered to open carrier access. Top wall 314PD of the carrier seals the load lock chamber port. Thus, the load lock chamber is sealed to enable pump down operation of the chamber. An appropriate elevator is provided to raise and lower the carrier door 314G. 17-17C show another top seal carrier 300H and load lock chamber 6400H according to another embodiment. The carrier 300H has a top seal flange 314H and side openings 304H (along the carrier edges to allow load / unload of the workpiece). In this embodiment, the carrier top sealing flange 314H is installed and sealed on the rim 6412H of the chamber port as shown in FIG. 17B. The carrier door 314DR is opened by outward radial and rotational movements. The movement is indicated by arrow O in FIG. 17C. The carrier opening is aligned with the slot valve of the load lock chamber. Although the load lock chamber has been specifically described in describing the present embodiment, the features described apply equally to the load port chamber as shown in FIG. 18. Inside the load port chamber there is a controlled atmosphere, but cannot be isolated.

29A and 29B, top views of automatic material handling systems 10 and 10 'in accordance with other implementations are shown. For example, the automated material handling systems shown in FIGS. 29A and 29B generally include one or more in-bay transfer system sections 15, one or more in-bay transfer system sections 20, bay queue sections 35, and transfer siding. Or shunt section 25 and workpiece carrier or conveying equipment. The terms 'intrabay' and 'interbay' are for convenience only and do not limit the placement of the transport system (10, 10) (the term 'liver' is generally used here). Refers to a section containing a number of groups, and the term 'my' generally refers to a section used within a group). The transfer system sections 15, 20, 25, 35 can overlap together (i.e., one transfer loop can be placed within another transfer loop), and typically a semiconductor workpiece (e.g. 200 mm wafer) within the processing facility. , 300 mm wafers, flat display panels and the like) and / or carriers are arranged to transfer at high speed between the processing bay 45 and the associated processing tool 30. In other embodiments, all suitable materials may be delivered to an automated material handling system. The transfer system 10 allows the workpiece to be redirected from one transfer section to another. An example of an interbay portion and an inbay portion within an automated material handling system for conveying a workpiece is described in US Patent Application No. 10 entitled "Automated Material Handling System", which is incorporated herein by reference in its entirety. / 697,528.

The configuration of the automatic material handling systems 10, 10 'shown in Figures 29A and 29B is an example of a typical configuration, and the automatic material handling systems 10, 10' are arranged in any suitable configuration to enable processing bays and / or at processing facilities. It can accommodate any desired layout of processing tools. As can be seen in FIG. 29A, in this embodiment the interbay transfer sections 15 are arranged on one or more sides of each other and connected to each other by any number of transfer sections 20 corresponding to one or more processing bays 45. do. In other embodiments, the outer or lateral transfer section is an intra bay section, with sections moving between them connect the intra bay section to a processing tool group or array within the bay. In this embodiment, the interbay transfer section 15 of FIG. 29A is connected by a cross shunt 50 so that the workpiece transfer device is between the interbay transfer sections 15 without passing through the processing or FAB bay 45. You can go directly from In another embodiment, the transfer sections 15 are connected to each other with additional in-bay transfer sections (not shown). In other embodiments, such as those shown in FIG. 29B, the interbay transfer section 15 is disposed between any number of processing bays 45, so that a general center point, i.e., between the branch sections used in the bays or tool groups 45, It becomes the transfer center passage. In another embodiment, the in-bay transfer section is a boundary surrounding any number of processing bays 45. In yet another embodiment, there may be any number of nested loop sections for N systems. For example, as shown in FIGS. 29A and 29B, the system 10 or 10 'is generally connected in parallel by a transfer section, with the transfer sections connected directly to each interbay transfer section 15. In yet another embodiment, the transfer sections 15, 20 and processing tools can be arbitrarily configured appropriately. In addition, any number of in-bay / bayan systems can be connected together in any suitable configuration to form a nested processing arrangement.

For example, the interbay transfer section 15 may be a modular track system for moving any suitable workpiece transfer device. Each module of the track system is equipped with suitable engagement means (e.g. interlocking facets, mechanical fasteners) so that the modules can be perfectly coupled to each other during installation of the in-bay transfer section 15. Rail modules can be provided in any suitable length (for example, a few feet) or in any suitable form of straight or curved lines, making them easy to handle and flexible in installation. The track system may support the workpiece transport device from below, or in other embodiments, make the track system a suspended system. The track system has roller bearings or other suitable bearing surfaces, allowing the workpiece transporter to move along the track without being subjected to large resistances on the rollers. The roller bearings are tapered or bent inwardly into curves or corners to increase directional stability as the workpiece container moves along the track.

In-bay conveying section 15 is a conveyor conveying system, a conveying system using cables and pulleys or chains and sprockets, a wheel driven system or a magnetic induction conveying system. The motor used to drive the conveying system is any suitable linear motor with unlimited movement capable of moving the workpiece container along the conveying section 15 in the bay. Linear motors are solid state motors with no moving parts. For example, the linear motor is a brushed or brushless AC / DC motor, a linear induction motor or a linear stepper motor. The linear motor may be embedded in the in-bay transfer section 15 or in the workpiece transfer device or the container itself. In other embodiments, suitable drive means for driving the workpiece transfer device via the in-bay transfer system may be incorporated. In yet another embodiment, the in-bay transport system may be a passageway for a trackless autonomous transport vehicle.

As will be described below, in the bay transfer section 15, the workpiece transfer device can be moved or flowed at high speed without interruption, generally along the path of the bay bay transfer section 15 using queue sections and shunts. This is an advantage over existing transfer systems that require material flow to stop when adding or removing transfer vessels in the transfer line.

As mentioned above, in this embodiment, the intrabay transfer section 20 determines the area of the processing bay or FAB bay 45 and is connected to the interbay transfer section 15 via the queue section 35. The queue section 35 is disposed on either side of the interbay / inbay transfer section 15, 20, and the material flow in the interbay transfer section 15 or the material flow in the inbay transfer section 20. Allow the workpiece or workpiece container to enter and exit the in-bay transfer section 20 without interrupting or slowing down. In the embodiment, the queue section 35 is drawn as a section independent of the transport sections 15, 20. In the present embodiment, the queue path between the queue section or transfer sections 15, 20 constitutes an important part of the transfer section, but it delimits the individual queue transfer paths between the transfer sections. In other embodiments, queues may be placed in the interbay and intrabay sections as desired. An example in which a transfer system has a moving track and an access track and a queue track that can selectively turn on / off access of the moving track without damaging the moving track is referred to herein as a "transport system", which is hereby incorporated by reference in its entirety. US Patent Application No. 11 / 211,236 entitled (Transportation System). In-bay transfer section 20 and queue section 35 have a track system that is nearly similar to that described above for inter-bay transfer section 15. In another embodiment, the queue section connecting the in-bay transfer section and the in-bay / inter-bay transfer section may use any suitable configuration, shape, shape and may be driven in any suitable manner. As shown in FIG. 29A, in the present embodiment, the queue section 35 includes an input section 35A and an output section 35B corresponding to the moving directions R1 and R2 of the in-bay and inter-bay transfer sections 20 and 15. There is. The rule used as an example here defines section 35A as the input of section 20 (outlet of section 15) and section 35B as the outlet / output of section 20 (input of section 15). define. In other embodiments, the direction of movement of the queue section can be determined as desired. As will be described in more detail below, the workpiece container exits the interbay transfer section 15 through the input section 35A and enters the interbay transfer section 15 through the output section 35B. The queue section 35 is of a suitable length to turn the transfer sections 15, 20 on and off to withdraw or put in the workpiece transfer device.

In-bay transfer section 20 may be expanded in the passageway to connect any number of process tools 30 to transfer system 10, 10 ′. In-bay transfer section 20 may also connect two or more inter-bay transfer sections 15 to each other as shown in FIG. 29A and as described above. In-bay transfer section 20 is depicted in the form of a closed loop in FIGS. 29A and 29B, but in other embodiments may be of any configuration or shape suitable and may be modified to suit any manufacturing facility layout. In this embodiment, the in-bay transfer section 20 may be connected to the process tool 30 via a transfer siding or shunt 25 similar to the queue section 24. In other embodiments, the shunt may be provided in a similar manner to the interbay transfer section. The shunt 25 is effective to make the workpiece conveying device "offline" and the input section 25A and the output section 25B along the direction of travel R2 of the interbay transfer section 20 as shown in Figure 29A. have. The shunt 25 allows the workpiece transfer device to enter or exit the in-bay transfer section 20 through the input / output sections 25A and 25B, and within the in-bay transfer section 20, Do not interrupt the flow of constant velocity. In the shunt 25, the workpiece container may stop at the tool interface station corresponding to the position of the process tool station 30, thus loading the process tool and / or the container through the machine front end module, sorter or other suitable transfer robot. It may be transferred to a port or other suitable workpiece staging area. In another embodiment, the workpiece conveying device may be sent to a desired shunt to reorder (ie, reset) the conveying device order of the designated conveying section.

Switching between the workpiece carrier or the conveying device between the sections 15, 20, 25, 35 can be controlled by a guidance system (not shown) connected to a controller (not shown). The guidance system includes a positioning device capable of determining the position of the conveying device moving along the sections 15, 20, 25, 35. Positioning devices are suitable types such as continuous devices or distributed devices (eg optical, magnetic, bar codes, standard strips) and the like, and are used throughout the sections 15, 20, 25, 35. The controller reads or verifies the distributed device with an appropriate reading device in the conveying device so that the controller can determine the position of the conveying device and the movement state of the conveying device in sections 15, 20, 25, 35. Alternatively, the device may detect and / or verify sensing information, such as RFID (Radio Frequency Identification Device), in the transfer device, workpiece carrier or workpiece to identify the location / movement information. Positioning devices are independent or distributed by independent positioning devices (e.g. laser lasing devices, ultrasonic ranging devices, built-in positioning systems similar to built-in GPS, built-in reverse GPS) capable of detecting the position of the transporting device in motion It is included in the form of a combined device. The controller combines the information sent by the guidance system with the position feedback information sent by the conveying device to follow sections 15, 20, 25, 35 to identify and maintain the conveying path of the conveying device therebetween.

In other embodiments, the guide system includes grooves, rails, tracks, or other suitable structures that form a structural or mechanical guide surface in connection with the mechanical guide features of the workpiece conveying device. In another embodiment, an appropriate electromagnetic signal sensed by an electrical wire (eg, a suitable guidance system of the transfer device) such as a printed strip or conductor that electronically guides the workpiece transfer device to sections 15, 20, 25 and 35. Electric wire sending) is included.

Referring now again to FIGS. 29A and 29B, an operational embodiment of the transfer system 10, 10 ′ is described. The workpiece container in the shunt 25 enters the conveying system 10, 10 ′. The workpiece container accesses the interbay transfer section 20 through the shunt 25 in order to maintain the flow of the intrabay transfer section 20 which is almost uninterrupted and moves at a substantially constant speed. The workpiece conveying device is accelerated in the shunt 25 so that the conveying device moves at the same speed as the material flow in the conveying section 20 in the bay. The shunt 25 allows the workpiece conveying device to be accelerated so that the conveying device joins the flow of the in-bay conveying section 20 and with other conveying devices that obstruct the flow or move within the inter-bay conveying section 20. There is no conflict. The workpiece conveying device joined with the intrabay transfer section 20 waits at the shunt 25 for a suitable time to freely join the flow of the intrabay transfer section and collides with or passes through the other workpiece carriers or transfer devices. Does not reduce the speed of the transfer device. For example, the workpiece conveying device travels to the output queue area or section 35B at an exact path with an almost constant speed and switch along the intrabay transfer section 20 to switch to the interbay section 15. In one embodiment, if there is no space in the output queue section 35B, the transfer device continues to move around the in-bay transfer device section 20 until an available output queue section 35B emerges. In another embodiment, a cross shunt is provided that connects the opposite path of travel of the transfer section so that the transfer device can switch between transfer paths to return to the bypass station without following the entire loop of the transfer section. The conveying device waits in the bay output queue section 35B for a suitable time and then accelerates in a manner substantially similar to the merging described above for the conveying section 20 in the bay, leading to a generally constant speed of interbay conveying section 15. To join. For example, the transfer device may go along the interbay transfer section 15 to a predetermined bay at a generally continuous speed and then switch to the connected queue input section 35A to enter the desired intrabay section 20. In one embodiment, if there is no space in the input queue section 35A, the transport continues to move around the in-bay transport section 15 until an available input queue section 35A emerges in a manner similar to that described above. do. The transfer device waits in the input queue section 35A for an appropriate time and then accelerates to join the other in-bay transfer section 20 so that the second in-bay transfer section 20 can maintain a continuous flow at a constant speed. have. The conveying device exits its second in-bay conveying section 20 to the conveying shunt 25 and connects to the process tool 30. If there is no other space for use in the shunt 25 and there is no space for use, the transport device continues to move along the in-bay transfer section 20 with a right of passage until the shunt 25 is available. Because the material flow in the interbay transfer section 15 and the intrabay transfer section 20 travels at substantially constant speed with little interruption, the system maintains high throughput of the workpiece transfer device between the processing bay and the processing tool. Can be.

In the embodiment shown in FIG. 29A, the transfer device is provided between the processing bays via an extension 20 that directly connects the queue section 35, the processing tool, the in-bay transfer section 20, or the inter-bay transfer section 15 together. Move directly. For example, as shown in FIGS. 29A and 29B, the extension 40 connects the queue sections 35 together. In another embodiment, the transfer shunt (similar to shunt 25) of each tool, which is extension 30, can be linked together to allow one processing tool to access another process tool. In yet another embodiment, the extension may directly connect together any number of elements or combinations of elements in an automated material handling system to provide a short access path. In larger overlapped networks, shorter paths between the destinations of the transport device made by extension 40 can be used to shorten the travel time of the transport device and increase the productivity of the system.

In another embodiment, the flow of automatic material handling systems 10, 10 'is bidirectional. The conveying sections 15, 20, 25, 35, 40 and 50 are arranged side by side parallel lanes moving in opposite directions, respectively, and loops are formed by connecting the moving lanes in opposite directions in the exit ramp and the entrance ramp. Each parallel lane of the conveying section is dedicated to the designated direction of travel and can be switched individually or simultaneously, so that the movement of each of the corresponding parallel lanes is reversed according to the conveying algorithm in accordance with the conveying device loading conditions. For example, the flow of material or conveying device along the parallel lanes of the conveying sections 15, 20, 25, 35, 40, 50 flows in that direction. However, if some workpiece transfer devices in the facility are later expected to move along parallel lanes in the opposite direction of the current flow direction to a more efficient location, the direction of travel of the parallel lanes is reversed.

In this embodiment, bidirectional moving lanes are arranged in a stack (ie, stacked). The interface between the process tool and the transfer shunt 25 is of an elevator configuration, so that the transfer device can be raised or lowered from the shunt to the process tool load port. For example, a shunt in which the material flow is clockwise can be placed above the shunt in which the material flow is counterclockwise. In other embodiments, bidirectional shunts and other transfer sections may use any suitable configuration.

20 is a portion of a transport system track 500. This part is used to transfer the carrier between tool stations according to another embodiment. The track uses a solid state conveyor system. The system is similar to that described in US Patent Application No. 10 / 697,528, which is incorporated herein by reference in its entirety. The track has a stationary forcer segment associated with the reactive portion that is important for the carrier shell / casing. This allows the conveyor to transfer the carrier directly. The transport system 500 shown is an asynchronous transport system in which carrier transport is substantially separated from the operation of other carriers in the transport system. The track system is configured to eliminate the decisive factors affecting the conveying speed of a given carrier due to the action of other carriers. Conveyor track 500 uses the main transport path and is used to move the carrier off the main transport path without affecting the transport device in the main transport path to effect routing changes or connect with tool stations (buffers, sprockets, etc.). There is also an on / off branch path (see Figures 297-298). Suitable examples of transfer systems with branch on / off paths are described in US patent application Ser. No. 11 / 211,236, which is incorporated herein by reference in its entirety. In this embodiment, segments 500A, C, and D have winding sets for the A1-D linear motors that make them move along the main travel path 500M (this is shown in FIG. 20A). Segment 500B is shown in FIG. 20 as off / exit of what is referred to as access path 500S. The windings of the segment's forcers are arranged to be virtually 2-D plane motors so they may travel along the main path 500M and, if necessary, move the carrier along the path 500S (see FIG. 20B). . The motor controller is a zoned controller similar to the distributed control architecture described in US patent application Ser. No. 11 / 178,615, filed 7/11/05, which is hereby incorporated by reference in its entirety. In this embodiment, the drive / motor is divided into zones so that the zone controller appropriately in charge of each zone can control it efficiently. The conveyor 500 has a suitable bearing capable of supporting the carrier while moving. For example, there are bearings in segments 500A, 500C, and 500D (eg, there is a 1 degree of freedom for the carrier to move along path 500M if there are rollers, ball bearings).

The bearing of the segment 500b has two degrees of freedom of carrier dml movement. In another embodiment, a bearing is provided to the carrier. In another embodiment, air bearings are used to support the carrier moving on the track. Guiding the carrier between the paths 500M and orienting in the path 500S can be accomplished by a suitable guidance system, such as the steering or adjusting wheels of the carrier, the adjustable guide rails, the magnetic steering device, etc., as shown in FIG. 20B. In charge.

20A shows the transfer component 500A of the system 500 used in the embodiment. The illustrated embodiment is a segment with a single moving lane or path (eg, path 500M). In the embodiment shown in FIG. 20A, the segment has a support surface 504A for supporting movement of the linear motor portion or the forcer 502A and the transfer device. As mentioned above, in other embodiments, the transport segment may be configured in any other form desired. In this embodiment, the guide rail 506A is used to guide the conveying apparatus. In another embodiment, the transfer segment has a magnet or a magnetic bearing instead of a rail for the transfer guide. The electromagnet of the carrier can be used to assist in separating the carrier from the track. 20B is another transfer segment of the transfer system 500 according to another embodiment. Segment 500A 'has a number of moving lanes (e.g., cross lanes similar to segment 500B in Figure 20) or nearly parallel primary moving lanes (similar to path 500M) that are switched to each other. There is this. In the embodiment shown in FIG. 20B, the moving lanes (similar to paths 500M, 500S) are generally defined by the 1-D motor section 502A1 and the corresponding carrier motif support surface / area 504A '. . The intersection or turning point between the moving lanes is formed by an arrangement of 2-D motor elements capable of generating the 2-D forces required to move between the moving lanes 500M ', 500S' in the transfer device.

21 is an intersection or diverting segment of a conveyor conveying system according to another embodiment. In the illustrated embodiment, a number of moving lanes 500M ", 500S" intersecting are defined according to the transport segment 500A ". The moving lanes are generally similar to lane 500M (see Figure 20A). In an embodiment, a traversing vehicle generally traverses a given lane 500S ", 500S" until it is in line with the crossing lane. When paralleled, the 1-D motor of the desired lane moves the traversing device along the crossing lane. In another embodiment, the direction of the intersection is not set to 90 ° Figure 20C is the reactive elements at and below the carrier 1200. The reactive elements coincide with the direction of the corresponding forcer section of the intersection. (See Fig. 21) so that the carrier can change the track without actually stopping at the intersection. 22 is a track segment 500H ", which is a side track storage location 500S". This is generally similar to the intersection shown in Figure 21. Figures 23-23A show a track segment 500. Cutout or opening 1500 for the lift arm of the carrier lift or shuffle, which is described in detail below.In this embodiment, the opening 1500 allows the carrier to be selected at the bottom of the conveyor track. The carrier may be accessed laterally to make reference to Fig. 24 is a track segment 2500A and a forcer 2502A (eg a linear motor) is off the carrier / track centerline indicated by arrow 2500M.

25A-25B are linear motor conveyors 3500 (grounded forcer segments and reactive elements embedded within carrier 3200) used to transfer substrates within semiconductor FABs. In the illustrated embodiment, the conveyor 3500 is inverted as shown (ie, the carrier hangs on the conveyor and is below the conveyor), allowing the carrier to be accessed directly below. Otherwise, the conveyor 3500 is similar to the transport system segments 500A, 500A ", 500A" 'as described above. In this embodiment, a magnetic retention forcer 3502 is used to maintain the connection between the conveyor 3500 and the carrier 3200. This force comes from a linear motor coil (for example in the case of a linear synchronous design) and / or is generated through separate electromagnets and / or permanent magnets (not shown) specially prepared for that purpose. Connecting the carrier to the conveyor and disconnecting it is quick and can be done without the use of moving parts (eg electromagnetic switches). Failsafe operation is ensured through the flow path between the carrier and the conveyor and / or passive mechanical retention features.

In this embodiment, the intersection point and the branch point (for example, the junction-branch point similar to the segment 500b of FIG. 20) may be implemented by coil switching. In another embodiment, a turntable or other routing device is used to transfer the carrier between the travel paths of the conveyor 3200.

In this embodiment, the carrier 3200 is positioned so that the reaction element is at the top and the substrate is accessed at the bottom of the carrier. In this embodiment, the carrier 3200 has a magnetic platen arranged to engage the forcer of the conveyor 3500. The carrier platen (ie platen section) includes rollers, bearings or other motif support surfaces (eg reaction surfaces for the air bearings of the conveyor). The platen includes an electro-magnetic coupling to separate the vessel portion of the carrier from the platen portion. The coupling remains connected to the conveyor even when the workpiece container portion is loaded into the processing tool 3030.

In this embodiment, the conveyor 3200 places a carrier in the tool load port to load the tool, and the carrier is mounted at the height of the conveyor using a dedicated vertical transfer mechanism 3040 (see FIGS. 26A-26B). Lower the load interface 3302 to 3030 (which is a controlled environment). In addition, the vertical transfer device is used to position the wafer for access by the wafer handling robot. Suitable examples of vertical conveying devices are described in US patent application Ser. No. 11 / 210,918, filed 3/25/05. This patent is incorporated herein by reference in its entirety and above.

 In another embodiment, an electric wheel accumulating conveyor with sufficient magnetic force to hold the carrier on the conveyor wheel may be used in the reverse direction. In another embodiment, the general arrangement is reversed so that the conveyor is under the load port, placing the reactive features on top of the carrier.

26A-26B are another example of directly lowering and lifting the carrier from the transfer system to the load port / tool interface. The embodiments shown in FIGS. 26A-26B use an important reactive platen of the carrier. In another embodiment, as mentioned above, the platen can be removed from the carrier, so that it can still be connected to the conveyor even with the carrier removed. In that case, each platen of the transfer system corresponds with the carrier of the FAB in a nearly 1: 1 relationship.

27 is a carrier 4200 using a conveyor vehicle hybrid configuration according to another embodiment. A carrier vehicle 4200 may also be provided for payload automatic delivery (eg, a carrier carrying a semiconductor foundation). The vehicle can be equipped with self-propelled stored energy, steering systems, at least one electric drive wheel, mileage and obstacle sensing sensors, and associated control electronics. In addition, one or more reactive elements (similar to the magnetic platen described above) that interlock with the stationary linear motor forcer segment of the conveyor 4500 similar to the conveyor system can be mounted in the vehicle (see FIG. 20).

In this embodiment, when the vehicle 4200 moves along a path (similar to the paths 500M and 500J) defined by one or more forcer segments, the drive motor can be detached from the drive wheels and the conveyor 4500 Electromagnetic coupling with responsive elements allows manual propulsion of the vehicle along the path. If a stored energy device (eg, battery, ultracapacitor, flywheel, etc.) needs to be charged in the vehicle, the traction wheel moving along the guideway can be used to convert the energy of the linear motor into the vehicle storage device. In the case of electrical energy storage devices, this can be done by reconnecting the vehicle drive motor used as a generator with the appropriate monitoring and conditioning electronics. Such "real-time" charging has the advantage of being simple and robust, and such a configuration has considerable flexibility and fault tolerance. For example, vehicle 4200 can automatically pass through a broken conveyor segment, bypass an obstacle, or pass through a work area that does not use a conveyor (see FIGS. 27A, 27B). The number and length of conveyor forcer segments can be adjusted to the same behavior as the conveyor between bays, using autonomous vehicle movement in the bay. Self-adjusting steering is used for flexible path selection. Self-adjusting cornering can also be used to eliminate curved forcer segments. It can move at high speeds along the path of the conveyor and, if desired, can protect workers with safety barriers at high speeds. Long sections (eg links to adjacent FABs) can be used with conveyor sections. Conveyors can be used to change grades to alleviate the problems experienced by vehicles using dedicated storage energy.

28 is another example of an integrated carrier / transport vehicle. In contrast to conventional vehicular semiconductor automation that sends vehicles to transport workpiece carriers within the FAB, each carrier 5200 is a vehicle in this embodiment. The integrated carrier / vehicle 5200 of this embodiment is similar to the vehicle 4200 described above. In other embodiments, the carrier vehicle may include desired vehicle features. In this embodiment, the vehicle 5200 includes a carrier portion 5202 and a vehicle portion 5204 which are essential elements. For reference, the carrier 5202 is depicted as a front / side opening in FIG. 28. In other embodiments, the carrier may be top open or may provide other suitable workpiece transfer openings. The vehicle can be driven directly to the load port where the workpiece must be transported, or other automation components such as tool buffers can be engaged with the vehicle. The permanent permanent fixation of the carrier 5202 and the vehicle 5204 will result in no waiting time for empty vehicles to be sent if lot transfer is required, and no associated delivery time deviations. In addition, the use of the carrier vehicle 5200 does not move the "empty vehicle", thereby reducing the total amount of transport in the transport network, thereby improving system capacity. In other embodiments, the carrier and the vehicle may have couplings to separate the carrier and the vehicle. The vehicle in the system can be assigned a one-to-one relationship with the carrier to eliminate delays caused by the carrier transport waiting for the vehicle, but in limited situations (eg maintenance / maintenance or vehicle or workpiece carrier sections), It can also be separated using system information. In addition, carriers and vehicles are still essential devices during transport or when engaged with tool load stations or other FAB automation components.

29C is a top view of a horizontally arranged buffering system 6000 connecting between the conveyor 500 (or other desired carrier transport system) and the tool station 1000 according to another embodiment. The buffering system may be located below or above the tool station. The buffering system can be located separate from the operator's access route (ie, below or above). 30 is an elevation view of a buffering system. For example, FIGS. 29C-30 are buffering systems disposed beside one side of the conveyor 500. You can extend the buffering system to cover as much of the FAB floor as you want. In the illustrated embodiment, the worker passage is raised above the buffering system. Similarly, the buffering system can be extended up anywhere in the FAB. In the embodiment of Figures 29C-30, the buffering system 6000 includes an arrangement of a shuttle system 6100 (with appropriate carrier lift or indexer) and buffer station ST capable of at least 3-D movement. . Shuttle systems generally include a guide system (eg a rail) for one or more shuttles 6104 capable of at least 2-D traversal through the guide system. The shuttle system arrangement shown in FIGS. 29C-30 is just one example and in other embodiments the shuttle system may be arranged in any other form desired. In this embodiment, the shuttle system sequentially switches or connects between the conveyor 500, the buffer station ST and the tool load station LP (see FIG. 29C). Shuttle 6102 is located between the horizontally arranged conveyor and the buffer storage ST or load location LP on the tool station (eg, via an access lane 602 between segments 600 of the conveyor). It is possible to sequentially switch between carriers 200 therebetween. As shown in FIG. 30, the shuttle 6104 in this embodiment includes an indexer 6106 that selects / places the conveyor 600 or selects / places a buffer station ST or a tool load port LP. The buffering system can be configured in a modular fashion so that the system can be easily scaled up or down. For example, each module has a corresponding storage location ST and a shuttle rail, and a coupling joint for connecting to other installed modules of the buffering system. In another embodiment, the shuttle rails can be modularly installed because the system has a buffering station module (including one or more core buffering stations) and a shuttle rail module. As shown in FIG. 29C, the shuttle indexer can access the carrier through the conveyor lane because there is a shuttle access path in the access rail 60L of the conveyor 500. 31 is an elevation view of a buffering system for exchanging information with confluence / branch lanes of conveyor 500. In this embodiment, the buffering system shuttle 6104 can access the carrier guided to the access lane of the conveyor. Shuttles may be restricted from accessing or engaging the conveyor's moving lanes because there is a stop or no access path similar to lane 602 of FIG. 29C. 32 is another elevation view showing several rows of buffering stations. In the buffering system, you can arrange as many buffering systems as you want. By replacing the traverse guide 61087 with a modular one, the shuttle movement (in the direction indicated by arrow Y in FIG. 32) can be adjusted as desired. In other embodiments, the buffering system can be arranged in several horizontal lanes or levels (ie, two or more levels vertically separated so that the carrier height can pass between each level). Multi-level buffering can be used for carriers with reduced capacity. 33 shows another top view of the buffering system connected with the induced vehicle carrier V. FIG. 34 is an elevation view of an overhead buffering system 7000 similar to the under tool buffering system 6000 described previously. The overhead buffering system 7000 can be used in conjunction with an under tool buffering system (similar to system 6000). The overhead buffering system is drawn in connection with the overhead conveyor 500. In other embodiments, an overhead system may connect with a floor conveyor system or floor based vehicle. Appropriate control interlocks (e.g., hard interlocks) can be provided to prevent horizontal movement of the shuttle with the payload impinging on the passage vertical space. Top shields can be used over the aisles to prevent hanging objects from passing through the aisle spaces.

35 is a looped buffering system 8000. The buffering station ST of this system is mounted on the track 8100 (represented as a closed loop in this embodiment) and is movable. Track 8100 moves buffer station ST between load station R, where the carrier is loaded into buffer station ST (eg, using overhead loading), and lot station LP of the tool interface. The tool interface has an indexer that loads carriers into the tool station.

36A-36C, a perspective view, side view, and front view, respectively, of a substrate carrier 2000 according to another embodiment are shown. The carrier 2000 is a representative carrier and is drawn in a sample configuration. The carrier 2000 of the illustrated embodiment is depicted as a bottom open carrier, and in other embodiments the carrier may be configured in other forms as desired (eg, top open or side open). The carrier 2000 of the embodiment shown in FIGS. 36A-36C is generally similar to the carriers 200, 200 ′, 300 shown in FIGS. 1-3, and the numbers assigned to the features are similar. As such, the carrier 2000 has a shell or casing 2012 that has one or more openings 2004 (in one example, only one of the openings is indicated in FIGS. 36A-36C) that may allow wafers to be inserted into or removed from the carrier. The carrier shell has a removable wall or section 2016 that constitutes a closing device or door that opens and closes the opening 2004. As already mentioned, in the illustrated embodiment, the shell 2012 has a removable bottom wall 2016 to open and close the opening 2004. In other embodiments, other sections or walls of the carrier shell are removable so that the wafer can be inserted into or removed from the carrier. The removable section 2016 is sealed to the rest of the casing 2014 in a manner similar to that covered in the previous figures and descriptions, where the casing is insulated atmosphere such as inert gas, very clean air with a pressure difference from the surrounding atmosphere, or a vacuum. You can put The shell 2014 and the removable wall 2016 are passive structures similar to the wall 216 and the shell 214 described above, and engage with each other by magnetic force or with other desired manual locks. In this embodiment, the wall 2016 includes a magnetic element 2016C (eg, iron material) and the shell 2014 operates the magnetic switch 2014S to lock or unlock the wall and the shell. Magnetic elements on the wall and actuated magnets on the shell (2014S) are interlocked with the magnetic lock on the port door interface (described in detail below) so that the carrier door (wall or shell, see FIGS. 36A, 36C) engages the port door. Is released at the remainder of the carrier. Depending on the embodiment, the magnetic lock between the wall and the shell may use a different configuration. The metal manual carrier 2000 and the carrier doors 2016 and 2014 are clean and washable vacuum type carriers.

In the embodiment shown in FIGS. 36A-36C, the carrier 2000 is depicted as being configured to carry multiple wafers. In other embodiments, the carrier size may be adjusted to meet the needs to deliver only a single wafer with or without an integrated wafer buffer or to deliver any number of wafers. Similar to the carriers 200, 200 ', and 300 in the embodiments described above, the carrier 2000 is a small lot sized carrier with reduced capacity based on the existing 13-25 wafer carriers. As best seen in FIGS. 36A-36B, the carrier shell has a transfer system interface section 2060. The transfer system interface section 2060 of the carrier 2000 can be arranged to connect with any desired transfer system, such as a conveyor system, similar to the embodiment shown in FIGS. 20-30. For example, the carrier may include reactive elements such as pads or components containing magnetic material containing iron. The reactive element can be disposed or connected to the carrier casing and interlock with the forcer section of the linear plane or motor of the conveyor system conveying device that propels the carrier along the conveyor. Examples of suitable configurations of reactive elements of linear or planar motors connected to a carrier casing are described in US patent application Ser. No. 10 / 697,528, filed 10/30/03. This patent is incorporated herein by reference in its entirety and above. In the embodiment shown in FIGS. 36A-36C, the carrier interface section 2060 has a carrier support component or support surface 2062. This part is connected with the transport system to support the carrier from the transport system when the carrier is moving or stationary in the transport system. The support surface is contactless or contactable, and the carrier is stable in the transport system by placing or facing the side (eg surface 2062S) or bottom (eg surface 2062B) or any other desired location or facing. To support it. For example, the non-contact support surface is in fact a flat area, surface or pad connected to or otherwise arranged in the casing and formed by any suitable means, in conjunction with an air bearing (not shown) of the conveying system (the force of the air bearing Alone or in conjunction with the power (for example associated with magnetic force) that the transfer system motor transfers to the carrier. In another embodiment, one or more (active) air bearings that send air (or other desired gas) to the carrier casing (passive) transport system structure are used to stably support (ie, contactless) and support the carrier in the transport system structure. Do it. In this embodiment, a suitable air / gas supply device (eg a fan or gas pump) is connected to the carrier to power the air bearing of the carrier. In another embodiment, the carrier casing and the conveying system have both an active air bearing surface and a passive air bearing surface (for example, a lifting air bearing of the conveying system and a horizontal guided air bearing of the carrier). Carrier 2000 has other handling components, flanges or surfaces, such as handling flange 2068 as shown in FIG. 36B.

In this embodiment, the carrier 2000 has a tool interface section 2070 that allows the carrier to connect with the loading section (eg, load port) of the processing tool. You can use any kind of processing tool. In this embodiment, interface 2070 is at the bottom of the carrier. In this embodiment, the tool interface may be placed on the other desired side of the carrier. In another embodiment, the carrier has multiple tool interfaces (eg, bottom and side) so that the carrier can connect with the tool in various configurations. The tool interface section 2070 of the carrier 2000 of this embodiment is well illustrated in FIG. 36C. The configuration of tool interface section 2070 shown in FIG. 36C is just one example, and in other embodiments, there may be a tool interface section of another desired configuration in the carrier. In this embodiment, interface section 2070 has features and generally conforms to the criteria specified in the carrier's appropriate SEMI standards (eg, SEMI E.47.1 and E57, and other appropriate SEMI or other standards). All such standards are incorporated herein by reference in their entirety. As such, in this embodiment, the carrier interface 2070 includes a kinetic coupling (KC) connection receptacle disposed in accordance with the criteria of the SEMI STDS. E.47.1 and E57 are used to plug in the primary and / or secondary KC pins (not shown) on the existing load port interface. Carrier interface 2070 has a section with one or more information pads that match the SEMI STDS for the carrier. In other embodiments, SEMI designated features may not be provided in the carrier interface section (eg, dynamic coupling features may not be provided in the interface section). However, there may be a spare area on the connecting side of the casing corresponding to the feature. As such, in this embodiment, the carrier interface section 2070 can connect the carrier 2000 to the loading interface of an existing processing tool. And as mentioned in the previously described embodiment, to engage the carrier with a load port connecting the carrier to the process environment (or to maintain a vacuum in the process equipment), such that the interior of the carrier is substantially sealed to the process environment. It is desirable to engage the carrier so that the seal can be sealed by virtually isolating the part that can be said to be an unclean surface of the carrier from the process environment. As previously described, too severe control conditions between the carrier and the load port are applied to the carrier / load port contact surface and the dynamic coupling between the carrier and the load port to seal the carrier. In order to mitigate excessive control, the dynamic coupling between the carrier and the load port must be adjusted so that the carrier can be repeatedly placed at the load port interface. Coupling compliance is activated by preloading the load port interface. Referring now to FIG. 36E, a cross-sectional view of a typical interface portion 2272 of a compliant dynamic coupling 2082 according to the present embodiment is shown. Coupling interface portion 2072 generally has pins 2274 and is provided with grooves or detents 2276. It also provides compliance in one or more desired directions (indicated by arrows X and Z), ie flexibility, to mitigate carrier constraints in the desired degrees of freedom (eg, carrier pitch, roll, yaw). Let's do it. For example, coupling pin 2274 has compliance (spring rods, spherically mounted spherical pins, resilient flexible material pins, and the like). Coupling groove 2276 also has a compliance (making a groove made of elastically flexible or elastic flexible material to pre-load the compressed groove surface to maintain elasticity).

Further, in this embodiment, the carrier interface section 2070 can be configured to be able to apply the contactless coupling interface of the carrier to the loading interface of the processing tool. This is explained in more detail below.

In general, a wafer carrier, such as carrier 2000, is positioned in accordance with the processing tool to be processed. To automate the transfer of wafers into the tool, it is best to position the wafer carrier close to the load port of the tool. Conventional locating methods generally use a mechanical coupling that abuts the bottom surface of the carrier. For example, such mechanical couplings use a lead-in or cam to compensate for misalignment and to guide the wafer carrier to the aligned position. However, since these features rely on the lead-in surface of the carrier, they are in sliding contact with the mating pins of the load port, which may lead to wear or contaminants. Another problem associated with the use of existing mechanical couplings is that they attempt to roughly place the carriers within the capture area of the existing couplings for the carriers to work properly. The carrier transport system has the problem that the transport system becomes more complex or takes longer to properly deploy (i.e., retry). As such, the carrier transport system must place the carrier within the capture range of the existing mechanical coupling or at the alignment position specified in the existing application to avoid wear. It is inevitable that the carrier transport system will not be able to maintain its repeatability for a long time and will eventually slip and come into contact with particles. The interface of the carrier 2000 is highly repeatable and guides the wafer carrier to the process tool and uses a contactless (eg, magnetic) coupling. This allows the transport system to realize the maximum lead-in features to mitigate placement tolerances and accelerate the carrier load / unload phase. In addition, since all operations for correcting the placement error can be performed without physical contact between the carrier and the load port, the relative slipping operation can be eliminated and thus clean.

In the embodiment of FIG. 36C, the carrier interface section 2070 has a contactless coupling 2071, allowing carriers to be contactlessly connected to the load port. The contactless coupling 2071 generally includes a contactless support or lift area 2072 and a contactless coupling section 2074. In this embodiment, the lift area 2072 is a generally flat and smooth surface arranged to interlock with the air bearing of the load port, thereby stably lifting the carrier from the load port to the air bearing in a controlled manner. The carrier lift area is passive in this embodiment, but in other embodiments one or more active air / gas bearings may be included in the carrier to lift the carrier. Referring again to FIG. 36C, there are three sections in the lift area 2072 in this embodiment. Since these sections are generally similar to each other and are distributed on the connecting side of the carrier casing (i.e. at the bottom), the buoyancy forces acting on the carrier in the load port air bearing are created by the pressure of the air bearing affecting the lift area section, The resulting buoyancy is approximately coincident with the center of mass (CG) of the carrier. The shape and number of lift area sections 2072 shown in FIG. 36C is just one example, and in other embodiments, the lift area may be any other shape and number desired. For example, the lift area is a single continuous (or almost unobstructed section that extends around the carrier interface). In this embodiment, the lift area is disposed on the carrier interface 2070 so as not to interfere with interface features that match the SEMI (eg, dynamic coupling outlets, information pads, etc.). The lift area 2082 can be placed as far as possible from the center of mass (CG) within the constraints of the interface, distributing pressure properly and maximizing the desired translational (i.e. xy plane) alignment error between the carrier and the load port. It is an acceptable size. In this embodiment, the lift area 2072 is disposed symmetrically about one axis (indicated by the X axis in FIG. 36C, ie a bidirectional reference axis) rather than all axes of the carrier interface. As such, the carrier interface 2070 is polarized so that it can be contactlessly connected to the tool loading interface but properly aligned in a single direction. Positioning the carrier in the incorrect direction will result in unstable carrier lift. The transport system placing the carrier or the appropriate sensors in the carrier itself or in the load port will detect this situation and signal to stop the incorrect placement. Lift area 2072 has a pitch or bias that helps to properly align the carrier to the rope port. In other embodiments, the lift zone (s) can be moved or tilted by mechanical, electromagnetic, piezoelectric, thermal or any other suitable means, so that the pressure applied by the air bearings exerts varying strength and direction forces on the carrier. Act horizontally to align between carrier and load port.

Referring again to FIG. 36C, in this embodiment there are one or more permanent magnets 2074A-2074C in the non-contact coupling section (s) 074 (three magnets 2074A-2074C are shown in the figure for reference, but other implementations are shown. In the example, the magnet may be more or less). Coupling magnets 2074A-2074C may belong to the reactive section of the transfer system linear / planar motor and may be independent of the motor reactive section. The coupling magnets 2074A-2074C are sized to overlap the coupling magnets of the load port so that the carrier and load port do not coincide with each other (described below). In the illustrated embodiment, the coupling magnets 2074A-2074C are disposed symmetrically around one axis (which is the X axis of FIG. 36C) but are asymmetrical with respect to all other axes of the carrier interface. As such, the contactless coupling section of the carrier is polarized to prevent the carrier from moving from the coupling to the load port unless the carrier is aligned in the desired direction relative to the load port. In other words, the non-contact coupling of the carrier is " aligned " to the load port so that the direction is correctly aligned and all other directions do not attempt to load because it is not engaged with the coupling. Proper sensors are provided in the load port or carrier to detect if the carrier is not properly positioned in the load port and cause poor coupling and send an appropriate signal to allow the transport system to remove the carrier or relocate it in the correct direction if possible. In another embodiment, the contactless coupling section and / or the lift area are arranged symmetrically around several axes of the carrier interface.

Referring now to FIG. 36D, a plan view of a carrier 2000 ′ according to another embodiment is shown. Here, the carrier 2000 'is almost similar to the carrier 2000 described above, and the numbers assigned to the features are similar. The carrier 2000 'has a carrier interface section 2070' with a contactless coupling 2071 ', which is generally similar to the contactless coupling 2071 described above with reference to Figures 36A-36C. In the embodiment shown in FIG. 36D, the magnetic contact sections 2074A ', 2074B', 2074C ', in which the non-contact coupling section 2074' contains iron instead of permanent magnets, may be part of the carrier's transfer system motor reactive component. May be independent). The ferrous metal material sections 2074A ', 2074B', 2074C 'are of any shape, such as rectangular, round cylindrical, spherical, and the like. Each of the sections 2074A'-2074C 'is similar to each other, but other embodiments use various shared sections that define the desired magnetic coupling and directional characteristics for each section. The sections are sized to fit within the magnetic field of the load port coupling point and to accommodate the initial alignment error that appears between the carrier and the load port when the carrier is first placed on the load port. Coupling sections 2074A ', 2074B', 2074C 'are positioned at the carrier interface such that the carrier's magnetic force is directed to the aligned position relative to the load port. As shown in FIG. 36D, the coupling sections 2074A ', 2074B', and 2074C 'of this embodiment are distributed over the carrier interface to designate a single axis of symmetry (which is the X axis), thereby providing a non-contact coupling 2071' of the carrier. Align it so that it is only connected in one direction to the load port. In other embodiments, the coupling sections may be arranged in other forms.

Referring now to FIG. 37D, a perspective view, stage and side elevation, and front view, respectively, of a tool load station or load port 2300 according to another embodiment are shown. The load port of the illustrated embodiment can be configured to load / unload the wafer in connection with a bottom open carrier similar to the carriers 2000, 200, 200 ′ 300 described above. In other embodiments, the load port may be configured in other forms as desired. The load port 2300 has a suitable mounting interface such as SEMI STD. Configure the BOLTS interface to engage the load port with the desired processing tool or workstation. For example, the load port may be mounted / engaged in an atmosphere controlled section, such as an EFEM (which will be described in more detail) of the processing tool, and the chamber in which the processing tool is isolated (eg, a vacuum transfer chamber). May be engaged (in a manner similar to that shown in FIG. 14) or the atmosphere of the processing tool may be engaged in an open chamber. The load port of this embodiment is similar to the load port described above. The load port 2300 generally has a carrier loading interface 2302 and a loading cavity, i.e., a chamber 2340 (where the wafer is received from or returned to the carrier individually or in cassette units). Chamber 2304 may isolate the atmosphere (which may allow the load port to act as a load lock for the processing tool) and may contain a controlled (very clean) atmosphere. The carrier loading interface 2302 has a loading plane 2302L that supports a carrier connected to a load port. Unlike conventional load ports, the loading plane has few protrusions in the carrier placement zone. As shown in FIG. 37A, the loading plane has a bumper or shock absorber outside the carrier placement zone to replace carrier movement if a cross alignment error occurs between the carrier and the load port. The loading interface 2302 of the load port has a loading opening (or port 2308) (in communication with the loading chamber 2304) and a port door that closes the port similar to the load port described above. In this embodiment, the port door 2310 is nearly flat and horizontal to the loading plane of the loading interface. The port door 2310 is sealed to the pot rim in a sealing arrangement similar to that described above and shown in FIGS. 4A-4B. When connected to the load port's load port interface 2302, the carrier case and carrier door may be referred to as a " zero volume purge " seal disposed similar to that shown in FIGS. It is sealed to the door 2310. In other embodiments, the seal between the port rim, the port door, the carrier casing, and the carrier door can be configured in other forms. The port door 2310 of this embodiment is also connected to the port by passive magnetic coupling or latch in a manner similar to that described above. In this embodiment, the magnetic coupling / latching element between the port door and the port is arranged and configured to actuate the passive magnetic latching between the carrier door and the casing while simultaneously latching acts between the port door and the port. Thus, for example, unlocking the port door at the port unlocks the carrier door that is held by the carrier, and locking the port door causes the carrier door to be snapped onto the carrier. In this embodiment, the load port includes an indexer 2306 and a purge / ventilation facility 2314 similar to those shown in FIGS. 8-14.

Referring again to FIG. 37D, the carrier loading interface of the load port of this embodiment is a virtually contactless interface with the contactless interface section 2071 of the carrier 2000, for example, connecting the carrier 2000 to the load port 2300. There is an interface section 2331. As shown in FIG. 37D, in this embodiment, the interface section 2331 has one or more air bearings 2372 and a non-contact coupling section 2374. The air bearing 2372 of the load port is of an appropriate type and configuration and is generally arranged in a "custom" shape that matches the placement of the lifting area 2702 of the carrier interface. As such, the air bearing 2372 is symmetrically disposed along the reference axis X, which is the alignment reference of the carrier 2000 connected to the load port. Appropriate devices (not shown) for supplying air / gas actuate the air bearings. Appropriate regulators (not shown) are used to maintain the gas flow from the air bearings. The gas supply device and the adjusting device of the air bearing can be arranged arbitrarily. For example, the gas supply 2237S (FIG. 37C) of the air bearing 2372, which is outside or inside the loading chamber 2304 of the load port and is blocked from the air inside the chamber, may be a bellows or other flexible sealed sleeve. It is possible to extend the gas supply within the air bearing to isolate it from the loading chamber. As another example, the gas supply of the air bearing may extend in a manner similar to the purge and ventilation lines shown in FIG. 14 within the bellows seal that isolates the indexing device. In this embodiment, since the air / lift area of the carrier is in the carrier door, the air bearing 2372 of the load port of this embodiment (which is actually under the lift area) is disposed in the area of the port door 2310. In another embodiment, the air bearing is in the port frame or port rim, and the gas supply of the air bearing is disposed outside the loading chamber of the load port. In this embodiment, the air bearing 2372 may be an orifice bearing (usually having a local exhaust port) or a porous media air bearing with a generally uniform distributed exhaust port. The exhaust flow of each air bearing 2372 is fixed in terms of pressure, mass flow and direction and remains substantially constant (in FIG. 37C this is indicated almost vertically as AB in one example). In another embodiment, the air bearing is variable to allow for modification of the carrier movement relative to the load port and to change the exhaust flow characteristics (eg, pressure, mass or direction) to facilitate carrier-load port alignment. Phosphorous exhaust flow can be produced. The carrier's air bearing 2372 and lift pad 2072 can be sized to provide an alignment error tolerance zone or placement zone when the carrier is first placed in the load port.

37E, a plan view of a load port 2300 'according to another embodiment is shown. Here, load port 2300 'is almost similar to load port 2300 and the number assigned to the features is similar. There may be nozzle arrangements in one or more air bearings 2372 ′ in this embodiment. By combining the exhaust nozzles AB1-AB4 of the array nozzle, the direction of the exhaust gas can be adjusted. For example, each nozzle in the array has a vent that is bent relative to another nozzle vent. The exhaust stream from one or more nozzles is fixed or variable. If the air nozzles in the array operate at the maximum flow rate, the resulting exhaust is in the first desired direction (eg, generally vertical). Stopping or reducing the flow through one or more nozzles in the array changes the resulting exhaust direction, resulting in a directional component in the loading plane. In other embodiments, the air bearing nozzle may be movable (eg, an air bearing nozzle mounted on a tiltable platform) or the shape may be changed (using a piezoelectric material or shape memory material) to adjust the direction of the exhaust gas. have. Accordingly, the directional component of the air bearing exhaust port of the loading plane sends the power of the carrier acting on the air bearing of the loading plane in the opposite direction of the directional component of the exhaust port, causing the carrier of the loading plane to move laterally.

Referring again to FIGS. 37A-37D, the contactless coupling section 2374 of the load port may be coupled with the carrier's magnet 2074A-2074C (see FIG. 36C) or the magnetic material section 2074A'-2074C 'to load the carrier and rod. Magnet sections arranged to designate areas of lockable / unlockable magnetic couplings between ports (e.g., between carrier door 2016 and port door 2310, and preferably between carrier casing and load port frame) (2374A-2374C). In this embodiment, the position of the carrier in the rod portion such that the magnet sections 2374A-2374C of the load port are in desired alignment with the magnets 2074A-2074C, or the magnetic material section 2074A'-2074C'1 of the carrier. It becomes a carrier position correction device that can adjust. This point is explained below. Alignment of the illustrated magnet sections 2374A-2374C is just one example, and in other embodiments the magnet sections of the load port contactless carrier coupling section may be arranged / configured in any desired manner. The magnet sections 2374A-2374C are magnets for actuating the magnetic switch. When activated, the switch generates a magnetic field that deflects the magnet or magnet section of the carrier in the desired direction (eg, actuates the locking / coupling of the carrier and load port or applies a corrective force to the carrier). 37A and 37D, the load port interface of this embodiment includes a contactless alignment system 2380 that informs the carrier transport system of the load port location and initially places the carrier on the load port interface. As mentioned above, the placement zone of the load port is virtually free of protrusions and there is little contact between the carrier and the load port of this embodiment when the carrier is first placed in the placement zone (ie no frictional contact). In the illustrated embodiment, the alignment system 2380 has an array or pattern of registration marks that can be imaged with a suitable sensor. The pattern of marks shown in FIG. 37D is just one example, and in another embodiment, an appropriate mark pattern may be used that can be imaged with a suitable sensor to define positional information in a desired degree of freedom. For example, a sensor (not shown) that can be placed in the carrier holding portion of the transfer system is a CCD or CMOS imaging sensor that can image the pattern and its spatial characteristics. The image data implementing this pattern is transferred to an appropriate processor, which registers the position data of the carrier and associates with the pattern to determine the position of the placement zone of the load port relative to the carrier transfer device and the position on the carrier transfer device. Tells.

In this embodiment, the carrier 2000 is disposed in the loading plane with no protrusions in the placement zone 2302P by the transfer system. The placement zone of this embodiment is an area formed based on the carrier size +/- about 20 mm with respect to the alignment axis of the load port. The actual placement error can be any value and does not depend on a given value. And in proportion to the correction mechanism used to determine the position of the carrier after placement. As such, the alignment repeatability of the coupling is largely the same as with conventional coupling schemes, while at the same time the acceptable carrier transfer placement error is increased. Once the load port senses the carrier, the air membrane (air bearing) acts to lift the carrier so that there is no friction between the carrier and the load port interface. The force acting on the carrier at this time is the mass of the carrier and the relative position of the center of gravity with respect to the horizontal reference plane, and the flotation force itself. The carrier lift area is connected to the air pad of the load port to lift the carrier and set the repeatable positioning of the carrier (including both angular and transverse positioning) to the load port. The carrier floating on the air curtain is now placed in alignment with the load port. As mentioned earlier, magnetic coupling can be used to transfer and rotate the carrier by transmitting a force acting on the carrier. With enough stroke, the carriers can transmit forces other than magnetic and predict the target position. Once the carrier and load port connections are complete, the two objects are tightened together to maintain position.

With particular reference to the embodiment shown in FIGS. 36A-36C as an example, when the carrier 2000 is in the placement zone, the permanent magnets 2074A-2074C overlap the magnets 2374A-2374C of the load port interface. Power the air bearings and actuate the load port magnetics electronically or mechanically to exert the opposite magnetic poles on the carrier magnets. Without friction at the interface, carrier freedom can move in the X, Y, and theta Z axes until the magnetic poles are naturally aligned and there is no physical contact. During this stage, the air bearings are preloaded with the magnetic forces of the magnets in the carrier and load port. The preload helps to maintain control of the carrier and also increases the rigidity of the air bearings. The air bearings are deactivated after a predetermined time elapses or in response to sensor feedback so that the carrier descends into the port door of the load port. The magnet is then in full contact with the clamping force that holds the carrier to the port door.

In the embodiment of FIG. 36D the carrier 2000 will have ferrous pads 2074A and 2074C (see FIG. 36D) of sufficient size to enter the magnetic field of the load port coupling point after placement (by the carrier transport system). . The air bearings are actuated and the load port magnetics actuated electronically or mechanically to create magnetic fields on the carrier ferrous metal pads. Since there is no friction at the interface, a pulling force is applied between the magnet and the ferrous metal pad, causing the carrier to move or rotate to the aligned position. The magnetic force is preloaded in the air bearing. The preload helps to maintain control of the carrier and also increases the rigidity of the air bearings. The air bearing is deactivated after a predetermined time elapses or according to sensor feedback, so that the carrier is lowered into the port door of the load port. The magnetic force acting on the ferrous metal pad is the tightening force that fixes the carrier to the port door.

According to another example, the carrier is driven by an oriented air nozzle 2372 ′ (see FIG. 37E) integrated into the air bearing surface as in the embodiment shown in FIG. 37E. In this embodiment, the air nozzle 2372 provides a pressure applied laterally to the bottom surface that transfers motion to the carrier. The operation can be controlled by a controller that operates the appropriate nozzle assembly to orient the carrier to the X or Y axis until the magnet of the carrier is aligned with the load port. In another embodiment where the nozzle array is mounted on a rotating or rotating platen, the platen is actuated to inform the nozzle of the desired direction. The nozzle orients the exhaust port to the opposite side of the carrier's intended direction of operation. This transfers the side force and moves the carrier until the magnets are aligned side by side. Some sensor feedback information, including the feedback information sent by the magnetic coupling, is used to detect the actual position of the carrier and compare it with the aligned position. This information determines the direction in which to move the carrier and how the air nozzle exerts a force on the carrier. In another embodiment, the nozzle and magnetic coupling are used together to align the carrier to the desired position.

37F is a top view of a load port interface according to another embodiment. The load port 2300 " in this embodiment is similar to that described above, except that the magnet 2374 " disposed in the load port is attached in the X-Y step movement direction where the movement indicated by the arrow in FIG. In this embodiment, when the carrier is placed in the load port and the air bearing is actuated, the carrier magnet is pulled into the load port magnet connected to the XY stage 2374S ". It is a solenoid and directly encoded to report the translated position. The connected carrier magnet and the load port magnet are returned to the learned (aligned) position. On reaching the destination, the bearings are deactivated and the carrier is lowered into the port door and tightened. Similarly, this approach can be adapted to the existing behavioral coupling schemes used to connect each actuation pin to the X-Y stage. In this example, two of the actuation pins are aligned with X, Y, and theta Z. This does not work non-contacting, but is a possible way to increase carrier placement error with minimal wear.

37G is another embodiment of a similar load port 2300A, except that the carrier is driven by a mechanically operated pusher arm 2374M to position the carrier and align the carrier's coupling point with the load port. In the illustrated embodiment, the loading plane is mounted in the form of an axis of rotation around theta X and theta Y (indicated by arrows R, P). In combination with the air bearings, the load plane is tilted to move the center of gravity of the carrier to transfer the movement force in the pivot angle direction. This method uses position feedback information to intelligently operate the load plane in the proper carrier direction to align the magnets of the carrier and load port. Once the carrier is placed, the air bearing operation is released and the carrier is tightened to the port door. Finally, the load plane is rotated back to its original position to properly align it with the port so that the door can be removed.

As mentioned earlier, the environment in the carrier depends on the previous process and the environment inside the wafer and the carrier. Thus, the carriers connected to the load port and loading station will be placed in an environment different from the current process environment (eg gas type, cleanliness, pressure). For example, some processes defined for wafers of carriers use inert gases. Thus, the interface between the carrier and the load port of the tool can inject or evacuate the appropriate type of gas to minimize pressure differentials or the introduction of unwanted types of gas while the carrier is open. As another example, the environment of the tool is a vacuum and the carrier engaged with the load port of the tool is lowered to low pressure through the interface so that the wafer of the carrier can be loaded directly into the vacuum load lock. The interface between the carrier and the load port and the environmental control system capable of mating between the carrier and the tool are similar to those described above and shown in FIGS. 10-10A and 14. Another suitable example of a carrier load port interface and environmental matching system is described in US patent application Ser. No. 11 / 210,918, filed 8/25/05. This patent is incorporated herein by reference in its entirety and above. Referring now to FIG. 38A, a flow diagram is shown showing a process of matching a carrier's environment to a load port of another controlled environment. In the embodiment of FIG. 38A, the carrier and load ports contain the same kind of gas (ie, the same kind of inert gas). In this embodiment, if the pressure of the carrier is higher than the pressure of the process, the carrier ventilates into the load port chamber (or other suitable ventilation location) until the equilibrium point (via the interface) is reached and the pressure of the carrier is further increased. If low, insert gas from the load port or other suitable feeder into the carrier until the carrier and load port / tool environment has reached the equilibrium point. In the embodiment of FIG. 38B, there is an atmospheric environment (eg, very clean air) at the load port, and the balance between the carrier and the load port is achieved in a similar manner as described above with respect to FIG. 38A. 38C shows a process of an embodiment where a vacuum environment is present at a load port. In other embodiments where different types of gas are initially present in the carrier and load port, the same type of gas is introduced into the carrier (e.g., load port) before all of the carrier's initial air is removed and the door is opened. From).

Referring again to FIG. 37A, as mentioned above, in this embodiment there is an indexer 2306 that raises or lowers the port door 2310 to the load port to open or close the port. Indexer 2306 may raise or lower the wafer cassette to the desired height in the load port chamber in the carrier for wafer processing. The indexer 2306 described above is similar to the embodiment shown in FIGS. 8, 9, 10-10A, 14 and 18, with the indexing mechanism separate from the volume / environment occupied by the wafer. In summary, suitable examples of indexing mechanisms are arranged as follows.

1. Lead screws with bellows-This mechanism uses lead screws driven by an electric motor attached to the port plate of the load port. The part of the lead screw that goes into the clean area is wrapped with bellows. Bellows are materials such as metals, plastics, fabrics, etc., and may be materials that are clean and fatigue-free in operation. The bellows is a barrier between the mechanism by which contaminants are produced and the clean area where the wafer is present. The flexible nature of the bellows provides such isolation in the entire stroke of the actuator. The feedback from the mechanism can come from a rotary encoder on the motor or lead screw, or from a linear encoder on the travel path. (See Figure 14).

2. Bellows-embedded pneumatic cylinder-similar to the previous embodiment (1) except that the drive mechanism is a pneumatic cylinder. It can be used for movement between two positions (eg pod closed and pod lowered). (See Figure 9).

3. Lead screw of pneumatic cylinder remote drive-Similar to the previous embodiment, except that the drive mechanism is remotely located outside the wafer volume (see FIG. 10). The port plate of the load port is attached to the drive with the support structure. The drive unit is exposed to clean areas but contamination is controlled through air flow paths or labyrinth seals. To utilize airflow, the drive must be placed downstream of the wafer. This creates contaminants below the wafer and separates from the wafer. The addition of labyrinth or other "friction free" seals limits particle loading, creating a solid barrier between the drive and the clean area. Secondly, the drive can be remotely deployed completely outside the process tool environment. This will place the mechanisms with the potential for debris to be placed in a less clean FAB environment, but use a labyrinth seal to protect the process tool environment in a less clean FAB.

4. Drive Mechanism Using Port Plates Connected Magnetically-This embodiment uses a magnetic coupling between the port plate and the drive mechanism (see inverted example in FIG. 8). The magnetic coupling works through a non-ferrous metal wall in the air gap that can separate the drive outside the clean area. The drive type is all the types described above, such as lead screw, pneumatic cylinder, linear motor. The latter can be placed in a clean area because it can operate cleanly in conjunction with the air bearing guide which essentially controls the direction of travel.

Referring now to FIG. 39, there is a cross-sectional view of a load port 2300A and a carrier 2000A connected thereto, and a cross-sectional view of a wafer airflow management system according to another embodiment. Carriers 2000A and load ports 2300A are similar to the carrier and load ports of the previously described embodiments, respectively. In the embodiment shown in FIG. 39, the port door is open and the cassette is indexed into the load port chamber and arranged for processing. When the carrier is open and the wafer is placed for processing, air flow around the wafer helps to keep the wafer clean. For example, depending on the process, the wafer is held in a lowered position for an extended period of time, increasing the risk that particles generated in the environment will accumulate on the wafer surface. In addition, contaminants generated by the load port mechanism can settle on the wafer surface without proper airflow. In the illustrated embodiment, at least a portion of the air flow in the process environment can be "captured" and sent back to the flow through the wafer. Air is then vented back to the process environment downstream of the wafer transfer plane (WTP). In this embodiment, the airflow pattern passes horizontally parallel to the top surface of the wafer and exits to the backside of the wafer cassette. The exhaust path pulls the air exiting the cassette vertically and directs it to the exhaust port which leads to the floor. This method ensures a clean and constant air flow on the wafer surface while operating in an open loop or sealed environment. For example, when a load port is operating in an environment where process-dependent gases such as nitrogen or argon are present, the existing air flow can be redirected back to the main stream as shown to use for a controlled type of gas. Support closed loop environment.

As shown in FIG. 39, in this embodiment, the supply air vane is mounted on the vertical plane of the process shrinking environment over the region accessing the wafer. The location is reserved for FOUP door openers in accordance with existing SEMI E63 standards. The air foil is designed to capture large amounts of existing laminar flow from the shrinking environment and to rotate the air stream from vertical to horizontal. In this embodiment, the diffuser element is disposed on the back side of the wafer cassette lowered inside the outer skin of the load port. For example, a diffuser consists of a solid panel that is partially open depending on the flow characteristics. The diffuser is configured to uniformly manage the horizontal air flow through the wafer while creating pressure differentials before air enters the exhaust side of the duct. In this embodiment, the exhaust side of the circuit is forcibly guided so that the air flow on the wafer is kept constant and uniform. For example, the duct on the exhaust side is equipped with an axial fan and the output is directed to the process tool reduction environment port. The device can also be used without a fan, and a system consisting of supply vanes, diffusers and exhaust ducts can be deployed to ensure a stable and uniform air flow on the wafer.

Referring now to FIGS. 40A-40D, cross-sectional views of wafer restraints of representative carriers in accordance with each of the other embodiments in question are shown. The embodiment shown in FIG. 40A is a view of a radial clamp wafer restraint. The cassette sidewalls can be moved for clamping. The mechanism resides in the cassette and is operated by a load port or by a pod shell-cassette interface (Z axis). In other embodiments, the side walls may be moved into the pod shell. The mechanism is present with the pod shell and is operated by a load port or by a pod shell-pod door (Z axis of OHT) or a pod-cassette (Z axis of load port). High quality materials (ie shape memory metal or magnetic resistant materials, etc.) are used for the actuation mechanism. The embodiment shown in FIG. 40B is a wafer restraint using clamping forces that generally act on the wafer top surface. In this embodiment, the vertically moving finger is embedded in the cassette. The mechanism is present in the cassette. The mechanism is operated by a load port or by a pod-port door (Z axis of OHT) or a pod-cassette (Z axis of load port). In another embodiment, the axial movement finger is embedded in the pod shell or cassette. The mechanism can reside in a cassette or pod shell. The fingers move to the wafer at an angle that is not horizontal (see Figure 40C). The mechanism is operated by a load port or by a pod shell-pod door (Z axis of OHT) or a pod shell-cassette (Z axis of load port). In another embodiment, a 2 DOF finger is embedded in the pod shell or cassette. The finger then moves vertically to engage the wafer (see FIG. 40D). The mechanism is actuated by a load port or by a pod shell-port door (Z axis of OHT) or a pod shell-cassette (Z axis of load port). In other embodiments, the wafer restraints of the carrier may be configured in other suitable forms. For example, the wafer is sandwiched between supported wafer edge contacts (eg, support fingers on a cassette forming the wafer and linear edge contacts).

Referring now to FIGS. 41-41B, a perspective view, a short side elevation, and a front view, respectively, of a typical processing facility of a process tool PD and a transfer system according to another embodiment are shown. Processing tools (PT) are depicted in a typical array, such as tools arranged in the processing bay of a FAB. The transfer system 3000 of this embodiment is for use in the tool of the processing bay. For example, the transport system 3000 is part of the bay of the FAB overall transport system. The transfer system 3000 of the embodiment is generally similar to the section of the AMHS system embodiment described above and shown in FIGS. 29A-29D. The transfer system 3000 exchanges information with other (eg, interbay) portions 3102 of the FAB AMHS system via the appropriate transfer interface shown in FIG. 41. As mentioned earlier, the processing tool (PT) configuration of the illustrated tool array is just one example and the tool has several rows (two rows R1, R2 in this example) in the drawing, but in other embodiments Fewer or more tool rows). In the example shown, the tool rows are arranged almost parallel (geometrically parallel but oblique to each other) and define a nearly parallel process direction. The process direction of each tool row may be the same or may be opposite to each other. Also, the process direction in any row may be reversed so that the process direction of another portion or zone of the same tool row is the opposite of the process direction in one portion or zone of the tool row. Several process zones ZA-ZC can be designated by distributing the process tools in rows R1 and R2 (see, for example, FIG. 41). Each process zone ZA-ZC may include one or more process tools of rows R1 and R2. In other embodiments, tools in the process zone may exist only in a single row. Process tools in any zone are process related. That is, there is a complementary process or the tool throughput is similar. For example, a tool zone (ZA) contains a high throughput tool (e.g., about 500 wafers per hour (WPH)), and a medium throughput tool (e.g., less than about 75 WPH-less than 500 WPH) is used by zone (ZB). And low throughput tools (eg, about 15 WPH-100 WPH) may be in zone ZC. The tools for zoning any zone are not the same, and one or more tools within any zone may differ in throughput or process from other tools in that zone. Nevertheless, there is a relationship between the tools in the zone, so at least in terms of transport, it is systematically appropriate to organize the tools within the same zone. The tool zone shown in FIG. 41 is just one example and may be arranged differently according to an embodiment.

As shown in FIG. 41, the transfer system 3000 may transfer the carrier from the tool to the carrier or to the tool. The transfer system 3000 is generally similar to the transfer system described above and shown in FIGS. 29-35. In the embodiment shown in FIGS. 41-41B, the transfer system 3000 uses an overhead configuration (ie, the transfer system is above the tool). In other embodiments, other suitable configurations may be applied to the transfer system, such as an underneath configuration (ie, placing the transfer system under a tool similar to the transfer system shown in FIGS. 30-33). As shown in Figures 41-41B, the transfer system generally has a large number of subordinate transfer systems or sections. In this embodiment, the transfer system 3000 generally has a bulk material / high speed transfer section 3100, such as a conveyor section (i.e., similar to the solid state conveyor described above in FIGS. 20-25B or other suitable conveyor). . The conveyor section extends to all tool zones and allows carriers to be transported with almost constant feed speed without stopping or slowing down when the carriers are placed in or removed from the conveyor section. The transfer system 3000 of this embodiment includes a storage station / location 3000S (see FIG. 41B), a shuttle system section 3200 (see FIG. 42) with a shutter 3202 that can access one or more storage stations / locations. And a linked transport system section 3300. In this embodiment, the connecting transfer system section may access the carrier being transferred from the mass transfer conveyor section 3100 or the storage station to transfer the carrier to the loading section of the processing tool. In this embodiment, the storage station, shuttle system section 3200 and the connecting transfer system section are formed as optional mounting portions that can be selectively installed along the transfer system. In this embodiment, the transfer system sections 3100, 3300, 3200 are modular to facilitate the installation of selected portions of the system sections to be installed in the transfer system. Each part of the transfer system, that is, the shuttle system, the interface system and the storage system selected for installation in the transfer system, corresponds to the zone ZA-ZC of the processing tool. Accordingly, the transfer system 3000 can be configured to match the processing tool or processing tool zone. In addition, in this embodiment, the transfer system can be configured in the zone TA-TC and is generally suitable for and corresponding to the processing tool zone ZA-ZC. As such, the transfer system has different system section configurations for different zones. In this embodiment, the storage system section and the shuttle system section can be configured in each zone TA-TC of the transfer system. Also, in this embodiment, the interface transfer system section can be configured in each zone. In this embodiment, the interface transfer system has interface transfer device portions 3310 and 3320 that can be selectively installed (example in the gantry of FIG. 41). This transfer unit part can be added / removed and installed in a wide variety of directions in each transfer system zone (TA-TC). The desired interface transfer system portion can be installed in the transfer system zone to provide the desired tool interface and access speed proportional to the throughput of the processing tools in that tool zone (ZA-ZC). As best seen in FIG. 41A, there is a variable selectable number of transport movement planes in the interface transport system section (e.g., some zones TC have a single interface transport movement plane (see FIG. 48), Other zones TA, TB have one or more transfer device moving planes ITC1, ITC2 (FIGS. 41A, 46). In zones where there are multiple planes, the transfer devices can move across each other. Although two planes are shown in the figure, there may be more or less transport device planes provided. In this embodiment, the transfer system is arranged almost horizontally with the movement plane, but in other embodiments the transfer system may be arranged in any other desired form, including having a vertical movement plane for the interface transfer device bypass.

Overhead Gantry Systems (OGC) can be configured for low, medium and high throughput. Modular assemblies that can be reconfigured in the field can respond to changes in coefficients or process functions. These modular assemblies can be divided into three categories: low throughput, medium throughput, and high throughput. Various module deployments depend on various factors such as desired travel speed, storage capacity, and desired throughput distribution within the bear.

Low throughput :

For example, a low throughput tool or tool zone can be adequately handled by a single gantry 3310. This configuration can provide any desired movement without the use of a "feeder" robot 3320 or a shuttle system 3200. The gantry picks up the carrier from the in-bay conveyor and transports it to the storage location and transports the carrier from the storage to the tool. To move the carrier to an adjacent gantry zone, the carrier may be placed on a conveyor in the bay, or placed in a storage nest that the adjacent gantry will retrieve. In this configuration, one gantry passes through the other until the gantry in between is moved. In a situation where two or more gantry are operating side by side, if one gantry fails, the adjacent gantry can take over the work of the failed gantry. The work capacity will decrease, but work will not be stopped completely.

Medium throughput :

For example, a tool or tool zone with medium throughput can be processed by adding a "feeder" robot 3320 (ie, adding a gantry / transfer device level). This configuration is generally similar to a low throughput batch with feeder robot 3320 and sorter / shuttle 33200 added. In this embodiment, the feeder robot and sorter / shuttle are dedicated devices for conveyor operation in the bay to move only the storage. For all feeder robots it is desirable to use two gantry loader robots 3310 and 3312 on either side of the feeder (see FIG. 44). However, in another embodiment the feeder is mated with one loader robot. The purpose of the sorter / shuttle is to take the carrier from the feeder and put it in the storage queue. In this configuration, the "loader" robot can focus on storage-tool movements and tool-storage movements without the additional burden of selecting a carrier on an in-bay conveyor. The system can work with adjacent modules with low, medium, or high throughput. If the loader robot fails, it is possible for adjacent loader robots to move in and work in the zone of the failed robot (see FIGS. 46 and 47). If the feeder mechanism fails, the individual loader robots operate in the same way as the low throughput configurations. In both cases of failure, the system is always operational but with reduced capacity.

High throughput :

For example, for high throughput applications, the gantry module can be reconfigured to meet the needs of a particular tool or tool zone. In high throughput batches, there are loader robots on each side of the bay, so the zones of medium throughput and feeder robots are similar, and the sorter / shuttle that queues carriers to storage is similar (see FIG. 45). The loader robot takes care of the tools on one side of the bay, so the travel distance is shorter. Carriers enter and exit the high-throughput zone through an in-bay conveyor system. High throughput configurations have a high tolerance for loader robot failure and / or feeder robot failure. If the loader robot fails, another loader robot can work on both sides of the bay after the failed robot moves out of the zone. If the feeder fails, the loader robot is responsible for selecting carriers in the conveyor system in the bay. If both the loader and feeder robots fail, one loader robot takes care of all the desired actions.

Each throughput configuration (low, medium, high) may operate as a single entity or may operate adjacent to one of three deployments, depending on the desired speed of travel. In this system, there is no single point of failure that completely disables the carrier flow through the system. In addition to preventing individual component failures or multiple component failures, the system can take advantage of multiple carrier movement paths available. The host controller uses a series of standard movement schemes with successive priority movement levels applied for a particular carrier under normal operating conditions. To overcome the problems of periodic carrier traffic explosion, tool failure, upstream limitations, etc., the host's control logic can initiate a way of resetting the carrier flow path and bypassing carrier flow in the problem area. 50 shows a number of ways to move the carrier from point A to point B in accordance with this embodiment.

In this embodiment the "feeder" robot can retrieve the carrier from the in-bay conveyor system and place it in the appropriate storage location. If necessary, the feeder robot allows the tool loading robot to focus only on storage-tool movement, increasing the total system moving capacity. The feeder utilizes rapid short-range movements to allow the conveyor in the bay to move with a limited level of interruption or no interruption (e.g., no conveyor interruption occurs when accessing the carrier in the access lane, similar to FIG. 20). The feeder mechanism relieves the workload of the gantry system. Anticipated drive mechanisms that support a variety of motions include linear motors, ball screws, pneumatic drives, belt drives, friction drives and magnetic propulsion. Given the foregoing, the following embodiments can be implemented.

1. The feeder robot is similar to the gantry loading robot except that the feeder robot is fixed in the x direction (the longitudinal direction of the bay) and has degrees of freedom in the y direction (crossing the bay) and the z direction (vertical direction). . The feeder mechanism is in the plane underneath the tool loading robot, allowing the loader robot to pass through without payload. The area above the load port zone is empty so that the loader robot can move across the feeder with the payload. The feeder system is placed vertically so that when the vehicle is in the raised position, it can pass over the conveyor in the bay and have enough space to move over the carrier and grab the carrier. Since the feeder approaches the carrier from above, a short vertical stroke is utilized to select the carrier from the in-bay conveyor system and place it on the desired storage flange. In this configuration, the storage lanes are coplanar with the conveyor in the bay. The storage lanes have a bidirectional sorter / shuttle mechanism used to shuttle the carrier to the next location on the storage row. The shuttle drive mechanism is designed to move the carrier at least one pitch distance in the longitudinal direction of the bay. The pitch distance can be defined as the distance that the gantry tool loading robot can move adjacent to the feeder robot and select the carrier without interference. Sorters / shuttles are also used to transfer carriers between adjacent loader robot zones and storage lanes when desired. For example, the carrier movement order is as follows.

In-bay conveyor stops momentarily at a fixed X position of the feeder robot in the bay length direction.

The feeder robot moves from the previous Y position to a position just above the carrier on the conveyor in the bay.

The feeder robot selects a carrier.

The feeder robot moves to the specified shuttle lane in the Y direction (moves to the bay).

The feeder robot places the carrier on the shuttle and proceeds to the next move.

Shuttle / sorter mechanism drives the carrier in the X direction.

The gantry tool loading robot moves to the storage location, then selects the carrier and places it on the appropriate tool.

Some examples of improved systems in accordance with embodiments include increased wafer throughput, multiple travel paths to complete carrier movement, and improved fault tolerance compared to existing systems.

According to another embodiment in FIG. 48, the feeder robot is implemented with a linear stage present in the plane directly below the shuttle and in-bay conveyor systems. This stage has the same degree of freedom as Example 1 and holds the carrier from below, not from above. The carrier is grabbed from the conveyor in the bay, then moved to the bay and placed on an appropriate shuttle. This architecture has the advantage that the conveyor lane can be placed anywhere between machine boundaries. For example, the in-bay conveyor may be in the middle, not outside, as in Example 1. Another advantage of this arrangement is that the loader robot can pass over the feeder mechanism with the payload at any Y position in the bay, while in embodiment 1 it can only do so if the loader is in the load port zone. Is the point. In addition, the loader robot does not need to communicate with the feeder structure to avoid collisions. The feeder and loader robots may occupy the same vertical space with payloads but may not connect with each other. The order of movement of this configuration is the same as that of the first embodiment except that the carrier is held at the bottom, not at the top.

In another embodiment, the overhead or underholding mechanism can move in the X direction (bay length direction), Y direction (move to bay) and Z direction (vertical direction). This configuration does not use shuttle / sort. This is because three-axis feeders can be moved to specific storage lanes and slots as needed. For example, carriers are removed from the conveyor in the bay and placed in the appropriate storage lanes and then moved vertically to the first carriage queue of storage. As can be seen in Figure 49, another embodiment provides increased storage capacity by providing a vertical storage column that can store carriage within a volume to match the carrier geometry extending from the FAB floor to the highest reach of the OHT system. Can be. The OHT system can be placed in the longitudinal direction of the bay.

In an embodiment such as that shown in FIG. 41, the interface station or loading / unloading station of the process tool PT using the transfer system 3000 (see FIGS. 37A-37C and 39 for example) has different facings to each other. have. The pacing of the loading station and / or process tool, which will be described later, is based on the carrier engaged with the loading station and / or wafer loaded from the carrier to the process tool instead of specifically referring to the position or orientation of the side or front of the loading station or process tool. Reference is made to (all) properties of a loading station or process tool that specifies a predetermined orientation of the loading station and / or process tool. Carriers conveyed between the process tools PT by the conveying system 3000 are engaged in different directions corresponding to the loading stations facing each other when paired with the loading stations of other tools having different facings. As such, the carriers mated with the loading stations of other process tools using the transfer system 3000 are each different in orientation to each other. The seating interface that engages the carrier with the loading station of the process tool is polarized to engage the carrier in the desired direction, ie in a direction consistent with the facing of the loading station. The carrier (generally similar to carrier 200 shown in FIGS. 1-5 and 36A-36D) may not be of the same construction in terms of engaging the loading station of the process tool PT. For example, the casing or housing of the carrier is generally the same shape or shape (see for example FIGS. 1 and 36A), but can load the foundation in the desired direction with respect to the reference frame of the process tool. As such, the carrier engaged with the loading station of the process tool PT is loaded such that the substrate therein is in the desired direction specified for the process tool. In another embodiment, the carrier casing is not of the same configuration in which the carrier is engaged with the loading station of the process tool (ie, the carrier is similar to a FOUP with substrate transfer openings on only one side or front of the casing). . In the present embodiment, the carrier CAR 200 has a suitable identification device or indication (eg, structural form or electronic display) that indicates the direction of the carrier. A control system (not shown) of the conveying system 3000 identifies and directs the direction of the carrier CAR 200 by means of the identification device or indication of the carrier when the carrier is conveyed between the tools PT of the FAB by the conveying system 3000. And / or may be appropriately configured or programmed to track. The control system may be configured or programmed to associate the orientation of the carrier CAR 200 with the pacing of the loading station such that the transport system 3000 is loaded and connected to the loading station in a direction associated with the pacing of the loading station. In the embodiment shown in FIGS. 41 and 50, the transfer system 3000 is a θ drive system arranged to perform a θ operation (rotating the carrier to change the carrier direction as indicated in FIG. 41A) independently of the carriers conveyed during the description. What is represented by 3600 may be included. The drive system 3600 of the transfer system 3000 can perform the [theta] motion or rotation of the carrier irrespective of the carrier movement in other directions (x, y, z directions shown in FIG. 41) as described in detail below. have. As such, the transfer system 3000 of the present embodiment can make four degrees of freedom movement (x, y, z, θ) when transferring the carrier between the process tools. In other embodiments, the degree of freedom of carrier transport operation of the transport system may be somewhat higher or lower. In this embodiment, the [theta] drive system 3600 can be arranged to perform an independent [theta] operation of the carrier "in real time" on the carrier as described in detail below.

As mentioned earlier, since the process tool PT has loading stations LSR1 and LSR2 which use different pacings with respect to each other, the transport system 3000 has different carriers (corresponding to the pacing of the loading station). It will be placed on the loading station in the loading direction. 41 and 50 again, in the illustrated embodiment, the process tool PT using the transfer system 3000 is arranged in rows R1 and R2 (as previously mentioned, in other embodiments the process tool and its loading). Stations can be arranged in different forms, with or without rows or columns, and can use any array batch or serial batch). 41A, in the present embodiment, the process tools PT of the corresponding rows R1 and R2 may be arranged such that the head loading stations LSR1 and LSR2 of the process tools generally face each other. Thus, as can be seen in FIG. 41A, the row R1's loading station LSR1 or process tool is substantially opposite to the loading station LRS2's pacing direction (the direction indicated by arrow LSA2) (i.e., approximately 180 ° away) (the direction indicated by the arrow LSA1 in Fig. 41A) The pacing direction of the loading station is similar in each row (e.g., in the corresponding tool row R1, 42). Are generally directed in the direction of LSR1 and LSR2, respectively, and in other embodiments there will be a loading station in one or more tools of one or more rows having a different pacing than other loading stations of the tools of the same tool row. The loading station is facing in a different direction about 180 ° In another embodiment, the facing direction of the loading station using the transfer system is similar. For example, Fig. 41A shows that the carrier CAR 200 is engaged with the loading station LSR1 In the illustrated embodiment the carrier CAR 200 of the loading station LSR1 is indicated by the pacing of the loading station LSR1 (indicated by the arrow LSA1). (As indicated by the direction feature CAR A, drawn for reference.) Figure 41A is also oriented (feature CAR A ') to match the facing of the loading station LSR2 (indicated by the arrow LSA2). Shows a carrier (CAR 200 ') (dimmed) engaged with the loading station (LSR2), as can be seen in Figure 41A, in this embodiment of the carrier (CAR 200) engaged with the loading station (LSR2). The direction is about 180 ° away from the direction of the carrier engaged with the loading station LSR1. In another embodiment, the direction difference of the carriers engaged with the loading stations having different facings is about 180 °. The carrier system 3000 using the θ drive system 3600 rotates the carrier CAR 200 (eg, rotates θ) to align the carrier with the desired directions CAR A, CAR A 'and the desired carrier. Can be engaged with the loading station. As can be seen in FIG. 41A, the θ drive system of the transfer system 3000 can perform θ rotation of the carrier about 180 °, and as described in detail below, the θ drive system 3600 performs in this embodiment. Θ rotation of the carrier CAR 200 is about 270 °. In this embodiment, the θ drive system can execute θ rotation of the carrier by an arbitrary amount.

Referring again to FIG. 41, in this embodiment, as previously described, the transfer system 3000 is generally a fast transfer section 3100 (eg, a conveyor or other suitable mass material transfer device. There may be a separate transfer vehicle or May be absent) and the interface transfer system section 3300 (operated transfer section 3100 between the high speed transfer section and the tool loading station so that the feed rate remains almost constant whether loading or unloading containers into the loading station). Connecting carriers). In FIG. 42, the interface transfer section 3300 is depicted in an overhead gantry 3310 configuration, and in other embodiments the interface transfer section may use other suitable configurations. In the embodiment shown in FIG. 42, the gantry 3310 (which can be configured modularly with any number of gantry) is generally a traverser 3314 in two axis movement (eg, x, a moving platform 3312 arranged to provide a y axis, see FIG. 41). Since the traverser 3314 can be configured in a suitable form and includes a hoist device, the Z-axis movement can be performed by raising or lowering the carrier grip of the gantry that holds and holds the carrier CAR 200. A suitable example of a traverser vehicle is an Aeroloader ™ transport vehicle available from Brooks Automation, Inc. As mentioned above, the gantry 3310 may be configured to select or place a carrier at the conveyor section 3100 (see FIGS. 43-45) and to select or place a carrier at the loading station of the process tool. In this embodiment, a storage station 3000S is provided (eg, see FIG. 41B) and the interface transfer section (eg, gantry 3310) is a transfer conveyor section 3100, or a storage station 3000S. The container in the loading station of the process tool can be accessed and the carriers (CAR 200) in between can be moved in the desired order as described above. As described above, FIG. 50 shows a representative example of several carrier movements. For example, the movement between the conveyor sections 3100R1 and 3100R2 and the loading stations LSR1 and LSR2 in one of the tool rows R1 and R2 or two loading stations LSR1 in the same tool row or another tool row. There is a movement between LSR2, or a movement between the loading stations LSR1, LSR2 and the storage station 3000S. This movement is performed by the gantry 3310 of the interface transfer section 3300.

In this embodiment, the gantry 3310 includes a θ drive system 3600, as will be described further below. As shown in Fig. 50, in this embodiment, the carrier CAR 200 (indicated by arrow θ) can be rotated during the transfer by the interface transfer section 3300 to change the carrier direction as desired. For example, the carrier CAR 200 can be set in any direction when carried by the conveyor sections 3100R1, 3100R2. In other words, the direction of the carrier CAR 200 of the conveyor conveying apparatus may be different from the direction in which the carrier is arranged in the loading stations LSR1, LSR2. For example, the carrier (CAR 200) is in the desired direction of the carrier (indicated by feature CAR A ') (about clockwise) about 270 ° (indicated by feature CAR A in Figure 50) when engaged to the destination loading station. It can arrange | position to the conveyor conveyance apparatus 3100R2. The carrier CAR 200 may be transferred from the conveyor 3100R2 to the desired loading station LSR1 by the gantry 3310 of the interface transfer section 3300. This is generally indicated by arrow C2L1 in FIG. In this embodiment, the orientation of the carrier can be changed by the conveying section during movement (e.g. initial orientation of the conveyor (to feature CAR A) to engage the carrier CAR 200 with the loading station LSR1. Display) to the desired loading direction setting (marked as feature CAR A ') (rotated about 270 ° clockwise)). FIG. 42A is a partial perspective view of the gantry 3310 of the interface transfer section 3300 with the carrier CAR 200 being held by the traverser 3314, for example, adjacent the typical loading station LSR2. The carrier CAR 200 is wound by a gantry set in a direction adjacent to the loading station facing the loading station LSR2. The position shown is a typical example of the position before or after disengaging the carrier with the loading station. The carriers transported by the transport system 3000 along the travel path (eg, travel path C2L1) shown in FIG. 50 to load / unload the loading stations LSR1, LSR2 are gantry 3310 as shown in FIG. 42A. Is placed by. In this embodiment, changing the direction by rotating the carrier CAR 200 θ to engage the load station is performed “in real time” as the gantry moves the carrier to the loading station. [Theta] rotation of the carrier can be performed at any time while moving the carrier by the gantry. In other embodiments, it may not be possible to perform θ rotation of the carrier “in real time”. In this embodiment, the gantry can unload the carrier at the loading stations LSR1, LSR2 and move it to the desired conveyors 3100R1, 3100R2, and change the direction of the carrier by θ rotation during the movement. For example, the carrier can be rotated and placed in advance. For example, it can then be oriented in the direction corresponding to the next expected arrival station or loading station (the next expected arrival station direction and the corresponding carrier direction can be confirmed by the transfer system controller). As mentioned earlier, there is at least one carrier (CAR 200) moving between the conveyor conveying units 3100R1 and 3100R2 and the loading stations LSR1 and LSR2 or between loading stations of the same or different tool rows R1 and R2. It can arrange | position temporarily to the above carrier storage station 3000S. Also, the orientation of the carriers disposed in the storage station (s) may differ from the desired carrier orientation when engaged with the loading station. For example, a carrier disposed in the storage station 3000S by the interface transfer section 3300 (eg, gantry 3310 or feeder robot 3320, see FIGS. 42, 44) is oriented according to some previous criteria. Is determined (ie the carrier can be set in the direction corresponding to the last unloaded loading station). This orientation may be different than matching the next loading station that will engage the carrier. Therefore, in this embodiment, the gantry sets the direction by executing θ rotation of the carrier when moving the carrier from the storage station 3000S to the loading station (for example, when moving along the path indicated by the arrow SL1 in FIG. 50). Can be changed. [Theta] rotation of the carrier is carried out "in real time" similar to that described previously. The gantry can also place the carrier in the storage station 3000S in the desired direction for later interface. For example, when unloading a carrier at the loading station, it can be done in a similar manner as described above. The gantry can change the orientation of the carrier by θ rotation when moving the carrier from the loading station to the storage station. In this embodiment, the gantry may preset the orientation of the carrier by rotating the carrier when moving the carrier from the conveyor transporter to the storage station. In the present embodiment, the gantry 3310 arranged to transport the carriers to the loading stations LSR1 and LSR2 of the other rows R1 and R2, respectively, carries the carriers from one row R1 to the other in the loading station of the rows R1 and R2. Can be moved to the loading station of R1, R2) (one movement or a series of movements), and the carrier matches the destination loading station in the initial direction corresponding to the loading station with the carrier removed by θ rotation during the movement. To the final direction).

Referring now again to FIGS. 42B-D, in this embodiment the θ drive system 3600 of the gantry 3310 may be included in the traverser vehicle 3314. As shown, the configuration of the? Drive system described below is just one example, and in other embodiments, the? Drive system may be configured in other suitable forms. In this embodiment, the traverser vehicle 3314 generally has a base vehicle section 3340, a hoist mechanism 3332 and a carrier gripper section 3344. In this embodiment, the base vehicle section 3340 is supported while moving on the moving platform of the gantry (see FIG. 42). Hoist mechanism 3332 attaches carrier gripper section 3344 to base vehicle section 3340. Hoist mechanism 3342 can be raised or lowered to raise or lower the carrier gripper section relative to the base vehicle section. The carrier gripper section can be configured to connect with the carrier and to grasp or release the carrier. Turning now to FIGS. 42C-42D, a perspective view and a top plan view of the carrier gripper section 3344 respectively appear. In this embodiment, the θ drive system 3600 is included in the carrier gripper section 3344. In other embodiments, the θ drive system may be included in the gantry traverser in other ways. In this embodiment, the upper and lower ends 3344F and 3344R are included in the carrier gripper section 3344. The parts are joined together by an axis (such as a rotary shaft) to allow relative rotation between the parts (in the direction indicated by the arrow θ in FIG. 42C). In this embodiment, the top component 3344F can be connected to the hoist band or member 3332H (see FIG. 42B). At the lower end 3344R there is a carrier gripper mechanism that engages the carrier. The carriers caught in the gripper mechanism are fixed relative to the lower end 3344R of the traverser carrier gripper section. In the embodiment shown in FIGS. 42B-D, the θ drive system 3600 generally consists of a motor 3602 (an appropriate servo motor or stepper motor), a shaft 3604 and an encoder 3606. The motor 3602 has a stator fixed to the upper end 3344F of the carrier gripper section and a rotor mounted to the shaft 3604. The shaft 3602 is fixed to the lower end 3344R of the carrier gripper section. As such, the motor can rotate the lower end 3344R, thereby rotating the carrier held by the carrier gripper. Encoder 360 (of the appropriate type) identifies both the absolute and traveling positions of the shaft relative to a control system (not shown). As mentioned earlier, in this embodiment, the θ drive system can be arranged to make about 270 ° rotation, that is, θ rotation. Thus, this allows the transport system to rotate the carrier at least about ± 90 ° at any initial orientation. In other embodiments, the θ drive system can be configured to the desired shape and the carrier can be rotated within the desired rotation range.

In another embodiment, cylindrical carrier nests can be placed to further increase the storage density of the FAB. Cylindrical storage nests can stack carriers on top of each other and provide a mechanism for raising or lowering the carrier to a specified height. The vertical movement mechanism is pneumatic, mechanical or magnetic.

Referring now to FIG. 51, there is shown a top view of a transfer system 4000 according to another embodiment. The transfer system of the embodiment shown in FIG. 51 is a typical section, such as the interbay portion of the FAB overall transfer system, and in other embodiments the transfer system can be arranged in any size and configuration. The transfer system 4000 of the embodiment shown in FIG. 51 is generally similar to the transfer system 3000 described above and shown in FIGS. 41-50. The numbers assigned to the features are similar. Similar to the transfer system 3000, the transfer system 4000 of the embodiment shown in FIG. 51 has a mass high speed transfer section 4100 (eg, a conveyor) and an interface section 4200. The interface section 4200 shown in this embodiment is only one example, and in other embodiments, it may be arranged in any configuration in which there are as many subsections as desired (eg, storage sections, shuttle sections similar to those described above). Can be. In general, the interface section 4200 has a large number of feeder robots capable of connecting carriers between the mass transfer system section 4100 and the process tool. The mass transfer system section 4100 is generally similar to the transfer system described above. Part of this system is shown in FIG. 20. In the embodiment shown in FIG. 51, the mass transfer system section 4100 consists of a track with a solid state conveyor system. This track is similar to the conveyor track described in US Patent Application No. 10 / 697,528, and Application No. 11 / 211,236, both incorporated herein by reference in their entirety. In the embodiment shown in FIG. 51, the transfer system 4100 is an asynchronous transfer system (similar to the transfer system 500) that is substantially separate from the operation of other carriers to which carrier transfers of the transfer system are transferred. As a result, one or more carriers can make independent movements (eg acceleration / deceleration, stop, load / unload) during transfer, thereby transferring other adjacent or close carriers in the carrier transfer flow of the transfer system. Speed is not affected

In the embodiment shown in FIG. 51, the mass transfer system section (hereinafter referred to as mass transfer device 4100) is generally comprised of a main transfer track 4100M. The mass transfer device 4100 has a large number of siding tracks 4100S. The main conveying path (or flow) of the carrier conveyed by the mass conveying device is determined by the main conveying track 4100M, which is shown in FIG. 51 in the form of a loop (which may be any other form in other embodiments). Although the description of this embodiment is specifically for the carrier, the features described herein are equally applicable to other embodiments in which the (substrate) carrier is placed on a payload platen or other power unit carried by a mass transfer device. have. In this embodiment the main feed path is continuous and maintains a substantially constant speed. As such, the carriers transported in the main transport track (s) 4100M can sustain high travel speeds throughout the main transport path without being delayed by carriers stationary on the transport system. In fact, the siding or branching track 4100S can separate work in the main transport path that affects the transport speed of the carriers on the mass transport device. As mentioned earlier, such operations affecting speed can be performed on the siding track and therefore do not adversely affect the main feed path. Thus, the siding track 4100S may designate an area of the carrier buffer, loading / unloading station or path switching device. In this embodiment, one siding track is shown as an example, but in another embodiment, siding tracks can be arranged as desired. The siding configuration of the illustrated embodiment, i.e., splitting a nearly straight segment of the main track into two and then rejoining is just one example, and in other embodiments the siding track may be configured in any other form. For example, the siding track may redirect between both sides of the main track loop (within a given bay) and transfer between different bays (e.g., bay-to-bay) as shown in FIGS. 29A, 29B. It is also possible to switch directions between the main tracks of the section or in the bay-to-bay (or in-bay-to-bay) transport section. In other embodiments, the siding may be set in a direction other than the main track and traverse above or below the main track. In other embodiments, the intersection point between the main track and the siding track may be arranged in a desired manner (eg, at nearly right angles or in a switch).

In the present embodiment, the main track and the siding tracks 4100M and 4100S are modularly connected to each other and constituted of modular track segments A, B, C, D and L that constitute a mass transfer device track. The carrier is driven in tracks 4100S and 4100M of the mass transfer device by a linear motor. Similar to the track 500 described above, the force of the linear motor is disposed in the tracks 4100M and 4100S and the reactive portion of the linear motor is disposed in the carrier. The carrier can be used in contact with the track's contactless / slippery bearings (e.g. air / gas bearings) or contact bearings (e.g. rollers, ball / roller bearings) to the appropriate solid state support members of the carrier. It is supported by moving on the track by such a suitable device. In other embodiments, the carrier (s) may incorporate motif supports such as wheels, rollers, gas / air bearings. Thus, the motive support that supports the carriers in the main and siding tracks can be placed on the tracks so that each carrier can be reliably supported on the tracks and distributed along the main and siding tracks to allow the carriers to move freely on the tracks. You can. In this embodiment, the linear motor is a linear induction motor (LIM), a linear brushless DC motor (etc.), but in other embodiments the main track of the mass transfer device using any desired linear motor or other type of motor / drive mechanism. And move the carrier (s) along the siding track. As mentioned above, in this embodiment, the four (or phase windings) 4120, 4120M and 4120S of the LIM are connected to the track modules A, B, C, D and L which constitute the main track and the siding track of the transport apparatus. Deployed, the carrier has a reaction rate / member of the LIM, which is described in more detail below. In another embodiment, a motor coil is mounted on the carrier or vehicle platen and a magnetically reactive element is mounted on the track.

Referring again to FIG. 51, the modular segments A, B, C, D, and L of the main track 4100M and the siding track 4100S of the illustrated embodiment are typical examples and in other embodiments may be configured as desired. have. The track segments A, B, C, D, L are generally similar except where noted. As shown in FIG. 51, in this embodiment the track segment (module) generally includes a single track segment (e.g., A, C, D, L) and a junction (track switching) segment. In other embodiments, other desired modular track sections may be used. For example, in another embodiment, a given track module (each of which constitutes a different carrier transport path) includes a plurality of tracks, which extend side by side in the form of what are generally referred to as non-junction multitrack modules. In this embodiment, a single track segment includes almost straight segments A, D, L, and a curved segment C. Of course, in other embodiments, a single track segment may be any other type desired. In the illustrated embodiment, the track sections are drawn at about the same height for illustrative purposes. In another embodiment, the main track and the siding track each include sections of different heights. For example, the siding may be placed at a different height than the main track and / or other siding. The main track and / or siding track may also have track sections of different heights (eg, high track portions and low track portions) on the track. Appropriate ramps (not shown) can be used to join track sections of different heights so that carriers moving along the track can switch between tracks. As can be seen in FIG. 51, the junction segments B, 4102, 4102 'can be placed where the siding track or branch track 4100S joins the main track 4100M or where the junction is needed. In the embodiment shown in FIG. 51, two junction track segments 4102 and 4102 'are illustrative. The configuration of junction segments 4102, 4102 'in FIG. 51 is such that a single branching track is joined / branched at one side of the main track 4100M (eg, left relative to the direction indicated by axis X in FIG. 51). This is just one example. In another embodiment, the junction segment may branch to the right of the main track. In other embodiments, the junction segment may be configured in other forms. For example, one segment can have multiple branches and branches on the opposite side of the main track. The branches may be nearly opposite or staggered from each other, or may have multiple branches on one side of the main track (eg, right and / or left). In this embodiment, the single track segments A, C, D, L are generally similar, although different in form (eg, straight, curved, etc.). Each track segment A, C, D, L includes a corresponding section of the motor forcer 4120. As can be seen in FIG. 51, assembling the modular track segments results in a nearly continuous motor forcers 4120M and 4120S determined by an integrated motor forcer section (of various track sections) for operation (using the appropriate controller). The main track and siding track can act on the reactive plate (s) of the carrier (s) / platen (s) to drive the carrier / platen in the longitudinal direction of the main track and the siding track. In other embodiments, the track may include one or more segments without an integrated forcer section.

The forcer 4120, ie otherwise referred to as the main coil assembly of the linear motor, generally consists of a thin steel sheet and phase windings in a LIM arrangement. Phase windings can be made integral with the track segment or placed in a forcer housing connected to the track segment. In this embodiment, the phase windings of the linear motor forcer embedded in the track segment can be arranged in another suitable form. The forcer section of each segment A, C, D, L (see segment C in FIG. 52) may itself be divided into segments or may be continuous. Curved track segment (C) has a forcer section (4120C), which may be placed with a phase winding such that the coil assembly defines a curve proportional to the curvature of the track, or a generally curved forcer section. There may be a four section section divided into arranged segments. Other embodiments may make the forcer section of the track segment any other desired shape. The forcer sections of the track segments A, C, D, L may be arranged symmetrically with respect to the track and the carrier (s) running the track. In other embodiments, the forcer may be placed asymmetrically with respect to the track and the carrier on the track.

54 is a cross-sectional view of a typical track segment A and a typical carrier 5000 supported thereon during movement. As already mentioned, the main track (s) and siding track (s) 4100M, 4100S generally provide the carrier (s) 5000 with power, motive support and guides to control the movement of the carriers on the track. . As mentioned previously, in this embodiment, the linear motor driving the carrier (s), such as the LIM, causes the forcers 4120M, 4120S, which operate using the reaction plate (s) / element of the carrier, to be pulled to one side. Referring again to FIG. 53, a bottom view of a typical carrier 5000 and the reaction plate (s) 5100 of the carrier is shown. The placement of the reaction plate (s) 5100 in the carrier shown in FIG. 53 is just one example, and in other embodiments, the reaction plate of the carrier may be arranged in other suitable forms. In other embodiments, the number of reaction plates may vary. In this embodiment, the reaction plate 5100 is indicated at the bottom of the carrier. Of course, in other embodiments, the reaction plate may be placed on the other side or part of the carrier. In this embodiment, the reaction plate (s) 5100, such as defining the area of the LIM, are made of metal such as steel or aluminum, but other suitable materials may be used. One or more reaction plates may be made of ferrous (magnetic) material as described below. In another embodiment, the reaction element includes a permanent magnet arranged to cooperate with a motor phase winding, such as a linear brushless DC motor. The reaction plate (s) of the carrier may include one or more plates (5102) corresponding to the four (4120M, 4120S) of the track (4100M, 4100S) to send a driving force along the main track or siding track. This is the diagram shown in FIG. Reaction plate 5102 is depicted as one plate in FIG. 53, but may include as many plates as desired, such as the arrangement shown in FIGS. 20C and 20D. As previously described, the tracker's 4120 (and the four's section 4120A and 4120C, see FIGS. 52 and 54) and the corresponding reaction plate (s) 5102 are positioned approximately symmetrically relative to the carrier and track. can do. In other embodiments, the motor forcer may be asymmetrical.

In the embodiment shown in FIG. 54, the carrier (s) 5000 are supported in motion on the track by a suitable air bearing 4200. The distribution of gas / air / fluid bearings shown in FIG. 54 is just one example, and in other embodiments, exhaust ports may be arranged to stably support the carrier exiting the track so that the gas pressure is distributed in another desired form. In another embodiment, a gas port may be introduced into the carrier exhaust gas to lift the carrier off the track. As already mentioned, in other embodiments the motive support between the carrier and the track is of any desired type and independent of the track segment or carrier (s). The gas port of the air bearing 4200 and / or the gas working region of the carrier can be configured to produce a directional force that can guide the carrier horizontally relative to the track. The gas port can also be connected to a suitable gas supply (not shown). In this embodiment there is a gas conduit in the track section for supplying gas from the gas supply to the gas port of the fluid bearing. Appropriate valve actuation and control may be included to operate the gas port in the vicinity of where the carrier is on the track. The control function is active (ie, the sensor can identify the presence of the carrier and turn on / off the gas port acting on the track section where the carrier is known to be active).

In the embodiment shown in FIGS. 51-52 and 54, tracks 4100M and 4100S may include a control and guidance system 4130 to guide the movement of carriers propelled along the track. Guide system 4130 is a contactless system that extends along the main track and siding tracks 4100M and 4100S. In this embodiment, each track segment A, C, D, L may include a corresponding section (see FIGS. 52, 54) of the guidance system 4130A, 4130C. The guide system is integrated with each other when the segments are combined to form a continuous guide system for the track. In other embodiments, the guide system can be mounted on the track independently. In other embodiments, the guide system may be of another type as appropriate, and the support system of the track (e.g., a roller or wheel that helps to connect each other in the track or carrier and maintain the orientation and horizontal alignment of the carrier moving along the track). ) And / or integrated with the linear motor (described in detail below) and / or independent of the carrier support and the linear motor. In this embodiment, the guide system 4130 of the tracks 4100M and 4100S generally consists of guide magnet tracks 4130M and 4130S that extend substantially parallel to the linear motor forcers 4120 of the track. For example, the guide magnet track may consist of permanent magnets arranged sequentially to make up the magnet track. Track parts, such as OT switches / junctions, contain an electro-magnet that can be switched on and off. In another embodiment, the guidance system includes providing a winding capable of generating inductive forces on the carrier to the motor of the track section. The guiding winding can be integrated into a linear forcer or can be independent of the forcer pushing along the track. The guide force of the track interacts with the appropriate guide plate / element 5104 (magnetic material of the carrier (eg ferrous metal) or permanent magnet) to keep the carrier in the desired horizontal position relative to the tracks 4100M and 4100S. You can. In another embodiment, a locking device that generates an inductive force mounted on the carrier guides the carrier in conjunction with the stator element of the track. As described above, in this embodiment, the track segment modules A, C, D, L have corresponding sections 1430A, 1430L of the guide track as shown in FIGS. 52 and 54, respectively. In this embodiment, the guide track sections 1430A, 1430L of the track sections A, C, D, L are arranged on opposite sides of the four-side 4120A on two guide tracks 4132, 4134 (as an example). 54). The position of the guide track shown is one example. In other embodiments, fewer guide tracks or more guide tracks may be provided at any desired location. The guide plate / element of the carrier interacting with the guide track is based on the X axis of the linear motor reaction plates 5104R, 5106R, 5104L, 5106L (see FIG. 53) for the other sections of the linear motor described below. May be off axis, or any other suitable ferrous metal plate / element independent of the linear motor reaction plate. In another embodiment, the carrier may guide the magnet element, and the track may have an iron metal / magnetic material track disposed to interact with the magnets on the carrier to define the area of the track guide system. The guide system may include a positioning / position sensing system / device such as a Hall Effect sensor, LVDT, etc., which is communicatively connected to the controller and controls the movement of the carrier on the track. Positioning system / apparatus is similar to that described in US patent application Ser. No. 11 / 211,236, which is incorporated herein by reference in its entirety. For example, positioning feedback information on the main track and siding track may be provided by the appropriate Hall effect sensor of the LIM.

Referring now again to FIG. 52, a plan view of the track segment C and the typical junction segment B described above is shown. The other junction segment of the mass transfer device 4100 is generally similar to the junction segment (B). In this embodiment, the junction segment has a parser section for both the main track and siding tracks 4120M and 4120S. There is also a switching linear motor forcer section 4125 in segment B in this embodiment. In the present embodiment, a separate linear motor independent of the linear motors of the main track and the siding track is disposed at the junction to perform carrier switching between the main track and the siding track as described below. In this embodiment, the switching linear motor is a LIM. Of course, other suitable linear motors can be used, such as a brushless DC motor. In other embodiments, other suitable electromechanical switching systems may be used. As shown in Fig. 52, in this embodiment, the four-poser 4125 (for the switch motor) is disposed separately from the four-posers 4120M and 4120S of the main track and the siding track. The forcer section of the main track can be further divided into subsections 4122, 4124, 4126 as shown. The subsections 4122, 4124, 4126 of the main track forcer may be physically separated as shown and replace the section 4124 from the switching LIM forcer 4125 with other adjacent main track LIM forcer sections 4122, 4126. It can also be separated from each other by the controller so that the power can be turned off independently. The configuration of the four segments 4122, 4125, 4124, 4126 and the guidance system of the junction segment shown in FIG. 52 is just one example, and in other embodiments, the junction segment may be configured in other forms as desired. As shown in Fig. 52, in this embodiment, the switching forcer 4125 is separated from both the main tracker and the siding tracker in the direction in which the siding tracks join / branch (e.g., left on the X axis). In this embodiment there is one end 4125M which is generally aligned parallel to the direction of the main track (indicated by the X axis) at one end of the switching forcer 4125 and at the other end (indicated by the axis b in FIG. 52). There is the other end 4125S which is generally aligned in parallel in the local direction of the track. In this embodiment, the local direction of the siding (axis b) at the exit / entrance of the main track is sharply bent relative to the movement direction (axis X) of the main track. As such, the carrier utilizes the momentum force on the X axis to perform switching and does not completely eliminate the momentum on X when moving to siding (ie does not stop on the main track). According to another embodiment (see FIG. 52C), the junction segment is provided with a switching guide 4130S '(tracks 4132S', 4134S ") instead of the switching forcer 4125 and on the moving axis (i.e., the X axis). The switching is performed without the motor A 'by carrying out the switching using the kinetic force of the carrier, which will be explained in detail below .. As described in another embodiment, the angle between the entry / exit of the siding and the direction of the main track Can be set as desired (for example, when crossing at right angles. In such a case, the configuration of the switching linear motor can utilize the driving force in the X direction.) As shown in Figs. One end 4125M of the LIM forcer 4125 is arranged to operate on one or more reaction plate (s) 5104, 5106 of the carrier (see Figure 53.) The reaction plates 5104, 5106 (along the Y axis). Are laterally offset. In addition, the reaction plates 5106L and 5106R are also offset longitudinally (along the X axis) from the desired reference point (i.e., the center) of the carrier. In other embodiments, other desired reaction plate arrangements with more or less reaction plates in the carrier may be used, as described above, switching one or more reaction plate (s) 5104L, 5106L to the switching forcer 4125. In combination with the main track 4100M to siding 4100S (and siding 4100S, the converse junction at the other end of the segment 4102 ', and vice versa (see FIG. 51)). .

52B, the guide magnet section 4130 is arranged to switch between the main track and the siding track in this embodiment. As shown in Fig. 52B, in the present embodiment (on the side adjacent to the siding inlet) the guide magnet track 4134 is interrupted so that a portion of the switching guide track 4134S 'at that position joins the track 4134M. The interface of the guide track shown in FIG. 52B is just one example, and in other embodiments, the track interface / exchange device may be arranged in another suitable manner. The opposite guide magnet track 4132M (which is on the opposite side of the siding inlet) may integrate with the corresponding switching guide 4132S ', as shown. In this embodiment, each of the guide tracks 4130M and 4130S 'includes a section 4132J (see FIG. 52) to constitute an operable magnetic field that can be turned on and off. For example, the section 4132J of the guide track may consist of an electromagnet coil. An electromagnet coil is similar to a magnetic chuck that places permanent magnet (s) and coils around the windings, causing the magnetic field in the guide magnet section to turn on and off as a result of the current passing through the coil, releasing inductive forces between the carrier and the guide track. In other embodiments, an executable magnetic section may be arranged in any other desired form. The guide magnet sections 4132J of the desired guide tracks 4132M, 4132S ', 4134S, 4134S' are "on" / "off" for switching. For example, to keep the carrier on the main track, set the main guide tracks 4132M and 4134M to "on" and the switching guide to "off". During the transition of the carrier to siding, the switching guides 4132S ', 4134S' are "on" and the main guide is "off". Setting the guide magnet sections 4132M and 4134M to “off” allows them to move freely laterally (separate from the main track) because the carrier is no longer secured to the main track. In other embodiments where the guide magnet is in the carrier, a suitable winding may be included in the junction segment guide system to generate and send a canceling magnetic field to the carrier magnet. The junction segment may also include one or more actuable guide magnets (not shown) that are generally aligned with the inlet (axis b) of the siding. Setting this guide magnet to " on " (moved by the forcer 4125) guides the carrier to the siding track 4100S. This guide magnet section “offs” when the carrier moves over the junction and continues to be on the main track. Thus, as an example of switching the carrier from the main track to siding, in this embodiment the deactivator section 4124 is deactivated, the guide magnet sections 4132M, 4134M are “off” and the switches of the guides 4132S ', 4134S' are switched off. To "come". The kinetic force of the carrier deflects the orbit of the carrier in the direction of arrow b towards the siding while moving along the track with the switching guide (see FIG. 52). The forcer 4125 (if provided) may send the carrier from the main track toward the siding inlet. Of course, in this embodiment, there must be sufficient carrier momentum to move the carrier toward the siding until the siding forcer 4120s acts on the corresponding reaction plate (s) 5102 to keep moving along the siding track 4100S. . Guide magnet track 4130S grabs the magnetic elements of the carrier and guides the carrier along side track 4100S. In this embodiment, no position feedback is used for switching because carrier switching is generally done in a passive manner. In an embodiment using active switching, the guidance / positioning system performs position feedback while switching the carrier from the main track to the siding track. The guidance / positioning system is arranged to capture the position of the carrier on the main track before handing over to the switching LIM forcer, allowing the carrier to pass over to the siding track LIM while continuing position feedback as the carrier switches through the switching LIM. As such, positioning devices are suitable for continuous or distributed devices (e.g. optical, magnetic, bar code, standard strips, laser / beam ranging or wireless ranging), which are arranged to provide position feedback during switching. It's kind.

Referring now to FIG. 52A, there is another top view of the junction segment B ′ of a mass transfer device according to another embodiment. Junction segment B 'of this embodiment is similar to segment B shown in FIG. 52 except as otherwise noted. The guide magnet track is not clearly shown in Fig. 52A. The main track LIM forcer section 4120M 'of segment B' also has a lower section 4124 'that can power off independently of adjacent forcers 4122' and 4126 '. In this embodiment, the siding LIM forcer 4120B 'is fully enlarged toward the main track so that it can operate on the carrier's reaction plate 5106L' when the carrier is on the main track. This is illustrated in FIG. 52A where the reaction plates 5102 ', 5106L' of carriers arranged to effect switching are (faintly) indicated. For example, the reaction plate 5102 'of the track LIM is disposed above the main track forcer segment 4124' and is separated from the adjacent "upstream" main track forcer 4122 '. And reaction plate 5106L 'is arranged to cooperate with siding LIM forcer 4120B'. Thus, to make the switch, the main track segment 4124 'is powered off and the siding forcer 4120B' is powered to send the carrier to the siding track. Switching from siding to main track is done in a similar way. In other embodiments, the linear motors of the main and siding tracks are suitable linear motors, such as DC brushless motors or other brushless iron core motors. In another embodiment, the permanent magnet reaction element is in the carrier and in another embodiment the permanent magnet is in the track segment (core motor of the carrier). In another embodiment, phase windings are placed on the track (similar to those shown in FIGS. 20A, 20B) or placed on a carrier to cancel the magnetic field between the magnet and the motor core resulting from the interaction of the magnet / iron core elements of the motor. Eliminating inductive forces causes the carrier to switch from one track to another.

Referring now again to FIG. 51, in this embodiment, there is an area I in which one or more track segments L are supported on the track by the robot of the interface section 4200. In the lift region I, the guide magnet track 4130S is provided with a section having a magnetic field capable of operation similar to the section 4132J shown in FIG. In this embodiment, phase winding is used to cancel the magnetic field between a magnet in the track or carrier and a magnetic material such as a linear motor iron core or a ferrous metal reaction plate in the track or carrier. Thus, the carriers held on the tracks are "unleashed" so that the carriers can be easily supported on the tracks.

Referring again to FIG. 53, in this embodiment there is a coupling 5200 that connects one or more carriers to the one or more carriers 5000 as a carrier train. This coupling is a suitable type, such as a magnetic coupling that can be connected to the controller during operation to turn the coupling on or off. In this embodiment, the intercarrier coupling is a mechanical coupling. Coupling 5200, shown in FIG. 53, may be arranged in a carrier as desired in other embodiments. The intercarrier coupling is used to load two or more carriers together while being transported to the mass transfer device 4100. This allows one or more of the carriers to be the engine of that train and any other carriers on that train to be passive. 51 is a carrier train according to another embodiment. Thus, the carriers carried on the train are batched within the train, so that the movement of the "engine" carrier (s) of the train can be controlled to make all carriers move. This greatly reduces the burden on the controller. The location information of any carrier of the train is registered in the controlled reference information of the carrier train (ie, the reference information of the "engine" carrier). Thus, if necessary, the controller can identify and find the desired carriers without individually tracking the movement of each carrier moving in one train. By identifying the location of the carrier based on the reference information of the train, the rough location of the carrier can be identified on the track. Precise positioning with the track positioning system. In other embodiments, positioning can be done in a desired manner when disconnecting from the carrier train. Each carrier in the train may be an engine carrier. The engine carrier can be positioned within the carrier train to support the desired operating parameters. It is also possible to switch the engine position by deactivating the engine carrier and operating another carrier in the train as the engine carrier.

Referring now to FIG. 55, a cross-sectional elevation view of a transfer system A4000 according to another embodiment is shown. The transport system arrangement of the embodiment shown in FIG. 55 is just one example, and in other embodiments, the transport system may be appropriately arranged differently. The transfer system A4000 of the embodiment shown in FIG. 55 is generally similar to the transfer system 4000 described above and shown in FIG. 51, and the numbers assigned to the features are similar. The transfer system A4000 generally includes a high speed mass transfer section A4100 and an interface section 4200. There is one or more high speed mass transfer paths A4102 (two paths appear in the embodiment shown in FIG. 55 for reference) in the high speed mass transfer section A4100. In this embodiment, the mass transfer path A4102 can be configured to execute mass transfer of the carrier A5000 in the FAB in a manner similar to that described previously. In this embodiment, the mass transfer path A4102 of the mass transfer section A4100 can be arranged to transport the carrier moving the path at a fairly constant speed (for at least a portion of the path) in the path travel direction. The paths of the mass transfer sections can be connected to each other in a manner similar to that described previously. The interface section A4200 of the embodiment shown in FIG. 55 is generally similar to the interface section 4200 described above and shown in FIG. 51. In this embodiment, the interface section A4200 can connect the carrier between the mass transfer device and the process tool. The interface section A4200 generally has a shuttle section A4202 and a storage section A4204. As mentioned previously, the storage section A4204 can be placed with the storage location A4204A to store or buffer the carrier for many processing tools. The storage location A4204A can be arranged in any desired manner to efficiently buffer the carriers for processing tools. There are a number of feeder robots A4202 in the shuttle section A4202 that can connect a carrier between the storage location of the storage section A4204 and the load interface (ie, load port) of the processing tool. In the present embodiment, there is a transfer handoff section A4300 in the transfer system A4000 that can connect the carrier A5000 and the interface section A4200 being transferred at a substantially constant speed in the mass transfer section path A4100. Therefore, in this embodiment, the transfer system A4000 becomes an asynchronous transfer system even in the portion where the carrier moving along the path in the transfer system path is transferred at a substantially constant speed. In this embodiment, the transfer handoff section A4300 connects the operation of determining the conveying speed of the carrier while the carrier is being conveyed in the conveying path A4102 where the carrier is moved at a substantially constant speed by the conveying system A4000. You can turn it off.

Referring again to FIG. 55, the path A4102 of the mass transfer section can be configured with all types of mass conveyor systems. Referring now to FIG. 55A, in the illustrated embodiment, the path A4102 of the mass transfer section A4100 is drawn with a belt or ribbon conveyor A4103. The belt conveyor A4103 has a carrier support surface or transport surface A4604 supported by the belt A4103 for the transport of the carrier A5000. Accordingly, the belt A4103 and the carrier carrying surface (defined by the belt or dependent on the belt) move at a substantially constant feed speed along the feed direction of the path indicated by the arrow X in FIG. 55A. In another embodiment, a conveyor system that carries carriers along the path of the mass transfer system section may be configured in the desired configuration. For example, this path may have a solid state conveyor system as described previously, or may have mechanically defined conveyor equipment such as rollers, fluid bearings, and the like. In other embodiments, the path may be a track for an autonomous or semiautonomous vehicle. The conveyor system in the path may be configured to operate so that the carriers it carries are at a substantially constant speed, or may operate so that the feed rate is variable if desired. As a result, the conveying handoff section can be used to operate the conveyor system of the desired path (or a portion thereof) so that the conveying speed can be maintained almost constant regardless of the conveying speed determination operation of the carrier conveyed by the conveyor system.

In the embodiment shown in FIG. 55A, mass transfer section path A4102 is depicted as an overhead system above the processing tool. In other embodiments, the mass transfer section path may be placed at any desired height relative to the tool and the loading interface LP of the tool. 55, 55A-55C, the carrier A5000 of the embodiment is a typical example. The carrier A5000 is similar to the carrier 2000 of FIGS. 36A-36B described above. In this embodiment, the carrier A5000 generally has a top interface section A5002 (ie, generally arranged to connect and couple the carrier over the carrier) and a bottom interface section (ie, generally connect the carrier under the carrier). And arranged to engage. The carrier is side open, top open or bottom open as previously described. In another embodiment, the carrier is provided with a connection / engagement surface (eg, side engagement) capable of connecting the carrier to the loading interface of the transfer system and processing tool. In the embodiment shown in FIG. 55, the loading interface LP of the processing tool is a typical example. In this embodiment, the loading interface LP is arranged to connect with the lower interface section A5004 of the carrier. Of course, in other embodiments, the tool loading interface can be configured to engage a complementary carrier engagement feature on the other side of the carrier. The position of the tool loading interface LP relative to the transport system A4000 shown in FIG. 55 is just one example, and in other embodiments, the tool loading interface LP may be arranged as desired with respect to the transport system. In the embodiment shown in FIGS. 55, 55A, there is a carrier support A4104 arranged to couple the upper interface section A5002 of the carrier A5000 to the conveyor system of the mass transfer section path A4102. The configuration of the carrier support shown in FIGS. 55 and 55A is a typical example, and the carrier support is properly configured to complement and interlock with the coupling features of the carrier top interface A5002 to capture the carrier from the conveyor during transfer. I can let you hold it. In this embodiment, the carrier A5000 carries the conveyor of the path suspended under the path A4102. Carrier bottom interface A5004 may be accessible (under the carrier or on the side of the carrier) during transport in path A4102. In another embodiment, the carrier support in the conveyor in the path may be arbitrarily configured to engage and support the carrier during transport at the side or surface of the carrier (ie, the conveyor may engage or connect with the carrier bottom).

Referring again to FIG. 55, as mentioned above, the interface section A4200 of the transfer system is an overhead gantry system generally similar to the interface systems 3200, 3300, 4200 of FIGS. 41-46 and 51 described above. The interface system A4200 has an optionally variable number of transfer device movement planes (determined by the gantry A4201) in which the shuttle and feeder robot A4202 moves. As mentioned above, in other embodiments, the interface system may be configured in other forms as desired. In this embodiment, the gantry A4201 and the storage location A4204 are nested between the path A4102 of the mass transfer section. Feeder robot A4204 may be configured to engage carrier A5000 at carrier top interface A5002 and support the carrier from above. A shuttle (not shown) may support the carrier from above or below. In other embodiments, the interface robot and shuttle may be properly arranged. As mentioned above, the transfer of carriers between mass transfer section A4100 and interface section 4200 is accomplished by handoff section A4300 as described in more detail below.

55 and 55A, the handoff section A4300 generally has access to and captures carriers transported along the mass transfer path (by a substantially constant feed rate of the path), separates the carrier from the path, and interfaces There is a delivery surface on which the carrier / shuttle of section A4200 can put the carrier on a drop station that can access the carrier. Referring now to FIGS. 55B-55D, in this embodiment, there are a large number of carriers A4302 (one in the drawing for reference) in the handoff section A4300. As shown, the carriage A4302 is a vehicle or other suitable conveyor mechanism that can match its position with the carrier being transported in the path at a feed rate. As such, the carriage A4302 can move along the path (indicated by arrow X) a sufficient distance for the carriage to engage the carrier and separate the carrier from the mass transfer conveyor support A4104. In this embodiment, the carriage A4302 is depicted as a vehicle following the track or path A4304. Track A4304 is under path A4102 of the mass transfer section (see FIG. 55). For example, track A4304 is suspended on a hanger above the head. In the illustrated embodiment, the track and its carriage A4302 are under the interface section. As mentioned above, in other embodiments, the handoff section carriage may be configured in other suitable forms. In this embodiment, the handoff section is arranged so that the carriage can access the carrier of the path at each part on the path. The handoff section is distributed to the appropriate sections on the path. 55D, the carriage A4302 has a carrier interface A4306 that can be captured in combination with carriers on the path. The carrier interface A4306 of the carriage A4302 can be appropriately arranged. In this embodiment, there is a coupling feature that couples the bottom interface A5004 of the carrier to the carrier interface A4306 (see FIG. 55A). For example, the carriage interface A4306 has a dynamic coupling feature that complements the carrier's dynamic coupling feature, so that when the carrier and the carriage are engaged, they are manually aligned and create a positive passive engagement between them. In this embodiment, there is another passive or active coupling that captures the carrier to the carriage interface, i.e. a coupling system (e.g., clamp, magnetic chuck, etc.). As shown in FIG. 55B, the carriage A4302 is supported by the track A4304 so that the carrier interface A4306 of the carriage A4302 is sufficiently aligned with the carrier A5000 to allow coupling. Accordingly, the carriage track A4304 accelerates the carriage A4302 according to the moving speed of the path A4102, aligns and captures the carrier A5000 delivered by the path, and picks up the carrier at the path support A4204. It is enough to separate. In this embodiment, the carriage track A4304 is sufficient to allow the carriage to decelerate to the desired speed and handoff from the dropoff station DS to the interface system A4200. In this embodiment, the dropoff station DS is in a stopped state. Of course, it is possible to variably select a position along the handoff section track A4304. In this embodiment, the carriage is arranged on the same track as the infinite loop track and moves at a movement speed that substantially matches the path.

55A, 55D, the transport surface of the handoff section A4300 in this embodiment is close to the carrier (s) on the path and moves in the Z direction to load / unload the carrier at the path support. In the illustrated embodiment, the carriage is provided with a suitable Z drive (e.g. lead screw, pneumatic, electromagnetic) capable of driving the carriage interface A4306 in the Z direction.

Thus, for example, to unload the carrier in the path, the carriage interface A4306 is raised (aligning the carriage and the carrier side by side) to be in contact with the carrier interface A5004. For example, after joining the carriers, the carrier interface may be raised further to allow the carrier A5000 to separate from the path (e.g., to speed up or slow the carriage movement relative to the path to facilitate carrier separation at the path support). Can be done). The carrier separated from the path is lowered by the carriage A4302 so that the carrier removes the transport envelope of the carrier carried by the path. Loading the carrier into the path using the handoff section A4300 is about the same but in the opposite way. In other embodiments, the Z direction movement of the carriage interface may be performed in any other manner desired. For example, the support track may have a Z drive or lift, or may have a carriage support surface of varying height, such as an up / down ramp that raises or lowers the carriage in contact with a carrier on the path. In other embodiments, it may be close to the carrier and carriage while moving along the axis using a suitable drive or path or other means of movement of the carrier (for example, there may be a Z axis drive in the path support). In another embodiment, a movement axis or a termination axis close to the carrier and carriage may be present in the desired direction (relative to the reference frame) to couple / disengage the carrier from the path with the handoff section.

55, 55B-C and as described above, the handoff section A4300 has a drop station DS arranged to be accessible by the robot A4202 of the interface section A4200. In this embodiment, the drop station DS is separated in the mass transfer section path and the transport envelope TE of the carriers carried on that path, as in the Y axis (of course in other embodiments there may be an offset along the desired axis). Can be). The offset of the drop station DS (as shown well in FIGS. 55B-55C) is generally referred to as the lateral offset in the longitudinal direction defined by the path and indicates that the interface section A4200 approaches the upper carrier interface A5002. Make it easy. In addition, in the present embodiment, when the carrier is disposed in the drop station DS by the carriage A4302, the upper interface A500N of the carrier may freely engage with the interface section A4200. This is because the carriage is connected with the carrier at another carrier interface A5002. Therefore, in the present embodiment, the carrier can be directly transferred between the carriage A4302 and the interface section robot A4202 without any selection / arrangement operation in between. In this embodiment, the handoff system carriage is arranged so that the carrier enters the storage location and the interface section accesses the carrier at the storage location. In another embodiment, the handoff section carriage and the interface section robot are connected with the carrier at the common interface. In this embodiment, since the carrier is accessed from the top, the interface section can be connected to the carrier at the drop station DS using the feeder robot A4202. In another embodiment, the drop station of the handoff section can be detached in the proper direction from the transport envelope so that the interface section can access and connect to the carrier of the drop station.

55B-55C, in this embodiment, the carriage A4302 may move the carrier A5000 to or from the drop station DS. For example, the carriage has a suitable Y drive where the carriage can move the carrier to the drop station (the drive can provide the carriage, at least the part connecting / supporting the carrier's free movement in the offset direction). For example, the carriage interface A4306 is on a movable support that can move in the Y direction. In another embodiment, the carriage can be moved to the drop station while the carriage is moving in the Y direction (eg, a device with a carrier). In another embodiment, the shape of the track can be shaped to guide the carriage moving along the track to the drop station (eg, an endless loop that bends outward in the transport envelope).

Referring now again to FIGS. 56-56A, an elevation view of a typical transport system A4000 ′ according to another embodiment is shown. The transport system A4000 'of the embodiment shown in Figures 56-56A is almost similar to the transport system A4000 described above (the numbers assigned to the features are also similar). The transfer system A4000 'typically has a mass transfer section A4100' with a large number of paths A4102 ', handing off the carrier A5000' between the mass transfer device and the interface section and transferring the mass transfer section path. There is an interface section A4200 '(illustrated in one example as a gantry) and a handoff section A4300' that allows the carrier delivered by the carrier to maintain a substantially constant moving speed. In this embodiment, the separation between the drop station DS 'of the handoff section A4300' and the transport envelope TE 'of the path A4102', that is, the offset (feed rate without the transport envelope). Decision carrier operations / operations) may be performed by reorienting the path A4102 '. 56, in the present embodiment, there are sections A4102A ', A4102B', and A4102C 'each having different directions with respect to each other in the path. For example, this may occur at the intersection of the shunt / bypass section, the termination section of the path (see FIGS. 29A-29B and 51). As in the example shown in FIG. 56, path sections A4102A ', A4102B', A4102C ', each having a different direction, may be provided in the FAB zone where it is desirable to load / unload carriers in the mass transfer system path. In the embodiment shown in FIG. 56, the arrangement of the path sections A4102A ', A4102B', A4102C 'generally defines two bent regions. Each area is large enough to make a drop station DS by separating between the transport envelope TE 'and the handoff section. As mentioned earlier, the orientation and arrangement of the route section shown is only one example. In this embodiment, there is a handoff section portion A4300 'in each section. This part is very similar to the mutual and handoff section A4300 as shown in Figures 55A-55D described above. Each handoff section portion A4300 'has a carriage and moving track A4304' arranged to load / unload carrier A5000 '(see Figure 56A) in path A4102' (in a similar manner as described above). There is this. In each handoff section portion A4300D 'there is a drop station DS' of the carrier. In this embodiment, the drop station DS 'closely matches the transport envelope TE' of the track A4304 'and the path of the downstream or upstream portion shown in FIG. In this embodiment, the handoff sections A4300 and A4300B can be used to unload the carrier in the path, and other parts can be used to load the carrier in the path. For example, portion A4300 'may be connected to the carrier in path section A4102A'. The unloaded carrier A5000 'is transferred to the drop station DS' at the end of the track A4304 'and handed over to the interface section A4200'. Carriers intended to be loaded in the path are transferred to the drop station DSB 'of the portion A4300B' by the interface section A4200 'and handed off. The handoff section portion A4300B 'then loads the carrier into the path while moving the carrier by matching the feed rate and direction with the path section A4102C'. In another embodiment, each portion of the handoff section may load / unload carriers in the path (ie, the track has multiple drop stations arranged to support loading / unloading carriers based on the path and / Or the carriage runs along the track to perform both loading and unloading). As such, the transport system A4000 'is asynchronous.

Factory automation uses wafer identification to plan, schedule, and track each wafer throughout the process. The ID is machine readable and maintained by the host server's database. Wafer identification information in the database can be affected by equipment failure situations or software errors that damage the wafer. Therefore, we overcome this problem by using repeated reading steps in each process tool. The reading of the wafer by the machine generally proceeds after loading the carrier, removing the wafer and setting the orientation. The ID is reported back to the host for verification, and once authenticated, processing begins. In the past, it took a lot of time to find the incorrect wafers loaded. In addition, if the tool goes down by mistake, the wafer must be retrieved and re-entered into the carrier / database, which can cause mistakes. The carrier has an onboard recordable data tag that stores the wafer ID, and the load port can read the tag. According to the embodiment described above, the carrier has an interlock that links the ID tag that the carrier can record with the wafer ID of the load port. The recordable ID tag in the carrier contains an external digital input / output (I / O) signal. This signal is connected to a sensor that can detect pod door removal. This sensor is a suitable type for optical, mechanical, acoustical and capacitive. For example, low voltage signal lines are wired into the conductive pads of the pod shell and pod door. When the door is closed, the pads are in contact locally, completing the voltage flow. When the door is removed, the voltage flow is broken and a signal is recorded on the carrier ID tag.

According to one embodiment, a wafer reading method is implemented with a software integrity tag and a method of detecting when a door is opened. For example, an integrity tag is written to a recordable carrier ID after the wafer is loaded and the door engages the pod. When Ford reaches the next tool load port, it reads the tag along with the integrity tag. If the integrity tag is valid, it is assumed that the wafer ID is valid, unmodulated. If the integrity tag is not valid, the door has been removed and you can suspect wafer ID accuracy. Based on this information, the host performs a wafer read on the tool to verify its integrity.

According to another embodiment, an integrity wafer ID reading device may be embedded in the load port. This reading device reads the ID during the door open sequence to reduce cycle time. The present embodiment has the advantage that the cycle time is shorter than that embedded in the process tool, and the entire verification process can be executed separately from the process tool host communication.

According to another embodiment, a dedicated alpha-numeric display of each wafer slot in the carrier can be added to the carrier. The integrated display is related to the actual wafer ID present in the carrier. The character height is large enough to be read at a distance of about the length between the operator and the ceiling-mounted storage nest. In this embodiment, the ID integrity is shown in graphical form on the display. If the integrity tag is not valid, it is shown on the display in clear text or color.

Another embodiment is to integrate an external wafer ID reading device. The external wafer ID reading device is external to the load port and process tool in the AMHS system. The carrier with the wafer ID in question is loaded into an external reading device. Once the operation is complete, the door is locked and the integrity tag is recorded on the recordable carrier ID. The carrier now moves to the final destination storage / load port location. This method has the advantage that it is performed in parallel to the wafer carrier wait time rather than following the tool process time. In addition, the external readout device may include a wafer orientation method.

Referring now to FIG. 57, there is shown an elevation of a carrier door according to another embodiment. The carrier door of the embodiment shown in FIG. 57 is similar to the carrier of the embodiment shown in the preceding figures, except as noted otherwise. For example, the shape or border of the carrier door is round or cylindrical as before (similar to carrier 2000 in FIG. 36C). Of course, in other embodiments, the carrier may be any other desired shape, such as a flat boundary side. As detailed below, the carrier door 6070 is coupled in a detachable manner with the carrier shell 6060 to close the wafer (or other working area) opening of the shell and to isolate the interior of the carrier. In the figure, as an example, the carrier door 6070 is depicted as being at the bottom of the carrier 6000. In other embodiments, the carrier door may be disposed on the other side or surface of the carrier. As mentioned earlier, the carrier may be made of a metal (non-ferrous) material, or may be made of a nonmetallic material, such as a thermoplastic material.

As previously mentioned, when the carrier door 6070 is closed, the door 6070 and the shell 6060 become a seal 6080 at the interface between the carrier door and the shell as described below to isolate the interior of the carrier from outside air. Let's do it. Carrier door 6070 is snapped to this shell 6060, the door being securely fixed to the shell to allow carrier transfer by the latching system 6072. Latching system 6072 is a solid state (ie, no moving parts at all) in this embodiment. Of course, in other embodiments, the latching system may have both solid state and mechanically acting parts. In the embodiment shown in FIG. 57, a latching system 6072 includes a magnetic latching system 6074. Magnetic latching system 6074 typically has a magnet or field section 6074M, and has a responsive, ie platen section 6074R that reacts with the field section to create a locking force and engage the door in the shell. In this embodiment, the magnet section 6074M is distributed around the border of the container shell or around the border of the door-shell interface to generate a nearly evenly distributed magnetic field in the wafer opening of the carrier shell. In this embodiment, the magnet section 6074M is formed by a flexible (ie, multipolar) magnetic strip or ribbon. 57A is a diagram of the flexible magnet strip. In other embodiments, the magnet section or solid state latch system may be configured in any other suitable manner. The magnet sections are continuous or divided into segments and can be installed in the carrier to form the desired shape. In the embodiment shown in Fig. 57A, the multipolar magnet is attached to a flexible nonmagnetic material (e.g., an electromagnetic material) having restoring force or flexibility. In this embodiment, the magnet section 6074M is depicted as being mounted on an almost flat surface of the shell. The reactive section 6074R, which is a suitable ring or segment of ferrous material, is depicted mounted on the opposite surface of the carrier door. In another embodiment, the magnet section is mounted to the door and the reactive section is mounted to the shell. It can also be placed on different surfaces of doors and shells. When the door is closed, the reactive section is directed toward the flexible magnet of the magnet section, forming a door seal around the opening.

Referring now to FIG. 58, there is shown an elevation of a carrier 6000 ′ and a load port 6300 according to another embodiment. The carrier is generally similar to the carrier 6000 of FIG. 57. The carrier is depicted as being in engagement with the load port 6300 or at a location adjacent to the coupling with the load port 6300. The load port 6300 is generally similar to the load port shown in the preceding figures, except as otherwise described below. The load port of this embodiment has a solid state latching system that engages the carrier with the load port and engages the carrier door with the door port. For example, the load port contains a magnet (ie, an electromagnet) that acts on part of the carrier. Similarly, the door port has a magnet (ie an electromagnet) that acts on the magnet portion of the carrier door (see for example FIGS. 60-62). In this embodiment, the carrier door is separated from the carrier shell due to the coupling between the load port door and the carrier door. For example, the magnetic latch between the load port door and the carrier door is strong enough to overcome the force of the magnetic latch between the carrier door and the carrier so that the carrier door is unlocked and opened by the load port door. Conversely, when the port door returns to the closed position, the carrier door is automatically caught by the carrier. 59A-D are diagrams of four-way (ie, "X") interfaces between carrier shells, carrier doors, load port shells, and load port doors, in accordance with many different embodiments.

Referring now to FIGS. 60-62 a magnetic interaction between the carrier 6000 'and the load port 6300 is shown. As described above, the load port includes a solid state latching system that engages the carrier 6000 'with the load port rim 6310 and engages the carrier door 6070' with the load port door 6320. The solid state latching system includes a magnet, such as an electromagnet 6302 of rod pot rim 6310, which interacts with ferrous material 6301 in carrier shell 6060 ′. In other embodiments, the magnet 6302 is any suitable magnet. The ferrous metal material is a magnet section that is almost similar to the section 6074m described above and is disposed around the boundary of the carrier shell 6060 '. In another embodiment, the magnet section is a suitable ferrous material of any suitable shape. In another embodiment, the magnet sections may be continuous or divided into segments and installed in the carrier to form the desired shape. In addition, the load port door 6320 includes a magnet 6204 that is almost similar to the magnet 6302, and the carrier door includes a magnet 6303 that is almost similar to the magnet 6301. In another embodiment, magnets 6302 and 6304 are in the carrier shell and carrier door and magnets 6301 and 6303 are in the load port rim and load port door.

The load port 6300 includes alignment features that guide the Z axis operation of the carrier to the load port. Carrier alignment features are, for example, friction plate 6330 and dynamic pins 6630 'that interact with the carrier door 6070'. In other embodiments, appropriate alignment features may be utilized. In other embodiments, the alignment feature may interact with a portion of the carrier 6000 '. Alignment features may be spring or stationary as shown in the figures. This alignment feature is associated with the magnets 6301-6304 to match the carrier 6000 ′ to the load port 6300. In another embodiment, a carrier or alignment feature is used to match the carrier to the load port. In other embodiments, the carrier and the load port may be aligned in other suitable ways. Since the interaction between the carrier 6000 'and the load port 6300 is a solid state (i.e. there are no moving parts to engage the carrier with the load port), little guidance is required to match the carrier to the load port. It should be noted that In addition, the solid state latching system requires little effort to engage the carrier with the load port. Thus, the alignment feature is minimal in size and comes into contact with the carrier 6000 'almost simultaneously when the carrier touches the load port surface. It should also be noted that since little guide is needed and alignment features are minimized, friction between the carrier and the load port during engagement is reduced, resulting in reduced particle generation.

In operation, the load port rim 6310 and the magnets 6302, 6304 of the load port door 6320 are inoperative or “off”. Since the magnets 6302 and 6304 do not work, the carrier is placed in the load port 6300 without breaking the latch / seal between the carrier shell 6060 'formed by the latching system 6074 and the carrier door 6070'. can do. When the carrier 6000 'contacts the load port 6300, particles cannot enter the carrier at the same time as the magnets 6302, 6304 become active, i.e., " on ". As can be seen in FIG. 63, a seal is provided that shields the inside of the carrier from outside air. This seal abuts before the latching system that engages the carrier with the load port is activated, i.e. " on ". For example, the seal is a flat seal disposed between the carrier shell 6060 'and the load port rim 6310 and between the carrier door 6070' and the load port door 6320. This seal is in the form of an O-ring disposed between the carrier shell 6060 'and the carrier door 6070' and between the load port rim 6310 and the load port door 6320. In other embodiments, any combination of flat seals and / or O-rings are utilized. The seal is made of a deformable material (eg foam, rubber, etc.). In other embodiments, the seal is made of any suitable material. In another embodiment, a seal can be formed with the magnet 7040 shown in FIGS. 64C-64E.

In one embodiment, the seal is in the form of a molded seal 7050 shaped to be in contact with multiple surfaces simultaneously, as shown in FIGS. 64A-643. For example, as shown in FIG. 64A, the seal has a bent top portion and a bent bottom portion. Since the seal 7050 is deformable, when the carrier 6000 'is lowered, the bent upper portion is deformed, so that the carrier door 6070' and the load port rim 6310 are respectively connected to the contacts 7060B and 7060A. You will come across. Sealing between the carrier shell 6060 'and the load port rim 6310, and between the carrier shell 6060' and the carrier door 6070, may be provided by magnets, O-rings, flat seals, or the like. In other embodiments, the seal is provided in any suitable manner. In addition to the contacts 7060A, the load port door 6320 is in a closed position to isolate the interior of the processing tool / load port from outside air so that the bent lower end of the seal abuts the load port rim 6310. In this figure, the seal 7050 is depicted as being attached to the load port door 6320, but in other embodiments the seal is attached to the carrier shell 6060 ', the carrier door 6070', the load port rim 6310, May be attached to the load port door 6320 or any other suitable location. In other embodiments, the seal 7050 may have an arm, such as a feature that acts between the carrier shell 6060 '/ carrier door 6070 and the load port. In other embodiments, the seal may be configured in other suitable forms. During operation, seal 7050 isolates the processing tool through a seal formed at point 7060A. When the load port door 6320 is opened, the seal 7040 is removed to separate the carrier door 6070 'from the carrier 6000'. The seal formed by seal 7050 at point 7060B may prevent contaminants / air between carrier door 6070 'and load port door 6320 not enter carrier 6000' or processing tool / load port.

The operation of opening the carrier will now be described. As described above, the carrier 6000 ′ reaches the load port 6300. Carrier 6000 'is mechanically coupled to load port 6300 via Z-axis alignment features 6330 and 6330'. Carrier shell 6060 'allows it to float during the mechanical coupling. The alignment feature guides the carrier 6000 'to the minimum level while the carrier / load port latching system is operating. Carrier door 6070 ′ is hung on load port door 6320 through magnets 6303, 6304. Carrier shell 6060 ′ is hung on load port rim 6310 via magnets 6301, 6302. Magnets 6303 and 6304 overcome the force of the magnet to engage carrier door 6070 'with carrier shell 6060' and carrier door 6070 'is released from carrier shell 6060' and detached from shell 6060 '. To be. The wafer is lowered to the robot transport height and removed from the carrier 6000 '. In the present embodiment, the bottom load carrier is utilized, but in other embodiments, any suitable carrier (eg, front load, etc.) may be utilized.

To close the carrier, the wafer is raised into the carrier 6000 'at the robot transport height. Insert carrier door 6070 'into carrier shell 6060'. The carrier door is fastened through the carrier door / carrier shell latching system described above. As the magnets 6302 and 6304 are turned off, the carrier shell 6060 'and the carrier door 6070' are released at the same time. In another embodiment, the carrier shell and carrier door are randomly released at different times. The carrier can now be removed from the load port.

It should be noted that the above description is intended to help understand the invention. Skilled artisans can devise various alternatives and improvements based on the principles of the invention. Accordingly, the present invention is intended to include all alternatives, improvements and variations that fall within the scope of the filed patent.

Claims (6)

At least one processing tool for processing a semiconductor workpiece; A container holding at least one semiconductor workpiece therein for transferring to and from the at least one processing tool; Elongated, defining the direction of movement and having portions that interface with the container, support and transport the container along the direction of movement to the at least one processing tool and also support and transport from the at least one processing tool. A first conveying section comprising: the first conveying section which is conveyed substantially continuously at a substantially constant speed when the container is supported by the first conveying section; And A second transfer section connected to the at least one processing tool and separated from and distinct from the first transfer section for transferring the container to and from the at least one processing tool; A second transfer section for interfacing with the first transfer section for loading the container into portions of the first transfer section and unloading from portions of the first transfer section; Semiconductor workpiece processing system comprising a. The method of claim 1, And the second transfer section is connected to the at least one processing tool for loading the container into the at least one processing tool and also unloading from the at least one processing tool. The method of claim 1, The first transfer section is a mass transfer system having a distributed drive device arranged to support and transfer the container without a transfer vehicle, And the second transfer section is a vehicle based system having a transfer vehicle capable of holding and transferring the container. The method of claim 1, The second conveying section comprises a conveying vehicle capable of holding and moving the container in the movement direction defined by the second conveying section, And said transport vehicle is arranged for loading said container into said first transport system and unloading from said first transport system. The method of claim 4, wherein The second transfer section, And a drive system arranged to move in the at least two movement directions at which the conveying vehicle of the second moving section is relatively angled with respect to each other. At least one processing tool for processing a semiconductor workpiece; A container holding at least one semiconductor workpiece therein for transferring to and from the at least one processing tool; A first, elongated, defining a direction of movement, having portions which interface with the container, a first supporting and transporting the container along the direction of movement to the at least one processing tool and also supported and transported from the at least one processing tool; A conveying section, said container being conveyed at a substantially constant speed when said container is supported by said first conveying section; And A second transfer section connected with the at least one processing tool and the first transfer section and distinct from the first transfer section to interface with the container between the at least one processing tool and the first transfer section The second conveying section interface with the first conveying section for loading the container into portions of the first conveying section and unloading from the portions of the first conveying section; Including, Said constant speed of transfer of said container is independent of the interface speed between said second transfer section and said at least one processing tool.

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