KR20090013497A - Plasma display panel - Google Patents

Abstract

A plasma display panel is provided to reduce the generation rate of the noise by regularly maintaining the pressure of the discharge gas. A scan electrode(102) and a sustain electrode(103) are arranged on the top of the front substrate(101). The scan electrode and the sustain electrode are reclaimed by an upper dielectric layer(104). The upper dielectric layer limits the discharge current of the sustain electrode and the scan electrode. The scan electrode and the sustain electrode are insulated by the upper dielectric layer. A protective layer(105) is arranged on the upper dielectric layer. An address electrode(113) and a lower dielectric layer(115) are arranged on a rear substrate(111). A partition(112) is formed on the top of the lower dielectric layer. The discharge cell segmented by the partition is filled with the discharge gas.

Description

Plasma Display Panel

The present invention relates to a plasma display panel.

In the plasma display panel, a phosphor layer is formed in a discharge cell divided by a partition, and a plurality of electrodes are formed.

When the drive signal is supplied to the electrode of the plasma display panel, the discharge is generated by the drive signal supplied in the discharge cell. Here, when discharged by a drive signal in the discharge cell, the discharge gas filled in the discharge cell generates vacuum ultraviolet rays, and the vacuum ultraviolet light emits the phosphor formed in the discharge cell to emit visible light. Generate. The visible light displays an image on the screen of the plasma display panel.

One aspect of the present invention is to provide a plasma display panel with reduced noise and improved reliability by adjusting the thickness of the upper dielectric layer or the lower dielectric layer.

According to an embodiment of the present invention, a plasma display panel includes a front substrate on which an upper dielectric layer is disposed, a rear substrate disposed to face the front substrate and a lower dielectric layer, a partition wall disposed between the front substrate and the rear substrate; It is disposed between the front substrate and the rear substrate, and comprises a seal layer (Bead), the thickness of the upper dielectric layer is 0.125 times or more than 0.42 times the particle size of the beads.

In addition, the thickness of the upper dielectric layer may be 0.13 times or more and 0.35 times or less of the particle size of the beads.

In addition, the plasma display panel according to another embodiment of the present invention is disposed between the front substrate having the upper dielectric layer, the rear substrate disposed opposite the front substrate and the lower dielectric layer disposed between the front substrate and the rear substrate. It is disposed between the partition wall and the front substrate and the rear substrate, and comprises a seal layer (Bead), the thickness of the lower dielectric layer is 0.05 to 0.17 times the particle size of the bead.

In addition, the thickness of the lower dielectric layer may be 0.055 times or more and 0.14 times or less of the particle size of the beads.

In addition, the thickness of the seal layer may be larger than the height of the partition wall.

In addition, the particle size of the beads may be larger than the height of the partition wall.

In addition, the particle size of the beads may be 1.01 times or more and 1.45 times or less the height of the partition wall.

Plasma display panel according to an embodiment of the present invention has an improvement effect that noise is reduced, reliability is improved.

Hereinafter, a plasma display panel according to the present invention will be described in detail with reference to the accompanying drawings.

1 is a view for explaining the structure of a plasma display panel according to an embodiment of the present invention.

Referring to FIG. 1, the plasma display panel 100 according to an embodiment of the present invention includes a front substrate 101 on which scan electrodes 102 and Y and sustain electrodes 103 and Z which are parallel to each other are disposed, and a front substrate ( The rear substrate 111, which is disposed to face the 101 and the address electrode 113 that intersects the scan electrode 102 and the sustain electrode 103, may be bonded to each other by a seal layer (not shown). have.

An upper dielectric layer 104 is disposed on the front substrate 101 on which the scan electrode 102 and the sustain electrode 103 are disposed, and the scan electrode 102 and the sustain electrode 103 are embedded.

The upper dielectric layer 104 limits the discharge current of the scan electrode 102 and the sustain electrode 103 and can insulate the scan electrode 102 and the sustain electrode 103 from each other.

A protective layer 105 may be disposed over the upper dielectric layer 104 to facilitate discharge conditions. The protective layer 105 may include a material having a high secondary electron emission coefficient, such as magnesium oxide (MgO).

In addition, an electrode, for example, an address electrode 113 is disposed on the rear substrate 111, and the rear substrate 111 on which the address electrode 113 is disposed covers the address electrode 113 and insulates the address electrode 113. A dielectric layer, such as lower dielectric layer 115, may be disposed.

On top of the lower dielectric layer 115, a discharge space, that is, a partition wall 112 such as a stripe type, a well type, a delta type, a honeycomb type, etc., which partitions a discharge cell, may be disposed. Can be. The barrier rib 112 may be provided with a red (R), green (G), and blue (B) discharge cell between the front substrate 101 and the rear substrate 111. In addition, in addition to the red (R), green (G), and blue (B) discharge cells, white (W) or yellow (Yellow: Y) discharge cells may be further provided.

In the discharge cell partitioned by the partition wall 112, a discharge gas such as xenon (Xe), neon (Ne), or the like may be filled.

In addition, a phosphor layer 114 that emits visible light for image display may be disposed in the discharge cell partitioned by the partition wall 112. For example, a first phosphor layer emitting red (R) light, a second phosphor layer emitting blue (B) light, and a third phosphor layer emitting green (G) light are disposed. Can be. In addition to the red (R), green (G), and blue (B) light, it is also possible to further arrange other phosphor layers emitting white (W) light or yellow (Yellow: Y) light.

In addition, the thickness of the phosphor layer 114 in at least one of the red (R), green (G), and blue (B) discharge cells may be different from other discharge cells. For example, a phosphor layer of a green (G) discharge cell, that is, a phosphor layer in a third phosphor layer or a blue (B) discharge cell, that is, a thickness of a second phosphor layer in a red (R) discharge cell, Ie thicker than the thickness of the first phosphor layer. Here, the thickness of the third phosphor layer may be substantially the same or different from the thickness of the second phosphor layer.

In addition, in the plasma display panel 100 according to an exemplary embodiment, the widths of the red (R), green (G), and blue (B) discharge cells may be substantially the same, but the red (R) and green (G) colors may be substantially the same. And at least one of the blue (B) discharge cells may be different from the widths of the other discharge cells.

For example, the width of the red (R) discharge cell is the smallest, and the width of the green (G) and blue (B) discharge cells can be made larger than the width of the red (R) discharge cell. Here, the width of the green (G) discharge cell may be substantially the same as or different from the width of the blue (B) discharge cell.

The width of the phosphor layer 114 disposed in the discharge cell is then changed in relation to the width of the discharge cell. For example, the width of the second phosphor layer disposed in the blue (B) discharge cell is wider than the width of the first phosphor layer disposed in the red (R) discharge cell, and the third disposed in the green (G) discharge cell. The width of the phosphor layer may be wider than the width of the first phosphor layer disposed in the red (R) discharge cell, thereby improving the color temperature characteristics of the image implemented.

In addition, the plasma display panel 100 according to an exemplary embodiment of the present invention may have not only the structure of the partition wall 112 shown in FIG. 1 but also the structure of the partition wall having various shapes. For example, the partition wall 112 includes a first partition wall 112b and a second partition wall 112a, where the height of the first partition wall 112b and the height of the second partition wall 112a are different from each other. Etc. are possible.

In the case of the differential partition wall structure, the height of the first partition wall 112b among the first partition wall 112b or the second partition wall 112a may be lower than the height of the second partition wall 112a.

In addition, although the red (R), green (G), and blue (B) discharge cells are each shown and described as being arranged on the same line in FIG. 1, they may be arranged in other shapes. For example, a delta type arrangement in which red (R), green (G) and blue (B) discharge cells are arranged in a triangular shape is also possible. In addition, the shape of the discharge cell is not only rectangular but also various polygonal shapes such as pentagon and hexagon.

In addition, although only the case where the partition wall 112 is formed in the rear substrate 111 is illustrated in FIG. 1, the partition wall 112 may be disposed on at least one of the front substrate 101 and the rear substrate 111.

In the above description, only one example of the plasma display panel 100 according to an exemplary embodiment of the present invention is illustrated and described. Therefore, the present invention is not limited to the plasma display panel 100 having the structure described above. For example, the above description shows only the case where the lower dielectric layer number 115 and the upper dielectric layer number 104 are one layer, but at least one of the lower dielectric layer or the upper dielectric layer is divided into a plurality of layers. It is also possible to achieve.

In addition, although the width and thickness of the address electrode 113 disposed on the rear substrate 111 may be substantially constant, the width or thickness inside the discharge cell may be different from the width or thickness outside the discharge cell. For example, the width or thickness inside the discharge cell may be wider or thicker than that outside the discharge cell.

2 is a view for explaining an example of the operation of the plasma display panel according to an embodiment of the present invention. FIG. 2 illustrates an example of a method of operating a plasma display panel according to an embodiment of the present invention. The present invention is not limited to FIG. 2, and the plasma display panel according to an embodiment of the present invention is described. The method of operation may be variously changed.

Referring to FIG. 2, a reset signal may be supplied to a scan electrode in a reset period for initialization. The reset signal may include a ramp-up signal and a ramp-down signal.

For example, in the set-up period, the voltage gradually increases from the second voltage V2 to the third voltage V3 after the voltage rises rapidly from the first voltage V1 to the second voltage V2 with the scan electrode. Rising rising ramp signals may be supplied. Here, the first voltage V1 may be a voltage of the ground level GND.

In this setup period, a weak dark discharge, that is, a setup discharge occurs in the discharge cell by the rising ramp signal. By this setup discharge, some wall charges can be accumulated in the discharge cells.

In the set-down period after the setup period, the rising ramp signal may be supplied to the scan electrode after the rising ramp signal in the opposite polarity direction.

Here, the falling ramp signal may gradually fall from the peak voltage of the rising ramp signal, that is, the fourth voltage V4 lower than the third voltage V3 to the fifth voltage V5.

As the falling ramp signal is supplied, a weak erase discharge, that is, a setdown discharge, occurs in the discharge cell. By this set-down discharge, wall charges such that address discharge can be stably generated in the discharge cells remain uniformly.

In the address period after the reset period, a scan bias signal that substantially maintains the lowest voltage of the falling ramp signal, that is, a voltage higher than the fifth voltage V5, for example, the sixth voltage V6, is supplied to the scan electrode.

In addition, a scan signal falling from the scan bias signal may be supplied to the scan electrode.

Meanwhile, the pulse width of the scan signal Scan supplied to the scan electrode in the address period of at least one subfield may be different from the pulse width of the scan signal of another subfield. For example, the width of the scan signal in the subfield located later in time may be smaller than the width of the scan signal in the subfield located earlier. In addition, the reduction of the scan signal width according to the arrangement order of the subfields can be made gradually, such as 2.6 Hz (microseconds), 2.3 Hz, 2.1 Hz, 1.9 Hz, or 2.6 Hz, 2.3 Hz, 2.3 Hz, 2.1 Hz. .... 1.9 ㎲, 1.9 ㎲ and so on.

As such, when the scan signal is supplied to the scan electrode, the data signal may be supplied to the address electrode corresponding to the scan signal.

When the scan signal and the data signal are supplied, an address discharge may be generated in the discharge cell to which the data signal is supplied while the voltage difference between the scan signal and the data signal and the wall voltage generated by the wall charges generated in the reset period are added. .

Here, the sustain bias signal may be supplied to the sustain electrode in order to prevent the address discharge from becoming unstable due to the interference of the sustain electrode in the address period.

The sustain bias signal can keep the sustain bias voltage Vz smaller than the voltage of the sustain signal supplied in the sustain period and larger than the voltage of the ground level GND.

Subsequently, in the sustain period for displaying an image, a sustain signal may be supplied to at least one of the scan electrode and the sustain electrode. For example, a sustain signal may be alternately supplied to the scan electrode and the sustain electrode.

When such a sustain signal is supplied, the discharge cell selected by the address discharge is added with the wall voltage in the discharge cell and the sustain voltage Vs of the sustain signal, and the sustain discharge, i.e., the sustain discharge between the scan electrode and the sustain electrode when the sustain signal is supplied. , Display discharge may occur.

Meanwhile, in the at least one subfield, a plurality of sustain signals are supplied in the sustain period, and the pulse width of at least one sustain signal of the plurality of sustain signals may be different from the pulse widths of other sustain signals. For example, the pulse width of the sustain signal that is supplied first of the plurality of sustain signals may be larger than the pulse width of other sustain signals. Then, the sustain discharge can be more stabilized.

3A to 3B are views for explaining an example of the manufacturing process of the plasma display panel.

First, referring to FIG. 3A, a seal layer 300 is formed at an edge of at least one of the front substrate 101 and the rear substrate 111 as shown in (a), and the front substrate 101 and the rear substrate are in close contact with each other. For example, the seal layer 300 may be formed in a dummy area of the rear substrate 111, and the front substrate 101 and the rear substrate 111 may be brought into close contact with each other.

Then, as shown in (b), the front substrate 101 and the rear substrate 111 may be bonded by the seal layer 300.

Thereafter, as shown in FIG. 3B, fixing means 310, such as a clip, is disposed at the edges of the front substrate 101 and the rear substrate 111 bonded together, and the front substrate 101 until the seal layer 300 is cured. ) And the rear substrate 111 may be fixed so as not to be misaligned.

4A to 4B are views for explaining the seal layer in more detail. In the following description and description of the protective layer will be omitted for convenience of description.

First, referring to FIG. 4A, the seal layer 400 of the plasma display panel 100 according to the exemplary embodiment includes a bead 410.

When the seal layer 400 includes the beads 410, collision between the front substrate 101 and the rear substrate 111 may be prevented during driving, thereby reducing noise.

If the seal layer 400 does not include the beads 410, the alignment of the front substrate 101 and the rear substrate 111 may be misaligned during the bonding process of the front substrate 101 and the rear substrate 111. The seal layer 400 may be excessively compressed by the fixing means such as a clip used to prevent the seal layer 400 from being excessively compressed as shown in FIG. 4B, and thus the gap between the front substrate 101 and the rear substrate 111 may become uneven. Can be.

That is, when the seal layer 400 does not include beads, when the fixing means such as a clip is disposed at the edges of the front substrate 101 and the rear substrate 111 bonded together as in the case of FIG. 3B, the front substrate ( It is possible to prevent the alignment of the 101 and the rear substrate 111 to be misaligned, but the pressure applied to the panel edges by the fixing means 310 may cause the seal layer 400 to be excessively compressed as in the case of FIG. 4B. It can be.

Accordingly, the distance between the front substrate 101 and the rear substrate 111 may be uneven. Then, excessive noise may occur due to collision between the front substrate 101 and the partition wall (not shown) due to the uneven spacing between the front substrate 101 and the rear substrate 111 during driving.

On the other hand, when the seal layer 400 includes the beads 410 as in the case of FIG. 4A, the beads 410 may support the front substrate 101 and the rear substrate 111, and thus the beads ( The seal layer 400 may be prevented from being excessively compressed by the 410. Accordingly, the thickness of the seal layer 400 may be maintained substantially constant. Then, the collision between the front substrate 101 and the partition wall (not shown) during driving can be sufficiently prevented, so that noise can be reduced.

An example of the manufacturing process of the seal layer 400 is as follows.

First, the seal material having a fluidity may be formed by mixing the seal material, the solvent, the binder, and the beads 410.

Thereafter, the seal paste is applied to at least one dummy area of the front substrate 101 or the rear substrate 111, and the front substrate 101 and the rear substrate 111 are brought into close contact with each other.

Subsequently, when the firing process of the seal paste is performed in the firing furnace, the seal material is melted in the seal paste applied between the front substrate 101 and the rear substrate 111, and the binder and the solvent are burned to form the seal layer 400. Can be.

When the bead 410 mixed with the seal material melts during firing of the seal paste, the gap between the front substrate 101 and the rear substrate 111 may not be properly maintained. Therefore, it may be preferable that the beads 410 do not melt during the firing process. That is, the melting point of the bead 410 may be preferably higher than the melting point of the seal material. More preferably, the melting point of the bead 410 may be 500 degrees (° C.) or more.

The material used for the bead 410 is not particularly limited except that the material does not melt when firing the seal material. The material of the bead 410 may be a metal material, a plastic material, a glass material, a silicon material and the like.

Meanwhile, the beads 410 may be randomly distributed in the seal layer 400, and thus the beads 410 may be disposed on the upper dielectric layer 104 and the rear substrate 111 disposed on the front substrate 101. A plurality of beads 410 may be disposed between the lower dielectric layers 115.

Here, the particle size of the bead 410 is R, the thickness of the upper dielectric layer 104 is t1, the thickness of the lower dielectric layer 115 is t2.

5A to 5D are diagrams for explaining the relationship between the thickness of the beads and the upper dielectric layer.

First, referring to FIG. 5A, a bead 410 is disposed between the upper dielectric layer 104 and the lower dielectric layer 115.

The beads 410 may be formed so that the gap between the front substrate 101 and the rear substrate 111 does not become excessively small when the front substrate 101 and the rear substrate 111 are bonded to each other. I can support it. In addition, the upper dielectric layer 104 serves as a buffer to prevent the front substrate 101 from being damaged by the beads 410, and the lower dielectric layer 115 has the rear substrate 111 beaded. 410 may serve as a buffer to prevent damage.

Such beads 410 may cause excessive concentration of pressure at certain points of the upper dielectric layer 104. For example, the front substrate 101 and the rear substrate 111 are supported by the beads 410 included in the seal layer 400, so that the weight of the front substrate 101 at the P point is reduced as shown in FIG. 5A. Pressure may be concentrated. Here, when the thickness of the front substrate 101 is excessively thin, the upper dielectric layer 104 may be physically damaged by the pressure applied to the P point. This is equally applicable to the lower dielectric layer 115.

Meanwhile, the upper dielectric layer 104 is disposed on the scan electrode 102 and the sustain electrode 103 arranged side by side as shown in FIG. 5B to insulate the scan electrode 102 and the sustain electrode 103.

In addition, since the scan electrode 102 and the sustain electrode 103 are disposed substantially in parallel on the same layer, the discharge start voltage between the scan electrode 102 and the sustain electrode 103 is relatively high. high. Accordingly, a relatively high voltage must be supplied to generate a discharge between the scan electrode 102 and the sustain electrode 103.

Accordingly, when the upper dielectric layer 104 is physically damaged by the beads 410 as in the case of FIG. 5A, driving of a high voltage supplied to generate a discharge between the scan electrode 102 and the sustain electrode 103 is performed. Dielectric breakdown of the upper dielectric layer 104 may occur by the signal.

5B is an example in which the scan electrode 102 and the sustain electrode 103 each have a multi-layer structure. For example, the scan electrode 102 and the sustain electrode 103 may include the transparent electrodes 102a and 103a and the bus electrodes 102b and 103b.

Here, the bus electrodes 102b and 103b include at least one of a substantially opaque material such as silver (Ag), gold (Au), and aluminum (Al), and the transparent electrodes 102a and 103a are substantially transparent. The material may include, for example, indium tin oxide (ITO) material.

In addition, when the scan electrode 102 and the sustain electrode 103 include the bus electrodes 102b and 103b and the transparent electrodes 102a and 103a, the reflection of external light by the bus electrodes 102b and 103b is prevented. The black layers 500 and 510 may be further included between the transparent electrodes 102a and 103a and the bus electrodes 102b and 103b.

On the other hand, the transparent electrodes 102a and 103a may be omitted from the scan electrode 102 and the sustain electrode 103. That is, the scan electrode 102 and the sustain electrode 103 can also be ITO-Less electrodes in which the transparent electrodes 102a and 103a are omitted.

Next, in FIG. 5C, the voltages of 192 V, 242 V, 360 V, and 485 V are applied to the scan electrodes while changing the ratio t1 / R of the thickness t1 of the upper dielectric layer and the particle size R of the beads from 0.1 to 0.47. Data is shown to observe whether a breakdown of the top dielectric layer occurs. Here, the beads use those having a particle size R of approximately 145 μm.

A mark indicates that the insulation of the upper dielectric layer is not broken, and an X mark indicates that the insulation of the upper dielectric layer is broken.

Referring to FIG. 5C, when the thickness t1 of the upper dielectric layer is 0.1 times the particle size R of the bead, the upper dielectric layer of the upper dielectric layer is 242V, 360V, or 485V, except that a voltage of 192V is applied to the scan electrode. It can be seen that the insulation is broken. This is because the thickness of the upper dielectric layer (t1) is so thin that the upper dielectric layer can be easily damaged by the beads contained in the seal layer, so that even if the scan electrode is subjected to a relatively low voltage of 242V, the upper dielectric layer Because it is difficult to withstand the voltage.

On the other hand, when the thickness t1 of the upper dielectric layer is 0.125 times the particle size R of the bead, the insulation of the upper dielectric layer is destroyed only when the high voltage of 485 V is applied to the scan electrode, and the 192 V, 242 V, and 360 V are applied to the scan electrode. It can be seen that when the phosphorus voltage is applied, the insulation is not broken.

In this case, a high voltage of 485 V is rarely applied to the scan electrode when the plasma display panel is driven. When the thickness t1 of the upper dielectric layer is 0.125 times the particle size R of the bead, the reliability of the plasma display panel is somewhat reduced. Is to secure.

In addition, when the thickness t1 of the upper dielectric layer is 0.13 times or more of the particle size R of the beads, even when a high voltage of 485 V is applied to the scan electrode, the insulation of the upper dielectric layer is not broken.

Next, FIG. 5D shows data of measuring the discharge start voltage between the scan electrode and the sustain electrode while changing the ratio t1 / R of the thickness t1 of the upper dielectric layer and the particle size R of the bead from 0.1 to 0.47. have. Here, the symbol ◎ indicates that the discharge start voltage between the scan electrode and the sustain electrode is sufficiently low, which is very good, the ○ mark indicates that it is relatively good, and the X mark indicates that the discharge start voltage between the scan electrode and the sustain electrode is excessively high, which is poor. To indicate.

Referring to FIG. 5D, when the thickness t1 of the upper dielectric layer is 0.1 to 0.35 times the particle size R of the bead, the thickness t1 of the upper dielectric layer may be sufficiently thin. Accordingly, the scan electrode and the sustain electrode In between, discharge may occur sufficiently even at a relatively low voltage. Accordingly, when the thickness t1 of the upper dielectric layer is 0.1 to 0.35 times the particle size R of the beads, it is very good in terms of the discharge start voltage.

In addition, when the thickness t1 of the upper dielectric layer is 0.38 times or more and 0.42 times or less the particle size R of the beads, the thickness t1 of the upper dielectric layer is appropriate and relatively good in terms of the discharge start voltage. .

On the other hand, when the thickness t1 of the upper dielectric layer is more than 0.46 times the particle size R of the bead, the thickness t1 of the upper dielectric layer may be excessively thick, and thus, relatively between the scan electrode and the sustain electrode. Only when a high voltage is applied can a discharge be generated between the scan electrode and the sustain electrode. In this case, the discharge start voltage between the scan electrode and the sustain electrode is excessively high, so that the driving efficiency can be lowered, which is a defect (X).

5A to 5D, the insulation of the upper dielectric layer is prevented from being broken when the seal layer includes beads, thereby improving the reliability of the plasma display panel, and simultaneously discharging the discharge between the scan electrode and the sustain electrode. In order to prevent the starting voltage from being excessively high, it may be preferable that the thickness t1 of the upper dielectric layer is 0.125 times or more and 0.42 times or less, more preferably 0.13 times or more and 0.35 times or less of the particle size R of the beads. .

6A to 6C are diagrams for explaining the relationship between the thickness of the beads and the lower dielectric layer.

First, referring to FIG. 6A, since the scan electrode 102 disposed on the front substrate 101 and the address electrode 113 disposed on the rear substrate 111 are disposed to face each other, the scan electrode 102 and the address electrode are disposed. The discharge start voltage between the 113 may be lower than the discharge start voltage between the scan electrode 102 and the sustain electrode 103.

Accordingly, the address electrode 113 may have a lower voltage than that applied to the scan electrode 102 or the sustain electrode 103, and thus the thickness t2 of the lower dielectric layer 115 that insulates the address electrode 113. ) May be thinner than the thickness t1 of the upper dielectric layer 104 that insulates the scan electrode 102 and the sustain electrode 103.

Next, in FIG. 6B, the voltages of 192 V, 235 V, 320 V, and 452 are applied to the address electrode while changing the ratio t2 / R of the thickness t2 of the lower dielectric layer and the particle size R of the beads from 0.03 to 0.21. Data is shown to observe whether a breakdown of the underlying dielectric layer occurs. Here, the beads use those having a particle size R of approximately 145 μm.

? Indicates that the insulation of the lower dielectric layer has not been broken, and X indicates that the insulation of the lower dielectric layer has been broken.

Referring to FIG. 6B, when the thickness t2 of the lower dielectric layer is 0.03 times the particle size R of the bead, the lower dielectric layer of the lower dielectric layer is 235V, 320V, and 452V, except that a voltage of 192V is applied to the address electrode. It can be seen that the insulation is broken. This is because the thickness of the lower dielectric layer (t2) is excessively thin so that the upper dielectric layer can be easily damaged by the beads contained in the seal layer, so that the lower dielectric layer has a low voltage of 235V at the address electrode. Because it is difficult to withstand the voltage.

On the other hand, when the thickness t2 of the lower dielectric layer is 0.05 times the particle size R of the bead, the insulation of the lower dielectric layer is destroyed only when the high voltage of 452 V is applied to the address electrode, and the 192 V, 235 V, and 320 V are applied to the address electrode. It can be seen that when the phosphorus voltage is applied, the insulation is not broken.

In this case, a high voltage of 452 V is rarely applied to the address electrode when the plasma display panel is driven. When the thickness t2 of the lower dielectric layer is 0.05 times the particle size R of the bead, the reliability of the plasma display panel is somewhat reduced. Is to secure.

In addition, when the thickness t2 of the lower dielectric layer is 0.055 times or more of the particle size R of the bead, the insulation of the lower dielectric layer is not broken even when a high voltage of 485 V is applied to the scan electrode.

Next, FIG. 6C shows data obtained by measuring the discharge start voltage between the scan electrode and the address electrode while changing the ratio (t2 / R) of the thickness t2 of the lower dielectric layer and the particle size R of the beads from 0.03 to 0.21. have. Here,? Indicates that the discharge start voltage between the scan electrode and the address electrode is sufficiently low, which is very good,? Indicates that the discharge start voltage is relatively good, and X indicates that the discharge start voltage between the scan electrode and the address electrode is excessively high and is defective. To indicate.

Referring to FIG. 6C, when the thickness t2 of the lower dielectric layer is 0.03 times or more and 0.14 times or less than the particle size R of the bead, the thickness t2 of the lower dielectric layer may be sufficiently thin, and thus the scan electrode and the address electrode In between, discharge may occur sufficiently even at a relatively low voltage. Accordingly, when the thickness t2 of the lower dielectric layer is 0.03 times or more and 0.14 times or less of the particle size R of the beads, it is very good in terms of the discharge start voltage.

In addition, when the thickness t2 of the lower dielectric layer is 0.15 times or more and 0.17 times or less of the particle size R of the beads, the thickness t2 of the lower dielectric layer is appropriate and relatively good in terms of the discharge start voltage. .

On the other hand, when the thickness t2 of the lower dielectric layer is more than 0.20 times the particle size R of the bead, the thickness t2 of the lower dielectric layer may be excessively thick, and thus, relatively between the scan electrode and the address electrode. Only when a high voltage is applied can a discharge be generated between the scan electrode and the address electrode. In such a case, the discharge start voltage between the scan electrode and the address electrode is excessively high, so that the driving efficiency can be lowered, resulting in a poor X.

6A to 6C, the insulation of the lower dielectric layer is prevented from being broken when the seal layer includes beads, thereby improving reliability of the plasma display panel, and simultaneously discharging the discharge between the scan electrode and the address electrode. In order to prevent the starting voltage from being excessively high, it may be preferable that the thickness t2 of the lower dielectric layer is 0.05 times or more and 0.17 times or less, more preferably 0.055 times or more and 0.14 times or less of the particle size R of the beads. .

7A to 7B are views for explaining the height of the seal layer and the particle size of the beads. 7A to 7B, illustrations of the protective layer, the upper dielectric layer, and the lower dielectric layer will be omitted for convenience of description.

7A to 7B, a seal layer 400 for bonding the front substrate 101 and the back substrate 111 is disposed at an edge between the front substrate 101 and the rear substrate 111 and the seal layer 400. The height h2 may be greater than the height h1 of the partition wall 112. Then, the partition wall 112 may be spaced apart from the front substrate 101 by a predetermined distance.

In addition, the bead 410 included in the seal layer 400 serves to properly maintain the gap between the front substrate 101 and the rear substrate 111 between the front substrate 101 and the rear substrate 111. As such, the distance between the front substrate 101 and the rear substrate 111 may be determined according to the size of the particle size of the bead 410. For example, assuming that the particle size R of the bead 410 is 200 μm, the distance between the front substrate 101 and the back substrate 111 may be greater than or equal to 200 μm.

Therefore, in order to make the height h2 of the seal layer 400 larger than the height h1 of the partition wall 112, the particle size R of the bead 410 is larger than the height h1 of the partition wall 112. It may be desirable.

It is a figure for demonstrating an example of the reason which makes the height of a seal layer larger than the height of a partition.

Referring to FIG. 8, an example in which the height h1 of the partition wall 112 is greater than the height h2 of the seal layer 400 is illustrated. In this case, although not shown, the particle size of the beads (not shown) included in the seal layer 400 is smaller than the height h1 of the partition wall 112.

In this case, the height h2 of the seal layer 400 is lower than the height h1 of the partition wall 112 by the pressure applied by a fixing means such as a clip, so that the front substrate 101 and the partition wall during driving are reduced. Frequent collisions with 112 can result in excessive generation of noise.

On the other hand, as in the case of FIGS. 7A to 7B, the particle size of the beads is larger than the height h1 of the partition wall 112 so that the height h2 of the seal layer 400 is higher than the height h1 of the partition wall 112. In the case of making it larger, the collision between the partition 112 and the front substrate 101 can be prevented, and the occurrence of noise can be reduced.

It is a figure for demonstrating an example of the manufacturing process of the bead.

10A to 10D are views for explaining the shape of the beads and the arrangement of the beads in the seal layer.

First, referring to FIG. 9, the beads 910, 911, and 912 manufactured through a predetermined process may be filtered using the filter unit 900 in which the predetermined holes 901 are formed.

The hole 901 formed in the filter unit 900 may have a diameter of R ₁ .

For example, when beads 910, 911, and 912 are supplied to the upper portion of the filter unit 900, beads having a particle size smaller than the diameter of the hole 901, that is, R ₁ , for example, beads 911 and 912 are holes. Through the 901 may be discharged to the lower portion of the filter 900, the bead of the number 910 having a particle size larger than R ₁ may not be discharged.

The beads 911 and 912 having undergone this filtering process may be mixed with the seal material to form a seal layer.

Next, referring to FIG. 10A, an example in which the shape of the bead 1000 is not a sphere is shown.

Ideally, if the shape of the bead 1000 in the manufacturing process of the bead 1000 is manufactured in the form of a sphere, it may occur frequently even if the bead 1000 has an irregular shape as shown in FIG. have.

Here, the particle size of the bead 1000 may be R, the length may be L ₁ .

The bead 1000 having the shape as shown in FIG. 10A may be filtered by passing through the hole 901 formed in the filter unit 900 in the vertical direction as shown in FIG. 10B. Here, the particle size R of the bead 1000 is smaller than the diameter R ₁ of the hole 901.

Such beads 1000 may be disposed in the transverse direction in the seal layer 400 as in the case of FIG. 10C.

Since the front substrate and the rear substrate are pressurized by the fixing means such as the clip during the bonding process of the front substrate and the rear substrate, the beads 1000 can withstand the pressure well in the seal layer 400 by the pressure. Direction, which may be arranged in the horizontal direction as in the case of FIG. 10C.

Here, the particle size R of the bead 1000 may be substantially the same as the height of the bead 1000 in the seal layer 400. Since the distance between the front substrate and the rear substrate may be maintained by the particle size R of the bead 1000, the height of the bead 1000 in the seal layer 400 may be defined as the particle size R.

Alternatively, the diameter R ₁ of the hole 901 of the filter unit 900 may be defined as the particle size R of the bead 1000.

Alternatively, the maximum length of the cross section in the direction orthogonal to the direction passing through the hole 901 may be defined as the particle size.

Next, referring to FIG. 10D, an example of a bead 1010 having a shape similar to a human phosphorus is illustrated as shown in (a).

The bead 1010 may be disposed in a direction to effectively disperse the pressure applied to the front substrate and the rear substrate in the seal layer 400. For example, the beads 1010 may be disposed as shown in FIG. 10D (b).

The bead 1010 having this shape may pass through the hole 901 of FIG. 9 in the first direction and may be disposed in the seal layer 400 in a direction parallel to the first direction.

It is also possible to define the length of the bead 1010 in the direction orthogonal to this first direction as the particle size R.

11A to 11D are diagrams for explaining the relationship between the particle size of beads and the height of partition walls.

In FIGS. 11A to 11C, the height h of the partition wall is 125 μm, and the noise generated during driving is changed while changing the particle size R of the beads included in the seal layer from 0.9 times to 1.8 times the height h of the partition wall. Measurements are also made to observe the occurrence of crosstalk between adjacent discharge cells.

At the time of noise measurement, a noise measuring device was disposed 1m in front of the plasma display panel, and noise generated while supplying the same image data to the plasma display panel was measured.

Also, the particle size R of the beads is considered to be substantially the same as the height of the seal layer.

First, referring to FIG. 11A, in terms of noise generation, when the particle size R of the beads is 0.9 to 0.95 times the height h of the partition wall, the particle size R of the bead is smaller than the height h of the partition wall. It can be seen that the defect (X) is generated by excessively loud noise due to the same reason as in the case of FIG. 8.

On the other hand, if the particle size (R) of the bead is 1.01 times the height (h) of the partition wall, the particle size (R) of the bead is appropriate to prevent collision between the front substrate and the rear substrate during driving, thereby reducing noise generation. Thus, it can be seen that good (○). In this case, some noise may occur during driving, but the magnitude of the noise may be sufficiently small.

In addition, when the particle size R of the beads is 1.04 times or more the height h of the partition wall, the particle size R of the bead 410 is sufficiently large as compared with the height h of the partition wall 112 as in the case of FIG. 11B. Thus, the gap Δh between the partition wall 112 and the front substrate 101 can be sufficiently secured. Therefore, even when vibration occurs during driving, the barrier 112 and the front substrate 101 are prevented from colliding, thereby effectively preventing the generation of noise, which is very good (◎).

Next, looking at the side of the crosstalk, if the particle size (R) of the bead is 0.9 times the height (h) of the partition wall, the front substrate and the partition wall can be in close contact with each other to block the passage where charges can move between adjacent discharge cells. have. Accordingly, it can be seen that the generation of crosstalk, which can occur due to the movement of charges between adjacent discharge cells, can be reduced, which is good (○).

In this case, a central portion of the front substrate may be convex relative to the edge, and thus a path through which charges may move between adjacent cells may be provided. Accordingly, some degree of crosstalk may occur, but the degree may be insignificant.

In addition, when the particle size (R) of the beads is 1.45 times the height (h) of the partition wall, the front substrate and the partition wall are spaced apart, but the separation degree is appropriate, so that the occurrence of crosstalk can be reduced, which is good (○). Able to know. In this case, some of the crosstalk may occur because of the movement of charges between adjacent discharge cells during driving, but the degree may be insignificant.

In addition, when the particle size R of the beads is 0.95 times or more and 1.37 times or less the height h of the partition walls, the partition walls and the front substrate are separated, but the gap between the partition walls and the front substrate prevents crosstalk between adjacent discharge cells. Small enough to do Accordingly, it can be seen that the occurrence of crosstalk is reduced and is very good ().

On the other hand, if the particle size (R) of the bead is more than 1.7 times the height (h) of the partition wall, the height of the seal layer 300 may be excessively higher than the height h of the partition wall as shown in FIG.

Then, the gap between the front substrate 101 and the partition wall 112 may be excessively widened as in the region A shown in FIG. 11C, and accordingly crosstalk may occur excessively, thus failing (X). Able to know.

Next, looking at Figure 11d shows the relationship between the altitude and the noise.

Here, the first type (Type 1) is a case in which the bead is not included in the seal layer, and the second type (Type 2) is a case in which the particle size (R) of the bead is 1.0 times the height (h) of the partition wall, that is, The particle size R and the height h of the partition wall are substantially the same, and in the third type Type 3, the particle size R of the bead is 1.1 times the height h of the partition wall.

In addition, noise generated while driving the first, second, and third types of plasma display panels at the elevations of 0m, 500m, 1000m, 1500m, 2000m, 2500m, 3000m, and 3500m, respectively, is measured.

In addition, when measuring noise, noise generated in the frequency bands of 0.5 kHz, 1 kHz, 2 kHz, 4 kHz, 8 kHz, and 16 kHz, respectively, and the noise generated in all the measured frequency bands are summed up. Calculate

The other experimental conditions are the same as in the case of FIGS. 11A to 11C.

In the case of the first type, the second type, and the third type, the noise generated when the altitude is driven at a height of 0 m is similar to about 22 dB.

In the case of the first type, it can be seen that noise of approximately 22.7 dB occurs when driving at a point where the elevation is 500 m.

In addition, approximately 24dB of noise occurs at an altitude of 1000m, approximately 25.8dB at 1500m, approximately 28dB at 2000m, approximately 33.4dB at 2500m, and approximately 40.9dB, 3500m at 3000m. At this point, we can see that approximately 45.5dB of noise is generated.

As described above, it can be seen that in the first type without using the beads, the amount of noise generated while the elevation above sea level is increased from 0m to 3500m increases from 22dB to 45.5dB.

This is because as the altitude above sea level increases, the pressure inside the plasma display panel increases with respect to the external air pressure. Thus, a minute gap is provided between the front substrate and the partition wall. It can be interpreted as relatively large. For example, noise may be generated by a collision between the protective layer disposed on the front substrate and the partition wall disposed on the rear substrate during driving.

Next, in the case of the second type, it can be seen that noise of about 22.3 dB occurs when driving at a point where the elevation is 500 m.

In addition, approximately 22.3dB of noise occurs at an altitude of 1000m, approximately 24dB at 1500m, approximately 26.7dB at 2000m, approximately 30.1dB at 2500m, approximately 36.5dB, 3500m at 3000m It can be seen that the noise of about 42.2dB occurs at the point of.

Thus, in the second type using beads having a particle size (R) substantially equal to the height (h) of the bulkhead, the amount of noise generated while the elevation above sea level increases from 0 m to 3500 m increases from 22 dB to 42.2 dB. It can be seen.

Next, in the case of the third type, it can be seen that noise of approximately 22.1 dB occurs when driving at a point where the elevation is 500 m.

In addition, approximately 22.2 dB of noise occurs at an altitude of 1000 m, approximately 23.1 dB at 1500 m, approximately 24 dB at 2000 m, approximately 25.8 dB at 2500 m, approximately 27.5 dB, 3500 m at 3000 m It can be seen that approximately 30.6dB of noise occurs at the point of in.

Thus, it can be seen that in the third type using beads whose particle size R is 1.1 times the height h of the bulkhead, the amount of noise generated while the altitude above sea level increases from 0 m to 3500 m increases from 22 dB to 30.6 dB. Can be.

In consideration of the data of FIGS. 11A to 11D, the particle size R of the beads may be preferably 1.01 times or more and 1.45 times or less, and more preferably 1.04 times or more and 1.37 times or less of the height h of the partition wall. .

Meanwhile, the noise related to the altitude above sea level described in FIG. 11D may be reduced by adjusting the pressure of the discharge gas filled in the plasma display panel.

For example, when the gas pressure inside the panel is excessively high, the air pressure outside the panel may be lower than the pressure inside the panel, and thus, the front substrate and the partition wall frequently collide with each other during driving, thereby increasing noise generation. . In addition, in this case, even if the altitude above sea level is slightly increased, the noise generation amount may increase rapidly.

On the other hand, when the gas pressure inside the panel is excessively low, the number of particles of the discharge gas in the panel is reduced, thereby reducing the amount of ultraviolet light generated by the discharge gas during driving, thereby reducing the luminance of the image to be realized. .

In consideration of the foregoing, it may be preferable that the pressure of the discharge gas is 350 tortor or more and 450torr or less.

As such, the technical configuration of the present invention described above can be understood by those skilled in the art that the present invention can be implemented in other specific forms without changing the technical spirit or essential features of the present invention.

Therefore, the exemplary embodiments described above are to be understood as illustrative and not restrictive in all respects, and the scope of the present invention is indicated by the appended claims rather than the foregoing detailed description, and the meaning and scope of the claims are as follows. And all changes or modifications derived from the equivalent concept should be interpreted as being included in the scope of the present invention.

1 is a view for explaining the structure of a plasma display panel according to an embodiment of the present invention.

2 is a view for explaining an example of the operation of the plasma display panel according to an embodiment of the present invention;

3A to 3B are views for explaining an example of the manufacturing process of the plasma display panel.

4A to 4B are views for explaining the seal layer in more detail.

5A to 5D are diagrams for explaining the relationship between the thickness of the beads and the upper dielectric layer.

6A to 6C are diagrams for explaining the relationship between the thickness of the beads and the lower dielectric layer.

7A to 7B are views for explaining the height of the seal layer and the particle size of the beads.

The figure for demonstrating an example of the reason which makes the height of a seal layer larger than the height of a partition.

9 is a diagram for explaining an example of a bead manufacturing step.

10A to 10D are views for explaining the shape of the beads and the arrangement of the beads in the seal layer.

11A to 11D are diagrams for explaining the relationship between the particle size of beads and the height of partition walls;

<Explanation of symbols for the main parts of the drawings>

101: front substrate 102: scan electrode

103: sustain electrode 104: upper dielectric layer

105: protective layer 111: back substrate

112: partition 113: address electrode

114: phosphor layer 115: lower dielectric layer

112a: second partition 112b: first partition

Claims (7)

A front substrate on which an upper dielectric layer is disposed; A rear substrate disposed opposite the front substrate and having a lower dielectric layer disposed thereon; Barrier ribs disposed between the front substrate and the rear substrate; And A seal layer disposed between the front substrate and the rear substrate and including a bead; Including, And a thickness of the upper dielectric layer is 0.125 times or more and 0.42 times or less of the particle size of the beads. The method of claim 1, And a thickness of the upper dielectric layer is 0.13 to 0.35 times the particle size of the bead. A front substrate on which an upper dielectric layer is disposed; A rear substrate disposed opposite the front substrate and having a lower dielectric layer disposed thereon; Barrier ribs disposed between the front substrate and the rear substrate; And A seal layer disposed between the front substrate and the rear substrate and including a bead; Including, And a thickness of the lower dielectric layer is 0.05 to 0.17 times the particle size of the bead. The method of claim 3, wherein And a thickness of the lower dielectric layer is 0.055 times or more and 0.14 times or less of the particle size of the beads. The method according to claim 1 or 3, And a thickness of the seal layer is greater than a height of the partition wall. The method according to claim 1 or 3, And the particle size of the bead is larger than the height of the partition wall. The method according to claim 1 or 3, And a particle size of the bead is 1.01 times or more and 1.45 times or less the height of the partition wall.

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