KR20090018247A - Organic light emitting diode display device and method of manufacturing the same - Google Patents

Abstract

An organic light emitting diode display device and method of manufacturing the same is provided to prevent the defect of the toast by making electrical contact of the driver component and organic light-emitting diode device stable. In an organic light emitting diode display device, a driver component(105) is arranged on the first substrate(100). A protective film is arranged on the first substrate including driver component(110). A contact pattern electrically is connected to the driver component on the protective film(130). A first electrode is arranged in the inner side of the second substrate(200) opposite directions to the first substrate(210). An organic layer including the organic electroluminescent pattern is arranged on the first electrode(220). A conducting material having high corrosion resistance is arranged on the second electrode.

Description

Organic light emitting diode display and manufacturing method thereof {ORGANIC LIGHT EMITTING DIODE DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an organic light emitting diode display, and more particularly, to a dual panel type organic light emitting display device and a method of manufacturing the same, which ensure reliability and improve toast defects.

Recently, the organic light emitting diode display is self-luminous and does not require a backlight, such as a liquid crystal display, so that it is not only light and thin, but also can be manufactured through a simple process, thereby increasing price competitiveness. In addition, organic light emitting diode display devices are rapidly rising as next generation displays due to low voltage driving, high luminous efficiency, and wide viewing angle.

The organic light emitting diode display device includes an organic light emitting diode device for generating light and a driving device for controlling driving of the organic light emitting diode, for example, a thin film transistor. Here, since the driving device individually drives the organic light emitting diode device, the organic light emitting diode device may display the same luminance even when a low current is applied to the organic light emitting diode device. As a result, the organic light emitting diode display device includes a driving element, which is advantageous for low power consumption, high definition, and large size, and can improve the life of the organic light emitting diode display device.

In the organic light emitting diode display as described above, the aperture ratio is reduced as the light provided from the organic light emitting layer is provided to the user through the substrate on which the driving device is formed. In addition, in the organic light emitting diode display device, as the driving device and the organic light emitting diode device are continuously formed on one substrate, the manufacturing process time of the organic light emitting diode display device is lengthened, and the process yield is raised.

Accordingly, a technology for an organic light emitting diode display device of a dual panel type has emerged. The dual panel type organic light emitting diode display includes first and second substrates spaced apart from each other. Here, a driving device is formed on the first substrate, and an organic light emitting diode device is formed on the second substrate. In this case, the driving device and the organic light emitting diode device spaced apart from each other are electrically connected to each other and the first and second substrates are bonded to each other.

Such an organic light emitting diode display of the dual panel type may be manufactured by forming driving elements and organic light emitting diodes on the first and second substrates, respectively, and then bonding the first and second substrates together in a vacuum state. . Thereby, process yield can be improved.

However, the dual panel type organic light emitting diode display has a problem in that the contact between the driving element and the organic light emitting diode element is unstable.

For example, an oxide film is formed at a contact interface between the driving device and the organic light emitting diode device, which may cause a problem that the reliability of the dual panel type organic light emitting diode display device is degraded.

In addition, in the dual panel type organic light emitting diode display, the cell gap between the first and second substrates is gradually increased from the outside to the center by the outgassing generated therein or moisture and oxygen penetrated therein. It has a problem that occurs. As a result, poor electrical contact between the driving element and the organic light emitting diode device gradually progresses from the outer portion to the center portion, and as a result, the dual panel type organic light emitting diode display device does not gradually light up from the outer portion to the center portion over time. There is a problem that a bad toast occurs. In particular, when the dual panel type organic light emitting diode display is driven, the toast failure rate increases due to an increase in internal pressure. Such toast failures can drastically reduce brightness and lead to voltage drops. In this case, the voltage enhancement may reduce the driving voltage supplied to the organic light emitting diode device, thereby increasing power consumption.

Accordingly, the dual panel type organic light emitting diode display device which can increase the process efficiency of the related art has a problem in that electrical contact between the organic light emitting diode element and the driving element is unstable over time, resulting in a decrease in reliability or poor toast. .

One object of the present invention is to provide an organic light emitting diode display that can improve reliability by preventing electrical contact between the organic light emitting diode device and the driving device and prevent toast failure.

Another object of the present invention is to provide a method of manufacturing the organic light emitting diode display.

In order to achieve the above technical problem, an aspect of the present invention provides an organic light emitting diode display. The organic light emitting diode display may include a driving element disposed on a first substrate, a passivation layer disposed on the first substrate including the driving element, a contact pattern electrically connected to the driving element on the passivation layer, and the first pattern. A first electrode disposed on an inner surface of a second substrate facing the substrate, an organic layer disposed on the first electrode and including at least an organic light emitting pattern, a second electrode disposed on the organic layer, and the second electrode And a third electrode disposed on and having a contact portion in electrical contact with the contact pattern.

In order to achieve the above technical problem, another aspect of the present invention provides a method of manufacturing an organic light emitting diode display. The manufacturing method includes providing a first and a second substrate, respectively, forming a driving element on the first substrate, forming a protective film on the first substrate including the driving element, and forming the protective film. Forming a contact pattern electrically connected to the driving device at the first side, forming a first electrode on the second substrate, and forming an organic layer including at least an organic light emitting pattern on the first electrode Forming a second electrode on the layer, forming a third electrode having a contact portion protruding on the second electrode, and electrically contacting the contact portion and the contact pattern to each other; 2 bonding the substrate.

The present invention forms an electrode which is electrically in contact with the driving element by using a material having high corrosion resistance, thereby preventing the formation of oxide at the contact interface between the driving element and the organic light emitting diode element, thereby improving reliability of the completed organic light emitting diode display device. It can be secured.

In addition, the driving device and the organic light emitting diode device may be in contact with the driving device and the organic light emitting diode device through a fusion process using a low melting point alloy, it is possible to prevent the toast failure occurs.

In addition, oxide formation can be delayed at the contact interface between the driving element and the organic light emitting diode element using the low melting point alloy, thereby improving the reliability.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings of the organic light emitting diode display. The following embodiments are provided as examples to sufficiently convey the spirit of the present invention to those skilled in the art. Accordingly, the invention is not limited to the embodiments described below and may be embodied in other forms. In the drawings, the size and thickness of the device may be exaggerated for convenience. Like numbers refer to like elements throughout.

1A and 1B are diagrams illustrating an organic light emitting diode display device according to a first embodiment of the present invention. FIG. 1A is a plan view of an organic light emitting diode display according to a first exemplary embodiment of the present invention, and FIG. 1B is a cross-sectional view taken along the line II ′ of FIG. 1A.

1A and 1B, the organic light emitting diode display includes first and second substrates 100 and 200 facing each other and spaced apart at regular intervals. The first and second substrates 100 and 200 are bonded by a sealing member (not shown) interposed therebetween. The sealing member may prevent permeation of moisture and oxygen into the spaced space between the first and second substrates 100 and 200.

Although the plurality of pixels are defined in the first substrate 100, only one pixel of the plurality of pixels is enlarged in the drawing for convenience of description.

A plurality of wirings, for example, a gate wiring 101, a data wiring 102, and a power supply wiring 103 are disposed on the first substrate 100. The gate line 101 and the data line 102 may cross each other to define the pixel. The pixels may be arranged in various forms according to the arrangement and shape of the gate line 101 and the data line 102. For example, when the gate line 101 and the data line 102 are orthogonal to each other, each pixel may have a rectangular or rectangular shape.

In addition, the gate wiring 101 and the data wiring 102 are insulated from each other by a gate insulating film (not shown) interposed therebetween. In addition, a pad electrode (not shown) is disposed at each end of the plurality of wires. The pad electrode receives an electrical signal from an external driving circuit unit and provides it to each of the wirings. In addition, a pad contact electrode may be disposed to cover the pad electrode. Substantially, the external driving circuit portion is in electrical contact with the pad contact electrode to receive an electrical signal from the external driving circuit portion.

A driving element 105 electrically connected to the gate wiring 101, the data wiring 102, and the power wiring 103 is disposed in each pixel. The driving device 105 drives the organic light emitting diode device E to be described later by electrical signals applied from the gate wiring 101, the data wiring 102, and the power supply wiring 103. The driving device 105 includes a switching thin film transistor for selecting each pixel according to a selection signal, and an organic light emitting diode device by an electrical signal, for example, a data signal, which is adjusted by on / off of the switching thin film transistor. A driving thin film transistor for driving in (E) and a capacitor for maintaining the electrical signal for a predetermined time may be included.

The passivation layer 120 is disposed on the first substrate 100 including the plurality of wirings and the driving device 105. The passivation layer 120 may be formed of an organic insulating layer or an inorganic insulating layer. The passivation layer 120 may include a contact hole exposing a portion of the driving element 105. Substantially, the contact hole is provided in the driving thin film transistor (not shown) to expose a portion of the drain electrode for outputting an electrical signal.

A contact pattern 130 electrically connected to the driving device 105 is disposed on the passivation layer 120 through the contact hole. In order to prevent corrosion of the contact pattern 130, the contact pattern 130 may be formed of a conductive material having corrosion resistance. For example, the contact pattern 130 may be formed of any one of ITO and IZO. In addition, the contact pattern 130 may be formed of the same material as the pad contact electrode to prevent corrosion of the pad electrode, thereby ensuring reliability of the organic light emitting diode display device.

On the other hand, in the second substrate 200, an opposite pixel corresponding to the pixel is defined. That is, a plurality of opposing pixels may be defined in the second substrate 200.

The organic light emitting diode device E is electrically connected to the driving device 105 disposed on the first substrate 100 corresponding to the opposing pixel. In order to electrically connect the driving element 105 disposed in the pixel and the organic light emitting diode element E disposed in the opposite pixel to each other, at least a portion of the pixel and the opposite pixel may overlap each other.

The organic light emitting diode device E includes a first electrode 210, an organic layer 220 including at least an organic light emitting pattern, and a second electrode 230. In detail, the first electrode 210 may be commonly disposed in the plurality of opposing pixels. The first electrode 210 is transparent to transmit light. The first electrode 210 may be made of any one of ITO and IZO. As a result, the light generated from the organic light emitting pattern passes through the first electrode 210 and the second substrate 200 to provide an image to the user. Accordingly, the light may pass through the second substrate 200 without being affected by the driving device 105 disposed on the first substrate 100, thereby improving light efficiency. In addition, the driving device 105 may be freely designed in various sizes and shapes without considering the light transmittance.

The organic light emitting pattern receives first and second charges from the first and second electrodes 210 and 220, respectively, to generate light having a specific wavelength. The organic light emitting pattern may be separated for each opposing pixel. Alternatively, the organic light emitting pattern may be separated for each of the opposite pixels for implementing different colors.

The organic layer 220 may include a first charge injection layer, a first charge transport layer, a first charge blocking layer, a second charge transport layer, and a second charge injection in order to smoothly provide first and second charges to the organic light emitting pattern. It may further comprise at least one of the layers. The first charge injection layer and the first charge transport layer may be interposed between the first electrode 210 and the organic light emitting pattern. The first charge blocking layer, the second charge transport layer, and the second charge injection layer may be interposed between the organic light emitting pattern and the second electrode 230 to be described later.

The second electrode 230 is separated for each opposing pixel. The second electrode 230 is electrically connected to the driving device 105. The second electrode 230 may reflect light to the first electrode 210 and the second substrate 200 to improve light transmittance. In addition, the second electrode 230 is a conductive having a lower work function than the first electrode 210 in order to tunnel the second charge in the organic light emitting pattern, that is, the second charge crosses the energy barrier. It can be formed of a material. For example, the second electrode 230 may be formed of any one of Al and Pb.

In addition, a separator 215 is interposed between the first electrode 210 and the organic layer 220. The separator 215 may have an inverted trapezoidal shape when viewed in cross section. Thus, the separator 215 is disposed on the first electrode 210 along the periphery of the opposing pixel to separate the second electrode 230 for each opposing pixel. Although not shown, a buffer pattern may be further disposed between the first electrode 210 and the separator 215. The buffer pattern improves adhesion between the first electrode 210 and the separator 215 and prevents a short defect between the first electrode 210 and the second electrode 230.

In addition, at least one protrusion member 205 is disposed between the first electrode 210 and the organic layer 220. The protrusion member 205 is disposed on an area defined by the separator 215, for example, the first electrode 210 corresponding to the opposing pixel. The protruding member 205 has a tetragonal cross section. Accordingly, the protrusion member 205 protrudes a part of the organic layer 220 and the second electrode 230 without a short circuit between the organic layer 220 and the second electrode 230. Thus, when the first substrate 100 and the second substrate 200 are bonded to each other, the protrusion of the second electrode 230 and the contact pattern 130 are in electrical contact with each other, and eventually the organic light emitting diode The device E and the driving device 105 are electrically connected to each other.

However, the second electrode 230 may be oxidized by outgassing or oxygen and moisture introduced from the outside. Accordingly, an oxide film is formed at the contact interface between the second electrode 230 and the contact pattern 130. As a result, the contact resistance between the driving device 105 and the organic light emitting diode device E increases, resulting in a signal delay, and thus, the reliability of the organic light emitting diode display device may be degraded.

Accordingly, the organic light emitting diode device E is disposed on the second electrode 230 and further includes a third electrode 240 having greater corrosion resistance to moisture and oxygen than the second electrode 230. can do. The third electrode 240 includes a region in which a portion of the third electrode 240 protrudes by the protrusion member 205, that is, a contact portion 245. The contact part 245 is in contact with the contact pattern 130, and substantially connects the driving device 105 and the organic light emitting diode device E to each other. In addition, the third electrode 240 may be formed of a conductive material having a lower work function than the first electrode 210 to provide a first charge in the organic light emitting pattern. Thus, examples of the conductive material forming the third electrode 240 may be any one of Ag, Ti, V, W, and Ta.

The third electrode 240 may be separated for each opposing pixel by the separator 215. Accordingly, the third electrode 240 may have an area corresponding to the second electrode 230.

Therefore, in the first embodiment of the present invention, further comprising the third electrode 240 having corrosion resistance, an oxide film is formed at the contact interface between the driving device 105 and the organic light emitting diode device E, thereby contact resistance. Could prevent this increase. That is, as the electrical contact between the driving device 105 and the organic light emitting diode device E is stabilized, the reliability of the organic light emitting diode display device may be improved.

2 is a cross-sectional view of an organic light emitting diode display according to a second exemplary embodiment of the present invention. The second embodiment has the same components as the organic light emitting diode display of the first embodiment described above except for the contact portion of the third electrode. Therefore, repeated description of the first embodiment will be omitted, and like reference numerals refer to like elements.

Referring to FIG. 2, the organic light emitting diode display includes first and second substrates 100 and 200 facing each other and bonded to each other. The driving element 105, the passivation layer 110, and the contact pattern 130 are disposed on the first substrate 100, and the inner surface of the second substrate 200 facing the first substrate 100 is disposed. The first electrode 210 includes at least an organic layer 220 including at least an organic light emitting pattern, a second electrode 230, and a third electrode 340. Here, the third electrode 340 includes a contact portion 345 in electrical contact with the contact pattern 130.

The contact part 345 is fused to the contact pattern 130. As a result, the cell gap between the first and second substrates 100 and 200 collapses with time, and the toast failure caused by contact between the third electrode 340 and the contact pattern 130 is broken. You can prevent it.

The third electrode 340 includes a conductive material having a low melting point in the range of 60 ° C to 120 ° C. Here, when the melting point is 60 ℃ or more, it is difficult to form a thin film. In addition, when the melting point exceeds 120 ° C., the process temperature for fusing the third electrode 340 and the contact pattern 130 is increased to deform the organic light emitting diode device (E), particularly the organic light emitting pattern, so as to deform the lifetime. This may be lowered or the light efficiency may be lowered.

In addition, when the third electrode 340 is formed of a low melting point metal of a single material, the third electrode 340 is self-aggregation and conglomeration on the surface of the second electrode 230. May occur. As a result, the third electrode 340 includes an alloy in which at least two species are mixed. For example, the alloy may include at least two or more of In, Sn, and Bi.

In addition, even if the third electrode 340 is formed of an alloy, the third electrode 340 has a low melting point, so that self aggregation and conglomeration may occur due to an external environment. have. Accordingly, the third electrode 340 may be shorted, but the short circuit of the third electrode 340 is compensated for by the second electrode 230 disposed below the third electrode 340.

Since the alloy constituting the third electrode 340 has increased corrosion resistance to moisture and oxygen than other metals, an oxide film is prevented from being formed at the contact interface between the contact portion 345 and the contact pattern 130. You can.

Accordingly, in the second embodiment of the present invention, the second and third electrodes 230 and 240 are formed of the electrode providing the second charge to the organic light emitting pattern, and the third electrode 340 is formed in the contact pattern ( Fusion to 130 may improve adhesion between the driving device 105 and the organic light emitting diode device E, thereby preventing toast defects from occurring.

In addition, since the third electrode 340 is formed of an alloy having corrosion resistance, the organic light emitting diode display device is delayed and prevented from forming an oxide film at a contact interface between the third electrode 340 and the contact pattern 130. The reliability of can be prevented from being lowered.

3A to 3E are cross-sectional views illustrating a method of manufacturing an organic light emitting diode display according to a third exemplary embodiment of the present invention.

Referring to FIG. 3A, in order to manufacture an organic light emitting diode display, first, a first substrate 100 is provided. A plurality of pixels are defined in the first substrate 100.

The driving device 105 is formed on the first substrate 100. Although not shown in the drawing, a plurality of wirings, for example, gate wirings (101 in FIG. 1A), data wirings (102 in FIG. 1A), and a power supply are formed on the first substrate 100 in the process of forming the driving device 105. Wiring (103 in FIG. 1A) may be further formed.

Thereafter, the passivation layer 110 is formed on the first substrate 100 including the driving device 105. The protective film 110 may be formed of an inorganic insulating film. For example, the inorganic insulating film may be any one of a silicon oxide film, a silicon nitride film, and a laminated film thereof. In order to form the protective layer 110, an inorganic insulating layer is formed on the first substrate 100 including the driving device 105 by chemical vapor deposition. Thereafter, a portion of the inorganic insulating layer is etched to form a contact hole exposing a portion of the driving element 105.

Thereafter, a contact pattern 130 is formed on the passivation layer 100 to be electrically connected to the driving device 105. In order to form the contact pattern 130, first, a conductive film is formed on the passivation layer 110. The conductive film may be formed of a conductive material having corrosion resistance to prevent the oxide film from being formed at the electrical contact interface between the driving device 105 and the organic light emitting diode device E to be described later. For example, the conductive film may be formed of any one of ITO and IZO. Thereafter, the conductive layer is etched for each pixel to form the contact pattern 130.

Referring to FIG. 3B, a second substrate 200 is provided. The second substrate 200 may have a plurality of opposing pixels corresponding to the pixels.

The first electrode 210 is formed on the second substrate. The first electrode 210 may be formed in common to a plurality of opposing pixels. The first electrode 210 is transparent to transmit light. The first electrode 210 may be formed of any one of ITO and IZO. The first electrode 210 may be formed through a sputtering method.

Referring to FIG. 3C, a separator 215 is formed on the first electrode 210 along the periphery of each opposing pixel. The separator 215 has an inverted trapezoidal cross section.

In addition, at least one protrusion member 205 is formed on the first electrode 210 of the opposite pixel. The protruding member 205 may have a regular trapezoidal shape in cross section. Herein, the protrusion member 205 is formed after the separator 215 is formed. However, the separator 215 may be formed after the protrusion member 205 is formed.

The separator 215 and the protrusion member 205 may be formed from an organic insulating material.

In addition, before the separator 215 is formed, a buffer pattern (not shown) may be further formed along the periphery of each of the opposing pixels. The buffer pattern may be formed by etching at least one of a silicon oxide film and a silicon nitride film.

Referring to FIG. 3D, an organic layer 220 is formed on the first substrate on which the protrusion member 205 and the separator 215 are formed. The organic layer 220 includes an organic light emitting pattern patterned at least for each of the opposing pixels. In addition, the organic layer 220 may further include at least one of a first charge injection layer, a first charge transport layer, a first charge suppression layer, a second charge transport layer, and a second charge injection layer.

The organic layer 220 may be formed through a wet process or a vacuum deposition method. In particular, the organic light emitting pattern may be formed through a vacuum deposition method using a shadow mask.

Thereafter, the second electrode 230 is formed on the organic layer 220. The second electrode 230 may be formed by depositing a conductive material by vacuum deposition. In this case, the conductive material may be deposited on the organic layer 220 while being naturally separated by each of the opposing pixels by the separator 215 to form the second electrode 230 separated by each of the opposing pixels. .

Thereafter, a third electrode 240 is formed on the second electrode 230. The third electrode 240 may be formed of a conductive material having greater corrosion resistance than the second electrode 230. In addition, the third electrode 240 may be formed of a conductive material having a lower work function than the first electrode 210. For example, the third electrode 240 may be formed of any one of Ag, Ti, V, W, and Ta. The third electrode 240 may be formed through vacuum deposition. In this case, the third electrode 240 is separated for each opposing pixel by the separator 215. In addition, the third electrode 240 protrudes by the protrusion member 205 and includes a contact portion 245 corresponding to an upper portion of the protrusion member.

Referring to FIG. 3E, the contact portion 245 and the contact pattern 130 are electrically contacted with each other, and a sealing member (not shown) is formed on an outer side of at least one of the first and second substrates 100 and 200. The first and second substrates 100 and 200 are bonded to each other.

Therefore, in the embodiment of the present invention, as the third electrode 240 and the contact pattern 130 are each formed of a conductive material having high corrosion resistance, the surface of the second electrode 230 is oxidized, of course, An oxide film may be prevented from being formed at the contact interface between the contact portion 245 of the third electrode 240 and the contact pattern 130.

In addition, the third electrode 240 is opposed to each other by the separator 215 without further performing a separate patterning process such as photoresist formation, an exposure process using a mask, an etching process, and a removal process of the photoresist. By etching pixel by pixel, the process could be simplified.

4A and 4B are cross-sectional views illustrating a method of manufacturing an organic light emitting diode display according to a fourth embodiment of the present invention. The fourth embodiment of the present invention can be formed through the same manufacturing method as the above-described third embodiment except for forming the third electrode. Therefore, the description repeated from the third embodiment in the fourth embodiment will be omitted, and the same reference numerals refer to the same components.

Referring to FIG. 4A, first and second substrates 100 and 200 are provided to manufacture an organic light emitting diode display. Thereafter, the driving device 105, the passivation layer 110, and the contact pattern 130 are formed on the first substrate 100. Separately, a third electrode including a first electrode 210, an organic layer 220 including at least an organic light emitting pattern, a second electrode 230, and a protruding contact portion 345 on the second substrate 200. An electrode 340 is formed. Thereafter, the contact portion 345 and the contact pattern 130 are electrically contacted with each other, and the first and second substrates 100 and 200 are bonded to each other.

The third electrode 340 may include a low melting point alloy having a range of 60 ° C to 120 ° C. The third electrode 340 may form at least two or more of In, Sn, and Bi by a co-deposition method. That is, at least two crucibles are filled with different metals, respectively. Thereafter, the at least two crucibles may be simultaneously heated to deposit metals respectively filled in the at least two crucibles onto the second electrode 230 to form a third electrode 340. In contrast, the third electrode 340 may form at least two or more alloys of In, Sn, and Bi by vacuum deposition. That is, after filling the crucible with the alloy, the crucible may be heated to deposit the alloy filled with the crucible onto the second electrode 230 to form a third electrode 340.

Referring to FIG. 4B, after the first and second substrates 100 and 200 are bonded to each other, the contact portion of the third electrode 340 may be heat-treated by bonding the first and second substrates 100 and 200 to be bonded. 345 is fused to the contact pattern 130. The temperature of the heat treatment may be 80 ° C. to 120 ° C. in consideration of the melting point of the third electrode 340 and the deterioration of the organic light emitting diode device (E).

Therefore, in the fourth embodiment of the present invention, the third electrode 340 is formed of a low melting point alloy, and then the third electrode 340 and the contact pattern 130 are fused to form the driving element 105 and the organic light emitting diode. The adhesion between the diode elements E can be improved to prevent occurrence of toast defects.

In addition, since the low melting point alloy of the third electrode 340 has higher corrosion resistance due to outgassing, oxygen, and moisture than other single conductive materials, the oxide film is formed at the contact interface between the driving device 105 and the organic light emitting diode device E. This can be delayed or prevented from forming.

Hereinafter, in order to compare the electrical contact characteristics of the conventional organic light emitting diode display and the organic light emitting diode display according to the embodiment of the present invention, the first organic light emitting diode display and the embodiment of the present invention as described above. A second, third and fourth organic light emitting diode display according to the present invention was manufactured.

The second electrode of the first organic light emitting diode display device is formed of Al, and the contact pattern is formed of Mo.

The second organic light emitting diode display device is the same as the first organic light emitting diode display device except that a third electrode is further formed on the second electrode, the third electrode is formed of Ag, and the contact pattern is formed of ITO. Has a configuration.

The third organic light emitting diode display device has the same configuration as the second organic light emitting diode display device except that the third electrode is formed of an In: Sn alloy, and the contact pattern is formed of ITO.

The fourth organic light emitting diode display has the same structure as the second organic light emitting diode display except that the third electrode is formed of In: Bi alloy and the contact pattern is formed of ITO.

FIG. 5 is a graph illustrating a change in contact resistance (Rc) according to a high temperature and high humidity time of the first to third organic light emitting diode display devices. Here, the change in contact resistance (Rc) with time was measured at room temperature, 80 ° C, 100 ° C, and 120 ° C of the first organic light emitting diode display devices, respectively. At this time, the humidity was 90%. In addition, the contact resistance (Rc) change is measured by selecting dozens of a plurality of wirings provided in the first organic light emitting diode display devices, the dispersion degree is shown in the graph. In the same manner, the change in contact resistance Rc of the second and third organic light emitting diode display devices was measured.

As shown in FIG. 5, the change in contact resistance Rc of the first to third organic light emitting diode display devices 510, 520, and 530 is measured. It can be seen that the first organic light emitting diode display 510 is larger than the light emitting diode display devices 520 and 530. The rapid change in the contact resistance Rc may occur due to a change in morphology at the contact interface between the driving device and the organic light emitting diode device, thereby reducing the contact area or forming an oxide film at the contact interface. That is, a sudden change in the contact resistance Rc may occur when the electrical contact between the driving device and the organic light emitting diode device is unstable.

Accordingly, it was confirmed that the second and third organic light emitting diode display devices 520 and 530 have more stable electrical contact characteristics between the driving device and the organic light emitting diode device than the first organic light emitting diode display device 510. In addition, as in the third organic light emitting diode display device 530, even when the third electrode and the contact pattern were fused, it was confirmed that the voltage drop and the current flow of the organic light emitting diode element were not substantially affected. .

FIG. 6 is a photograph of a scanning electron microscope showing a contact interface after detaching the first to fourth organic light emitting diode display devices. Here, the first organic light emitting diode display devices were left for 500 hours in an atmosphere having a temperature of 60 ° C. and a humidity of 90%, and then heat-treated to the first organic light emitting diode display device. Subsequently, after removing the first and second substrates of the first organic light emitting diode display devices, contact regions between the driving device and the organic light emitting diode device were observed with a scanning electron microscope. In the same manner, contact regions between the driving elements and the organic light emitting diode elements respectively provided in the second to fourth organic light emitting diode display devices were observed with a scanning electron microscope.

As shown in FIG. 6, when the contact regions of the first to fourth organic light emitting diode display devices 510, 520, 530 and 540 are detached from each other, the first and second organic light emitting diode display devices 510 and 520 may be viewed. The surface pattern of the contact pattern and the contact portion could not be observed. However, the third and fourth organic light emitting diode display devices 530 and 540 were able to observe a shape in which the contact pattern and the contact portion were fused and separated. In addition, as the heat treatment temperature is increased in the third organic light emitting diode display device 530, the fusion characteristics may be increased.

Therefore, by providing the third electrode of the low melting point alloy, the organic light emitting diode element and the driving element could be electrically contacted by fusion. Accordingly, the electrical and physical adhesion between the organic light emitting diode device and the driving device can be improved, thereby preventing toast defects from occurring.

1A is a plan view of an organic light emitting diode display according to a first exemplary embodiment of the present invention.

FIG. 1B is a cross-sectional view taken along the line II ′ of FIG. 1A.

2 is a cross-sectional view of an organic light emitting diode display according to a second exemplary embodiment of the present invention.

3A to 3E are cross-sectional views illustrating a method of manufacturing an organic light emitting diode display according to a third exemplary embodiment of the present invention.

4A and 4B are cross-sectional views illustrating a method of manufacturing an organic light emitting diode display according to a fourth embodiment of the present invention.

FIG. 5 is a graph illustrating a change in contact resistance (Rc) according to a high temperature and high humidity time of the first to third organic light emitting diode display devices.

FIG. 6 is a photograph of a scanning electron microscope showing a contact interface after detaching the first to fourth organic light emitting diode display devices.

 (Explanation of reference numerals for the main parts of the drawings)

100: first substrate 105: driving element

110: protective film 130: contact pattern

200: second substrate 210: first electrode

220: organic layer 230: second electrode

240, 340: third electrode 245, 345: contact portion

Claims (10)

A drive element disposed on the first substrate; A protective film disposed on the first substrate including the driving element; A contact pattern electrically connected to the driving element on the passivation layer; A first electrode disposed on an inner surface of a second substrate facing the first substrate; An organic layer disposed on the first electrode and including at least an organic light emitting pattern; A second electrode disposed on the organic layer; And An organic light emitting diode display device comprising: a third electrode disposed on the second electrode, the conductive material having a higher corrosion resistance than the second electrode, and having a contact portion in electrical contact with the contact pattern. The method of claim 1, And the third electrode is made of any one of Ag, Ti, V, W, and Ta. The method of claim 1, And the contact portion is fused to the contact pattern. The method of claim 3, wherein And the third electrode includes an alloy having a low melting point in the range of 60 ° C to 120 ° C. The method of claim 4, wherein And the alloy comprises at least two of In, Sn, and Bi. The method of claim 1, And the contact pattern includes any one of ITO and IZO. Providing a first and a second substrate, respectively; Forming a driving element on the first substrate; Forming a protective film on the first substrate including the driving device; Forming a contact pattern electrically connected to the driving device on the passivation layer; Forming a first electrode on the second substrate; Forming an organic layer including at least an organic light emitting pattern on the first electrode; Forming a second electrode on the organic layer; Forming a third electrode on the second electrode, wherein the third electrode is formed of a conductive material having a higher corrosion resistance than the second electrode; And And electrically contacting the contact portion and the contact pattern with each other, and bonding the first and second substrates together. The method of claim 7, wherein And the third electrode is formed of any one of Ag, Ti, V, W, and Ta. The method of claim 7, wherein And the third electrode includes an alloy having a low melting point in the range of 60 ° C. to 120 ° C. The method of claim 9, And after the bonding of the first and second substrates, bonding the contact portion to the contact pattern.

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