KR20090023777A - Rfid tag in-line manufacturing system and method using a laser - Google Patents

Abstract

An RFID tag manufacturing system using the laser and a manufacturing method thereof are provided to manufacture RFID tags in the in-line method. A pattern forming unit(130) forms an antenna pattern on one of flexible insulating substrates and a strap pattern on the other substrate at the same time by using the laser, and forms a pattern on an anisotropic conductive film along the strap pattern. A temporal combination unit(135) first temporarily couples the flexible insulating substrate having the antenna pattern, the flexible insulating substrate having the strap pattern, and the anisotropic conductive film. A strap bonding unit(140) arranges and pressurizes a glass substrate on the flexible insulating substrates as irradiating a laser beam in order to perform the strap bonding.

Description

RDF tag manufacturing system and method using laser {RFID TAG IN-LINE MANUFACTURING SYSTEM AND METHOD USING A LASER}

The present invention relates to an RFID tag manufacturing system and a manufacturing method using a laser. More specifically, the present invention relates to an RFID tag manufacturing system and a manufacturing method using a laser that can automate an RFID tag manufacturing method using a laser and can manufacture an RFID tag inline.

In general, RFID tags are widely used, such as logistics management and access / exit management, by exchanging information related to identification codes for identifying objects by contactless wireless communication with external devices.

Such RFID tags may take various forms, such as disks, smart cards, plastic housings or labels, and have a combination of antennas and analog and / or digital electronics, which may be e.g. communication electronics, data memory. And control logic.

For example, RFID tags are used in conjunction with security-locks in vehicles to control access to buildings, tracking inventory and parcels.

Typically, RFID tags are manufactured by patterning, etching, or printing a metal pattern for an antenna on a dielectric substrate and combining the metal pattern for the antenna with an integrated circuit chip.

As described above, in order to pattern a metal pattern on a dielectric substrate, complicated lithography processes such as a photoresist coating process, an exposure process, a developing process, an etching process, and a photoresist removing process must be repeatedly performed. It took a lot of problems and could not be automated and inlined.

In addition, such RFID tags require proper electrical connection, mechanical bonding, and proper positioning of components (chips, chip connectors, antennas) to maintain communication performance and to provide reliable bonding even when exposed to the external environment. Can be maintained.

In addition, as RFID tags are gradually miniaturized, it is necessary to maintain the precision and definition of the printing elements of lines and spaces when thinly depositing or etching metal patterns to maintain communication performance of the chip and the entire RFID tag.

To this end, conventionally, a hot plate or a hot bar is gradually heated to a high temperature to 180 to 250 ° C. using a hot bar, and then wire bonding or flip chip bonding is performed under pressure for at least 10 seconds while maintaining a constant temperature. Therefore, various variables according to temperature change have to be considered, and there is a problem in automating the RFID tag manufacturing method due to the long delay time.

In addition, in the related art, RFID tags have difficulty in continuously supplying materials because wire tags or flip chip bonding have to be molded using a thermosetting resin such as epoxy to avoid mechanical support and interference with an external strap.

In addition, due to the miniaturization of the RFID tag, it is impossible to provide precision suitable for joining a fine metal pattern, and there is a problem in that a bonding process time increases.

In addition, in order to solve the problem of recently adjacent metal straps deteriorating communication performance and to thin and flatten an RFID tag, an integrated circuit chip and a strip on which conductive leads are formed and a base substrate on which an antenna metal pattern is formed are separately formed. A strip bonding method for bonding these using anisotropic conductive films has been proposed.

However, the strip bonding method does not require a separate molding process due to the thermosetting resin included in the anisotropic conductive film. However, the bonding process takes a long time because the anisotropic conductive film is melted using a hot bar. Furthermore, the metal grains dispersed in the anisotropic conductive film were unevenly fused, so that not only the bonding failure rate was high, but also it was difficult to align the anisotropic conductive film at an appropriate position between the base substrate and the strap member.

SUMMARY OF THE INVENTION The present invention has been made to solve the above technical problem, and an object of the present invention is to continuously supply an RFID tag substrate using a flexible strap member and a base substrate, and use an laser to print the RFID tag substrate on the substrate. Tag components (chips, chip connectors, antennas) can be patterned continuously, and strap bonding of RFID tags can be performed by shortening the processing time using a laser, thereby automating the manufacturing method of RFID tags. The present invention provides an RFID tag manufacturing system and a manufacturing method using a laser which can be inlined.

In addition, an object of the present invention is a strap bonded RFID tag is composed of a base member and a strap member, and to form a metal pattern and a connection pattern, respectively, photoresist coating process, exposure process, developing process, etching process and photoresist removing process, etc. Since a complicated lithography process has to be performed repeatedly, there is a problem that the process is complicated and time-consuming.

RFID tag manufacturing method using a laser according to an embodiment of the present invention is to supply a pair of a flexible insulating substrate on which a conductive film is deposited side by side with the anisotropic conductive film between, and the flexible insulating using a laser Confirming the mark indicated along the supply direction of the substrate, and confirming the alignment, and simultaneously forming an antenna pattern on one of the flexible insulating substrates, forming a strap pattern on the other by using a laser, and performing the anisotropic conductivity Forming a pattern along the strap pattern on the film, and temporarily coupling the antenna pattern forming flexible insulating substrate and the strap pattern forming flexible insulating substrate to the anisotropic conductive film, and forming an upper surface of the flexible insulating substrate. Arranging and pressing a glass substrate to irradiate a laser beam to perform strap bonding; Bonding the IC chip to the center of the strap pattern, encapsulating with molding resin, and inspecting and packaging.

Photoresist coating process, exposure process, developing process, etching process and the like were performed to form a metal pattern and a connection pattern of the strap bonded RFID tag which is dually composed of the base member and the strap member according to an embodiment of the present invention. By patterning a complicated lithography process such as a photoresist removal process using a multifiber optical fiber laser, the process can be automated and simplified and the processing efficiency can be increased.

 According to an embodiment of the present invention, the base member and the strap member are made of a flexible thin film and are supplied from the first and second supply reels, and an anisotropic conductive film is supplied from the third supply reel between the base member and the strap member. RFID tag components placed in each can be automatically aligned using vision to automate the RFID tag manufacturing process.

According to an embodiment of the present invention, since the strap bonding process of the RFID tag is performed using a laser system, the RFID tag may be manufactured inline.

It is also an object of the present invention to prevent damage to heat-sensitive elements by using a laser in place of a hot plate, or to automate the strap bonding process of an RFID tag.

Hereinafter, an RFID tag manufacturing system and a manufacturing method using a laser according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

1 is a schematic plan view of an RFID tag inline manufacturing system using a laser according to an embodiment of the present invention, Figure 2 is a plurality of RFID patterns that can be manufactured inline RFID tag according to an embodiment of the present invention FIG. 3 is a schematic plan view illustrating a structure of a base substrate, a strap member, and an anisotropic conductive film, and FIG. 3 is a schematic conceptual view of a laser system used in an RFID tag inline manufacturing system according to an exemplary embodiment of the present invention.

Referring to Figure 1, RFID tag manufacturing system using a laser according to an embodiment of the present invention is a loading unit 110 for supplying a pair of a flexible insulating substrate on which a conductive film is deposited side by side with the anisotropic conductive film in between And a position alignment checking unit step 120 for confirming position alignment by checking a mark marked along a supply direction of the flexible insulation substrate using a laser, and an antenna on one of the flexible insulation substrates simultaneously using a laser. A pattern forming unit 130 for forming a pattern, forming a strap pattern on the other one, and forming a pattern along the strap pattern on the anisotropic conductive film, the antenna pattern forming flexible insulating substrate, and the strap pattern forming flexible A temporary coupling unit 135 for preliminarily coupling the insulating insulating material to the pattern-forming anisotropic conductive film, and an upper surface of the flexible insulating substrate. Using a strap bonding unit 140 for performing strap bonding by irradiating a laser beam while placing and pressing a substrate, an IC chip bonding unit 150 for loading and bonding an IC chip in the center of the strap pattern, and a molding resin The molding unit 160 to encapsulate, the positioning unit 165 to check the position of the molded RFID tag, the cutting unit 170 to cut the individual RFID tag using a laser, and whether the individual RFID tag is defective or not It includes an inspection unit 180 to inspect, a defective article unloading unit 185 for excluding defective articles, and an unloading unit 190 for loading a completed RFID tag.

The loading unit 110, the position alignment unit 120, the pattern forming unit 130, the strap bonding unit 140, the IC chip bonding unit 150, the molding unit 160, the cutting unit 170, and the inspection unit 180, the unloading unit 190 is configured to be connected inline by the transfer unit 200 consisting of a conveyor belt.

As shown in FIG. 2, the pair of flexible insulating substrates 10 and 20 on which the conductive film is deposited and the anisotropic conductive film 30 which are supplied side by side are supplied along the supply direction of the flexible insulating substrate. Groove marks A-1, B-1 and C-1 are formed at the same pitch, and the transfer unit has a position sensor 201 for checking the groove marks A-1, B-1 and C-1. ) Is arranged in the same pitch as the above pitch.

The position sensor 201 may be an infrared sensor, and is composed of a CPU or the like and the loading unit 110, the positioning unit 120, the pattern forming unit 130, the strap bonding unit 140, and the IC chip bonding. In addition to the programs for individually controlling the unit 150, the molding unit 160, the cutting unit 170, the inspection unit 180, the unloading unit 190, and the transfer unit 200, these individual programs may be integrated. It is connected to the central control unit 300 for interlocking control to enable inline control.

According to an embodiment of the present invention, the loading unit 110 is a material of the RFID tag by using a flexible planar insulating substrate (10, 20) and the anisotropic conductive film 30 to combine them by strap bonding RFID tag Because of the configuration, the first conductive reel 111, the second supply reel 113, the third supply reel 114 using the flexible insulating substrate (10, 20) and anisotropic conductive film 30 that combines them continuously ) Can be supplied. That is, the flexible planar insulating substrates 10 and 20 and the anisotropic conductive film 30 combining them can be automatically supplied continuously without protrusions.

The position alignment unit 120 recognizes an image using a CCD camera or a vision and transfers the image to the control unit 300 to the first supply reel 111, the second supply reel 113, and the third supply reel ( The winding direction and the winding speed of the 114 are controlled, and the home marks (A-1, B-1, C-1) are matched and pre-aligned.

The pattern forming unit 130 uses a laser system 100, as shown in FIG. The laser system 100 divides and amplifies the laser beam irradiated from the at least one laser oscillator 101 using the optical system 103 and controls the output and intensity through the shutters 106, 107, 108, and 109, respectively. The laser beams of different wavelength bands can be irradiated through the heads 104a, 104b, 104c, and 104d.

Each of the heads 104a, 104b, 104c, and 104d is connected to the optical fiber 105 to the remote pattern forming unit 130 and the strap bonding unit 140 on the transfer unit 200 without losing the output of the laser beam. Transfer to enable processing using at least one laser oscillator 101.

According to an embodiment of the present invention, the pattern forming unit 130 is connected to the control unit 300 through a plurality of laser heads 104a, 104b, 104c, 104d through a plurality of different wavelength bands, preferably conductive Patterns are formed by irradiating a laser beam of 800-1200 nm selected so as to be well absorbed into the film and penetrate the flexible insulating substrate.

According to the pattern forming unit 130, an antenna pattern 11 is formed on one of the flexible insulating substrates 10, a strap pattern 25 is formed on the other, and the strap pattern is formed on the anisotropic conductive film. A pattern can be formed along (25).

This is because the laser system 100 has a constant beam thickness DI which can perform processing by adjusting the focus, and has a unique wavelength band having good absorption or transmission power for each material. By controlling the second, third, and fourth different shutters 106, 107, 108, and 109, predetermined processing can be performed while reducing the thermal effect on other than the target object.

In addition, by patterning the pattern using the laser system 100, it is possible to reduce intricate processes due to wet processes, such as a printing process, a photoresist process, and a cleaning process, and to inline the pattern.

On the other hand, in general, the RFID tag electrically connects the base substrate (the first flexible insulating substrate) 10, the strap member (the second flexible insulating substrate) 20, and the base substrate 10 and the strap member 20. It can be configured as a bonding portion (anisotropic conductive film) 30 to be connected to each other and mechanically bonded.

The flexible insulating substrates 10 and 20 may be formed in a sheet form of a PET film, a PI (polyimide) film, ceramic, FR4, or the like.

The strap bonding unit 140 corresponds to a shape of a connection terminal input from the controller 300 using the laser system 100 based on the home marks A-1, B-1, and C-1. A beam profile is formed to perform strap bonding.

The strap bonding unit 140 further includes a high-strength glass substrate 40 and a pneumatic pressing jig 50 so that the anisotropic conductive film 30 can be heated by a laser beam in a compressed state.

The pneumatic pressure jig 50 is formed on the flexible insulating substrate (10, 20) by further using a silicon sheet as a cushioning material to press the uniform pressure regardless of the thickness of the pattern to form the anisotropic conductive film 30 It can be attached well.

The anisotropic conductive film is a film-like adhesive in which conductive particles (such as conductive balls), such as metal-coated plastic or metal particles, are dispersed. According to an embodiment of the present invention, the anisotropic conductive film is thermally cured using a laser beam, so that the connection The reliability can be improved and the connection pitch can be made fine.

According to one embodiment of the present invention, the anisotropic conductive film is configured to disperse fine conductive balls having a size of about 3 to 30um in an adhesive layer having a thickness of about 15 to 50um, and the connection terminal portion 13a of the base substrate 10 ) And the laser beam in the IR wavelength band of 800 to 1200 nm from the oscillation portion 101 of the laser system 100 after being disposed corresponding to the connection terminal 25 of the strap member 20. Irradiate the laser beam for 1 to 3 sec in the temperature range of about 160 to 180 ° C.

At this time, the glass substrate 40 disposed on the upper surface of the strap member 20 is pressed by 5 to 20kg / ㎠ by the pneumatic pressing jig 50, the connection terminal portion is replaced by the conductive ball is melted and dispersed in the ACF adhesive While conductivity is obtained by connecting between the corresponding leads 25 of the strap member 20, an ACF adhesive may wrap these connections to provide a double bonding effect.

Accordingly, conductivity is obtained in the vertical direction between the base substrate 10 and the strap member 20, and mechanical coupling between the conductive particles and the metal pattern may be maintained by high adhesive force of the adhesive to impart connection reliability. .

In addition, because of the use of a laser, even if the metal pattern is fine, poor connection may not occur, and thermal effects may be minimized because the absorption of the metal pattern or the base substrate is low by a non-contact process.

According to an embodiment of the present invention, in the laser system 100, the focus position is moved upward by using the optical device 103 so that the spot size corresponds to the shape of the connection terminal portion 25, and instead the output is made. It was increased to allow welding evenly.

In addition, the profile of the laser beam may be molded to correspond to the shape of the connection terminal to irradiate at once to make the laser beam uniformly spread over the entire area.

In addition, by irradiating a plurality of laser beams through a plurality of laser heads (104a, 104b, 104c, 104d) to combine these laser beams to correspond to the shape of the conductive lead can be welded uniformly and at the same time a plurality of strips Bonding is possible.

In this way, by irradiating a laser beam of a uniform output to the junction portion, the conductive ball was melted unevenly in the past, so that the conduction path over the entire area of the junction could not be formed, and thus the problem of poor connection could be solved.

On the other hand, the IC chip bonding unit 150 is formed perpendicular to the direction in which the strap bonding unit 140 and the flexible substrate (10, 20) is supplied.

The IC chip bonding unit 150 includes a telescopic arm 151 that moves vertically with respect to the direction in which the flexible substrates 10 and 20 are supplied, thereby providing a strap member 20 on the strap bonding unit 140. The IC chip is loaded into the IC chip portion 23 formed at the center of the.

At this time, the IC chip may be attached by an isotropic or anisotropic conductive adhesive.

The IC chip is bonded through the IC chip bonding unit 150, and the RFID strap bonding tag of the green state is molded by epoxy resin or the like in the molding unit 160.

Since the curing time is required for curing after molding in the molding unit 160, a buffer unit 155 may be further provided between the IC chip bonding unit 150 and the molding unit 160.

The buffer unit 155 may have a tag time at the molding unit 160 and a total tag time at the positioning unit 125, the pattern forming unit 130, the strap bonding 140, and the IC chip bonding unit 150. In consideration of this, it is preferable that the flexible substrate 10, 20, 30 is composed of a winding roll that can be wound.

The plurality of RFID tags 1 molded in the molding unit 160 as described above are checked through the positioning unit 165 and then individually cut through the cutting unit 170 and through the inspection unit 180. After checking whether there is a poor bonding or energization, if it is bad, it is classified as a bad unloading unit 185, and if normal, it is unloaded through the unloading unit 190.

The positioning unit 165, the cutting unit 170, and the inspection unit 180 is configured in the form of a rotating table is configured to proceed with the automation by reducing the tag time.

Now, an inline manufacturing method of an RFID tag using a laser according to an embodiment of the present invention will be described with reference to FIG. 5.

5 is a flowchart illustrating a method of manufacturing an RFID tag inline using a laser according to an embodiment of the present invention.

According to an embodiment of the present invention, a pair of flexible insulating substrates on which a conductive film is deposited are supplied side by side with the anisotropic conductive film interposed therebetween (S10) and displayed along the supply direction of the flexible insulating substrate using a laser. Check the mark to confirm the alignment (20), and at the same time using a laser to form an antenna pattern on one of the flexible insulating substrate, a strap pattern on the other, the strap pattern on the anisotropic conductive film A pattern is formed along (S30), the antenna pattern forming flexible insulating substrate and the strap pattern forming flexible insulating substrate are temporarily coupled to the anisotropic conductive film (S35), and a glass substrate is disposed on the upper surface of the flexible insulating substrate. And pressurizing and irradiating a laser beam to perform strap bonding (S40), bonding the IC chip to the center of the strap pattern (S50), and molding resin Encapsulate using (S60), inspect and package (S70).

RFID tag strap bonding method using a laser according to an embodiment of the present invention can be modified and applied in various forms within the scope of the technical idea of the present invention.

Therefore, the embodiments and drawings are merely for the purpose of describing the contents of the invention in detail, and are not intended to limit the scope of the technical idea of the invention, the scope of the present invention is not limited to the claims to be described later, the equivalent scope thereof It should be judged including.

1 is a schematic plan view of an RFID tag inline manufacturing system using a laser according to an embodiment of the present invention.

FIG. 2 is a schematic plan view illustrating a configuration of a base substrate, a strap member, and an anisotropic conductive film having a plurality of RFID patterns capable of manufacturing an RFID tag inline according to an embodiment of the present invention.

3 is a schematic conceptual diagram of a laser system used in an RFID tag inline manufacturing system according to an embodiment of the present invention.

Figure 4 is a schematic diagram showing a RFID tag strap bonding method using a laser in the RFID tag inline manufacturing system according to an embodiment of the present invention.

5 is a flowchart illustrating a method of manufacturing an RFID tag inline using a laser according to an embodiment of the present invention.

Claims (20)

In the strap bonding method of an RFID tag using a laser, Supplying a pair of flexible insulating substrates on which conductive films are deposited, side by side with the anisotropic conductive film interposed therebetween, and using a laser to check and mark the marked marks along the feeding direction of the flexible insulating substrate; And simultaneously forming an antenna pattern on one of the flexible insulating substrates using a laser, forming a strap pattern on the other, and forming a pattern along the strap pattern on the anisotropic conductive film, and the flexible insulation Irradiating a laser beam while placing and pressing a glass substrate on the upper surface of the substrate to perform strap bonding, bonding the IC chip to the center of the strap pattern, encapsulating with a molding resin, inspecting and packaging RFID tag manufacturing method using a laser comprising the step. The method of claim 1, The pair of flexible insulating substrates on which the conductive film is deposited are supplied side by side with the anisotropic conductive film interposed therebetween. The pair of flexible insulating substrates and the anisotropic conductive film may be provided with first, second and third supply reels. RFID tag manufacturing method using a laser supplied through. The method of claim 1, Identifying and aligning marks marked along the supply direction of the flexible insulating substrate using the laser may include forming a groove mark formed at a constant pitch along the supply direction on the pair of flexible insulating substrates and the anisotropic conductive film. RFID tag manufacturing method using a laser to check the infrared sensor. The method of claim 1, Forming an antenna pattern on one of the flexible insulating substrate, a strap pattern on the other, and simultaneously forming a pattern along the strap pattern on the anisotropic conductive film using a plurality of wavelength bands RFID tag manufacturing method using a laser that is performed simultaneously by varying the output, focal length. The method of claim 4, wherein The multi-head laser is a RFID tag manufacturing method using a laser connected to the optical fiber. The method of claim 1, Placing a glass substrate on the upper surface of the flexible insulating substrate and irradiating a laser beam while pressurizing straps may be performed by using a laser pressurized using a pneumatic push jig at the same time as the laser beam irradiation. The method of claim 6, The laser is a method of manufacturing an RFID tag using a laser for irradiating the laser beam for 1 to 3 seconds in the temperature range of about 160 ~ 180 ℃ with an output of 11 to 16 W laser beam of IR wavelength band of 800 to 1200 nm. The method of claim 6, Glass substrate disposed on the strap member is a RFID tag manufacturing method using a laser pressurized by 5 to 20kg / ㎠ by the pneumatic pressing jig. In the RFID tag manufacturing system using a laser,  Confirm the position alignment by checking the marked mark along the feeding direction of the flexible insulating substrate using a loading unit for supplying a pair of flexible insulating substrates on which the conductive film is deposited, with the anisotropic conductive film interposed therebetween, and using a laser. A pattern formed by forming an antenna pattern on one of the flexible insulating substrates, forming a strap pattern on the other, and forming a pattern along the strap pattern on the anisotropic conductive film using a position alignment unit and a laser at the same time. A unit, a strap bonding unit for performing strap bonding by irradiating a laser beam while placing and pressing a glass substrate on an upper surface of the flexible insulating substrate, an IC chip bonding unit for loading and bonding an IC chip in the center of the strap pattern; A molding unit encapsulating using a molding resin, a positioning unit for checking the position of the molded RFID tag, An RFID tag manufacturing system using a laser including a cutting unit for cutting into individual RFID tags by using a laser, an inspection unit for inspecting whether an individual RFID tag is defective, and an unloading unit for loading a completed RFID tag. The method of claim 9, The loading unit is a RFID tag manufacturing system using a laser including a first supply reel, the second supply reel, the third supply reel winding and rewinding. The method of claim 9, And the antenna pattern forming flexible insulating material and the strap pattern forming flexible insulating material, wherein the pattern forming anisotropic conductive film has a groove mark having a constant pitch in a supply direction. The method of claim 9, And a transfer unit comprising a conveyor belt for connecting the loading unit, the alignment unit, the pattern forming unit, the strap bonding unit, the IC chip bonding unit, the molding unit, the cutting unit, the inspection unit, and the unloading unit inline. RFID tag manufacturing system using. The method of claim 9, The alignment unit recognizes an image by using a CCD camera or a vision, and loads it, the alignment unit, the pattern forming unit, the strap bonding unit, the IC chip bonding unit, the molding unit, the cutting unit, the inspection unit, and the unloading unit. RFID tag manufacturing system using a laser to transmit the position information to the central control unit to control the unit integrally. The method of claim 9, The pattern forming unit uses a multihead laser system, and the laser system divides and amplifies a laser beam oscillated from at least one laser oscillator using an optical system and controls each head by controlling output and intensity through a shutter. RFID tag manufacturing system using a laser to irradiate laser beams of different wavelength bands through. The method of claim 14, Each head is an RFID tag manufacturing system using a laser connected to the optical fiber. The method of claim 9, The strap bonding unit is a RFID tag manufacturing system using a laser to form a laser beam profile corresponding to the shape of the connection terminal input from the control unit using a multi-head laser system on the basis of the home mark. The method of claim 9, The strap bonding unit is a RFID tag manufacturing system using a laser having a high-strength glass substrate and a pneumatic pressing jig further along the Z direction. The method of claim 9, RFID tag manufacturing system using a laser is formed in the IC chip bonding unit perpendicular to the direction in which the strap bonding unit and the flexible substrate is supplied. The method of claim 18, The IC chip bonding unit is a RFID tag manufacturing system using a laser having a telescopic arm that moves vertically with respect to the direction in which the flexible substrate is supplied. The method of claim 9, And a buffer unit between the strap bonding unit and the IC chip bonding unit, wherein the buffer unit is a rotary roll type laser tag manufacturing system.

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