KR20090009743U - Display Device - Google Patents

Abstract

According to an exemplary embodiment, a display apparatus includes a mold frame accommodating any one of a liquid crystal panel and a backlight assembly; And a chassis including a bottom plate disposed on the rear surface of the mold frame and sidewalls vertically extending from the bottom plate and coupled to the outside of the mold frame, wherein the bottom plate has a dual structure to support one surface of the bottom plate. It includes an additional arrangement.

According to an embodiment, the intensity of the display device may be improved.

Description

Display Device

In an embodiment, a display device is disclosed.

One of the display devices, a liquid crystal display (LCD), displays an image by using electrical and optical characteristics of the liquid crystal. Since the liquid crystal display device is a light receiving element that does not emit light by itself, a backlight unit is required, and the performance of the liquid crystal display device depends largely on the performance of the backlight unit as well as the liquid crystal display device.

The backlight unit includes a backlight assembly including a reflector, a light guide plate, an optical sheet, a light source, and a mold frame and a chassis in which the backlight assembly is accommodated.

The mold frame is fixed by inserting a backlight unit and a liquid crystal panel.

The chassis is fastened to the mold frame in order to reinforce the strength of the display device, and has a structure corresponding to the outer shape of the mold frame.

The embodiment provides a display device capable of enhancing the structure of the chassis to improve the strength of the liquid crystal panel and the backlight unit.

According to an exemplary embodiment, a display apparatus includes a mold frame accommodating any one of a liquid crystal panel and a backlight assembly; A bottom plate disposed on a rear surface of the mold frame and a chassis including sidewalls vertically extending from an edge of the bottom plate and coupled to an outer side of the mold frame, wherein the bottom plate has a dual structure; It includes that the support part is arranged in the.

According to the embodiment, since the chassis of the driving chip mounting portion having a relatively weak strength in the liquid crystal panel has a double bottom plate, there is an effect of protecting the liquid crystal panel from external impact.

1 is a front view of a display device according to an embodiment.

FIG. 2 is a perspective view illustrating an exploded state of the display apparatus illustrated in FIG. 1.

3 is a rear view of the chassis shown in FIG. 2.

4 is a rear view illustrating a state in which the support part of the chassis illustrated in FIG. 3 is bent.

5 is a cross-sectional view taken along the line AA ′ of FIG. 1.

A display device according to an embodiment will be described in detail with reference to the accompanying drawings.

In the description of an embodiment, each layer (film), region, pattern or structure is formed to be "on" or "under" a substrate, each layer (film), region, pad or pattern. In the case described, "on" and "under" include both being formed "directly" or "indirectly" through another layer. In addition, the criteria for the top or bottom of each layer will be described with reference to the drawings.

In the drawings, the thickness or size of each layer is exaggerated, omitted, or schematically illustrated for convenience and clarity of description. In addition, the size of each component does not necessarily reflect the actual size.

1 is a front view of a display device according to an embodiment. FIG. 2 is an exploded perspective view of the display device shown in FIG. 1. 3 is a rear view of the chassis shown in FIG. 2. 4 is a rear view illustrating a state in which the support part of the chassis illustrated in FIG. 3 is bent. 5 is a cross-sectional view taken along the line AA ′ of FIG. 1.

1 and 2, the display device includes a liquid crystal panel 10 and a backlight unit.

The liquid crystal panel 10 is formed by injecting a liquid crystal layer between a TFT substrate and a color filter substrate.

The liquid crystal panel 10 is connected to the main substrate (not shown) through a connector substrate, thereby controlling the driving of the liquid crystal panel 10. The main substrate is a flexible printed circuit board (FPCB), and a circuit pattern (not shown) and a driver chip 11 capable of operating the liquid crystal panel 10 are formed.

The backlight unit includes a backlight assembly 70, a mold frame 100, and a chassis 200.

The backlight assembly 70 includes a light guide plate 40, a light emitting unit 60, an optical sheet unit 30, a light blocking tape 20, and a reflecting plate 50.

The light guide plate 40 receives light generated from the light emitting unit 60 and evenly distributes the light to the entire light emitting area of the backlight.

The light emitting unit 60 is formed by mounting a lamp 63 such as an LED or a CCFL on a flexible printed circuit board (FPCB). A plurality of light emitting diode lamps 63 are mounted on the rear surface of the substrate of the light emitting unit 60 and electrically connected to the main substrate (not shown).

The light guide plate 40 and the light emitting unit 60 may be disposed in the mold frame 100 in an edge manner. The light emitting unit 60 is disposed on one side or a plurality of side surfaces of the light guide plate 40 to irradiate light to the light guide plate 40.

The optical sheet unit 30 includes a protective sheet, a plurality of prism sheets, and a diffusion sheet stacked on the light guide plate 40.

The light blocking tape 20 is attached to an outer surface between the backlight assembly 70 and the liquid crystal panel 10 so that the liquid crystal panel 10 may be fixed on the backlight assembly 70. In addition, the light blocking tape 20 is used as an adhesive tape to block light other than the light emitting area to be used.

The reflector 50 serves to reflect light leaking to the lower portion of the light guide plate 40 in the upper direction of the light guide plate 40.

The backlight unit disperses the light generated by the light emitting part 60 installed at one side of the mold frame 100 to the light guide plate 40 and then the liquid crystal panel 10 through the optical sheet part 30. Irradiate with.

The mold frame 100 includes sidewalls corresponding to the outer shape of the liquid crystal panel 10 and the backlight assembly 70. For example, four sidewalls of the mold frame 100 may be formed in a rectangular frame shape. Hereinafter, the four sidewalls are referred to as a first sidewall 110, a second sidewall 120, a third sidewall 130, and a fourth sidewall 140, respectively.

The first sidewall 110 and the third sidewall 130 are disposed to face each other, the second sidewall 120 and the fourth sidewall 140 are disposed to face each other, the first to fourth sidewalls (110, 120, 130, 140) ) Are connected to each other in a closed loop shape. Accordingly, the first to fourth sidewalls 110, 120, 130, and 140 have a rectangular frame shape when viewed in plan view. For example, the mold frame 100 may be formed using a synthetic resin such as polycarbonate resin, styrene resin, polyvinyl chloride or polypropylene.

In addition, an inner sidewall of the fourth sidewall 140 may be selectively opened to accommodate the light emitting unit 60 of the backlight assembly 70.

The chassis 200 is to improve the rigidity of the mold frame 100 and is coupled to an outer circumferential surface of the mold frame 100.

2 and 3, the chassis 200 includes a bottom plate 250 and sidewalls to surround the back and sidewalls 110, 120, 130, and 140 of the mold frame 100.

The chassis 200 may be formed of metal. For example, the metal constituting the chassis 200 may be stainless steel, iron, aluminum, aluminum alloy, copper, or the like. In addition, the chassis 200 may include metals of various materials.

The bottom plate 250 of the chassis 200 may be formed in the same shape and size as the mold frame 100 so as to support the rear surface of the mold frame 100. For example, the bottom plate 250 may be formed in a rectangular flat plate shape.

Sidewalls of the chassis 200 may be formed in four to form a rectangular frame. Hereinafter, sidewalls of the chassis 200 are referred to as a first sidewall 210, a second sidewall 220, a third sidewall 230, and a fourth sidewall 240.

The first to fourth sidewalls 210, 220, 230, and 240 are formed to extend (or protrude) and bend vertically at the edges of the bottom plate 250, respectively. That is, the first to fourth sidewalls 210, 220, 230, and 240 may be perpendicular to the bottom plate 250.

Accordingly, the bottom plate 250 is disposed on the rear surface of the mold frame 100 and the first to fourth sidewalls 210, 220, 230, and 240 are outer surfaces of the first to fourth sidewalls 110, 120, 130, and 140 of the mold frame 100. Can be placed in.

A support part 260 for supporting the driving chip 11 mounted on the liquid crystal panel 10 is formed on one surface of the bottom plate 250. The support part 260 may be formed by cutting a portion of the bottom plate 250 and bending it to face an inner surface or an outer surface of the bottom plate 250. 2 illustrates that the support part 260 is bent to the inner surface of the bottom plate 250 so that the bottom plate 250 and the support part 260 are formed in a double structure. Of course, the support part 260 may be formed by bending to face the outer surface of the bottom plate 250.

Thus, the chassis 200 may protect and reinforce the liquid crystal panel 10, the backlight assembly 70, and the mold frame 100.

In particular, since the bottom plate 250 and the support part 260 of the chassis 200 are disposed at a position corresponding to the driving chip 11, the driving chip having relatively low strength in the liquid crystal panel 10 ( Since the lower part of 11) is supported by the chassis 200 of the dual structure, the strength of the display device can be reinforced.

A method of forming the support part will be described with reference to FIGS. 3 and 4.

Referring to FIG. 3, the bending line 270 is defined on the bottom plate 250 so as to correspond to the position of the driving chip 11. The bending line 270 may be defined to have a length H1 at the same position as the driving chip 11 or longer than the position of the driving chip 11 with respect to the edge of the bottom plate 250. In addition, the bending line 270 may be defined to correspond to the width of the driving chip 11 or to have a wider width.

A predetermined support part region (not shown) having a length H2 smaller than the length H1 of the bending line 270 based on the bending line 270 and having the same width as the bending line 270 is defined.

The bottom plate 250 of one side of the bending line 270 is selectively cut based on the bending line 270. That is, the support portion 260 may be formed by cutting the H2 point in the vertical direction from both ends of the bending line 270 and cutting the H2 point in the horizontal direction so that the cut ends are connected.

The support part 260 is cut off from the bottom plate 250 based on the bending line 270. Therefore, the support part 260 is in a state that can be folded based on the bending line 270. In addition, as shown in FIG. 3, the support part 260 may be formed in a rectangular flat shape in an upper region thereof based on the bending line 270.

Referring to FIG. 4, the support part 260 is disposed to face one surface of the bottom plate 250. For example, the support part 260 may be formed by bending 180 ° in the inner surface or the outer surface direction of the bottom plate 250. In FIG. 4, the support part 260 is bent to face the inner surface of the bottom plate 250.

As described above, the support part 260 overlaps the bottom plate 250 so that the bottom surface of the chassis 200 may have a dual structure.

5 is a cross-sectional view taken along line AA ′ of FIG. 1, wherein the liquid crystal panel 10 and the backlight assembly 70 are coupled to the mold frame 100, and the chassis 200 is disposed outside the mold frame 100. ) Is combined.

Specifically, the backlight assembly 70 including the light guide plate 40, the optical sheet unit 30, the light emitting unit 60, and the reflecting plate 50 is coupled to the mold frame 100. In addition, the liquid crystal panel 10 having the driving chip 11 mounted on the backlight assembly 70 is coupled by the light blocking tape 20.

The chassis 200 for securing rigidity of the mold frame 100 is coupled to an outer circumferential surface of the mold frame 100.

The first to fourth sidewalls 210, 220, 230, and 240 of the chassis 200 are disposed to surround the outer surfaces of the sidewalls 110, 120, 130, and 140 of the mold frame 100. The bottom plate 250 of the chassis 200 is disposed to support the rear surface of the mold frame 100 to which the liquid crystal panel 10 and the backlight assembly 70 are coupled. In particular, the support part 260 is disposed on the inner surface of the bottom plate 250.

That is, the liquid crystal panel 10 is disposed at one side of the mold frame 100 and the backlight assembly 70, and the support part 260 and the bottom plate 250 are disposed at the other side. The support part 260 and the bottom plate 250 are disposed in a dual structure at a position corresponding to the driving chip 11 mounted on the liquid crystal panel 10.

Therefore, since the driving chip 11 is supported by the chassis 200 having the bottom surface of the dual structure, the protection strength of the driving chip 11 may be improved.

In general, when an external shock is applied to the display device, the driving chip 11, which is relatively weak in strength compared to other parts, may be damaged. In order to prevent this, in the embodiment, since the bottom plate and the support portion 260 of the chassis 200 are arranged in a double structure to a position corresponding to the driving chip 11, the driving chip 11 may be protected. have.

Although described above with reference to the embodiment is only an example and is not intended to limit the present invention, those of ordinary skill in the art to which the present invention belongs, which is not illustrated in the above not departing from the essential characteristics of the present embodiment It will be appreciated that many variations and applications are possible. For example, each component specifically shown in the embodiment can be modified. And differences relating to these modifications and applications will have to be construed as being included in the scope of the invention as defined in the appended claims.

Claims (3)

A mold frame accommodating any one of a liquid crystal panel and a backlight assembly; A chassis including a bottom plate disposed on a rear surface of the mold frame and sidewalls vertically extending from an edge of the bottom plate and coupled to an outer side of the mold frame, And a support part disposed on one surface of the bottom plate such that the bottom plate has a dual structure. The method of claim 1, The liquid crystal panel includes a driving chip, The support unit is disposed on one surface of the bottom plate corresponding to the lower portion of the driving chip. The method of claim 1, The support unit is formed by cutting a portion of the bottom plate and bent to the inner or outer surface of the bottom plate.