KR20090005566A - Organic light emitting display device - Google Patents

Abstract

An organic electroluminescent display device is provided to prevent the deformation or the damage of a substrate by effectively supporting glass substrates of a wiring area with an encap member. A substrate(100) comprises a pixel region, a drive circuit built-in region and a wiring area. The pixel region comprises a plurality of organic light-emitting diodes. The drive circuit built-in region is defined in the outer side of the pixel region. Wires connecting the pixel region and the drive circuit built-in region are formed in the wiring area. An encap member(200) seals the pixel region hermetically. The direct drive circuit(120) is positioned in the drive circuit built-in region. The encap member is overlapped with the pixel region and the wiring area except for the drive circuit built-in region. The encap member comprises an encapsulant(200a) and a junction(200b). The encapsulant corresponds to the pixel region. The junction is welded to circumference of the pixel region and the wiring area.

Description

Organic Light Emitting Display Device

1 is a plan view schematically illustrating an organic light emitting display device according to an exemplary embodiment of the present invention.

FIG. 2 is a perspective view illustrating an example of a sealing structure of the organic light emitting display device illustrated in FIG. 1.

3A and 3B are perspective views illustrating a process of attaching the flexible printed circuit board illustrated in FIG. 2.

<Explanation of symbols for the main parts of the drawings>

100: substrate 100a: pixel region

100b: drive circuit mounting area 100c: wiring area

100d: pad portion 120: driving integrated circuit

200: encap member 200a: sealing part

200b: junction 300: protective film

400: flexible printed circuit board

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an organic light emitting display device, and more particularly, to a chip on glass (COG) type organic light emitting display device.

Recently, various flat panel display devices have been developed that are lighter in weight and smaller in volume than cathode ray tubes. In particular, organic light emitting display devices having excellent brightness and color purity using organic compounds as light emitting materials have been developed. Emitting Display Device) is drawing attention.

The organic light emitting display device includes a pixel area including a plurality of pixels positioned at an intersection of scan lines and data lines, and a driving circuit for driving the pixel area.

Here, each pixel includes a plurality of organic light emitting diodes including an anode electrode and a cathode electrode and an organic light emitting layer formed therebetween.

However, since the organic light emitting layer is easily deteriorated by moisture and oxygen, the pixel region of the organic light emitting display device is typically sealed by an encap member. That is, the display panel of the organic light emitting display device in which the pixel region is formed includes a substrate on which the pixels are formed and an encap member adhered to the substrate by the sealing member to seal the pixel region.

The driving circuit generates a scan signal for selecting the pixels and a data signal for determining the light emission luminance of the pixels in response to the power and control signals supplied from the outside, and supplies the generated scan signal and the data signal to the pixels. .

Such a driving circuit may be mounted on a flexible printed circuit board (FPCB) electrically connected to the display panel through the pad part, or may be mounted on the display panel in the form of an integrated circuit (IC) chip. have.

Among these, in the case of a chip on glass (COG) type organic light emitting display device in which a driving circuit is mounted on a display panel in the form of a chip, the number of pads formed in the pad part can be reduced, thereby manufacturing cost required for the conductive film. Can reduce the cost.

Since the display panel of the organic light emitting display device is generally formed on a glass substrate, it is easily deformed or damaged when an impact is applied by an external force.

In addition, in recent years, as the size and size of the display device have become smaller, the organic light emitting display device has been generally slimmed down by reducing the thickness of the display panel.

Accordingly, although it is necessary to reduce the thickness of the glass substrate which determines the thickness of the display panel, the decrease in the thickness of the glass substrate may lead to the weakening of the display panel, thereby increasing the probability of the display panel being deformed or broken.

Accordingly, it is an object of the present invention to provide a COG type organic light emitting display device capable of reducing the thickness of the display panel and improving its rigidity.

In order to achieve the above object, the present invention provides a pixel area including a plurality of organic light emitting diodes, a driving circuit mounting area defined outside the pixel area, and wirings connecting the pixel area and the driving circuit mounting area. A substrate including a formed wiring area; An encap member sealing the pixel region; An organic light emitting display device including a driving integrated circuit (drive IC) mounted in the driving circuit mounting area is provided. Here, the encap member overlaps the pixel region and the wiring region except for the driving circuit mounting region.

The encap member may include a sealing part corresponding to the pixel area, and a junction part joined to a circumference of the pixel area and the wiring area. The display device may further include a pad part formed at one edge of the substrate, and may further include a flexible printed circuit board (FPCB) connected to the pixel area or the driving integrated circuit by the pad part. In addition, the encap member may be formed over the entire substrate in an area excluding the pad part and the driving circuit mounting area. The wirings may extend into the driving circuit mounting region to be connected to the driving integrated circuit in the driving circuit mounting region, and a protective film may be formed on the extended wirings. The flexible printed circuit board may be bent in a direction in which the driving integrated circuit is mounted and a portion of the flexible printed circuit board overlaps with the driving integrated circuit, and may be formed by an adhesive member attached to an encap member formed on the wiring area. It may be secured to the encap member.

Hereinafter, preferred embodiments of the present invention may be easily implemented by those skilled in the art with reference to FIGS. 1 to 3B as follows.

1 is a plan view schematically illustrating an organic light emitting display device according to an exemplary embodiment of the present invention. For convenience, the display panel of the passive organic light emitting display device is illustrated in FIG. 1, but the present invention is not limited thereto.

Referring to FIG. 1, an organic light emitting display device according to an exemplary embodiment of the present invention includes a pixel region 100a including a plurality of organic light emitting diodes OLED and a driving circuit defined outside the pixel region 100a. The wirings connecting the driving integrated circuit 120 (hereinafter referred to as a driving IC) 120 mounted in the mounting region 100b and the driving IC 120 in the pixel region 100a and the driving circuit mounting region 100b are provided. The formed wiring area 100c is included.

The pixel area 100a includes a plurality of pixels 110 positioned at the intersection of the scan lines S1 to S2n and the data lines D1 to Dm. Each pixel 110 is selected when the scan signal is supplied to the scan lines S1 to S2n and emits light at a luminance corresponding to the data signal supplied to the data lines D1 to Dm. To this end, each pixel 110 includes an organic light emitting diode (OLED) including an anode electrode and a cathode electrode and an organic light emitting layer formed therebetween.

The driving IC 120 is mounted on the display panel in the form of an integrated circuit chip. The driving IC 120 generates a scan signal and a data signal corresponding to the driving power and signals transmitted from the outside via the pad part 100d from the outside, and the scan ICs S1 to S2n and the data lines D1 to Dm). To this end, the driving IC 120 may include a scan driver for generating a scan signal and a data driver for generating a data signal.

The wiring area 100c includes a plurality of wirings connecting the pixel area 100a and the driving circuit mounting area 100b, particularly, the driving IC 120. For example, scan lines S1 to S2n and data lines D1 to Dm electrically connecting the pixel region 100a and the driving IC 120 to the wiring region 100c, a pixel power line (not shown), and the like. This can be formed.

According to the exemplary embodiment of the present invention, the number of pads P formed in the pad part 100d may be reduced by mounting the driving IC 120 on the display panel in the form of a chip. Thereby, the manufacturing cost for the conductive film used to form the pad portion 100d can be reduced.

However, in order to prevent degradation of the organic light emitting layer, the pixel region 100a is sealed by an encap member (not shown).

That is, the display panel of the organic light emitting display device includes a substrate 100 including a pixel area 100a, a driving circuit mounting area 100b, a wiring area 100c, and a pad part 100d, and at least a pixel area 100a. ) And an encap member (not shown) bonded to the substrate 100 to seal the), and a driving IC 120 mounted in the driving circuit mounting region 100b of the substrate 100.

Here, the substrate 100 may be formed of a light transmitting material, for example, a glass material so that light generated in the pixel region 100a may be transmitted, and the encap member may be formed of an inorganic material such as a glass material or a metal material. have.

A more detailed description of the sealing structure of the organic light emitting display device will be described later.

FIG. 2 is a perspective view illustrating an example of a sealing structure of the organic light emitting display device illustrated in FIG. 1.

Referring to FIG. 2 in conjunction with FIG. 1, the encap member 200 is bonded to one surface of the substrate 100 to seal at least the pixel region 100a. Here, the encap member 200 is disposed to overlap the pixel region 100a and the wiring region 100c except for the driving circuit mounting region 100b.

More specifically, the encap member 200 includes a sealing part 200a disposed to correspond to the pixel area 100a, and extends from an edge of the sealing part 200a to surround the pixel area 100a and the wiring area 100c. A junction portion 200b bonded to one surface of the substrate 100 is included.

The encapsulation part 200a is disposed to overlap the pixel area 100a and protrudes in a direction opposite to the substrate 100. As a result, the sealing part 200a is spaced apart from the pixel area 100a by a predetermined interval, and a space in which the moisture absorbent (not shown) is provided is formed in the sealing part 200a.

The bonding part 200b is adhered to the substrate 100 by a sealing member (not shown) such as an epoxy resin or a frit provided between the substrate 100 and the encap member 200.

As a result, the region between the substrate 100 and the encap member 200, in particular, the pixel region 100a is sealed.

However, the encap member 200 is disposed so as not to overlap with the driving IC 120. To this end, an opening is formed in one region of the encap member 200 corresponding to the driving circuit mounting region 100b on which the driving IC 120 is mounted.

Here, the driving circuit mounting area 100b may be set in consideration of the size of the driving IC 120 and the error range on the position when the driving IC 120 is inserted. That is, the driving circuit mounting area 100b may be defined to be wider than the area actually occupied by the driving IC 120.

Therefore, one end of the wirings formed in the wiring region 100c, that is, one end of the wirings positioned at the boundary between the wiring region 100c and the driving circuit mounting region 100b, may have the wirings and the driving circuit mounting region 100b. The driving IC 120 may extend into the driving circuit mounting area 100b to be electrically connected to the driving IC 120.

However, since the wires extending into the driving circuit mounting area 100b are not protected by the encap member 200, a separate passivation layer 300 may be formed on the extended wires to protect them. .

The passivation layer 300 may be formed of a wiring corrosion preventing material such as a turpy (Tuffy of Hitachi Kasei Kogyo Co., Ltd.), and is coated on the driving circuit mounting area 100b along the circumference of the driving IC 120 to mount the driving circuit. The wirings extending to the area 100b are protected.

Meanwhile, the wirings formed in the wiring area 100c protected by the encap member 200 are protected from moisture permeation by the encap member 200 to prevent corrosion or disconnection.

The encap member 200 may be formed of an inorganic material that blocks moisture and oxygen, for example, a glass material or a metal material. In particular, the encap member 200 formed of a metal material such as stainless steel can be manufactured at a relatively low cost and can improve the rigidity of the display device, which is useful in a passive organic light emitting display device. Is used.

In addition, a pad part 100d using a conductive film is formed at one edge of the substrate 100, and the pixel area 100a and / or the driving IC 120 are connected to the flexible printed circuit board by the pad part 100d. 400 is connected. Here, since the pad part 100d should be connected to the pad part of the flexible printed circuit board 400, the pad part 100d is formed so as not to overlap with the encap member 200. That is, the encap member 200 is formed so as not to overlap the driving circuit mounting region 100b and the pad portion 100d.

However, in order to more effectively protect the glass substrate 100, the encap member 200 may be formed over the entire remaining area of the substrate 100 except for the driving circuit mounting region 100b and the pad portion 100d.

The flexible printed circuit board 400 receives a driving signal from an external driving circuit (not shown). To this end, the flexible printed circuit board 400 includes a connector 420. The connector 420 may be integrally fixed to another connector attached to an external driving circuit, for example, a mobile phone side driving circuit, and may receive a driving signal from the mobile phone side driving circuit. The flexible printed circuit board 400 supplied with the driving signal generates various control signals in response to the driving signal supplied thereto, and drives the pixel region 100a and / or the driving IC 120 correspondingly.

According to the organic light emitting display device described above, the encap member 200 may be used to effectively seal the pixel region 100a, and the driving IC may be mounted on the display panel to reduce manufacturing costs.

In addition, by forming the encap member 200 to extend to the wiring region 100c of the substrate 100, the rigidity of the organic light emitting display device can be improved.

In particular, when the encap member 200 is formed of a metal material such as stainless steel, the substrate 100 formed of a glass material by effectively supporting the wiring region 100c of the substrate 100 is easily deformed by an external force or It can prevent damage.

In addition, since the rigidity of the display device is improved by this, the thickness of the glass substrate 100 may be reduced to make the organic light emitting display device overall slim. For example, when the thickness of the conventional glass substrate is 0.55mm, in the present invention, the glass substrate 100 is more effectively supported by the encap member 200, thereby reducing the thickness of the glass substrate 100 to 0.2 to 0.3mm. You can also Accordingly, the convenience of portability is improved, and thus it can be usefully applied to a portable display device.

In addition, except for the wiring region 100c overlapping the encap member 200, the passivation layer may be formed only on upper portions of the wirings located in the opening of the encap member 200 along the driving IC 120 of the driving circuit mounting region 100b. Since it is necessary to form 300, the area to which the protective film 300 is applied can be significantly reduced, thereby reducing the material cost of the protective film 300 such as Turkey. As a result, the manufacturing cost of the display device can be reduced.

Meanwhile, the flexible printed circuit board 400 is fixed to the display panel by an adhesive member (not shown). In this process, a method of preventing damage to the protective layer 300 due to the adhesive member is required. Will be described later with reference to FIGS. 3A and 3B.

3A and 3B are perspective views illustrating a process of attaching the flexible printed circuit board illustrated in FIG. 2.

3A and 3B, the flexible printed circuit board 400 is connected to the substrate 100 by the pad part 100d, and a part of the flexible printed circuit board 400 is bent in a direction in which the driving IC 120 is mounted.

One region of the flexible printed circuit board 400 bent as described above is disposed to overlap the driving IC 120, and an adhesive member such as a double-sided tape attached to an upper portion of the encap member 200 formed on the wiring region 100c. 440 is fixed to the encap member 200.

That is, when the flexible printed circuit board 400 is bent and fixed to the display panel, the encap member 200 is formed even on the wiring area 100c around the driving IC 120, so that the adhesive member 440 is protected by a protective film ( It may be attached to the encap member 200, not 300. As a result, even when the flexible printed circuit board 400 is repaired, the protective film 300 may be prevented from being damaged by the adhesive member 440 and the repair may be easily performed. In addition, the flexible printed circuit board 400 may also be repaired. Damage to the protective layer 300 due to the adhesive member 440 may be prevented.

In addition, the encap member 200 made of a material having a relatively low thickness deformation is formed up to the periphery of the driving IC 120, so that the driving IC 120 due to the external force applied in the step of fixing the flexible printed circuit board 400. Pressing may be prevented to prevent a failure of the driving IC 120.

Although the technical idea of the present invention has been described in detail according to the above preferred embodiment, it should be noted that the above-described embodiment is for the purpose of description and not of limitation. In addition, those skilled in the art will understand that various modifications are possible within the scope of the technical idea of the present invention.

As described above, according to the organic light emitting display device according to the present invention, it is possible to reduce the number of pads to reduce the manufacturing cost.

In addition, the encap member can effectively protect not only the pixel region but also the wirings formed in the wiring region between the driving circuit mounting region and the pixel region.

In addition, since the encap member is formed to effectively support the glass substrate in the wiring region, it is possible to prevent deformation or breakage of the substrate. As a result, the rigidity of the display device can be improved and the thickness of the substrate can be reduced, thereby making the organic light emitting display device generally slim.

In addition, while reducing the material cost due to the protective film, it is possible to prevent the driving IC from being pressed and to prevent the protective film from being damaged during the maintenance work of the flexible printed circuit board.

Claims (7)

A substrate including a pixel area including a plurality of organic light emitting diodes, a driving circuit mounting area defined outside the pixel area, and a wiring area on which wiring lines connecting the pixel area and the driving circuit mounting area are formed; An encap member sealing the pixel region; And And a driving integrated circuit (drive IC) mounted in the driving circuit mounting area. And the encap member overlapping the pixel area and the wiring area except for the driving circuit mounting area. The method of claim 1, The encap member includes an encapsulation portion corresponding to the pixel region, and a junction portion joined to a circumference of the pixel region and the wiring region. The method of claim 1, An organic light emitting display further comprising a pad portion formed at one edge of the substrate, and further comprising a flexible printed circuit board (FPCB) connected to the pixel region or the driving integrated circuit by the pad portion. Device. The method of claim 3, The encap member is formed over the entire substrate in the region excluding the pad portion and the driving circuit mounting region. The method of claim 1, And the wirings extend into the driving circuit mounting region to be connected to the driving integrated circuit in the driving circuit mounting region, and a passivation layer is formed on the extended wirings. The method of claim 3, The flexible printed circuit board is bent in a direction in which the driving integrated circuit is mounted, and the bent portion is disposed to overlap the driving integrated circuit. The method of claim 6, And the flexible printed circuit board is fixed to the encap member by an adhesive member formed on the encap member located on the wiring area.

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