KR20090006955A - Radiating apparatus for cpu of computer - Google Patents

Radiating apparatus for cpu of computer Download PDF

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Publication number
KR20090006955A
KR20090006955A KR1020070070451A KR20070070451A KR20090006955A KR 20090006955 A KR20090006955 A KR 20090006955A KR 1020070070451 A KR1020070070451 A KR 1020070070451A KR 20070070451 A KR20070070451 A KR 20070070451A KR 20090006955 A KR20090006955 A KR 20090006955A
Authority
KR
South Korea
Prior art keywords
cooling
cpu
heat
computer
tank
Prior art date
Application number
KR1020070070451A
Other languages
Korean (ko)
Inventor
유경준
Original Assignee
유경준
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 유경준 filed Critical 유경준
Priority to KR1020070070451A priority Critical patent/KR20090006955A/en
Publication of KR20090006955A publication Critical patent/KR20090006955A/en

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20309—Evaporators

Abstract

A CPU radiator for a computer for effectively cooling heat delivered to a cooling tank by porous material and solvent is provided to exchange the heat delivered to the cooling tank and improve the cooling efficiency by a cooling pan and a cooling pin. A motor(30) is mounted inside a bracket(20) and is combined with a cooling pan(31) generating wind. A cooling pin(40) is combined inside the guide part(22) of the bracket. A cooling tank(50) is inserted and fixed inside the guide part. The down side of the cooling tank is contacted on the surface of a CPU(60). The cooling tank cools heat delivered from the CPU.

Description

CIFIL heat sink for computer {Radiating apparatus for CPU of computer}

1 is a perspective view showing a conventional CPU radiator for a computer.

2 to 4 are diagrams showing a CPU heat sink for a computer according to an embodiment of the present invention.

2 is a cross-sectional view of the present invention,

3 is a bottom view of the present invention,

4 is a view showing a cooling fin of the present invention,

5 is a cross-sectional view showing a cooling tank of the present invention.

6 and 7 are diagrams illustrating a CPU radiator for a computer according to another embodiment of the present invention.

6 is a cross-sectional view of the present invention,

7 is a bottom view of the present invention.

Explanation of symbols on the main parts of the drawings

20: bracket 22: guide portion

30: motor 31: cooling fan

40: cooling fin 50: cooling tank

51: tank body 52: cover

53: porous material 54: groove

60: CPU

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a CPU heat sink for a computer, and more particularly, to a CPU heat sink for a computer for cooling a central processing unit installed in a computer.

In general, the CPU, which is essentially installed inside the main body of the computer, performs the role of computing and controlling like the human brain, and this CPU generates heat essentially corresponding to the frequency during the operation process. The heat generated damages not only the CPU but also internal electrical and electronic components, and a heat dissipation device is provided as a means to minimize the CPU.

Conventionally, a device for dissipating heat generated by a CPU includes a heat pipe 11 to transfer a heat exchange medium such as a refrigerant to one side of a heat dissipation unit 10 that radiates heat close to the CPU as shown in FIG. 1. Connected to the heat pipe 11, and a transfer part 12 for transferring heat to the heat dissipation part 10 is provided, and the heat dissipation part 10 is in contact with air to provide heat. It is made of a structure in which a plurality of heat dissipation fins 13 are formed.

Therefore, when heat is generated by the operation of the CPU while the CPU is in contact with the heat dissipation fins 13, the heat is dissipated by heat exchange through the heat dissipation fins 13, and the heat dissipation fins 13 are heat pipes 11, transmission. Cooling is achieved by the heat exchange medium circulated through the unit 12 and the heat radiating unit 10.

However, such a conventional CPU heat sink is not only very complicated in structure but also large in size, occupies a lot of occupied space in the case, and in particular, there are various problems inherent in that the cooling effect is not satisfactory.

The present invention has been invented to solve the above problems, and an object of the present invention is to provide a CPU heat dissipation device for a computer that can simplify the structure and minimize the volume to reduce the cost and improve the cooling efficiency. .

According to an aspect of the present invention, there is provided a CPU heat dissipation device for a computer, including a bracket having a guide part at a lower edge thereof, a motor and a cooling fan mounted therein, a cooling fin coupled to the inside of the guide part, and The cooling tank is inserted into and fixed to the inside of the cooling fin, and is provided with a cooling tank that receives and radiates heat generated from the CPU.

Therefore, according to the present invention, the structure is simple and the space occupied in the case is minimized, thereby not only improving the space utilization in the case but also reducing the manufacturing cost, in particular, the heat transferred to the cooling tank It is effectively heat exchanged by the porous material and the volatile material, and the heat dissipation is performed by the cooling fan and the cooling fin to further improve the cooling efficiency.

Hereinafter, exemplary embodiments of the present invention will be described in more detail with reference to the accompanying drawings.

2 to 5 are diagrams showing a computer CPU heat dissipation device according to the present invention, Figure 2 is a cross-sectional view of the combination of the present invention, Figure 3 is a bottom view of the present invention.

2 and 3, the bracket 20 is formed with a plurality of fastening holes 21 to be mounted on the main board (not shown) by bolts or screws, and a guide portion 22 is formed on the lower edge thereof.

A motor 30 is mounted inside the bracket 20, and a cooling fan 31 for generating wind in accordance with operation is coupled to the motor 30.

And the cooling fin 40 of the thin metal plate formed of a material such as aluminum is coupled to the inside of the guide portion 22 of the bracket 20.

The cooling fin 40 is formed in a cylindrical shape bent in a zigzag metal plate as shown in Figure 4 and fixed to the inside of the guide portion 22, the cooling tank (40) inside the cooling fin ( 50) is inserted and fixed.

The cooling tank 50 has a lower surface in contact with the surface of the CPU 60 to cool by radiating heat transferred from the CPU 60.

The cooling fin 40 has an inner surface 41 and the outer surface 42 is formed to facilitate the cylindrical shape, the oddity of the inner surface 41 is formed smaller than the length of the outer surface 42 have.

The cooling fin 40 and the cooling tank 50 are in contact with each other, that is, the inner surface 41 of the cooling fin 40 and the surface of the cooling tank 50 in contact with the inner surface 41 is soldered, etc. Is bonded by means of.

The cooling tank 50 is composed of a tank body 51 having an open upper portion, and a cover 52 coupled to an upper side of the tank body 51, and the inside of the tank body 51 and the cover 52. The surface is sintered and coated with a porous material 53 such as copper powder, carbon, bioceramic, zeolite, and the like, and a predetermined amount of volatile materials such as water, alcohol, and refrigerant is filled therein.

A plurality of recesses 54 formed by sintering porous materials are repeatedly formed on the inner bottom surface of the cooling tank 50.

The base portion 20 has a flange portion 22 is formed to extend upward, the cooling pin 40 is inserted into the inside of the flange portion 22 for heat exchange by contacting the heat transferred to the air.

 The cooling fin 40 has a central cylindrical portion formed in an empty cylindrical shape, the inner space is formed smaller than the outer space.

The cooling tank 50 is not limited to being inserted into the cooling fin 40 and welded thereto, and may be inserted and fixed in a forced press-fitting manner into the cooling fin 40.

In this case, as illustrated in FIGS. 6 and 7, a cooling fin 40 having a predetermined shape is inserted into the guide portion 22 of the bracket 20, and the inner side of the cooling fin 40 is fixed to the CPU or the like. A plurality of fixing holes 43 are formed.

And when fixing the cooling tank 50 to the inside of the cooling fin 40, the inner surface of the cooling fin 40 and the outer surface of the cooling tank 50 by giving approximately the same gradient coupled by force Afterwards, the cooling fins 40 and the cooling tank 50 are not separated arbitrarily.

The outer side of the cooling fin 40 is attached to the guide plate 44 to guide the wind generated by the operation of the cooling fan 31 is rotated in accordance with the operation of the motor 30 to the cooling fin 40.

The CPU heat dissipation device for a computer according to the present invention configured as described above is fixed to a motherboard (not shown) by means of a bolt or screw such that the lower surface of the cooling tank 50 contacts the surface of the CPU 60. do.

In this case, when heat is generated according to the operation of the CPU 60, the heat is transferred to the cooling tank 50, and the heat transferred to the cooling tank 50 is transferred to the porous material 53 in the cooling tank 50. The heat exchange is carried out by evaporation of the volatile material charged therein, and the heat transmitted is cooled, and at the same time, the cooling fins 40 in contact with the cooling tank 50 come into contact with air to generate heat. The wind generated from the cooling fan 31 that rotates according to the operation of the 30 cools the cooling fins 40, thereby further increasing the cooling effect.

In addition, the wind generated by the operation of the cooling fan 31 is guided to the lower side by the guide portion 22 formed on the lower edge of the bracket 20 to cool the cooling fins 40. .

In addition, a plurality of grooves 54 are formed on the lower inner surface of the cooling tank 50 so that heat can be quickly transferred and heat is also quickly transferred to the volatile material absorbed by the porous material 53 to further evaporate. It will be made smoothly.

As this operation is repeatedly performed, the heat generated by the CPU 60 is cooled in the cooling tank 50 so as not to rise above a predetermined temperature, thereby preventing the occurrence of malfunction due to the rise of the temperature, thereby achieving stable operation. do.

The present invention as described above is not limited to the above-described specific embodiments, and any person having ordinary skill in the art to which the present invention pertains may make various changes without departing from the gist of the present invention as claimed in the claims. will be.

Therefore, according to the present invention, the structure is simple and the space occupied in the case is minimized, thereby not only improving the space utilization in the case but also reducing the manufacturing cost, in particular, the heat transferred to the cooling tank It is effectively heat exchanged by the porous material and the volatile material, and the heat dissipation is performed by the cooling fan and the cooling fin, thereby further improving the cooling efficiency.

Claims (3)

Cooling tank that has a guide part on the lower edge and a motor and a cooling fan mounted therein, a cooling pin coupled to the inside of the guide part, and inserted into and fixed inside the cooling fin to receive heat generated from a CPU to radiate heat. CPI oil heat dissipation device for the computer, characterized in that the provided. The method of claim 1, The cooling tank is composed of a tank body having an open top and a cover coupled to the upper portion of the tank body, the inner surface of the porous material is sintered, and the inside of the computer-based CIF oil heat dissipation Device. The method of claim 1, The cooling tank is a CIF oil heat dissipation device for the computer, characterized in that the fixing fixed by welding or forced pressing method inside the cooling fins.
KR1020070070451A 2007-07-13 2007-07-13 Radiating apparatus for cpu of computer KR20090006955A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020070070451A KR20090006955A (en) 2007-07-13 2007-07-13 Radiating apparatus for cpu of computer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070070451A KR20090006955A (en) 2007-07-13 2007-07-13 Radiating apparatus for cpu of computer

Publications (1)

Publication Number Publication Date
KR20090006955A true KR20090006955A (en) 2009-01-16

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070070451A KR20090006955A (en) 2007-07-13 2007-07-13 Radiating apparatus for cpu of computer

Country Status (1)

Country Link
KR (1) KR20090006955A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101503748B1 (en) * 2013-04-08 2015-03-18 조선대학교산학협력단 Cpu cooling apparatus using stirling refrigeration

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101503748B1 (en) * 2013-04-08 2015-03-18 조선대학교산학협력단 Cpu cooling apparatus using stirling refrigeration

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E601 Decision to refuse application