KR20090013941A - Semiconductor device fabrication installation - Google Patents
Semiconductor device fabrication installation Download PDFInfo
- Publication number
- KR20090013941A KR20090013941A KR1020070078111A KR20070078111A KR20090013941A KR 20090013941 A KR20090013941 A KR 20090013941A KR 1020070078111 A KR1020070078111 A KR 1020070078111A KR 20070078111 A KR20070078111 A KR 20070078111A KR 20090013941 A KR20090013941 A KR 20090013941A
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- unit
- transfer unit
- substrate transfer
- guide
- Prior art date
Links
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
The present invention relates to a semiconductor manufacturing facility that can reduce contamination of a substrate.
The semiconductor manufacturing process proceeds with various processes applied to a semiconductor substrate or a glass substrate to form an electronic circuit on the semiconductor substrate or the glass substrate.
The photolithography process, which is a typical unit process in the semiconductor manufacturing process, is largely composed of a photoresist coating process, an exposure process, and a developing process. The photoresist coating step is a step of coating the photoresist on the surface of the substrate, and the exposure step is a step of irradiating ultraviolet rays to the substrate after covering the substrate with a mask having a pattern formed thereon. In addition, the developing step is a step of partially removing the photoresist film using a developer, and the photoresist film cured in the exposure process is not removed by the developer so that a photoresist pattern is formed on the substrate.
Facilities for performing the photolithography process include in-line equipment and spinner local equipment. The local facility consists of a process processor consisting of indexer, application, development and bake modules. The indexer is a unit for the purpose of interfacing the user to the wafer and the process module (application modules and bake module). When the cassette is provided to the indexer's load port by the operator (or AGP), the indexer robot The wafer is extracted to transfer the substrate to the substrate transfer apparatus, which is loaded into the process module by the substrate transfer apparatus. When the process is completed for the substrate, the wafer is recovered by the substrate transfer device and stored in the wafer cassette.
However, in the process of moving the substrate transfer apparatus in the vertical and horizontal directions along the transfer guide to load the wafer into the process module, surrounding particles may contaminate the wafer. If the wafer is contaminated by particles, the wiring formed in the semiconductor manufactured from the wafer into the substrate may be shorted or broken to reduce the semiconductor manufacturing yield.
It is an object of the present invention to provide a semiconductor manufacturing facility having a substrate transfer unit that can reduce the contamination of a substrate by particles.
In order to achieve the above object, the semiconductor manufacturing equipment according to the present invention is provided with a substrate processing unit for processing a substrate, a substrate transfer unit for moving within the substrate transfer region and transferring the substrate from the outside to the processing unit side, the substrate comprising a filter And a main fan filter unit provided above the transfer unit and generating a first downdraft in a region to which the substrate transfer unit moves.
The substrate transfer unit may include a base body, at least one arm portion coupled to the base body, a pocket portion coupled to the arm portion and a substrate on which the substrate is placed, and a second descending air flow around the pocket portion. And an auxiliary fan filter unit for generating.
The semiconductor manufacturing equipment according to the present invention is provided with a separate auxiliary fan filter unit on top of the substrate transfer unit, and as a result, contamination of the wafer seated on the substrate transfer unit by particles is reduced.
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The objects, features and effects of the present invention described above will be readily understood through embodiments related to the accompanying drawings. However, the present invention is not limited to the embodiments described herein and may be applied and modified in various forms. Rather, the following embodiments are provided to clarify the technical spirit disclosed by the present invention, and furthermore, to fully convey the technical spirit of the present invention to those skilled in the art having an average knowledge in the field to which the present invention belongs. Therefore, the scope of the present invention should not be construed as limited by the embodiments described below. On the other hand, the drawings presented in conjunction with the following examples are somewhat simplified or exaggerated for clarity, the same reference numerals in the drawings represent the same components.
1 is a plan view of a semiconductor manufacturing facility according to an embodiment of the present invention, and is a side view of the semiconductor manufacturing facility shown in FIG. 1.
1 and 2, the
The
Each of the
The
The
The
The
The
As described above, since the
Each of the
Therefore, when a wafer is provided to the cassette C of the
In addition, the
3 is a cross-sectional view illustrating a portion taken along line II ′ of FIG. 1, and FIG. 4 is an exploded perspective view of the substrate transfer unit illustrated in FIG. 1.
3 and 4, the
Meanwhile, a main
The
The
The auxiliary
The
Therefore, the inner region of the
Although described with reference to the above embodiments, those skilled in the art can be variously modified and changed within the scope of the present invention without departing from the spirit and scope of the invention described in the claims below. I can understand.
1 is a plan view of a semiconductor manufacturing facility according to an embodiment of the present invention.
FIG. 2 is a side view of the semiconductor manufacturing facility shown in FIG. 1.
3 is a cross-sectional view illustrating a portion taken along line II ′ of FIG. 1.
4 is an exploded perspective view of the substrate transfer unit shown in FIG. 1.
* Description of the symbols for the main parts of the drawings *
10-semiconductor manufacturing equipment 20-primary indexer
22-1st load port 30-Process treatment part
31a-
32a-
35-
36b-2nd arm 37-Base body
38-
39b-second pocket 40-processing module
50-Second Indexer 52-Second Loadport
60-main fan filter unit 70-auxiliary fan filter unit
80-1st transport guide 90-2nd transport guide
95-
100b-2nd indexer robot C-cassette
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070078111A KR20090013941A (en) | 2007-08-03 | 2007-08-03 | Semiconductor device fabrication installation |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070078111A KR20090013941A (en) | 2007-08-03 | 2007-08-03 | Semiconductor device fabrication installation |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20090013941A true KR20090013941A (en) | 2009-02-06 |
Family
ID=40684168
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020070078111A KR20090013941A (en) | 2007-08-03 | 2007-08-03 | Semiconductor device fabrication installation |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR20090013941A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20170054241A (en) * | 2015-10-20 | 2017-05-17 | 램 리써치 코포레이션 | Service tunnel for use on capital equipment in semiconductor manufacturing and research fabs |
-
2007
- 2007-08-03 KR KR1020070078111A patent/KR20090013941A/en not_active Application Discontinuation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20170054241A (en) * | 2015-10-20 | 2017-05-17 | 램 리써치 코포레이션 | Service tunnel for use on capital equipment in semiconductor manufacturing and research fabs |
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