KR20090014070A - Multiple socket plug and the manufacturiing method of the same and the fountain using the multiple socket plug - Google Patents

Abstract

A multiple socket plug and a manufacturing method thereof and a fountain using the multiple socket plug are provided to form a socket inserted into a board by the first and second socket units, thereby improving usability. A multiple socket type plug comprises the first and second lead lines(21,22), a socket and a board. The first and second lead lines are in charge of anode and cathode for electrical connection. The socket is formed by the first socket unit(75a) and the second socket unit(75b). The first socket unit forms a contact point with the first lead line. The second socket unit is installed to be separated from the first socket unit. The second socket unit forms a contact point with the second lead line. The board is formed by an external layer(70a) and an inner layer(70b).

Description

MULTIPLE SOCKET PLUG AND THE MANUFACTURIING METHOD OF THE SAME AND THE FOUNTAIN USING THE MULTIPLE SOCKET PLUG}

The present invention relates to a multi-socket plug that can be applied in a variety of fields by improving the socket-type plug structure is excellent in coupling performance and easy to use,

More specifically, the multi-socket plug may include a first socket part and a second lead wire which are in charge of the positive pole and the negative pole, and a first socket part which forms a contact point with the first lead wire for electrical connection. An outer layer having a socket formed of a second socket portion spaced from the first socket portion and forming a contact point with the second lead wire, and having an outer fastening hole to which the first socket portion is fastened; It is characterized in that it comprises a substrate made of an inner layer which is provided with an inner fastening hole and spaced apart from the outer layer and the second socket portion is fastened.

Temples often use various instruments, including lanterns and lanterns, to perform specific events or ceremonies. And lamps are used to illuminate events such as lanterns and lanterns.

In the past, candles were used to illuminate these events, but they were replaced by incandescent lamps because of fire hazards and failure to emit light for a long time. In addition, as disclosed in Korean Utility Model No. 033737 "Three-corporate lamps using high brightness light emitting diodes" and Korean Utility Model No. 033736 "molding lanterns" due to power consumption and heat generation problems, LEDs, that is, LEDs, Mainly used.

In the lamps used in the lanterns and the lights described above, the LED is directly connected to the cable or a structure through the printed circuit board connected to the cable, this structure is a way that the lead wire of the LED is soldered to the cable or printed circuit board If the LED is broken there was a problem that the replacement is virtually impossible.

There are improvements to the above problems, such as registered utility model No. 004087 "direct lighting lit directly", registered utility model No. 0425465 "a temple lamp with a waterproofing means", etc.

The LED disclosed in the related art has a structure in which the lead wire and the light emitting part are placed on the base, and the base is screwed to the socket, so that only the base on which the light emitting part is placed should be replaced when the LED is broken.

However, in the LED disclosed in the prior art, the lead wire forming the (+) or (-) part is electrically connected to the bottom of the base, and when it is fastened with the socket, an electrical connection with the bottom of the socket is required.

In the electrical connection, the bottom of the base and the bottom of the socket are not correctly contacted, i.e., a poor contact occurs frequently, causing a problem in light emission, and the light emitting part for easy insertion into the socket and electrical contact. As the shape of the base to be settled down becomes narrower in cross section, that is, the shape of the ordinary light narrowing is normally taken, and there is a problem that it can be easily released when fastening with the socket.

In particular, even in the case of installing a large number of LEDs at once, according to the prior art, there was a problem in that a partial contact failure occurred and a maintenance work must be performed every time.

In order to separate and turn on a large amount of LEDs, each of the electrically connected LEDs must be individually connected, and there is a problem in that specific LEDs cannot be easily turned off and on.

In addition, the prior art has been described with a light emitting diode, that is, a structure in which the lamp is fastened to the socket, but instead of the light emitting diode placed in the socket, one side of the (+) and (-) pole lead wire for electrical connection The plug is electrically connected to the socket and the other side is connected to a wire to be exposed to the outside to be fastened to an object requiring other electric supply, so that the configuration of the plug itself capable of connection without a defective electrical contact may be considered. This configuration has not been disclosed in the field at all, there is a problem in that it is inconvenient to use and difficult to apply to various fields.

In order to solve the above problem, the present invention relates to a substrate structure of a plug in which all the lead wires forming the positive and negative poles are electrically connected to the lead wires to induce easy electrical contact with the substrate. The inner layer is divided into two stages and the socket inserted into the substrate is also divided into a first socket portion and a second socket beam

If necessary, the socket can be connected to the light-emitting diode to be conducted. Alternatively, the non-light-emitting diode can be connected to a wire and supply power to a specific object through the wire. It is an object of the present invention to provide a method for preparing the same.

In addition, to increase the electrical contact area and to prevent safety problems, a specific insulation is formed between the sockets of the two-stage configuration or between the two-stage substrates or both, and a separate insulating layer is further provided on the upper surface of the substrate. not,

Furthermore, in order to prevent overheating of the configuration of each socket part by electrical connection, a separate socket means for providing heat dissipation is provided to provide a multi-socket type plug and a method of manufacturing the same, which ultimately ensures safety in use. Its purpose is to.

In addition, the multi-socket type plug may be provided with a plurality of fastening holes so that power supplied through a single path may be supplied to the plurality of fastening holes and sockets, and light emitting diodes or wires. It is an object of the present invention to provide a multi-socket plug and a method of manufacturing the same.

The multi-socket plug according to the present invention for solving the above problems is to form a contact between the first and second lead wires and the first lead wires for the (+) and (-) poles for electrical connection An outer layer having a socket formed of a first socket portion and a second socket portion spaced from the first socket portion and forming a contact with the second lead wire, and an outer fastening hole to which the first socket portion is fastened; It is characterized in that it comprises a substrate having an inner fastening hole formed to correspond to the outer fastening hole and is formed spaced apart from the outer layer and made of an inner layer to which the second socket portion is fastened.

In addition, the inner layer and the outer layer of the substrate according to the present invention is formed in a pipe shape having a concentric circle cross-section is further provided with a cooling means for preventing overheating, the cooling means through the space formed by the inner layer of the substrate The technical feature is that the cooling water is configured to pass.

In addition, the multi-socket type plus manufacturing method according to the present invention includes a substrate forming step of extruding a substrate formed of an outer layer and an inner layer of a pipe shape, and a hole processing step of forming fastening holes in the outer layer and the inner layer; And a socket fastening step of inserting and fastening a socket having first and second socket parts to form a contact point between the first and second lead wires in charge of the (+) pole and the (−) pole in the formed fastening hole. It is characterized by what is achieved.

In addition, the fountain using a multi-socket plug according to the present invention is a first socket for forming a contact between the first and second lead wires and the first lead wires for the (+) and (-) poles for electrical connection An outer layer and an outer fastening portion having a socket formed of a second socket portion spaced apart from the first socket portion and forming a contact point with the second lead wire, and an outer fastening hole engaged with the first socket portion. A multi-socket plug comprising: a pipe-shaped substrate having an inner fastening hole formed to correspond to a ball and spaced apart from the outer layer and formed of an inner layer fastened to the second socket portion. The light-emitting diode is electrically connected to the first and second lead wires, and a light emitting diode having a hollow penetrating the outside is fastened to the inner socket of the light emitting part, and the hollow is connected to the inner layer of the substrate. It is characterized in that the cooling water communicating with the space formed by passing through the space formed by the inner layer is ejected to the outside through the hollow.

According to the present invention, due to the two-stage socket and the two-stage substrate connected thereto, not only can the contact area of the lead wire for the electrical connection be made to the maximum, but also the contact failure can be caused even when the electrical connection with the substrate. To solve the problem you're experiencing,

If necessary, light emitting diodes can be fastened to sockets or wires directly connected to various fields, not just lamps.

Finally, even if a light emitting diode having a variety of colors or an object requiring power supply is connected to various types of boards having a large area, there is no problem in that some contact points are not generated, and a multi-socket type plug that can be used for safety is also a problem. There is an effect that it can provide.

In particular, when the light emitting diode is fastened to the socket, the light emitting diodes having various colors can be easily turned on or off, and the shape of the substrate can be changed into various shapes without a bad contact with the base. By doing so, you can produce a spectacular view.

Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

1 illustrates a conventional light emitting diode configuration in which contact failure is a problem. As shown in the drawing, there are two contacts 71 'and 72' for electrical coupling with a base inside the socket 70 '. These two contacts are respectively connected to two wires of the cable and in contact with two contacts 31 'and 32' formed on the base. Of course, the contacts 71 ′ and 31 ′ shown on the inner side of the socket and the outer side of the base among the two contacts are shown for explanation, and the inner side of the socket and the outer side of the base itself serve as contacts. It is common.

The base 30 'is electrically coupled to the socket by a screw, and the light emitting part 10' is placed inside the base.

The two lead wires 21 ′ and 22 ′ accommodated in the light emitting unit are connected to the two contacts of the base, respectively, and one of the two lead wires is connected to the protection resistor 80 ′. The protection resistance is to prevent the LED from being damaged by the surge voltage, which is a common configuration.

Of course, one of the two lead wires is connected to the (+) pole, the other is connected to the (-) pole, in the following for the sake of ease of explanation, the lead wires are connected to the outer surface of the base to make contact A description will be given with reference to 21 'as the first lead wire and the remaining lead wire 22' as the second lead wire.

In the above configuration, when the base 30 'is electrically connected to the socket 70', the contact 32 'of the base connected to the second lead 21' and the contact 72 'of the socket have good contact. There is a problem that is not made. That is, when the base 30 'is screwed to the socket 70' to be coupled to the socket 70 ', the bottom of the base on which the base 32' is formed and the bottom of the socket on which the socket 72 'is formed. Problems arise that the contact is not easy.

Furthermore, when the packing member is provided in order to solve the waterproof problem, the contact failure becomes more severe due to the volume or thickness of the packing member.

Accordingly, in the present invention, as shown in FIGS. 2 and 3, the configuration of the light emitting unit 10 and the lead wires 21 and 22 accommodated in the light emitting unit is the same as in the related art, but forms a contact with the lead wire and is electrically connected to the substrate. The base of the light emitting diode to which the connection is made is separately configured as the first BS 30 and the second base 40. In addition, the substrate 70 includes a socket 75 for inserting the base of the light emitting diode in the substrate 70 into which the base is inserted, the first socket portion 75a fastened to the first base 30, and the second socket. It has a second socket portion (75b) that is fastened to the base 40,

The first socket portion 75a is connected to the outer layer 70a of the substrate, and the second socket portion 75b is connected to the inner layer 70b of the substrate to facilitate electrical connection and prevent contact failure. .

More specifically, the first lead wire 21 according to the present invention is connected to the first base 30, and the second lead wire 22 is connected to the second base 40. The base of the two-stage configuration is formed on the substrate and is fastened to the socket 75 consisting of two stages in the same manner as the base by screwing.

As a result, due to the configuration of the second base 40 and the second socket portion 75b, it is possible to secure a wide area of electrical contact by the second lead wire 22, thereby reducing the possibility of problems in contact failure. It is.

In addition, the first socket portion 75a and the second socket portion 75b, more specifically, the outer layer 70a and the inner layer 70b of the substrate 70 are spaced apart from each other at a predetermined distance. As shown in FIG. 3, in order to ensure structural stability, it is preferable to provide a separate insulation unit 50 in the spaced space. In addition, the insulating portion is preferably formed in the spaced space between the first base and the second base of the light emitting diode fastened to the socket of the substrate.

Next, as shown in Figure 3a and 3b, the base consisting of two stages in contact with the lead wire is fastened to the socket of the substrate consisting of the outer layer and the inner layer,

A plurality of fastening holes 71a and 71b are formed in the substrate 70 to be fastened to the bases 30 and 40. That is, the first base 30 is screwed through the outer fastening hole 71a and the first socket portion 75a formed in the outer layer, and the second base 40 is the inner fastening hole formed in the inner layer. The threaded coupling is made through the 71b and the second socket portion 75b.

In this case, referring to FIG. 3B, moisture is prevented from penetrating through a narrow gap between the first base 30, the first socket part 75a, and the external fastening hole 71a in the coupling between the base and the substrate. In an embodiment of the present invention, the waterproof member 60 is provided under the light emitting unit to improve the adhesion to the substrate.

The waterproof member may be embodied in various forms, but as shown in FIGS. 2 and 3, the round base portion 60a is formed under the light emitting portion to form the first base 30, the first socket portion 75a, And it is possible to completely seal the narrow gap that may occur when combined with the outer fastening hole (71a) of the substrate.

Of course, the upper surface of the outer layer of the substrate is preferably coated with an epoxy or the like for insulation, after all, the first base 30, the first socket portion 75a, In addition, the gap between the outer fastening holes 71a of the substrate is sealed, and the insulating layer 72 coated again is in contact with the outer circumferential surface of the annulus, thereby further improving waterproofing.

In the present invention, although the waterproof member is shown as a round portion formed under the light emitting portion through FIGS. 2 and 3, it can be replaced by a packing inserted into the outer circumferential surface of the light emitting portion. In this case, considering the adhesion, rubber packing would be preferred.

2 and 3, the light emitting diode having a base composed of a two-stage configuration is inserted into a socket provided on a substrate.

In the socket, instead of the light emitting diode, a conventional wire C may be connected to the first lead wire 21 and the second lead wire 22 to be electrically coupled.

In the foregoing case, that is, when the light emitting diode is inserted, the substrate functions as a lighting lamp. However, when a wire is directly connected to the first lead wire and the second lead wire instead of the light emitting diode, power is supplied to various objects requiring power. It can be used as a plug itself, so the range of use is widened.

That is, as shown in FIG. 4, a plurality of fastening holes 71a and 71b are formed in the substrate according to the present invention, and the plurality of fastening holes are electrically connected to the first lead wire and the second lead wire. The first socket portion 75a and the second socket portion 75b, and a socket 75 composed of an insulation portion 50 are inserted and fastened therebetween, and the first lead wire 21 and the second socket portion are inserted into the socket. The wire C connected to the lead wire 22 is fastened.

Of course, the substrate is connected to a power supply unit (not shown) for supplying power to the object through the respective sockets 75, the first and second lead wires 21 and 22, and the wire C. The same applies to the form in which is inserted.

Therefore, when power is supplied to the substrate 70 through a power supply unit, power is supplied to the wires C connected to the respective sockets 75, thereby ultimately supplying power to the object connected to the respective sockets with wires. Will be supplied.

In this case, since the first and second lead wires 21 and 22 are electrically connected to a socket composed of the first socket part 75a and the second socket part 75b, the contact is poor and the power is cut off. The problem is solved.

3 and 5 will be described with reference to the substrate configuration in the light emitting diode connected state. Of course, the description of the following configuration is the same also applies to the case where the wire is connected instead of the light emitting diode.

In the substrate 70, a plurality of fastening holes 71a and 71b and sockets 75 are formed in the fastening holes in order to insert various types of LEDs emitting various colors. As described above, the substrate 70 In order to solve the problem of contact failure, the outer layer 70a formed with a plurality of external fastening holes and the second base connected with the second lead wire are formed to achieve electrical coupling with the first base connected with the first lead wire. Consists of an inner layer (70b) formed with a plurality of internal fastening holes for achieving a positive coupling,

The substrate is provided with a first socket portion 75a fastened to the outer fastening hole and a second socket part 75b fastened to the inner fastening hole.

Finally, the base of the light emitting diode is fastened to the socket 75.

Furthermore, although the outer layer 70a of the substrate is naturally composed of a conductor, the inner layer 70b is composed of a non-conductor 78, and only the adjacent portion 77 having the inner fastening hole 71b is formed of a conductor. It can also be configured as.

More specifically, referring to FIG. 5, which shows only the inner layer 70b, the inner layer 70b may be used to emit light in a large amount of light emitting diodes in a specific horizontal row, vertical column only, or diagonal line only. I need a configuration of

If the light emitting diodes are to be arranged in a horizontal row, as shown in FIG. 5, it is preferable to form adjacent portions 77 of the inner fastening holes 71b formed of a conductor in a horizontal row shape. Therefore, when the lighting of the light emitting diodes of a specific horizontal array is not desired, only electrical connection of the undesired array is blocked, so that only the desired array is turned on.

If the inner layers are all made of conductors, the light emitting diodes may not be turned on or off in a particular arrangement, and for this purpose, there is a problem in that the electrical connection to each of the light emitting diodes must be disconnected.

Although the arrangement is illustrated in FIG. 5 to be lit in a horizontal row, this may be configured as a vertical column or a diagonal row according to a user's request.

Next, referring to FIG. 6, the substrate 70 has a curved surface, that is, a pipe shape, unlike the flat substrate shown in FIG. 3.

That is, as shown in FIG. 6B, the inner layer 70b and the outer layer 70a of the substrate are configured in the shape of a pipe having concentric circles, and the first socket part and the first layer are formed on the inner layer and the outer layer. A socket 75 consisting of two socket parts is fastened, and a wire is connected to the socket through first and second lead wires.

Even if power is supplied to the wires, the method of supplying power only to the wires of some arrangements is the same as the method in which the LED is coupled and operated through FIGS. 3 and 5, and thus a detailed description thereof will be omitted.

However, when taking the form of the substrate as shown in FIG. 6, it is easy to install cooling means for preventing excessive heat generation of the wire or the light emitting diode.

The cooling means is implemented by passing the cooling water through the inner space 73 made by the pipe inner substrate layer 70b.

Therefore, as shown in FIG. 6A, the coolant is introduced into the inner side of one side of the substrate forming the concentric pipe shape 91.

While the introduced coolant penetrates through the space 73 of the inner layer, excessive heat generation of the LEDs which come into contact with the inside is prevented and radiated, thereby being discharged to the other side 92.

Furthermore, the material of the substrate is preferably made of a flexible material to implement a free shape. Accordingly, the present invention is not limited to the flat substrate shown in FIG. 3 and the pipe-shaped substrate shown in FIG. 6, and various shapes such as the folding or bending of the substrate can be realized, thereby creating a spectacular view. It becomes possible.

After all, in order to manufacture a multi-socket plug according to the present invention, whether it is a flat plate shape shown in FIG. 3 or a pipe shape shown in FIG.

A substrate forming step of extruding a substrate 70 formed of a pipe-shaped outer layer and an inner layer, a hole processing step of forming fastening holes 71a and 71b in the outer layer and the inner layer, and the formed fastening hole And a socket fastening step of inserting and fastening a socket 75 having first and second socket parts forming a contact point between the first and second lead wires in charge of the (+) pole and the (−) pole.

In addition, after the socket fastening step, it is preferable that a coating treatment for insulation is performed on the upper surface of the outer layer of the substrate.

In particular, when the substrate is formed in the pipe shape, both sides of the substrate 70 is preferably welded or placed to finish so as not to be connected to the outside.

As described above, the plug of the present invention can supply power to objects connected to light emitting diodes or wires connected to a plurality of sockets through a single power source.

In addition to the simple lighting field, it can be applied to various ranges such as the operation of cutting-edge robots and the lighting means used for catching squid in water.

In addition, the plug structure as described above, in particular, the structure of the substrate formed in a pipe shape can be applied to a fountain,

That is, FIG. 7 illustrates a fountain in which the plug structure of the present invention is applied, and the pipe shape shown in FIG. 6 and the structure in which the light emitting diode is fastened to the socket are used as it is. However, the configuration of the light emitting diode inserted into the socket is modified in order to induce water injection, which is a fountain, which will be described with reference to FIG. 7.

Referring to FIG. 7, a first socket part and a first socket part forming a contact point between the first and second lead wires, which are in charge of the (+) pole and the (-) pole, and the first lead wire for electrical connection. An outer layer (70a) and the outer fastening hole having a socket (75) formed of a second socket portion spaced from and formed to form a contact point with the second lead wire, and an outer fastening hole engaged with the first socket portion. In the multi-socket plug having an inner fastening hole correspondingly formed and spaced apart from the outer layer and including a pipe-shaped substrate 70 formed of an inner layer 70b fastened to the second socket portion,

The light emitting diode is electrically connected to the first and second lead wires to the socket 75 fastened to the substrate, and a light emitting diode having a hollow 10a penetrating the outside is fastened to an inner circumferential surface of the light emitting part.

The hollow is in communication with the space 73 formed by the inner layer of the substrate

Cooling water passing through the space (73) formed by the inner layer is configured to be ejected to the outside through the hollow (10a).

In order to serve as a fountain, a light emitting diode fastened to the socket is provided with a hollow 10a communicating with a space formed by an inner layer of the substrate.

Therefore, when the coolant is injected into the space formed by the inner layer of the substrate, the coolant is spouted out like a fountain through the space formed by the inner layer of the substrate and the hollow in communication therewith.

Of course, the light emitting unit 10 of the light emitting diode is divided about the hollow 10a to produce a spectacular view, it is preferable to configure so that different light is emitted for each divided space.

1 is an exploded perspective view showing a conventional LED before bonding to the substrate.

2 is a perspective view showing a light emitting diode fastened to a socket of a plug according to the present invention;

Figure 3 shows a combined state of the plug and the light emitting diode according to the present invention, Figure 3a is a perspective view of the combination, Figure 3b is a cross-sectional view of the coupling.

Figure 4 is a perspective view showing a coupling state of the plug and the wire according to the present invention.

Figure 5 is a perspective view showing only the substrate inner layer of the plug according to the present invention.

6 is a view illustrating a state in which a plug type and a light emitting diode are coupled to each other according to an embodiment of the present invention. FIG. 5A is a perspective view of the coupling, and FIG. 5B is a coupling cross-sectional view.

7 is a perspective view showing a fountain to which the plug according to the present invention is applied.

* Explanation of symbols for the main parts of the drawings *

10, 10 ': light emitting portion 21, 21': first lead wire 22, 22 ': second lead wire

30: first base 40; 2nd base 50 and 55: insulation part

60: waterproof member 70: substrate 70 ': socket

70a; Outer layer 70b: Inner layer 71a: Outer fastener 71b: Inner fastener

72: insulation layer 73: internal space 75: socket 77: adjacent portion 78: insulator

80, 80 ': Protective resistance 75a: First socket portion 75b: Second socket portion

91: coolant inlet 95: coolant discharge

Claims (10)

First and second lead wires for the positive and negative poles for electrical connection; A socket comprising a first socket portion forming a contact with the first lead wire, and a second socket portion spaced apart from the first socket portion and forming a contact with the second lead wire; And And an inner layer having an outer fastening hole to which the first socket part is fastened, and an inner fastening hole formed to correspond to the outer fastening hole and spaced apart from the outer layer. Multiple socket-type plug, characterized in that the substrate made; The multi-socket plug according to claim 1, wherein the substrate is made of a flexible material to realize a free shape of the plug. The multi-socket plug according to claim 1, wherein the inner layer and the outer layer of the substrate are formed in a pipe shape having concentric circles. 4. The multi-socket type plug of claim 3, wherein the plug further includes cooling means for preventing overheating, and the cooling means is configured to allow the cooling water to pass through a space formed by an inner layer of the substrate. The multi-socket plug according to claim 1, wherein both sides of the substrate formed of the outer layer and the inner layer are finished by welding or pouring. The multi-socket plug of claim 1, wherein an insulation part is further provided in a space between the first and second socket parts or a space between the outer and inner layers. A substrate forming step of extruding a substrate made of a pipe-shaped outer layer and an inner layer; Hole processing step of forming a fastening hole in the outer layer and the inner layer; And And a socket fastening step of inserting and fastening a socket having first and second socket parts to form a contact point between the first and second lead wires in charge of the (+) pole and the (−) pole in the formed fastening hole. Method of manufacturing a multi-socket plug. The method of claim 7, wherein The method of manufacturing a multi-socket plug, characterized in that further comprising a coating treatment step of performing a coating treatment for insulation on the upper surface of the outer layer after the socket fastening step. First and second lead wires for the positive and negative poles for electrical connection; A socket comprising a first socket portion forming a contact with the first lead wire, and a second socket portion spaced apart from the first socket portion and forming a contact with the second lead wire; And And an inner layer having an outer layer having an outer fastening hole fastened to the first socket portion, and an inner fastening hole formed to correspond to the outer fastening hole and being spaced apart from the outer layer and being fastened to the second socket portion. In the multiple socket-type plug comprising a; The light emitting diode is electrically connected to the first and second lead wires to the socket fastened to the substrate, and a light emitting diode having a hollow penetrating the outside is fastened to the inner circumferential surface of the light emitting part, The hollow is in communication with the space formed by the inner layer of the substrate A fountain using a multi-socket plug, characterized in that the cooling water passing through the space formed by the inner layer is ejected to the outside through the hollow. The method of claim 9, The light emitting part of the light emitting diode is a fountain using a multi-socket plug, characterized in that the multi-color light is emitted around the hollow.

Images