KR20090030140A - Surge absorber and method of manufacturing the surge absorber - Google Patents

Abstract

A surge absorber and method of manufacturing the surge absorber are provided to control the gap between the second gap electrode and the first gap electrode by the thickness of the sheet and to easily form the uniform gap. The first and second external terminals(12,14) are formed in one of the outer side surface of the container(40). The third external terminal(18) is formed in the other outer side surface of container. The first gap electrode is isolated from the first and the second external terminal in the container. One end of the first gap electrode is connected to the third external terminal. One end of the second gap electrode is connected to one external terminal of the first and the second external terminal. The other end is separated from the first gap electrode. The discharge medium(42) is connected to the first gap electrode and the second gap electrode. The inner electrode is connected to the first and the second external terminal in the container.

Description

Surge absorber and method of manufacturing the surge absorber

The present invention relates to a surge absorber and a method for manufacturing the same, and more particularly, to a surge absorber and a method for manufacturing the surge absorber that can block the surge voltage or surge current.

Recently, as the transmit / receive frequency of mobile phones becomes high and semiconductor chips inside the phones become highly integrated, the vulnerability to static electricity is increasing day by day.

Therefore, measures have been taken to eliminate surge voltages flowing through antennas or data transmission ports. As an example of the countermeasure, a fixed capacitance varistor is used to protect the load from ESD or surges flowing through the power line. When a high capacity varistor is used for a line for transmitting a high speed signal, a signal on the signal line is delayed or distorted, so a low capacitance varistor is used for a high speed signal line.

The varistors operate on high level ESD voltages (eg, ESD 3.0KV and above) and on low level ESD voltages (eg, ESD 3.0KV and below). Varistors with these operating characteristics degrade with ESD reduction as they go to lower capacitance.

Thus, a surge absorber has been developed that removes overvoltage (surge voltage) and static electricity while satisfying low capacitance (about 1 pF or less). The surge absorber arranges a predetermined empty space (discharge space) between the anode plates to block a surge energy or surge current having a relatively high energy.

Recent surge absorbers are also available in three-terminal array types to achieve the goal of simple wiring in many high-speed signal lines.

1 is an external perspective view illustrating an example of a conventional three-terminal array type surge absorber, and FIG. 2 is a cross-sectional view taken along line A-A of FIG.

The conventional three-terminal array type surge absorber has a first outer terminal 12 and a second outer terminal which are formed on both lateral outer surfaces of the body 10 at predetermined intervals and whose one end extends to the upper surface of the body 10. A terminal 14, a first gap electrode 16 transversely transverse to the central portion of the upper surface of the body 10, and a third formed to be connected to the first gap electrode 16 on both longitudinal outer sides of the body 10; At the upper surface of the outer terminal 18, the body 10, one end is connected to the first or second outer terminal (12 in FIG. 1) and the other end is directed to the first gap electrode 16, but the first gap electrode 16 is connected to the first gap electrode 16. And a discharge medium 22 filled in a gap (meaning a discharge space) between the second gap electrode 20, the first gap electrode 16, and the second gap electrode 20 formed to be spaced apart from each other by a predetermined interval. An inner electrode 24 is formed to be spaced apart from each other in the longitudinal direction by the inside of the 10 and has one end connected to the first outer terminal 12 and the other end connected to the second outer terminal 14. All.

Here, the first and second gap electrodes 16 and 20 are formed by expensive thin film processing equipment. Since the body 10 contracts upon firing, the first and second gap electrodes 16 and 20 must be formed in consideration of the shrinkage rate, so that the gap between the first and second gap electrodes 16 and 20 is desired. You can do

However, since it is difficult to accurately consider the shrinkage ratio of the body 10 and the shrinkage ratios of the first and second gap electrodes 16 and 20 should also be considered, the first and second gap electrodes 16 and 20 formed by the thin film forming process. ), It is very difficult to obtain the desired gap (e.g., about 10 µm).

The present invention has been proposed to solve the above-mentioned conventional problems, and an object thereof is to provide a surge absorber and a method of manufacturing the same, which enable a uniform gap between gap electrodes.

In order to achieve the above object, a surge absorber according to a preferred embodiment of the present invention, the first and second outer terminal formed on either outer surface of the body; A third outer terminal formed on at least one outer surface of the body; A first gap electrode formed in the body and spaced apart from the first and second external terminals, at least one end of which is connected to the third external terminal; A second gap electrode, one end of which is connected to one of the first and second outer terminals of the body and the other end of which is spaced apart from the first gap electrode by a predetermined distance; A discharge medium filled in a via hole exposed to another outer surface of the body and connected to the first gap electrode and the second gap electrode; And an internal electrode connecting the first and second external terminals inside the body.

The first gap electrode and the second gap electrode are formed on different sheets.

The first gap electrode is formed to be transversely transversely spaced apart from the first and second outer terminals, and the second gap electrode is formed so that the other end thereof is spaced apart from each other by a predetermined line on a vertical line with one side portion of the first gap electrode.

The upper and lower diameters of the via holes are the same or the diameters of the upper and lower portions are different.

The internal electrode is implemented with a resistor pattern or an inductor pattern.

A plurality of first and second external terminals are formed, respectively, and a plurality of discharge media are formed.

On the other hand, a method of manufacturing a surge absorber according to an embodiment of the present invention, the process of producing a plurality of sheets; Forming a first gap electrode pattern on one of the plurality of sheets; Forming an internal electrode pattern on the other one of the plurality of sheets orthogonally to the first gap electrode pattern; Forming via holes in some of the plurality of sheets; Forming a second gap electrode pattern in one sheet of a portion of the sheet on which the via holes are formed, wherein the second gap electrode pattern is exposed in the via hole of the sheet; A plurality of sheets are stacked to form a body, wherein both ends of the inner electrode pattern are exposed to both outer surfaces of the body, and the first and second gap electrode patterns maintain a predetermined gap in the body, and each end is a body. Stacking the exposed one of both outer surfaces of the outer surface and the outer surface and the other outer surface of the via hole exposed to another outer surface of the body; Firing the body; Forming first to third external terminals on both outer and other outer surfaces of the fired body, wherein the first outer terminal is connected to one of the first and second gap electrode patterns, and the second outer terminal is connected to the other gap. Connecting to an electrode pattern and connecting a third external terminal to the internal electrode pattern; And filling and discharging the discharge medium in the via hole.

And, the manufacturing method of the surge absorber according to another embodiment of the present invention, the process of manufacturing a plurality of sheets; Forming a first gap electrode pattern on one of the plurality of sheets; Forming an internal electrode pattern on the other one of the plurality of sheets orthogonally to the first gap electrode pattern; Forming via holes in some of the plurality of sheets; Forming a second gap electrode pattern in one sheet of a portion of the sheet on which the via holes are formed, wherein the second gap electrode pattern is exposed in the via hole of the sheet; A plurality of sheets are stacked to form a body, wherein both ends of the inner electrode pattern are exposed to both outer surfaces of the body, and the first and second gap electrode patterns maintain a predetermined gap in the body, and each end is a body. Stacking the exposed one of both outer surfaces of the outer surface and the outer surface and the other outer surface of the via hole exposed to another outer surface of the body; Filling a discharge medium in the via hole; Calcining the body after charging the discharge medium; And forming first to third external terminals on both outer and other outer surfaces of the fired body, wherein the first external terminal is connected to one of the first and second gap electrode patterns, and the second external terminal is connected to the other one. Connecting to a gap electrode pattern and connecting a third outer terminal to the inner electrode pattern.

The upper and lower diameters of the via holes formed in some sheets are made the same.

The diameter of the via hole formed in at least one of the sheets is different from the diameter of the via hole formed in the other sheet.

The first gap electrode pattern and the second gap electrode pattern are formed on different sheets.

A plurality of first and second external terminals are formed, respectively, and a plurality of discharge media are formed.

According to the present invention having such a configuration, since the gap between the first gap electrode and the second gap electrode is adjusted to the thickness of the sheet, a uniform gap can be easily achieved.

The three-terminal structure facilitates wiring in high-speed signal lines and can increase production efficiency because the manufacturing process is not increased compared to a conventional single-component manufacturing process.

Simultaneous firing of the gap electrode and the body is possible.

By exposing the gap electrode inside the body to the outside through the via hole, there is an advantage of eliminating the deterioration of the body due to the vaporization component in the discharge medium during the simultaneous firing of the gap electrode and the body.

Hereinafter, a surge absorber and a manufacturing method thereof according to an embodiment of the present invention will be described with reference to the accompanying drawings.

3 is an external perspective view of a surge absorber according to an embodiment of the present invention, and FIG. 4 is a cross-sectional view taken along line B-B in FIG. 3.

The first outer terminal 12 and the second outer terminal 14 are formed on both outer surfaces of the body 40 in the transverse direction (length direction). The first outer terminal 12 is formed in plural and formed spaced apart from each other by a predetermined interval. The second outer terminal 14 is formed of a plurality and formed spaced apart from each other by a predetermined interval. The number of the first and second external terminals 12 and 14 is the same and formed to face each other. One end of the first and second external terminals 12 and 14 extends a predetermined value to the upper surface of the body 40. Third outer terminals 18 are formed on both outer surfaces in the longitudinal direction of the body 40. In FIG. 3, two third external terminals 18 are provided. However, the third external terminals 18 may be formed only on one of the outer surfaces of both of the outer surfaces in the vertical direction. The third external terminal 18 may be referred to as a ground terminal.

The first to third external terminals 12, 14 and 18 are formed in a conventional termination method.

The internal electrode 24 connects the first external terminal 12 and the second external terminal 14 inside the body 40. The inner electrode 24 is formed in the horizontal direction so that one end is connected to the first outer terminal 12 and the other end is connected to the second outer terminal 14. Although the internal electrode 24 may be implemented as a general conductor, the internal electrode 24 may be implemented as a resistor pattern or an inductor pattern to lower the peak voltage in the ESD signal waveform to further improve the ESD performance.

The first gap electrode 44 is formed to be spaced apart from the first and second outer terminals 12 and 14 in the body 40. The first gap electrode 44 crosses opposite ends in the direction intersecting the internal electrode 24. Both ends of the first gap electrode 44 are connected to the third external terminals 18 which are opposed to each other.

At the first external terminal 46 such that the second gap electrode 46 is connected to the first external terminal 46 in one end of the body 40 and the other end is spaced apart from the first gap electrode 44 by a predetermined distance. Extends horizontally.

The discharge medium 42 is exposed to another outer surface (upper surface) of the body 40. The discharge medium 42 is filled in the via hole 43 formed to expose the first gap electrode 12 and the second gap electrode 14. The number of discharge mediums 42 is equal to the number of the first external terminals 12 or the second external terminals 14. The discharge medium 42 is formed to be spaced apart from each other in the direction transverse to the central portion of the upper surface of the body 40.

As shown in FIG. 4, even when the upper and lower diameters of the via holes 43 are the same, discharges between the first and second gap electrodes 44 and 46 are easily performed. If the diameter of the upper portion of the via hole 43 (that is, the portion exposed to the upper surface of the body) is larger than the diameter of the lower portion (the portion in contact with the surface of the first gap electrode 44), further stabilization of characteristics may be achieved. Can be. In addition, a large contact area between the first and second gap electrodes 44 and 46 increases the surge absorption effect. In other words, the diameter of the upper portion of the via hole 43 (that is, the portion exposed to the upper surface of the body) is lowered (ie, the portion of the upper surface of the body) so that the discharge medium 42 may also contact the upper surface portion of the second gap electrode 46. If the diameter of the first gap electrode 44 is increased, the contact area between the second gap electrode 46 and the discharge medium 42 is larger than that of the same diameter. Therefore, the bonding strength of the second gap electrode 46 can be increased to increase the reliability. Such contents can be sufficiently inferred by those who are engaged in the same industry even though not shown in the drawings.

5 is a flowchart illustrating a manufacturing process of a surge absorber according to an exemplary embodiment of the present invention.

First, a slurry is produced to produce a plurality of molded sheets that will constitute the body (laminate). For example, a raw material powder is prepared by ball milling water or alcohol with a solvent for 24 hours in a desired composition in which an additive such as Bi ₂ O ₃ , CoO, MnO, etc. is added to a dielectric material having a predetermined dielectric constant. PVB-based binder (binder) is measured as an additive to the prepared raw powder and then dissolved in toluene / alcohol (toluene / alcohol) -based solvent. The slurry is then milled and mixed for about 24 hours in a small ball mill. The numerical values and materials exemplified above are merely examples and may vary depending on the manufacturing environment and needs.

This slurry is produced by a method such as a doctor blade to produce a green sheet having a desired thickness (for example, about 15 µm). The manufactured green sheet is cut to a desired length unit to make a plurality of molded sheets. The sheet described in the claims should be taken to mean a molded sheet. On the other hand, the thickness of the green sheet is about 15 µm in consideration of shrinkage in the subsequent lamination, crimping and firing processes. Subsequent lamination, pressing, and firing processes result in the thickness of one molded sheet being approximately 10 µm. This makes it easier to adjust the gap between the gap electrodes (gap between the top and bottom) to about 10 um compared to the conventional printing method. That is, in the embodiment of the present invention, the gap between the gap electrodes 44 and 46 is adjusted by the thickness of the sheet.

In addition, as shown in FIG. 5A, some molded sheets 50 are provided with a plurality of via holes 43 having predetermined diameters at predetermined intervals. The diameter of the via hole 43 is about the same 60 ~ 300 um. The via hole 43 can be formed by a conventional punching machine (not shown). The shape of the cross section of the via hole 43 may be circular or may be an angular shape such as a square. In the molding sheet 52, a plurality of via holes 43 are formed as in the molding sheet 50, and a second gap electrode pattern 46 having one end exposed in each via hole 43 is formed. One end of the second gap electrode pattern 46 is exposed to the corresponding via hole 43 and the other end is exposed to one side surface of the sheet 52 in the transverse direction. Since the second gap electrode pattern 46 is later used as the second gap electrode, reference numerals "46" are used interchangeably. The second gap electrode pattern 46 is printed with silver paste or the like using Ag powder. The molded sheet 54 is formed with a first gap electrode pattern 44 that crosses the center portion of the sheet 54 horizontally. Both ends of the first gap electrode pattern 44 are exposed in both longitudinal sections of the sheet 54. Of course, you may not expose either one. Since the first gap electrode pattern 44 is used as the first gap electrode later, the reference numeral "44" is used interchangeably. The first gap electrode pattern 44 is printed with silver paste or the like using Ag powder. A plurality of internal electrode patterns 24 are vertically formed at predetermined intervals in the molding sheet 58. Although the internal electrode pattern 24 may be implemented as a general conductor, the internal electrode 24 may be implemented as a resistor pattern or an inductor pattern to lower the peak voltage in the ESD signal waveform to further improve the ESD performance. For example, in the case of a resistor pattern, glass, Pd, Ti, and the like are added to a conductor based on RuO ₂ to be implemented through a printing process using a paste having a constant sheet resistance value. In the case of the inductor pattern, a metal paste such as Ag, Pt, or Pd is used to implement the printing process. One end of each inner electrode pattern 24 is exposed to one side of the sheet 58 in the lateral direction, and the other end is exposed to the other side of the sheet 58 in the lateral direction. Since the internal electrode pattern 24 is used later as the internal electrode, the reference numeral “24” is used interchangeably. In FIG. 5A, the molded sheet 56 may be understood as a dummy sheet. What is necessary is just to suit the number of the shaping | molding sheets 56 in order to prevent unnecessary capacitance generate | occur | produced between the internal electrode pattern 24 and the 1st gap electrode pattern 44. FIG.

Subsequently, the molded sheet 58 is laminated on the lowermost molded sheet 56 shown in FIG. 5A as the lowermost layer, and then laminated in this order. Use a pressure of approximately 500 to 2000 psi for stacking. After that, it is compressed. Use a pressure of approximately 500 to 3000 psi for crimping. Thereby, the body 40 (laminated body) like FIG.5 (b) is formed.

The body 40 formed by lamination and compression is subjected to a degreasing and firing process. The degreasing process is performed at about 300 ° C. and then calcined at about 800 ° C. to 900 ° C. When firing is completed, the first and second gap electrode patterns 44 and 46 are appropriately called as gap electrodes, and hereinafter, referred to as first and second gap electrodes.

When the stacking, pressing and firing processes are sequentially performed, the thickness between the first and second gap electrodes 44 and 46 becomes a gap having a desired value (about 10 µm). That is, since the gap of the gap electrode is controlled by the thickness of the molded sheet, it is possible to realize the desired gap much easier than the conventional printing method.

Subsequently, the first to third external terminals 12 and 14 to be connected to the first gap electrode 44 and the second gap electrode 46 and the internal electrode 24 formed inside the body 40 using a conventional termination system. , 18) is formed on the outer surface of the body 40 (see (c) of FIG. 5). The first outer terminal 12 is formed on one outer surface in the transverse direction of the body 40 and is connected to one end of the second gap electrode 46 and the inner electrode 24 exposed to the corresponding portion. The second outer terminal 14 is formed on the other transverse outer surface of the body 40 and is connected to the other end of the inner electrode 24 exposed to the corresponding portion. The third outer terminal 18 is formed on both longitudinal outer surfaces of the body 40 and is connected to the end surface of the first gap electrode 44 exposed to the corresponding portion. Then, the first to third external terminals 12, 14, and 18 are baked at a predetermined temperature in order to couple the body 40 to each other.

Then, the discharge medium 42 is charged into the via hole 43 as shown in FIG. For example, the discharge medium 42 is composed of a metal material such as Al, Ag, Pt, Ru, Cu, W and an insulator (for example, Al ₂ O ₃ , SiO ₂ ) as a main raw material, and combines epoxy, silicon, glass, and the like. It is mixed by zero. The discharge medium 42 may be air or a polymer. Of course, the metallic material of the discharge medium 42 may be a metal material other than the aforementioned metal material as long as it is easy to discharge between the first and second gap electrodes 44 and 46 and contributes to surge absorption. You can do it with a substance.

The discharge medium 42 is cured at a predetermined temperature to bond the body 40.

As such, when curing of the discharge medium 42 is completed, a desired surge absorber is manufactured.

In the above-described embodiment, the first and second gap electrodes 44 and 46 and the body 40 can be simultaneously fired. Even if it is co-fired, the discharge medium 42 is cured after that, so that the worry of deterioration of the body 40 due to the vaporization component in the discharge medium 42 is eliminated. Further, even when the first and second gap electrodes 44 and 46 and the body 40 are simultaneously fired while the discharge medium 42 is charged, the via hole 43 is an outer surface (upper surface) of the body 40. Since it is exposed to the vaporized material by the discharge medium 42 during firing can easily escape to the outside there is an advantage of improving the impact resistance and deterioration of the body 40.

In the above-described embodiment, after simultaneous firing of the first and second gap electrodes 44 and 46 and the body 40, the first to third external terminals 12, 14, and 18 are formed to charge the discharge medium 42. And curing. This is the case when the external terminal baking temperature is set higher than the discharge medium curing temperature. If the discharge medium curing temperature is higher than the external terminal baking temperature, it is preferable to perform charging and curing of the discharge medium first. For example, after the external terminal is baked, the discharge medium is cured, because when the discharge medium curing temperature is higher than the external terminal baking temperature, physical properties of the baked external terminal are changed.

Although not shown in the drawings, the first to third external terminals 12, 14, and 18 are formed after simultaneously firing the first and second gap electrodes 44 and 46, the discharge medium 42, and the body 40. It may be allowed to. This is easily understood by anyone in the same industry.

In the above-described embodiment, the first gap electrode pattern 44 and the second gap electrode pattern 46 are formed in different sheets, but forming them together in one molding sheet may be considered. In this case, in order to form the first and second gap electrode patterns 44 and 46 together in one molding sheet, there is a problem of adjusting the shape and diameter of the via hole or increasing the printing accuracy of the first and second gap electrode patterns. have. Thus, as in the embodiment described above, the first gap electrode pattern 44 and the second gap electrode pattern 46 are printed on different sheets and the molding in which the first and second gap electrode patterns 44 and 46 are formed. It is easier to adjust the gap between the gap electrodes 44 and 46 by the thickness of the molded sheet interposed between the sheets.

FIG. 6 is a variation of FIG. 4. In FIG. 4, the discharge medium 42 is formed along a central horizontal line (not shown) of the upper surface of the body 40, but in FIG. 6, the discharge medium 42 is positioned close to one outer side of the transverse direction. Of course, although the discharge medium 42 is located close to the first external terminal 12 in FIG. 6, the discharge medium 42 may be located close to the second external terminal 14. In this case, the second gap electrode 46 may be formed to be connected to the second external terminal 14.

On the other hand, the present invention is not limited to the above-described embodiment, but can be modified and modified within the scope not departing from the gist of the present invention, the technical idea to which such modifications and modifications also belong to the claims below Must see

1 is an external perspective view for explaining an example of a conventional three-terminal array type surge absorber.

2 is a cross-sectional view taken along the line A-A of FIG.

3 is an external perspective view of a surge absorber according to the embodiment of the present invention.

4 is a cross-sectional view taken along line B-B in FIG. 3.

5 is a flowchart illustrating a manufacturing process of a surge absorber according to an exemplary embodiment of the present invention.

FIG. 6 is a variation of FIG. 4.

<Description of Symbols for Major Parts of Drawings>

12: first external terminal 14: second external terminal

18: third external terminal 24: internal electrode

40: body 42: discharge medium

43: via hole 44: first gap electrode

46: second gap electrode 50, 52, 54, 56, 58: molded sheet

Claims (13)

First and second outer terminals formed on either outer surface of the body; A third outer terminal formed on at least another outer surface of the body; A first gap electrode formed in the body and spaced apart from the first and second external terminals, at least one end of which is connected to the third external terminal; A second gap electrode having one end connected to any one of the first and second external terminals inside the body and the other end spaced apart from the first gap electrode by a predetermined distance; A discharge medium filled in a via hole exposed to another outer surface of the body and connected to the first gap electrode and the second gap electrode; And And an internal electrode connecting the first and second external terminals to the inside of the body. The method according to claim 1, And the first gap electrode and the second gap electrode are formed on different sheets. The method according to claim 1, The first gap electrode is formed to be transversely transversely spaced apart from the first and second external terminals, the second gap electrode is formed so that the other end is spaced apart a predetermined interval on a vertical line with one side portion of the first gap electrode Surge absorber, characterized in that. The method according to claim 1, And a diameter of the upper and lower portions of the via hole is the same. The method according to claim 1, And the via hole has a diameter different from an upper diameter and a lower diameter. The method according to claim 1, The internal electrode is a surge absorber, characterized in that implemented in the resistor pattern or the inductor pattern. The method according to any one of claims 1 to 6, And a plurality of first and second external terminals, and a plurality of discharge media. Manufacturing a plurality of sheets; Forming a first gap electrode pattern on one of the plurality of sheets; Forming an internal electrode pattern on one of the plurality of sheets orthogonally to the first gap electrode pattern; Forming via holes in some of the plurality of sheets; Forming a second gap electrode pattern in one of the sheets on which the via holes are formed, wherein the second gap electrode pattern is exposed in the via holes of the sheet; The plurality of sheets are stacked to form a body, wherein both ends of the inner electrode pattern are exposed to both outer surfaces of the body, and the first and second gap electrode patterns maintain a predetermined gap in the body. Stacking one end of each of the outer surfaces of the body to one of the outer surfaces of the body and the outer surface of the body and the other of the outer surfaces of the body; Firing the body; Forming first to third external terminals on both outer and other outer surfaces of the fired body, wherein the first external terminal is connected to one of the first and second gap electrode patterns, and the second external terminal Connecting to the other gap electrode pattern and connecting the third external terminal to the internal electrode pattern; And And charging and discharging a discharge medium in the via hole. Manufacturing a plurality of sheets; Forming a first gap electrode pattern on one of the plurality of sheets; Forming an internal electrode pattern on one of the plurality of sheets orthogonally to the first gap electrode pattern; Forming via holes in some of the plurality of sheets; Forming a second gap electrode pattern in one of the sheets on which the via holes are formed, wherein the second gap electrode pattern is exposed in the via holes of the sheet; The plurality of sheets are stacked to form a body, wherein both ends of the inner electrode pattern are exposed to both outer surfaces of the body, and the first and second gap electrode patterns maintain a predetermined gap in the body. Stacking one end of each of the outer surfaces of the body to one of the outer surfaces of the body and the outer surface of the body and the other of the outer surfaces of the body; Filling a discharge medium into the via hole; Firing the body after charging the discharge medium; And Forming first to third external terminals on both outer and other outer surfaces of the fired body, wherein the first external terminal is connected to one of the first and second gap electrode patterns, and the second external terminal is Connecting to the other gap electrode pattern and connecting the third external terminal to the internal electrode pattern. The method according to claim 8 or 9, A method of manufacturing a surge absorber, characterized in that the diameters of the upper and lower portions of the via holes formed in the partial sheet are the same. The method according to claim 8 or 9, A method of manufacturing a surge absorber, characterized in that the diameter of the via hole formed in at least one of the sheets is different from the diameter of the via hole formed in the other sheet. The method according to claim 8 or 9, And the first gap electrode pattern and the second gap electrode pattern are formed on different sheets. The method according to claim 8 or 9, And a plurality of first and second external terminals, respectively, and a plurality of discharge media.

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