KR20090000877A - Apparatus for exposure device for immersion lithography having sub-holder - Google Patents

Apparatus for exposure device for immersion lithography having sub-holder Download PDF

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Publication number
KR20090000877A
KR20090000877A KR1020070064755A KR20070064755A KR20090000877A KR 20090000877 A KR20090000877 A KR 20090000877A KR 1020070064755 A KR1020070064755 A KR 1020070064755A KR 20070064755 A KR20070064755 A KR 20070064755A KR 20090000877 A KR20090000877 A KR 20090000877A
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KR
South Korea
Prior art keywords
wafer
stage
holder
sub
immersion liquid
Prior art date
Application number
KR1020070064755A
Other languages
Korean (ko)
Inventor
전진혁
Original Assignee
주식회사 하이닉스반도체
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 하이닉스반도체 filed Critical 주식회사 하이닉스반도체
Priority to KR1020070064755A priority Critical patent/KR20090000877A/en
Publication of KR20090000877A publication Critical patent/KR20090000877A/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • B25B11/005—Vacuum work holders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

An exposure apparatus for immersion lithography having the sub-holder is prevent water drop from being soaked in a wafer backside by improving a structure of exposure apparatus for immersion lithography so that overlay accuracy is improved. An exposure apparatus for progressing an exposure process by using immersion liquid(235) comprises a stage(200) in which a wafer is arranged. A wafer holder part(205) is arranged on the stage and the wafer backside is absorbed toward the stage and is fixed. A sub-holder part(215) supports is posted at the location corresponding to the edge of the wafer backside of the both sides of the wafer holder part and supports the wafer with consisting of one or more protrusions. An optical lens(230) is arranged in the location corresponding to the stage and the light penetrates in wafer. An immersion liquid feed port(240) supplies immersion liquid between the optical lens and the wafer. An immersion liquid exhausting part(250) ejects the immersion liquid.

Description

Apparatus for exposure device for immersion lithography having sub-holder}

1 is a diagram illustrating the residue remaining on a wafer during an immersion exposure process.

2 and 3 are diagrams for explaining an exposure apparatus for immersion lithography having a sub-holder according to an embodiment of the present invention.

4 is a diagram illustrating the track process.

5 is a view showing a temperature change of the wafer depending on the presence of water droplets.

6 is a view showing the change in overlay depending on the presence of water droplets between the wafer and the wafer holder.

TECHNICAL FIELD The present invention relates to lithography, and more particularly to an exposure apparatus for immersion lithography having a sub-holder.

Immersion lithography methods can form fine patterns as a technique of interposing a liquid medium instead of an air gap between the optical device and the wafer surface. The higher the refractive index of a material, the shorter the wavelength when light passes through it. The immersion lithography method utilizes this property. In the conventional exposure apparatus, air is used as a medium of light between the exposure lens and the wafer on which the photoresist film is formed, whereas the immersion lithography method has a refractive index higher than that of the conventional air (n = 1). An immersion liquid with water, such as water (n = 1.44), is used. As such, when water having a refractive index higher than that of air is used, the wavelength of the exposure equipment may be reduced, and thus finer patterns may be formed even when the same exposure equipment is used. In addition, the immersion lithography method has an increased depth of focus (DOF) at a specific numerical aperture compared to general dry lithography, and in particular, uses an optical device having a numerical aperture (NA) of 1.0 or more. It is possible to improve the maximum resolution of photolithography.

However, the immersion lithography method has a problem that it is difficult to finely control the medium between the exposure lens and the wafer because water is used as the liquid. Accordingly, watermark defects may occur on the wafer in the exposure process.

1 is a diagram illustrating the residue remaining on a wafer during an immersion exposure process.

Referring to FIG. 1, in an immersion exposure process using immersion lithography, an exposure apparatus including an immersion liquid 105 disposed between the lens 100 and the wafer W moves along one direction of the wafer W. In FIG. During the track process, water droplets 110 may remain at the edge or surface of the wafer W. The water droplets 110 remaining on the wafer W flow into the back side of the wafer W during the immersion exposure process and are adsorbed between the wafer holder of the exposure apparatus and the back surface of the wafer. As evaporation heat is applied to the wafer while water droplets are adsorbed between the exposure equipment and the wafer, the water droplets are sucked into the vacuum port of the exposure equipment and the temperature of the wafer decreases. Water is not removed properly, resulting in defects that leave watermarks on the wafer. As such, when the watermark remains on the wafer, pattern defects may occur while the overlay accuracy decreases in the process of forming the pattern.

SUMMARY OF THE INVENTION An object of the present invention is to provide an exposure apparatus for immersion lithography having a sub-holder which can improve overlay accuracy by improving the structure of the exposure apparatus for immersion lithography to prevent water droplets from flowing to the back of the wafer. have.

In order to achieve the above technical problem, an exposure apparatus for immersion lithography having a sub-holder according to the present invention comprises: an exposure apparatus for performing an exposure process using immersion liquid, comprising: a stage on which a wafer is disposed; A wafer holder part disposed on the stage to suck and fix the wafer backside in a stage direction; A sub-holder portion (sub-holder) disposed at a position corresponding to an edge of a wafer back surface on both sides of the wafer holder portion and having at least one protrusion to support the wafer; An optical lens disposed at a position corresponding to the stage to transmit light to the wafer; An immersion liquid supply unit supplying an immersion liquid between the optical lens and the wafer; And an immersion liquid discharge part for discharging the immersion liquid.

In the present invention, it is preferable that the stage further includes a sub-air curtain disposed on the stage inside the sub holder portion to supply air in the wafer direction.

The stage is movable in one direction.

The wafer holder preferably further includes a vacuum port that sucks air to suck the wafer in the stage direction.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention.

2 and 3 are diagrams for explaining an exposure apparatus for immersion lithography having a sub-holder according to an embodiment of the present invention. 3 is an enlarged view of region 'A' of FIG. 2.

Immersion lithography processes are techniques that enhance the resolution of an exposure process by placing an immersion liquid between the optical device and the wafer surface. Immersion liquid may increase the refractive index of the light source transmitted through the wafer to form a fine pattern. Immersion lithography may perform an exposure process by performing a track process of scanning the stage on which the wafer is disposed in one direction. However, water droplets may remain on the edge or surface of the wafer due to an error during coating of the top coat or separation of the top coat during the track process. The water droplets remaining on the wafer may flow into the back of the wafer by the vacuum adsorption device holding the wafer and be adsorbed between the wafer holder and the back of the wafer. As such, the water droplets adsorbed between the wafer holder and the back surface of the wafer may be sucked into the vacuum port connected to the wafer holder in an evaporation process in which steam heat is applied. The sucked droplets lower the temperature of the wafer, thereby reducing the overlay accuracy. Accordingly, there is a need for a method in which water droplets do not flow to the wafer backside.

2 and 3, an exposure apparatus for immersion lithography having a sub-holder includes a stage 200 and a wafer W, which are movable in one direction while the wafer W is disposed. The wafer holder portion 205 is fixed on the stage 200 to be attracted and fixed in the direction of the stage 200. Here, the wafer holder 205 is connected to the vacuum port 210 to suck air from the vacuum port 210 to adsorb the wafer W onto the stage 200.

Next, on the stage 200, sub-holders 215 supporting the wafers W are disposed on both sides of the wafer holder 205. The sub-holder portion 215 is made up of one or more protrusions while being disposed at a position corresponding to the edge of the wafer (W). At this time, a sub-air curtain 220 for supplying air in the direction of the wafer W is disposed between the sub-holders 215 including one or more protrusions. The sub-air curtain unit 220 is connected to the air supply unit 225 to supply air in the direction of the wafer W to block the immersion liquid 235 from entering the wafer holder unit 210.

 An immersion optical device 260 having an optical lens 230 that transmits light through the wafer W is disposed at a position corresponding to the stage 200. An immersion liquid 235 is supplied between the immersion optical device 260 and the wafer, and the immersion liquid 235 is transferred from the immersion liquid supply 240 to the wafer W through the first nozzle portion 245. Supplied. In addition, the immersion liquid 235 subjected to the exposure process through the immersion liquid discharge part 250 is discharged from the second nozzle part 255 to the outside.

4 is a diagram illustrating the track process. 5 is a view showing a temperature change of the wafer depending on the presence of water droplets. 6 is a view showing the change in overlay depending on the presence of water droplets between the wafer and the wafer holder.

Referring to Fig. 4, the stage 200 is moved while moving in the direction of the arrow in the figure for a track process for immersion exposure using an exposure apparatus for immersion lithography having a sub-holder. Here, the immersion liquid 235 is filled between the optical lens 230 and the stage 200 to improve the resolution of the optical lens 230. As the stage 200 moves in the direction of the arrow, the immersion liquid 235 may remain on the wafer W while the track process is performed, such that the droplet 300 may remain. Among the droplets 300, droplets 300 positioned at the edge of the wafer W may flow into the back surface of the wafer. The water droplets 300 flowing to the back surface of the wafer are primarily blocked by the sub-holder portion 215 disposed in the form of one or more protrusions on the stage 200. In addition, the immersion liquid 235 is introduced into the wafer holder 210 by the sub-air curtain 220 disposed between the sub-holders 215 and supplying air toward the wafer W. Can be blocked by car.

As described above, when the water droplets are prevented from entering the wafer holder 210 using the sub-holder 215 and the sub-air curtain 220, the temperature change of the wafer according to the presence of water droplets is illustrated in FIG. 5. As shown in FIG. 3, it can be seen that the temperature 510 of the wafer without water droplets is higher than the temperature 500 of the wafer where water droplets remain. In addition, referring to FIG. 6, which shows an overlay change according to the presence or absence of water droplets between the wafer and the wafer holder, when the water droplets remain on the wafer, the overlay change of the wafers on the X and Y axes is large. On the other hand, if there is no water droplets on the wafer, it can be seen that the change in overlay changes on the X and Y axes is reduced.

As described so far, according to the exposure apparatus for immersion lithography having a sub-holder according to the present invention, the droplet remaining on the wafer edge side using the exposure apparatus for immersion lithography including the sub-holder portion and the sub-air curtain portion Overflow accuracy can be improved by preventing water from entering the back of the wafer.

Claims (4)

In the exposure apparatus which performs an exposure process using immersion liquid, A stage on which the wafer is placed; A wafer holder part disposed on the stage to suck and fix the wafer backside in a stage direction; Sub-holders (sub-holder) for supporting the wafer made of one or more protrusions disposed at positions corresponding to the edges of the wafer back surface on both sides of the wafer holder; An optical lens disposed at a position corresponding to the stage to transmit light to the wafer; An immersion liquid supply unit supplying an immersion liquid between the optical lens and the wafer; And And an immersion liquid discharge portion for discharging the immersion liquid. The method of claim 1, The stage further comprises a sub-air curtain disposed on the stage inside the sub holder and supplying air in the wafer direction, wherein the exposure apparatus for immersion lithography having a sub-holder . The method of claim 1, And the stage is movable in one direction. The exposure apparatus for immersion lithography having a sub-holder. The method of claim 1, And the wafer holder portion further comprises a vacuum port for sucking air to adsorb the wafer in a stage direction.
KR1020070064755A 2007-06-28 2007-06-28 Apparatus for exposure device for immersion lithography having sub-holder KR20090000877A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020070064755A KR20090000877A (en) 2007-06-28 2007-06-28 Apparatus for exposure device for immersion lithography having sub-holder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070064755A KR20090000877A (en) 2007-06-28 2007-06-28 Apparatus for exposure device for immersion lithography having sub-holder

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KR20090000877A true KR20090000877A (en) 2009-01-08

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013215868A (en) * 2012-04-12 2013-10-24 Disco Corp Chuck table

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013215868A (en) * 2012-04-12 2013-10-24 Disco Corp Chuck table

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