KR20090036700A - Wafer reverse apparatus of semiconductor cleanning equipment and method for sensing wafer of the same - Google Patents

Wafer reverse apparatus of semiconductor cleanning equipment and method for sensing wafer of the same Download PDF

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Publication number
KR20090036700A
KR20090036700A KR1020070101875A KR20070101875A KR20090036700A KR 20090036700 A KR20090036700 A KR 20090036700A KR 1020070101875 A KR1020070101875 A KR 1020070101875A KR 20070101875 A KR20070101875 A KR 20070101875A KR 20090036700 A KR20090036700 A KR 20090036700A
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KR
South Korea
Prior art keywords
wafer
buffer
seated
optical signal
unit
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KR1020070101875A
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Korean (ko)
Inventor
김성수
오세훈
Original Assignee
세메스 주식회사
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Priority to KR1020070101875A priority Critical patent/KR20090036700A/en
Publication of KR20090036700A publication Critical patent/KR20090036700A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02082—Cleaning product to be cleaned
    • H01L21/0209—Cleaning of wafer backside
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

A wafer reverse apparatus of semiconductor cleaning equipment and method for sensing wafer of the same are provided to sense the mounting state of wafer by receiving optical signals at the side of wafer. The reverse unit(110) comprises the chucking arm(112) chucking the buffer(108), a plurality of chucking blocks(114,116), and the mounted wafer and the head(106) operating the chucking arm. The reverse unit inverts the wafer in order to wash the rear side of wafer. The sensor senses the mounting state of the wafer settled in the reverse unit through one or more optical signal. The sensor is comprised of the lighting-emitting area(120) for generating one or more optical signal and the photo diode(122) receiving the optical signal. The drive unit(104) rotates the reverse unit. The controller determines the mounting state of the wafer settled through the optical signal sensed from the sensor in the buffer.

Description

Wafer reversing apparatus of semiconductor cleaning equipment and method for sensing wafers {WAFER REVERSE APPARATUS OF SEMICONDUCTOR CLEANNING EQUIPMENT AND METHOD FOR SENSING WAFER OF THE SAME}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing apparatus, and more particularly, to a wafer inversion apparatus of a semiconductor cleaning apparatus and a wafer sensing method thereof for sensing a wafer seated on an inversion unit from the side and controlling the inversion unit according to the seating state of the wafer. It is about.

As semiconductor devices have been highly integrated, patterns that must be implemented on wafers have become smaller. Therefore, the pattern on the wafer generates defects in the semiconductor device even by fine particles, and thus the importance of the cleaning process is further highlighted.

Generally, wafer cleaning processes utilize ultrapure water (DIW), brushes and / or ultrasonic waves to clean the surface of the wafer. This cleaning process removes foreign substances present on the surface of the semiconductor substrate (eg, wafer) before and after each unit process. At this time, in order to clean not only the front side but also the backside of the semiconductor substrate, the semiconductor cleaning apparatus includes a separate wafer reversing apparatus, flips the wafer, and supplies the cleaning liquid to the back surface of the wafer. Clean the back side.

Such semiconductor cleaning apparatuses include those patented by the applicant of the present invention, for example, 'Wafer cleaning equipment for semiconductor manufacturing equipment' of Patent Registration No. 10-0413067 (December 31, 2003); A wafer reversing unit in a semiconductor manufacturing facility, such as registration number 10-466294 (January 13, 2005), is disclosed.

That is, referring to FIG. 1, the semiconductor cleaning equipment 10 according to the related art is, for example, a single-leaf cleaning equipment, and an index 12 on which a cassette 14 on which a plurality of wafers W are mounted is placed. And a plurality of process chambers 16 and 18 for processing the wafer cleaning process, and a wafer W from the cassette 14 to extract the wafer W between the index 12 and the process chambers 16 and 18. It includes a transfer robot 20 for transferring. Each of the process chambers 16 and 18 is provided with cleaning devices 30 and 32 for cleaning the front and rear surfaces of the wafer W therein. Each of the cleaning apparatuses 30 and 32 includes an inversion unit 40 for inverting the wafer W to the front side or the rear side as shown in FIG. 2.

In the semiconductor cleaning apparatus 10, first, when the cassette 14 containing the wafer W is placed on the index 12, the wafer W is withdrawn from the cassette 14 through the transfer device 20. The wafers W are transferred to the chambers 16 and 18. At this time, the cleaning apparatuses 30 and 32 invert the back surface of the wafer W to face upward by the wafer inversion apparatus 40, and then clean the back surface of the wafer W. The wafer W on which the back surface cleaning is completed is inverted by the wafer inversion apparatus 40 again, and the transfer apparatus 20 draws the wafer W from the wafer inversion apparatus 40 to draw the cassette 14 of the index 12. Remount on

Specifically, referring to FIGS. 2 and 3, the cleaning apparatuses 30 and 32 are installed inside the respective process chambers 16 and 18, and the wafer inversion apparatus 40 which inverts the wafer W, and the wafer. The spin chuck 62 seating the (W) is installed inside the processing unit 60 for processing the cleaning process, and the plurality of cleaning units 70 to 90 for cleaning the front or rear surface of the wafer W. Include. For example, the cleaning units 70 to 90 include an ultrasonic cleaning device 70, a brush cleaning device 80, and a plurality of nozzle devices 90 for supplying a cleaning liquid.

The wafer reversing apparatus 40 includes a buffer 42 on which the wafer W is seated, a chucking arm 44 for chucking the seated wafer W at a plurality of positions, and a buffer 42 and the chucking arm 44. A reversing unit 41 including a head 46 coupled to the head 46 for driving the chucking arm 44 to chuck the wafer W seated in the buffer 42, and rotating or spinning the reversing unit 41. A drive unit 48 for moving up and down to load / unload the wafer W to / from the chuck 62 and a base reversing device 40 to install the wafer reversing device 40 into the process chamber 30 or 32. And a support frame 50 fixed therein.

Therefore, in order to clean the back surface of the wafer W, the wafer inversion apparatus 40 flips the wafer W so that the back surface of the wafer W faces upward when the wafer W is seated from the transfer device 20. Subsequently, the wafer reversing apparatus 40 moves the inverted wafer W downward to load the spin chuck 62. Therefore, the back surface of the wafer W loaded on the spin chuck 62 is cleaned by using the cleaning units 70 to 90. When the cleaning is completed, the wafer W is moved upwards again so that the entire surface of the wafer W is moved. Turn over again to face up. Of course, the wafer reversing device 40 is loaded on the spin chuck 62 in a state of being seated from the transfer device 20 to clean the entire surface of the wafer W.

Therefore, the semiconductor cleaning equipment 10 includes a wafer reversal device 40 for reversing the wafer in the cleaning devices 30 and 32, so that a separate device and a chamber for cleaning the back surface of the wafer W are unnecessary. This simplifies the processing step.

However, the wafer reversal apparatus 40 of the prior art cannot confirm the seating state of the wafer W when the wafer W is seated in the buffer 42 by the transfer device 20, so that the wafer W is abnormal. The wafer W is often inverted even when it is settled.

It is an object of the present invention to provide a wafer reversing apparatus of a semiconductor cleaning facility and a wafer sensing method thereof for detecting a wafer seating state.

It is another object of the present invention to provide a wafer reversing apparatus of a semiconductor cleaning apparatus and a wafer sensing method thereof for detecting a seating state of a wafer irrespective of a distance from the wafer and a film quality formed on the wafer surface.

In order to achieve the above objects, the wafer reversing apparatus of the present invention has one feature of detecting the seating state of a wafer by emitting and receiving an optical signal horizontally from the side of the wafer. As such, the wafer reversing apparatus detects the seating state of the wafer regardless of the distance from the wafer and the characteristics of the film formed on the surface of the wafer.

The wafer reversing apparatus of the present invention is provided in the process chamber in a semiconductor cleaning facility having at least one process chamber for cleaning the back surface of the wafer. The wafer reversing apparatus includes a reversing unit on which a wafer is seated and chucks the seated wafer; A sensor installed in the inversion unit, generating at least one optical signal horizontally from one side of the chucked wafer, and receiving the optical signal on the other side of the chucked wafer; When the wafer is seated in the buffer, the sensor determines the seating state of the wafer seated in the buffer. When the wafer seated in the buffer is normally seated, the reverse unit is rotated so that the back side of the wafer faces upward. And a control unit for inverting.

In one embodiment, the inverting unit; A buffer on which the wafer is seated; A chucking arm disposed around an edge of the buffer, the chucking arm chucking a side of the wafer seated in the buffer at a plurality of positions; A head coupled to the buffer and the wicking chucking arm to drive the chucking arm to chuck the wafer seated in the buffer.

In another embodiment, the sensor; A light emitting unit generating at least one optical signal on one side of a wafer; A light receiving unit receiving the optical signal on the other side of the wafer in correspondence with the light emitting unit; The light emitting portion and the light receiving portion are provided to face each other to the chucking arm.

In another embodiment, the light emitting unit; The optical signal emits light horizontally while maintaining a predetermined distance from the lower surface of the wafer seated in the buffer.

In yet another embodiment, the wafer reversing apparatus comprises; Further comprising a drive device for rotating and reversing the inverting unit; The controller inverts the wafer seated in the buffer by controlling the driving device to rotate the head when the wafer seated in the buffer is normally seated.

According to another feature of the present invention, a wafer sensing method of a wafer reversing apparatus provided in a semiconductor cleaning facility is provided. According to this method, a wafer is loaded into a buffer, and the wafer loaded into the buffer is chucked. At least one optical signal is generated parallel to the wafer at one side of the chucked wafer. It is determined whether the optical signal is received on the other side of the chucked wafer. As a result of the determination, when the optical signal is received, the back side of the wafer is inverted to face upward to clean the back side of the wafer.

In one embodiment, generating the at least one optical signal in parallel with a wafer; The optical signal is generated horizontally at a predetermined distance from a lower surface of the wafer seated in the buffer.

In another embodiment, generating the at least one optical signal parallel to a wafer; The optical signal is generated at various positions horizontally at a predetermined interval on each of the upper and lower surfaces of the wafer seated in the buffer.

As described above, the wafer reversing apparatus of the present invention emits and receives at least one optical signal from the side of the wafer to detect the seating state of the wafer, thereby making it accurate regardless of the distance from the wafer and the film quality formed on the surface of the wafer. The seating state of the wafer can be detected.

In addition, the wafer reversing apparatus of the present invention can accurately detect the mounting state of the wafer from the side of the wafer, thereby preventing wafer damage and process accidents in advance.

The embodiments of the present invention may be modified in various forms, and the scope of the present invention should not be interpreted as being limited by the embodiments described below. This embodiment is provided to more completely explain the present invention to those skilled in the art. Therefore, the shape of the components in the drawings and the like are exaggerated to emphasize a more clear description.

Hereinafter, embodiments of the present invention will be described in detail with reference to FIGS. 4 to 8.

4 is a perspective view showing the configuration of a wafer inversion apparatus of a semiconductor cleaning apparatus according to the present invention, FIGS. 5 and 6 are cross-sectional views showing the configuration of the inversion unit shown in FIG. 4, and FIG. It is a block diagram which shows the structure of the inversion unit shown.

4 and 7, the wafer inversion apparatus 100 includes an inversion unit 110 for inverting the wafer W to clean the back surface of the wafer W, and at least one optical signal SENSE1 and SENSE2. The light emitting and receiving in the horizontal direction with the wafer (W) to detect the mounting state of the wafer (W) seated on the reversing unit 110, and the reversing unit 110 to rotate or up and down The control unit 124 determines a normal or abnormal seating state of the wafer W through the driving unit 104 to move and the optical signals sensed by the sensors 120 and 122.

Therefore, the wafer reversing apparatus 100 is placed on the wafer W seated on the reversing unit 110 before the wafer reversing apparatus reverses the entire surface of the wafer W on which the pattern is formed to face downward. Determine.

In detail, the inversion unit 110 includes a buffer 108 on which the wafer W is seated and chucking blocks 114 and 116 at a plurality of positions, as shown in FIGS. 5 and 6, and the seated wafer. A chucking arm 112 for chucking (W) and a buffer 108 and one side of the chucking arm 112 are coupled to drive the chucking arm 112 to chuck the wafer W seated on the buffer 108. Includes a head 106.

The drive unit 104 is provided with typical drive devices such as guides, guide rails, motors, cylinders, cams, gears, belts and pulleys, so that the reversal unit 110 is rotated or the reversal unit 110 is The head 106 is rotated and moved to slide up and down. Since these driving apparatuses are the technique disclosed by the above-mentioned prior art, detailed description is abbreviate | omitted. The drive unit 104 therefore rotates the head 106 to invert the inversion unit 110 and to move it up and down to load / unload the wafer W to / from a spin chuck (not shown). In addition, the driving unit 104 includes a support frame 102 installed at a lower portion of the base frame (not shown) to fix the wafer reversing apparatus 100 to a process chamber (not shown).

The sensors 120 and 122 may include a light emitter 120 that generates at least one optical signal SENSE1 and SENSE2, and a light receiver 122 that receives respective light signals SENSE1 and SENSE2 corresponding to the light emitter 120. The light emitting unit 120 and the light receiving unit 122 are provided on the chucking arm 112 to face each other. Accordingly, the sensors 120 and 122 emit and receive the optical signals SENSE1 and SENSE2 in parallel with the wafer W seated in the buffer 108. To this end, the light emitter 120 includes at least one light emitting device (not shown) for generating at least one light signal SENSE1 and SENSE2, and the light receiver 122 includes at least one light signal SENSE1 and SENSE2. At least one light receiving element (not shown) for receiving a. For example, as shown in FIG. 7, the light emitter 120 may have a predetermined distance (eg, less than 1 mm) from a lower surface (ie, the front surface of the wafer) of the wafer W seated in the buffer 108. ) To generate one optical signal SENSE1 horizontally. As another example, the light emitter 120 may maintain a plurality of positions at a predetermined distance (for example, less than 1 mm) at various positions, that is, at an upper surface and a lower surface of the seated wafer W of the buffer 108. Generates the optical signals SENSE1 and SENSE2 horizontally. Accordingly, the sensors 120 and 122 emit and receive the optical signals SENSE1 and SENSE2 on the side of the wafer W, thereby accurately detecting whether the wafer W seated on the buffer 108 is in a normal state or an abnormal state. have.

The controller 124 controls the sensors 120 and 122 to emit and receive the optical signals SENSE1 and SENSE2 horizontally with the wafer W, and the optical signals SENSE1 and SENSE2 detected from the sensors 120 and 122. ) Determines the seating state of the wafer W seated in the buffer 108. That is, the controller 124 generates the at least one optical signal SENSE1 and SENSE2 horizontally with the wafer W to the light emitting unit 120, and transmits the optical signal to the light receiving unit 122 in response to the light emitting unit 120. SENSE1, SENSE2) control to receive. At this time, the control unit 124 determines that the optical signal (SENSE1 or SENSE1, SENSE2) generated from the light emitting unit 120 is normally seated only when all of the light receiving unit 122 is received.

8 is a flowchart showing a wafer sensing procedure of the wafer reversing apparatus according to the present invention. This procedure is a program that the controller 124 processes to clean the back surface of the wafer, which is stored in a memory device (not shown) of the controller 124.

Referring to FIG. 8, when the wafer W is loaded into the buffer 108 and chucked by the chucking arm 112 in step S200, the controller 124 may detect at least one side of the wafer W in one step S202. Generates optical signals (SENSE1 or SENSE1, SENSE2). In step S204, it is determined whether the optical signals SENSE1 or SENSE1, SENSE2 are received on the other side of the wafer W. At this time, the optical signals SENSE1 and SENSE2 are generated horizontally with the wafer W seated in the buffer 108. That is, the light emitting unit 120 is generated horizontally while maintaining a predetermined distance (for example, less than 1 mm) from the lower surface (that is, the front surface of the wafer) of the wafer W seated in the buffer 108, or Alternatively, the wafers may be horizontally generated at a predetermined distance from the upper and lower surfaces of the wafer W seated in the buffer 108 at various positions.

As a result of the determination, when the optical signal SENSE1 or SENSE1, SENSE2 is received, since the wafer W is normally seated in the buffer 108, the procedure proceeds to step S206 to invert the wafer W, and then inverted in step S208. The subsequent process of cleaning the back surface of the wafer W is performed by loading the loaded wafer W onto the spin chuck.

If the optical signals SENSE1 or SENSE1 and SENSE2 are not received at step S204, that is, all optical signals SENSE1 or SENSE1 and SENSE2 generated from the light emitting unit 120 are not received, the wafer is abnormally seated in the buffer. This process proceeds to step S210 to generate equipment interlock.

Therefore, the wafer reversing apparatus 100 of the present invention generates at least one optical signal SENSE1 and SENSE2 so as to be horizontal to the top and bottom surfaces of the wafer W at the side of the wafer W seated in the buffer 108. The seating state of the wafer W is determined.

In the above-described wafer reversing apparatus 100 of the present invention, the wafer W is transported in a state where a plurality of chucking blocks 114 and 116 provided on the chucking arms 112 disposed at the edge of the buffer 108 are opened. (Not shown) in the buffer 108 of the reversing unit 110, driving the chucking arm 112 through the head 106 to the wafer (W) to the chucking blocks 114, 116 in a plurality of positions Chuck the edge side of the.

Subsequently, the wafer reversing apparatus 100 senses the seating state of the wafer W through the sensors 120 and 122, and if it is in a normal seating state, rotates the reversing unit 110 so that the rear surface of the wafer W is in the upward direction. Invert to face. Thereafter, the wafer inversion apparatus 100 lowers the inversion unit 110 so that the wafer W is seated on the spin chuck (not shown) to chuck the chucking arm 112.

The wafer W inverted as described above faces the upper surface of the wafer W for cleaning the back surface, and the spin chuck rotates to clean the back surface of the wafer W using various cleaning units (not shown). When the cleaning of the back surface of the wafer W is completed, the wafer inversion apparatus 100 chucks the wafer W again with the chucking arm 112, and moves the inversion unit 110 upward so that the front surface of the wafer W is moved. Invert to face up.

In the above, the configuration and operation of the wafer reversing apparatus according to the present invention are shown in accordance with the detailed description and the drawings, which are merely described by way of example, and various changes and modifications may be made without departing from the spirit of the present invention. It is possible.

1 shows a schematic configuration of a wafer cleaning facility according to the prior art;

FIG. 2 is a perspective view showing the configuration of the cleaning device shown in FIG. 1; FIG.

3 is a perspective view showing the configuration of the wafer reversing apparatus shown in FIG. 2;

4 is a perspective view showing the configuration of a wafer reversing apparatus of the wafer cleaning equipment according to the present invention;

FIG. 5 is a plan view showing a partial configuration of the inversion unit shown in FIG. 4; FIG.

FIG. 6 is a side view showing a part of the configuration of the inversion unit shown in FIG. 4; FIG.

FIG. 7 is a block diagram showing the configuration of the inversion unit shown in FIG. 4; FIG. And

8 is a flowchart illustrating a wafer sensing procedure of the wafer reversing apparatus according to the present invention.

Explanation of symbols on the main parts of the drawings

100: wafer reversing apparatus 102: support frame

104: drive unit 106: head

108: buffer 110: inversion unit

112: chucking arm 114, 116: chucking block

120 light emitting unit 122 light receiving unit

124: control unit

Claims (8)

In a semiconductor cleaning apparatus having at least one process chamber for cleaning a back surface of a wafer, the wafer inversion apparatus provided in the process chamber includes: A reversal unit on which the wafer is seated and chucking the seated wafer, A sensor installed in the inversion unit, generating at least one optical signal horizontally from one side of the chucked wafer, and receiving the optical signal on the other side of the chucked wafer; When the wafer is seated on the inversion unit, if the mounting state of the wafer seated on the inversion unit by the sensor to determine the normal mounting, the control unit for rotating the inversion unit so that the back side of the wafer to face upwards; A wafer reversing apparatus for semiconductor cleaning equipment, characterized by the above-mentioned. The method of claim 1, The inverting unit; A buffer on which the wafer is seated; A chucking arm disposed around an edge of the buffer, the chucking arm chucking a side of the wafer seated in the buffer at a plurality of positions; And a head coupled to the buffer and the wicking chucking arm to drive the chucking arm to chuck the wafer seated in the buffer. The method of claim 2, The sensor; A light emitting part generating at least one optical signal on one side of a wafer; A light receiving unit receiving the optical signal on the other side of the wafer in correspondence with the light emitting unit; And the light emitting portion and the light receiving portion are provided opposite to the chucking arm. The method of claim 3, wherein The light emitting unit; And an optical signal emitting horizontally at a constant distance from a lower surface of the wafer seated in the buffer. The method of claim 2, The wafer reversing apparatus includes; Further comprising a drive device for rotating and reversing the inverting unit; And the controller inverts the wafer seated in the buffer by controlling the driving device to rotate the head when the wafer seated in the buffer is normally seated. In the wafer sensing method of the wafer reversing apparatus provided in the semiconductor cleaning equipment: A wafer is loaded into the buffer and chucks the wafer loaded into the buffer; Generating at least one optical signal parallel to the wafer at one side of the chucked wafer; Determine whether the optical signal is received on the other side of the chucked wafer; next And as a result of the determination, when the optical signal is received, inverting the back surface of the wafer to face upward to clean the back surface of the wafer. The method of claim 6, Generating the at least one optical signal parallel to a wafer; And generating the optical signal horizontally at a predetermined distance from a lower surface of the wafer seated in the buffer. The method of claim 6, Generating the at least one optical signal parallel to a wafer; The optical signal generation method of the wafer reversal device according to claim 1, wherein the optical signal is generated at various positions horizontally at a predetermined interval on each of the upper and lower surfaces of the wafer seated in the buffer.
KR1020070101875A 2007-10-10 2007-10-10 Wafer reverse apparatus of semiconductor cleanning equipment and method for sensing wafer of the same KR20090036700A (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107002239A (en) * 2014-10-08 2017-08-01 应用材料公司 The advance wetting apparatus of vacuum and method
CN107331641A (en) * 2017-06-27 2017-11-07 北京中电科电子装备有限公司 A kind of turning device
CN107639393A (en) * 2017-10-26 2018-01-30 宁波市惠力诚仪表有限公司 Lid switching mechanism on electric energy meter
WO2022007204A1 (en) * 2020-07-07 2022-01-13 北京京仪自动化装备技术有限公司 Material positioning and gripping device, and turning manipulator
US11571724B2 (en) 2020-12-29 2023-02-07 Semes Co., Ltd. Apparatus and method for processing substrate

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107002239A (en) * 2014-10-08 2017-08-01 应用材料公司 The advance wetting apparatus of vacuum and method
CN107002239B (en) * 2014-10-08 2019-05-28 应用材料公司 The preparatory wetting apparatus of vacuum and method
CN107331641A (en) * 2017-06-27 2017-11-07 北京中电科电子装备有限公司 A kind of turning device
CN107639393A (en) * 2017-10-26 2018-01-30 宁波市惠力诚仪表有限公司 Lid switching mechanism on electric energy meter
WO2022007204A1 (en) * 2020-07-07 2022-01-13 北京京仪自动化装备技术有限公司 Material positioning and gripping device, and turning manipulator
US11571724B2 (en) 2020-12-29 2023-02-07 Semes Co., Ltd. Apparatus and method for processing substrate

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