KR20090009978U - Apparatus for fabricating semiconductor package - Google Patents

Apparatus for fabricating semiconductor package

Info

Publication number
KR20090009978U
KR20090009978U KR2020080004124U KR20080004124U KR20090009978U KR 20090009978 U KR20090009978 U KR 20090009978U KR 2020080004124 U KR2020080004124 U KR 2020080004124U KR 20080004124 U KR20080004124 U KR 20080004124U KR 20090009978 U KR20090009978 U KR 20090009978U
Authority
KR
South Korea
Prior art keywords
semiconductor package
window
substrate
manufacturing
window clamp
Prior art date
Application number
KR2020080004124U
Other languages
Korean (ko)
Inventor
심승섭
Original Assignee
주식회사 하이닉스반도체
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 하이닉스반도체 filed Critical 주식회사 하이닉스반도체
Priority to KR2020080004124U priority Critical patent/KR20090009978U/en
Publication of KR20090009978U publication Critical patent/KR20090009978U/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67236—Apparatus for manufacturing or treating in a plurality of work-stations the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

본 고안에 따른 반도체 패키지 제조용 장치는, 자재를 이송 및 고정시키기 위한 반도체 패키지 제조용 장치로서, 상기 자재가 배치 및 이동되는 히터블록(Heater Block)과, 상기 히터블록 상부에 배치되며, 윈도우를 구비하고, 상기 자재를 이송시키는 회전부를 구비한 윈도우 클램프(Clamp)와, 상기 윈도우 클램프의 양측 가장자리 각각에 설치되며, 상기 윈도우 클램프를 고정시키는 고정부를 포함한다.An apparatus for manufacturing a semiconductor package according to the present invention is a device for manufacturing a semiconductor package for transferring and fixing a material, the heater block (Heater Block) is disposed and moved the material, and disposed above the heater block, having a window And a window clamp having a rotating part for conveying the material, and a fixing part installed at each of both edges of the window clamp and fixing the window clamp.

Description

반도체 패키지 제조용 장치{APPARATUS FOR FABRICATING SEMICONDUCTOR PACKAGE}Device for manufacturing semiconductor package {APPARATUS FOR FABRICATING SEMICONDUCTOR PACKAGE}

본 고안은 반도체 패키지 제조용 장치에 관한 것으로, 보다 자세하게는, 반도체 패키지 제조용 장치를 이용한 반도체 패키지 제조시, 자재의 이송 및 고정 시간과 반도체 패키지용 자재의 휨(Warpage)을 방지할 수 있는 반도체 패키지 제조용 장치에 관한 것이다.The present invention relates to an apparatus for manufacturing a semiconductor package, and more particularly, to manufacturing a semiconductor package that can prevent material transfer and fixation time and warpage of a material for a semiconductor package during semiconductor package manufacturing using the apparatus for manufacturing a semiconductor package. Relates to a device.

반도체 제조공정은 웨이퍼(Wafer)상에서 분리된 개별 칩을 리드 프레임(Lead Frame)에 접착시키는 반도체 칩 부착(Chip Attach) 공정, 그 칩과 리드 프레임 간에 전기적 접속을 이루는 와이어본딩(Wire Bonding) 공정, 그리고 그 전기적 접속 부분을 외부의 환경으로부터 보호하기 위하여 성형 수지로 봉지(Encapsulation)하는 공정 순서로 진행된다.The semiconductor manufacturing process includes a semiconductor chip attach process for bonding individual chips separated on a wafer to a lead frame, a wire bonding process for making an electrical connection between the chip and the lead frame, And in order to protect the electrical connection part from an external environment, it progresses in the process sequence which encapsulates with molding resin.

이 중에서 반도체 칩 부착 및 와이어본딩(Wire Bonding) 은 공정은 반도체 패키지 제작을 위한 여러 공정 중의 하나로서, 리드프레임 또는 기판의 유동을 억제하기 위하여 리드프레임 및 기판을 이송 및 고정시키는 장치가 사용된다.Among these, semiconductor chip attachment and wire bonding is one of several processes for manufacturing a semiconductor package. An apparatus for transferring and fixing the lead frame and the substrate is used to suppress the flow of the lead frame or the substrate.

상기와 같은 장치는 가압수단, 히터블럭(Heater Block) 또는 스테이지(Stage) 및 윈도우 클램프(Window Clamp)로 이루어지며, 상기 가압수단에 의해 상기 윈도우 클램프가 아래 방방으로 가압된다.Such a device is composed of a pressing means, a heater block or a stage and a window clamp, and the window clamp is pressed downward by the pressing means.

상기 히터블럭 또는 스테이지는 업/다운(Up/Down) 동작을 수행하여 상기 리드프레임과 기판을 아래 방향으로 움직임이 억제되도록 지지하면서, 리드프레임에 열이 전달되도록 가열된다. The heater block or stage is heated to transfer heat to the lead frame while supporting the lead frame and the substrate to suppress movement in the downward direction by performing an up / down operation.

상기 윈도우 클램프는 리드프레임 및 기판 상에 위치하며, 상기 리드프레임 및 기판은 히터블럭 상에 배치된다. 상기 윈도우 클램프의 중앙에는 와이어 본딩을 위한 윈도우(Window)가 형성되어 있으며, 상기 윈도우의 둘레에는 하방으로 돌출된 사각 테두리형의 클램프 돌출부가 형성된다. The window clamp is positioned on the leadframe and the substrate, and the leadframe and the substrate are disposed on the heater block. A window for wire bonding is formed in the center of the window clamp, and a clamp protrusion having a rectangular edge shape protruding downward is formed around the window.

이때, 상기 윈도우 클램프는 상기 히터블록 또는 스테이지의 업/다운 동작과 대응하여 상기 윈도우 클램프의 업/다운 동작 수행시, 동시에 업/다운 동작을 수행한다.In this case, the window clamp simultaneously performs the up / down operation when the window clamp is up / down in response to the up / down operation of the heater block or the stage.

이와 같이, 히터블록 또는 스테이지 및 윈도우 클램프 간의 업/다운 동작으로 와이어 본딩에의 한번의 인덱스(Index) 및 공정이 수행되며, 그리고 나서, 다음 공정으로 진행되는 방식으로 반도체 칩 및 와이어 본딩 공정이 수행된다.In this way, one index and a process for wire bonding are performed by an up / down operation between the heater block or the stage and the window clamp, and then the semiconductor chip and the wire bonding process are performed in a manner to proceed to the next process. do.

그러나, 자세하게 도시하고 설명하지는 않았지만, 일반적인 반도체 패키지 제조 공정 중 전술한 바와 같은 반도체 칩 부착과 와이어 본딩에 따른 장치에서는, 한번의 인덱스로 공정을 수행할 수 있는 리드프레임 또는 기판과 같은 반도체 패키지용 자재의 개수가 한정되어 있기 때문에, 반도체 칩 부착 및 와이어 본딩 공정을 수행하기 위해서는 매번의 인덱스 마다 상기와 같이 히터블록 또는 스테이지와 윈도우 클램프 간의 업/다운 동작에 필요한 반도체 패키지용 자재의 이송 및 고정 시간이 많이 소요되게 된다.However, although not shown and described in detail, in the apparatus according to the semiconductor chip attachment and wire bonding as described above in the general semiconductor package manufacturing process, a material for a semiconductor package such as a lead frame or a substrate that can perform the process with one index In order to perform the semiconductor chip attaching and wire bonding process, the transfer and fixing time of the material for the semiconductor package required for the up / down operation between the heater block or the stage and the window clamp as described above is required for each index. It will take a lot.

더욱이, 리드프레임 또는 기판의 Y축 길이가 점점 더 길어 짐에 따라서 상기와 같은 장치를 사용하게 되면, 히터블록 또는 스테이지와 윈도우 클램프 간의 업/다운 동작시, 리드프레임 또는 기판의 휨 현상이 발생하게 되어, 공정 작업성은 물론이고, 후속의 반도체 패키지를 형성하기 위한 나머지 공정을 수행시, 상기와 같은 리드프레임 또는 기판의 휨에 따른 와이어 및 반도체 칩의 노출 등으로 인해, 본딩와이어의 불량(Damage)이 발생하게 된다.Furthermore, as the Y-axis length of the leadframe or the substrate becomes longer and longer, the use of such a device causes bending of the leadframe or the substrate to occur during an up / down operation between the heater block or the stage and the window clamp. As a result, the bonding wires may be damaged due to the exposure of the wires and the semiconductor chips due to the warpage of the lead frame or the substrate, as well as the process workability, and the remaining processes for forming subsequent semiconductor packages. This will occur.

본 고안은 반도체 패키지 형성시, 반도체 패키지용 자재 이송 및 고정 시간을 최소화시킨 반도체 패키지 제조용 장치를 제공한다.The present invention provides an apparatus for manufacturing a semiconductor package, which minimizes material transport and fixing time for the semiconductor package when forming the semiconductor package.

또한, 본 고안은 상기와 같이 반도체 패키지 형성시, 반도체 패키지용 자재의 이송 및 고정 시간을 최소화시키면서 상기 반도체 패키지용 자재의 휨을 방지한 반도체 패키지 제조용 장치를 제공한다.In addition, the present invention provides a device for manufacturing a semiconductor package that prevents the bending of the material for the semiconductor package while minimizing the transport and fixing time of the material for the semiconductor package when forming the semiconductor package as described above.

본 고안에 따른 반도체 패키지 제조용 장치는, 자재를 이송 및 고정시키기 위한 반도체 패키지 제조용 장치로서, 상기 자재가 배치 및 이동되는 히터블록(Heater Block); 상기 히터블록 상부에 배치되며, 윈도우를 구비하고, 상기 자재를 이송시키는 회전부를 구비한 윈도우 클램프(Clamp); 및 상기 윈도우 클램프의 양측 가장자리 각각에 설치되며, 상기 윈도우 클램프를 고정시키는 고정부;를 포함한다.An apparatus for manufacturing a semiconductor package according to the present invention is a device for manufacturing a semiconductor package for transporting and fixing a material, the heater block (Heater Block) is placed and moved; A window clamp disposed on the heater block, the window clamp having a window, the window clamp including a rotating part for transferring the material; And fixing parts installed at both edges of the window clamp and fixing the window clamp.

상기 자재는 기판 또는 리드프레임인 것을 특징으로 한다.The material is characterized in that the substrate or lead frame.

상기 회전부는 톱니 바퀴 형상을 갖는 것을 특징으로 한다.The rotating part is characterized in that it has a cog wheel shape.

상기 회전부는 롤러(Roller) 형상을 갖는 것을 특징으로 한다.The rotating part has a roller shape.

상기 회전부는 상기 윈도우에 인접한 부분에 배치된 것을 특징으로 한다.The rotating part may be disposed at a portion adjacent to the window.

본 고안은, 반도체 패키지를 형성하기 위해 리드프레임 또는 기판을 반도체 칩 또는 와이어 본딩 영역으로 이송시, 톱니 바퀴와 같은 회전부가 구비되며, 고정식으로 이루어진 윈도우 클램프를 이용하여 이송 및 고정시킴으로써, 상기 회전부에 의해 매번의 인덱스마다 히터블록과 윈도우 클램프 간의 업/다운 동작을 수행하지 않아도 됨에 따라, 반도체 칩 부착 및 와이어 본딩 공정을 수행함에 따른 자재의 이송 및 고정 시간을 최소화시킬 수 있다.The present invention, when transferring the lead frame or the substrate to the semiconductor chip or wire bonding region to form a semiconductor package, a rotating part such as a cog wheel is provided, and is transferred and fixed by using a fixed window clamp, As a result, it is not necessary to perform the up / down operation between the heater block and the window clamp at every index, thereby minimizing the transportation and fixing time of materials by performing the semiconductor chip attaching and wire bonding process.

따라서, 본 고안은 한번의 인덱스로 공정을 수행할 수 있는 리드프레임 또는 기판과 같은 자재의 개수에 따른 한계를 극복할 수 있다.Therefore, the present invention can overcome the limitation depending on the number of materials such as a lead frame or a substrate that can perform the process with one index.

또한, 본 고안은 상기 회전부에 의해 리드프레임 또는 기판의 휨 현상의 발생을 방지할 수 있으므로, 공정 작업성은 물론이고, 후속의 반도체 패키지를 형성하기 위한 나머지 공정 수행시, 상기와 같은 리드프레임 또는 기판의 휨에 따른 와이어 및 반도체 칩의 노출을 방지할 수 있어, 그에 따른 본딩와이어의 불량 발생을 방지할 수 있다.In addition, the present invention can prevent the occurrence of bending of the lead frame or the substrate by the rotating part, as well as the process workability, when performing the remaining process for forming a subsequent semiconductor package, the lead frame or substrate as described above The exposure of the wire and the semiconductor chip due to the bending of the can be prevented, thereby preventing the occurrence of defects in the bonding wire.

도 1은 본 고안의 실시예에 따른 반도체 패키지 제조용 장치를 설명하기 위해 도시한 단면도.1 is a cross-sectional view illustrating a device for manufacturing a semiconductor package according to an embodiment of the present invention.

도 2는 본 고안의 실시예에 따른 반도체 패키지 제조용 장치를 설명하기 위해 도시한 정면도.2 is a front view illustrating a device for manufacturing a semiconductor package according to an embodiment of the present invention.

본 고안은, 반도체 칩 부착 또는 와이어 본딩 공정을 수행하기 위해 리드프레임 또는 기판을 반도체 칩 또는 와이어 본딩 영역으로 이송시, 톱니 바퀴와 같은 회전부가 구비되며, 고정식으로 이루어진 윈도우 클램프를 이용하여 이송 및 고정시킨다. The present invention, when transferring the lead frame or the substrate to the semiconductor chip or wire bonding area to perform the semiconductor chip attachment or wire bonding process, a rotary part such as a cog wheel is provided, and is transferred and fixed using a fixed window clamp Let's do it.

이렇게 하면, 상기와 같이 톱니 바퀴와 같은 회전부가 구비되며, 고정식으로 이루어진 윈도우 클램프를 이용하여 반도체 칩 부착 또는 와이어 본딩 공정을 수행하기 위한 본딩 영역으로 이송 및 고정시킴으로써, 상기 회전부에 의해 반도체 칩 부착 및 와이어 본딩 공정을 수행하기 위해, 매번의 인덱스마다 히터블록과 윈도우 클램프 간의 업/다운 동작을 수행하지 않아도 됨에 따라, 반도체 칩 부착 및 와이어 본딩 공정을 수행함에 따른 자재의 이송 및 고정 시간을 최소화시킬 수 있다.In this case, a rotary part such as a cog wheel is provided as described above, and the semiconductor chip is attached and fixed by the rotating part by transferring and fixing to a bonding area for performing the semiconductor chip attaching or wire bonding process using a fixed window clamp. In order to perform the wire bonding process, it is not necessary to perform the up / down operation between the heater block and the window clamp at each index, thereby minimizing the transportation and fixing time of materials by performing the semiconductor chip attaching and wire bonding process. have.

따라서, 상기와 같이 반도체 패키지를 형성하기 위한 자재의 이송 및 고정 시간을 최소화시킬 수 있으므로, 한번의 인덱스로 공정을 수행할 수 있는 리드프레임 또는 기판과 같은 자재의 개수에 따른 한계를 극복할 수 있다.Therefore, as described above, since the transfer and fixation time of the material for forming the semiconductor package can be minimized, a limitation according to the number of materials such as a lead frame or a substrate that can perform the process with one index can be overcome. .

또한, 리드프레임 또는 기판의 Y축 길이가 점점 더 길어지면서 고정 장치의 사용에 따라 발생하는 리드프레임 또는 기판의 휨 현상의 발생을 상기 회전부가 구비된 클램프에 의해 방지할 수 있으므로, 공정 작업성은 물론이고, 후속의 반도체 패키지를 형성하기 위한 나머지 공정 수행시, 상기와 같은 리드프레임 또는 기판의 휨에 따른 와이어 및 반도체 칩의 노출을 방지할 수 있어, 그에 따른 본딩와이어의 불량 발생을 방지할 수 있다.In addition, since the Y-axis length of the lead frame or the substrate becomes longer and longer, the occurrence of bending of the lead frame or the substrate caused by the use of the fixing device can be prevented by the clamp provided with the rotating part. When the remaining process for forming a subsequent semiconductor package is performed, it is possible to prevent the wire and the semiconductor chip from being exposed to the warpage of the lead frame or the substrate as described above, thereby preventing the failure of the bonding wire. .

이하에서는 첨부된 도면을 참조하여 본 고안의 바람직한 실시예를 상세하게 설명하도록 한다.Hereinafter, with reference to the accompanying drawings will be described in detail a preferred embodiment of the present invention.

자세하게, 도 1은 본 고안의 실시예에 따른 반도체 패키지 제조용 장치를 설명하기 위해 도시한 단면도이고, 도 2는 본 고안의 실시예에 따른 반도체 패키지 제조용 장치를 설명하기 위해 도시한 정면도로서, 이를 설명하면 다음과 같다.In detail, FIG. 1 is a cross-sectional view illustrating a device for manufacturing a semiconductor package according to an embodiment of the present invention, and FIG. 2 is a front view illustrating the device for manufacturing a semiconductor package according to an embodiment of the present invention. Is as follows.

도 1 및 도 2에 도시된 바와 같이 본 고안의 실시예에 따른 반도체 패키지 제조용 장치(100)는, 반도체 패키지를 형성하기 위해 반도체 패키지용 자재를 이송시키기 위한 반도체 패키지 제조용 장치로서, 리드프레임 또는 기판과 같은 반도체 패키지용 자재(110)가 배치 및 고정되는 히터블록(Heater Block : 102)이 하부에 설치되고, 상기 리드프레임 또는 기판과 같은 반도체 패키지용 자재(110)가 배치된 히터블록(102) 상부에는 상기 리드프레임 또는 기판과 같은 반도체 패키지용 자재(110)를 이송 및 고정시키는 상기 히터블록(102)를 고정하는 윈도우 클램프(Clamp : 104)가 설치된다.1 and 2, the apparatus 100 for manufacturing a semiconductor package according to an embodiment of the present invention is a device for manufacturing a semiconductor package for transferring a material for a semiconductor package to form a semiconductor package, and includes a lead frame or a substrate. A heater block 102 in which a semiconductor package material 110 is disposed and fixed, is installed below, and a heater block 102 in which a semiconductor package material 110 such as a lead frame or a substrate is disposed. In the upper portion, a window clamp 104 is installed to fix the heater block 102 for transporting and fixing the material 110 for the semiconductor package such as the lead frame or the substrate.

상기 윈도우 클램프(104)는 중앙에 반도체 칩 또는 와이어를 본딩하기 위한 본딩 영역을 노출시키는 윈도우(W)가 구비되고, 상기 리드프레임 또는 기판과 같은 반도체 패키지용 자재(110)를 용이하게 이송시키며, 톱니 바퀴와 같은 형상을 갖는 회전부(108)가 상기 윈도우(W)에 인접한 부분에 구비된다.The window clamp 104 is provided with a window (W) exposing a bonding area for bonding a semiconductor chip or wire in the center, and easily transports the semiconductor package material 110, such as the lead frame or substrate, A rotating part 108 having a shape such as a cog wheel is provided at a portion adjacent to the window W.

상기 윈도우 클램프(104)의 가장자리에는 상기 윈도우 클램프(104)를 고정시키는 고정부(106)가 설치된다.A fixing part 106 for fixing the window clamp 104 is installed at the edge of the window clamp 104.

전술한 바와 같이 본 고안에 따른 반도체 패키지 제조용 장치는, 상기와 같이 반도체 칩 부착 또는 와이어 본딩 공정을 수행하기 위해 리드프레임 또는 기판을 반도체 칩 또는 와이어 본딩 영역으로 이송 및 고정시, 톱니 바퀴와 같은 회전부가 구비되며, 고정식으로 이루어진 윈도우 클램프가 이용되어 이송 및 고정됨으로써, 반도체 칩 부착 및 와이어 본딩 공정을 수행하기 위해, 종래와 같이 매번의 인덱스마다 히터블록과 윈도우 클램프 간의 업/다운 동작을 수행하지 않아도 됨에 따라, 반도체 칩 부착 및 와이어 본딩 공정을 수행함에 따른 자재의 이송 및 고정 시간을 최소화시킬 수 있다.As described above, the apparatus for manufacturing a semiconductor package according to the present invention includes a rotation such as a gear wheel when transferring and fixing a lead frame or a substrate to a semiconductor chip or a wire bonding region in order to perform a semiconductor chip attaching or wire bonding process as described above. It is provided with an additional, fixed and fixed window clamp is used to transfer and fix, so as to perform the semiconductor chip attachment and wire bonding process, it is not necessary to perform the up / down operation between the heater block and the window clamp at every index as in the prior art. As a result, the transfer and fixation time of the material may be minimized by performing the semiconductor chip attaching and wire bonding process.

따라서, 상기와 같이 반도체 패키지를 형성하기 위한 자재의 이송 및 고정 시간을 최소화시킬 수 있으므로, 한번의 인덱스로 공정을 수행할 수 있는 리드프레임 또는 기판과 같은 자재의 개수에 따른 한계를 극복할 수 있다.Therefore, as described above, since the transfer and fixation time of the material for forming the semiconductor package can be minimized, a limitation according to the number of materials such as a lead frame or a substrate that can perform the process with one index can be overcome. .

또한, 리드프레임 또는 기판의 Y축 길이가 점점 더 길어지면서 발생하는 리드프레임 또는 기판의 휨 현상의 발생을 상기 회전부가 구비된 클램프에 의해 방지할 수 있으므로, 공정 작업성은 물론이고, 후속의 반도체 패키지를 형성하기 위한 나머지 공정 수행시, 상기와 같은 리드프레임 또는 기판의 휨에 따른 와이어 및 반도체 칩의 노출을 방지할 수 있어, 그에 따른 본딩와이어의 불량 발생을 방지할 수 있다.In addition, since the bending of the lead frame or the substrate, which occurs as the Y-axis length of the leadframe or the substrate becomes longer and longer, can be prevented by the clamp with the rotating part, the process workability as well as the subsequent semiconductor package can be prevented. When performing the rest of the process to form a, it is possible to prevent the exposure of the wire and the semiconductor chip due to the bending of the lead frame or the substrate as described above, it is possible to prevent the failure of the bonding wire accordingly.

이상, 전술한 본 고안의 실시예들에서는 특정 실시예에 관련하고 도시하고 설명하였지만, 본 고안이 그에 한정되는 것은 아니며, 이하의 특허청구의 범위는 본 고안의 정신과 분야를 이탈하지 않는 한도 내에서 본 고안이 다양하게 개조 및 변형될 수 있다는 것을 당 업계에서 통상의 지식을 가진 자가 용이하게 알 수 있다.In the above-described embodiments of the present invention, the present invention has been described and described with respect to a specific embodiment, but the present invention is not limited thereto, and the scope of the following claims is provided without departing from the spirit and the field of the present invention. It will be readily apparent to those skilled in the art that the present invention may be modified and modified in various ways.

Claims (5)

자재를 이송 및 고정시키기 위한 반도체 패키지 제조용 장치로서,Apparatus for manufacturing a semiconductor package for transporting and fixing material, 상기 자재가 배치 및 이동되는 히터블록(Heater Block);A heater block in which the material is placed and moved; 상기 히터블록 상부에 배치되며, 윈도우를 구비하고, 상기 자재를 이송시키는 회전부를 구비한 윈도우 클램프(Clamp); 및A window clamp disposed on the heater block, the window clamp having a window, the window clamp including a rotating part for transferring the material; And 상기 윈도우 클램프의 양측 가장자리 각각에 설치되며, 상기 윈도우 클램프를 고정시키는 고정부;Fixing parts installed at each of both edges of the window clamp and fixing the window clamp; 를 포함하는 것을 특징으로 하는 반도체 패키지 제조용 장치.Apparatus for manufacturing a semiconductor package comprising a. 제 1 항에 있어서,The method of claim 1, 상기 자재는 기판 또는 리드프레임인 것을 특징으로 하는 반도체 패키지 제조용 장치.And the material is a substrate or leadframe. 제 1 항에 있어서,The method of claim 1, 상기 회전부는 톱니 바퀴 형상을 갖는 것을 특징으로 하는 반도체 패키지 제조용 장치.And the rotating part has a toothed wheel shape. 제 1 항에 있어서,The method of claim 1, 상기 회전부는 롤러(Roller) 형상을 갖는 것을 특징으로 하는 반도체 패키지 제조용 장치.The rotating part has a roller (Roller) shape, characterized in that the device for manufacturing a semiconductor package. 제 1 항에 있어서,The method of claim 1, 상기 회전부는 상기 윈도우에 인접한 부분에 배치된 것을 특징으로 하는 반도체 패키지 제조용 장치.And the rotating part is disposed in a portion adjacent to the window.
KR2020080004124U 2008-03-28 2008-03-28 Apparatus for fabricating semiconductor package KR20090009978U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2020080004124U KR20090009978U (en) 2008-03-28 2008-03-28 Apparatus for fabricating semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2020080004124U KR20090009978U (en) 2008-03-28 2008-03-28 Apparatus for fabricating semiconductor package

Publications (1)

Publication Number Publication Date
KR20090009978U true KR20090009978U (en) 2009-10-01

Family

ID=41533930

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2020080004124U KR20090009978U (en) 2008-03-28 2008-03-28 Apparatus for fabricating semiconductor package

Country Status (1)

Country Link
KR (1) KR20090009978U (en)

Similar Documents

Publication Publication Date Title
KR100337412B1 (en) An integrated circuit and a semiconductor wafer having a bottom surface protective coating and method of making the same
US7772685B2 (en) Stacked semiconductor structure and fabrication method thereof
US9362214B2 (en) Pre-encapsulated etching-then-plating lead frame structure with island and method for manufacturing the same
US8642395B2 (en) Method of making chip-on-lead package
US7714415B2 (en) Leadframe structures for semiconductor packages
TW200810044A (en) Non-lead leadframe and package therewith
US8709870B2 (en) Method of forming solderable side-surface terminals of quad no-lead frame (QFN) integrated circuit packages
US20050176168A1 (en) Package structure of optical device and method for manufacturing the same
WO2013037185A1 (en) Pre-encapsulated plating-then-etching lead frame structure with island and manufacturing method
JP2000223639A (en) Lead frame structure for preventing warping of semiconductor package body
TWI555097B (en) Method of packaging semiconductor devices and apparatus for performing the same
KR20090009978U (en) Apparatus for fabricating semiconductor package
US9318356B2 (en) Substrate strip
CN105702651A (en) Integrated circuit device having exposed contact pads and leads supporting the integrated circuit die and method of forming the device
JP7313259B2 (en) Processing method of resin substrate
US20080157297A1 (en) Stress-Resistant Leadframe and Method
US20170084490A1 (en) Method for making ic with stepped sidewall and related ic devices
US20090181499A1 (en) Ic packaging process
TW201304629A (en) Module for arraying good substrate and method for manufacturing the same
US5596172A (en) Planar encapsulation process
JP2003078069A (en) Pseudo wafer for multichip module production and production method therefor
JP5362404B2 (en) Manufacturing method of semiconductor integrated circuit device
KR20090010318U (en) Wire bonding kit for fabricating semiconductor package
WO2013037188A1 (en) Pre-encapsulated islandless lead frame structures and manufacturing method
US7696008B2 (en) Wafer-level chip packaging process and chip package structure

Legal Events

Date Code Title Description
WITN Withdrawal due to no request for examination