KR20080113520A - Laser multiple cutting device - Google Patents

Abstract

A laser multi cutting device is provided to make a multi cutting work through a wide range of workpiece with a single laser source possible. A laser multi cutting device comprises a light source(10) generating the light, a splitter(21) which receives the light generated in the light source and branches the received light, a division unit(20) consisting of a reflective mirror changing the optical path of the branched light, a scanner unit which reflects the lights incoming through the division unit to form a predetermined refraction angle, an optical unit(30) guiding the light reflected in the scanner unit to a substrate supported by a stage, a first light-receiving part(41) which receives the light having the initial optical path among the effective optical paths reflected in the scanner unit, an optical path recognition part comprising a second light-receiving part(42) which receives the light having the final optical path, a controller(60) controlling the light source with the synchronizing signal received in the optical path recognition part and an external information part(70) providing the controller with information about the task performed on the substrate.

Description

Laser multiple cutting device

1 is a perspective view showing a laser cutting device according to the prior art,

2 is a perspective view showing a first embodiment of a laser multi-cutting apparatus according to the present invention;

3 is a perspective view showing a second embodiment of a laser multi-cutting apparatus according to the present invention;

4 is a perspective view showing a third embodiment of a laser multi-cutting apparatus according to the present invention;

5 is used in the first embodiment of the laser multi-cutting apparatus according to the present invention

Configuration diagram for polygon scanner and spindle motor,

6 (a) and 6 (b) show the first embodiment of the laser multicutting apparatus according to the present invention.

Top view showing an embodiment of a correction optical system used.

<Description of Symbols for Major Parts of Drawings>

10 light source 11 collimating lens

12: focusing lens 20: division

21: splitter 22: reflection mirror

30: optical unit 31: optical mirror

32: f-theta lens 33: imaging lens

40: optical path recognition unit 41: first light receiving unit

42: second light receiver 50: stage

60: control unit 100, 200, 300: scanner unit

110: polygon scanner 120: correction optical system

210: first galvanos scanner 220: second galvanos scanner

310: X axis galvanos scanner 320: Y axis galvanos scanner

330: homogenizer

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser multicutting apparatus for processing a workpiece by using a laser, wherein a single light generated from a single light source is split into a required number by a splitter, and the output and path of the light are adjusted to adjust a semiconductor wafer or glass. It is an invention that improves the convenience and efficiency of work by configuring to enable multi-cutting at the same time over a large area for a workpiece such as a substrate.

With the development of the industry, many parts of the production process are automated and competition among companies is intensifying, so that the productivity of products is an important measure of corporate competitiveness, and each company is conducting a lot of research, development and investment to improve the production efficiency. .

In particular, with the advent of the information age, various display device specifications used as AV devices such as TVs and monitors for OA are being advanced, and the demands are increasing to accommodate PDP, S / M (Shadow Mask), Discussions on efficient production methods of PCB, C / F (Color Filter), LCD, semiconductor, etc. have been raising the issue.

For example, the LCD has been used in various industrial fields because it has advantages such as slim and light weight compared to other display devices, and thus can be easily installed in a narrow space and a full color display.

The LCD is composed of a liquid crystal display panel, a driving circuit, a backlight, and the like. In the manufacturing process of the liquid crystal display panel, a process of cutting a glass substrate on which electrical wiring is formed by a known process is required, and a liquid crystal having electrical wiring. In the case of the display panel, a process of cutting a substrate is required to avoid a defect caused by static electricity and to insulate a shorted electrical wiring.

In addition, in the case of a display device such as a cathode ray tube (CRT) display, an LCD, a plasma display, an electroluminescence display (hereinafter referred to as an EL display), or a light emitting diode (LED) display, development and practical use for a large screen are in progress. However, when the size of the liquid crystal display panel is increased, there is a problem in that a defective rate due to disconnection of signal lines, pixel defects, etc. increases rapidly during the manufacturing process and increases the price of the liquid crystal display panel.

Therefore, in order to solve the above problems, a method of manufacturing a large active matrix substrate by connecting a plurality of small substrates from the side and then attaching one large substrate (counter substrate) provided with a color filter to the active matrix substrate, etc. This has been presented.

This manufacturing method also needs to cut the connection surface between active matrix substrates with high precision in order to hide the joints between the substrates, thereby minimizing the connection area between the substrates. In the manufacture of / F (Color Filter), LCD, semiconductor, etc., it is recognized that the precise cutting of the substrate connection surface is important from the viewpoint of high precision.

In the modern industrial field, laser is used in many fields, especially when the laser is applied to the work process of LCD and large screen liquid crystal display panel, the productivity and work efficiency are improved, and in many advanced manufacturing processes such as glass substrate cutting or semiconductor wafer cutting. Since the demand for a processing apparatus using a laser has been increased, a number of apparatuses and methods have been disclosed. The laser cutting apparatus according to the prior art will be described with reference to the accompanying drawings.

1 is a perspective view of a conventional laser according to the prior art.

As shown in FIG. 1, a laser-produced light source 10 according to the prior art, a scanner unit 1 for reflecting light generated by the light source 10 to achieve a predetermined refractive angle, and the Optical unit 30 for guiding the light reflected by the scanner unit 1 to the substrate supported by the stage 20 and the light having an initial optical path among the effective optical paths of the light reflected by the scanner unit 1 An optical path recognition unit 40 including a first light receiving unit 41 for receiving light and a second light receiving unit 42 for receiving light having a last optical path, and the light source by a synchronization signal received by the optical path recognition unit 40 And a control unit 60 for controlling 10 and an external information unit 70 for providing the control unit 60 with job information to be performed on the substrate.

In the case of the present invention, the light scanned by the light source 10 is reflected along the path set by the scanner unit 1, the reflected light passes through a predetermined optical unit 30, and by the scanner unit 1 By introducing the optical path recognition unit 40 that recognizes the path of the reflected light and generates a synchronization signal, the controller 60 controls the blinking of the light source 10, the movement of the stage, and the like on the workpiece based on the synchronization signal. Cutting operation was performed or a drilling process was performed.

In the case of using a laser and cutting a substrate by the device, precise cutting is performed to improve product quality and to shorten the processing step, thereby reducing costs, but requesting automation for mass production and working efficiency Simultaneous operation using a single laser source has been required for the improvement of the present invention, and the present invention has been disclosed to realize this.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and includes a scanner and a controller for adjusting the scanner to reflect light generated from each light source to a predetermined path by branching into a plurality of light paths using a single source. Therefore, the object of the present invention is to provide a multi-cutting device capable of simultaneously improving multi-cutting work over a wide range of workpieces by using a single laser source, thereby improving productivity and reducing costs.

In order to solve the above problem, the present invention provides a light source for generating light, a splitter configured to receive light generated by the light source, a splitter for splitting the received light, and a splitting unit for changing an optical path of the split light, A scanner unit for reflecting a plurality of light incident through the installment to achieve a predetermined refractive angle, an optical unit for guiding the light reflected from the scanner unit to a substrate supported by a stage, and effective light of the light reflected from the scanner unit An optical path recognition unit comprising a first light receiving unit receiving light having an initial optical path and a second light receiving unit receiving light having a last optical path, and controlling the light source by a synchronization signal received by the optical path recognition unit; And a control unit and an external information unit which provides the control unit with job information to be performed on the substrate.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

2 to 6, the present invention provides a light path 10 for generating light, a splitter 21 for receiving light generated by the light source 10, and splitting the received light. A division unit 20 composed of a reflection mirror 22 to change, a scanner unit 100, 200, and 300 reflecting a plurality of light incident through the division unit 20 to achieve a predetermined refractive angle, and the scanner Of the optical unit 30 for guiding the light reflected by the unit (100, 200, 300) to the substrate supported by the stage 50, and the effective optical path of the light reflected by the scanner unit (100, 200, 300) An optical path recognition unit 40 comprising a first light receiving unit 41 for receiving light having an initial optical path and a second light receiving unit 42 for receiving light having a final optical path, and received by the optical path recognition unit 40. The controller 60 controls the light source 10 by one synchronization signal, and the task information to be performed on the substrate. It is characterized by consisting of an external information unit 70 provided to the fisherman (60).

As shown in Figs. 2 to 5, the present invention uses a single light source 10, it is reasonable that the light source 10 is implemented using a laser diode that emits laser light of the point light. Since the laser diode employed in the light source 10 is a semiconductor device, the light output increases when the temperature decreases, while the light output decreases when the temperature rises, and continuously monitors the variation of the laser output and the driving current according to the temperature change, The light source driver 51 for controlling to maintain the laser output can be mounted on the control unit 60.

The light source driver 51 is known as a circuit having an inverting amplifier and a buffer and controlled and operated by the control unit 60 to keep the intensity of the laser light constant.

According to the above configuration, the light source 10 emits laser light at a constant power, and the power of the laser light emitted from the light source 10 is controlled by the driver 61. In addition, the power of the emitted light is monitored by the first and second light receivers 41 and 42, so that the controller 60 controls the driver 61 based on the power of the monitored outgoing light.

A collimating lens 11 that makes the light emitted from the light source 10 into parallel light or convergent light with respect to the optical axis is installed on the light path emitted from the light source 10 and passes through the collimating lens 11. The focus lens 12, which forms a laser beam in a horizontal linear form, may be installed on an optical path using a conventional cylindrical lens or a telecentric lens. The collimating lens 11 and the focus lens 12 are sequentially disposed on a path between the light source 10 and the splitter 20.

The emitted light passes through the collimating lens 11 and the focus lens 12 and is incident to the splitter 20. The splitter 20 includes a conventional splitter 21 and a reflective mirror 22. By splitting the light and changing the light path, the number and positions of the splitter 210 and the reflecting mirror 22 for constituting a plurality of light paths having an appropriate routine according to the object of work are determined and installed.

The light branched by the dividing unit 20 is incident to the scanner units 100, 200, and 300, and the scanner units 100, 200, and 300 are configured in various embodiments to be described below according to working characteristics. According to the configuration of the scanner unit (100, 200, 300) may be equipped with an appropriate optical unit 30 to image the light reflected from the scanner unit (100, 200, 300) to the stage unit 50 .

The optical path recognition unit 40 includes a first light receiver 41 and a second light receiver 42. The first light receiver 41 receives light having an initial optical path among the effective optical paths of the light reflected by the scanner parts 100, 200, and 300, and recognizes an initial synchronization signal by using a photodiode. can do. The signal received by the first light receiving unit 41 is transmitted to the control unit 60, and the second light receiving unit 42 determines the last light path among the effective light paths of the light reflected by the scanner units 100, 200, and 300. A photodiode can also be used to receive the light and to recognize the last synchronization signal. The light receiving signal from the second light receiving unit 42 is transmitted to the control unit 60.

The controller 60 controls driving of the stage 50, the light source 10, and the scanner units 100, 200, and 300 based on the synchronization signals transmitted from the light receiving units 41 and 42. The controller 10 includes the light source driver 61, the motor driver 62, a stage driver 63 for driving the stage 50, and the controller 50. ) Controls the output and on / off control of the light source 10 and the on / off time of the light source 10 based on the cutting information provided from the external information source 60, but at the first and second light receiving units 41 and 42, respectively. The light source driver 61 is controlled based on the transmitted synchronization signal.

In addition, the controller 50 adjusts the motor driver 62 to maintain the constant speed rotation of the scanner unit 100, 200, 300 during the drive control of the light source 10, and the stage drive driver 63 The control unit 60 selectively drives the stage 50 in the main scanning direction A and in the sub scanning direction B orthogonal to the main scanning direction A. FIG.

The external information source 70 may comprise a computer capable of programming a cutting pattern. Therefore, the computer programs the preset or stored data in a cutting pattern and supplies the data to the controller 60. The stage 50 has a workpiece such as a semiconductor wafer, an LCD, a PDP panel, a PCB, and the like.

As described above, the scanner units 100, 200, and 300 may select a plurality or a plurality of scanners according to a work situation, and FIG. 2 illustrates an embodiment using a polygon scanner as an example. .

In the case of the scanner unit 100 according to the above embodiment, the polygon scanner 110 having six reflective surfaces disposed at equal intervals is rotatably supported by the spindle motor 112 coupled to the support frame 111. 60, it is controlled to rotate at constant speed.

When light from the single light source 20 is incident on the splitter 21 and the reflecting mirror 22 on each reflecting surface of the polygon scanner 110, the position and number of the splitter 210 and the reflecting mirror 22 are adjusted. Accordingly, the reflected beams branch into four or more different paths, and the branched reflected beams are incident on the respective surfaces of the polygon scanner 110 in the same phase.

At this time, the rotation of the polygon scanner 110 causes a change in the reflection angle, so that the beams incident on the mirror surfaces of the polygon scanner 110 change the reflection paths, thereby producing a straight line on the workpiece. In the case of rotating at a high speed, the beam reflected from each side of the polygon scanner 110 passes through the same point several times in a short time.

The optical unit 30 is guided to the workpiece by the optical unit 30 for guiding the beam reflected from the polygon scanner 110. When the polygon scanner 110 is used for the scanner unit 100, the optical unit 30 is reflected. By using an F-theta lens that constantly adjusts the focal length of the received light, the respective beams passing through each reflective surface of the polygon scanner 110 are installed on the path of each light. Each light passing through the light beam 1 is scanned into the stage 50.

The controller 60 may adjust the cutting length by controlling the polygon scanner 110 and determining and controlling the light oscillation time in the light source 10 in synchronization with the coordinate values of the stage 50. In the above embodiment, the cutting speed may be adjusted by controlling the rotational speed of the polygon scanner 110 and the conveying speed of the stage 50.

However, in the above embodiment, when the central axis of the spindle motor 111 and the rotation axis of the polygon scanner 110 do not coincide, the mirror slope occurs when the polygon scanner 110 is rotated, which is reflected by the polygon scanner 110. Since it affects the optical path, which causes damage to the work precision, the optical system 120 may be additionally mounted to the output terminal of the polygon scanner 110 to correct the error of the optical path.

The correction optical system 120 may use a general wobble-free optical system. In the present invention, as shown in FIG. 6A, front and rear surfaces of the correction optical system 120 are examples. Three correction lenses 121, 122, and 123 having a negative curved surface having a predetermined curvature can be implemented.

At this time, among the correction lenses, the front, rear, left and right curvature radii r1, r2, and r3, r4 of the front lens 121 and the center lens 122 have the same dimensions as the upper and lower curvature radii, and the rear lens ( In the case of 123, the front left and right curvature radii r5 and the upper and lower curvature radii are the same, and the rear left and right curvature radii r6 and the upper and lower curvature radii are formed differently so that the front, rear, and center lenses 122 of the front lens 121 are different. The front, rear, and front surface of the rear range 123 may be spherical surfaces, and the rear surface of the rear lens 123 may be formed by a toric surfac.

The three correction lenses 121, 122, and 123 made of the above-mentioned negative curved surfaces make the scanning speed of the luminous flux constant and the mechanics of correcting the error of fine movement perpendicularly to the scanning direction of the luminous flux. The left and right curvature r6 of the rear surface of the rear lens 123 of the 120 is formed to be different from the upper and lower curvature radii, and the left and right curvature r6 of the rear lens 123 contributes to maintaining a constant beam scanning speed in the scanning direction. The upper and lower curvatures contribute to preventing the movement of the luminous flux caused by the mirror slope of the polygon scanner 110, thereby preventing errors in the optical path and improving the degree of freedom requiring accurate imaging of the light.

Further, since six surfaces of the first lens of the correction lenses 121, 122, and 123 are formed as negative curved surfaces, the ratio of the focal length f1 in the scanning direction and the focal length f2 in the direction perpendicular to the scanning direction is 3.0 < It is designed to be in the range of f1 <f2 <4.0, and the rear curvature radius r2 of the front lens 121 is formed larger than the front curvature radius r3 of the center lens 302 so that the luminous flux can be effectively focused. Can be carried out.

As another example of the correction optical system 120, as shown in FIG. 6B, a pair of Fresnel lenses 124 and 125 having a flat surface and an uneven surface may be formed by the polygon scanner 110. Can be carried out facing the

The correction optical system 120 according to the above configuration includes one or more Fresnel lenses 124 and 125 composed of a flat surface and an uneven surface side by side so that the flat surface faces the polygon scanner 110 side, so that the light source 10 When the light generated by the light passes through the collimating lens 11 and the focus lens 12 to form parallel light and then is reflected by the polygon scanner 110, the Fresnel lenses 124 and 125 having a flat surface in front are formed. It improves the transmittance of light and makes the scanning speed constant to form a linear focus trajectory. In particular, when the Fresnel lenses 124 and 125 are installed in close proximity to the optical unit 30, they are generated by the mirror slope of the polygon scanner 110. The shake is corrected.

In another embodiment of the scanner unit 200, a plurality of first galvanos scanners 210 for receiving light branched from the division unit 20 and reflected from the first galvanos scanners 210. One second galvanometer scanner 220 may be configured to receive light. In this case, the optical unit 30 may receive a plurality of light reflected from the second galvanometer scanner 220. The imaging lens 33 can be implemented by adjusting the spot size of light.

When light from the single light source 20 is incident on the splitter 21 and the reflecting mirror 22, the light is reflected in three or more different paths depending on the position and the number of the splitter 21 and the reflecting mirror 22. The beam is branched, and the branched reflected beam is incident on each reflecting surface of the first galvanos scanner 210 corresponding to each branched reflecting beam.

The light reflected by the first galvanos scanner 210 is incident on the second galvanos scanner 220, and the galvanometer scanner 200 reflects the light generated by the light source 10 to have a predetermined refractive angle. By adjusting the light path to guide the light to the optical unit 30, the total reflection for changing the vertical path of the light generated from the light source 100 to reflect the light in accordance with the mounting position of the first galvanos scanner 210 It may be provided with a mirror, the light reflected by the second galvanoscancer 220 is converted into a beam size (spot size) that can be processed through the imaging lens 33 having a large incident aperture.

In another embodiment of the scanner unit 300, when the light from the single light source 20 is incident on the splitter 21 and the reflecting mirror 22, the splitter 21 and the reflecting mirror 22 According to the position and the number of the reflected beam is diverged in two or more different paths, the branched reflected beam is located in correspondence with each branched reflected beam, the scanner unit 300 is diverged from the divider 20 After passing through the respective homogenizer 310, it is possible to form and implement a plurality of X-axis galvanoscancer 320 and Y-axis galvanoscancer 330 for receiving each light to change the optical path, In this case, the optical unit 30 may be configured as an imaging lens 33 for adjusting the spot size of the incident light by the plurality of light reflected from the Y-axis galbanos scanner 330 is incident.

The light from the single light source 10 is divided by the light beam splitter 21 and the total reflection mirror 22 and is incident on each homogenizer 210 that uniformly forms the light density of the light and is transformed into a cuttable form. The beam passing through the homogenizer 210 is incident to each X-axis galvanos scanner 320 and directed to the processing area, the control unit 50 is the laser launch point and each X-axis galvanos scanner ( 320) and Y-axis galvanoscancer 330.

The advantage of the multi-cutting device of the above type is that it is possible to take full advantage of the advantages of the respective X-axis galvanoscancer 320 and Y-axis galvanoscancer 330, and in the case of the first and second embodiments, the optical path Although it is difficult to deviate from the linear motion, in the case of the optical path according to the present embodiment, it is possible to change the path of the beams of the straight line and the curve, and thus there is an advantage of cutting the workpiece into various shapes. In addition, since the control unit 60 can control the laser launch point and the galvano scanner by analyzing the position value of the stage to work on the moving workpiece, the control unit 60 can greatly contribute to productivity improvement.

As described above, the present invention divides one light generated from a single light source into a required number by a splitter and adjusts the output and path of the light to simultaneously cover a wide area for a workpiece such as a semiconductor wafer or a glass substrate. It is an invention that has an excellent effect of improving productivity and reducing costs by shortening working time by configuring to enable multi-cutting.

Claims (4)

A splitter comprising a light source for generating light, a splitter for receiving the light generated by the light source, and a splitter for splitting the received light, and a reflecting mirror for changing a light path of the split light; A scanner unit that reflects a predetermined refractive angle, an optical unit that guides the light reflected by the scanner unit to a substrate supported by the stage, and light having an initial optical path among the effective optical paths of the light reflected by the scanner unit; An optical path recognition unit comprising a first light receiving unit for receiving light and a second light receiving unit for receiving light having a last optical path, a control unit controlling the light source by a synchronization signal received by the optical path recognition unit, and a task to be performed on the substrate Laser cutting device consisting of an external information unit for providing information to the control unit. The method of claim 1, The scanner unit is formed of a single polygon scanner and a correction optical system for error correction of an optical path by mirror slope of the polygon scanner, The optical unit is a laser multi-cutting device, characterized in that the first optical mirror for reflecting each light in the direction of the stage and the f-theta lens for constantly adjusting the focal length of the reflected light. The method of claim 1, The scanner unit includes a plurality of first galvanos scanners for receiving light branched from the dividing unit, and a second galvanometer scanner for receiving light reflected from the first galvanos scanner. The optical unit is a laser multi-cutting apparatus, characterized in that consisting of an imaging lens for adjusting the spot size of the incident light is a plurality of light reflected from the second galvanometer scanner. The method of claim 1, The scanner unit has a homogenizer for uniformly forming the optical density of each light branched from the dividing unit, and a plurality of X-axis galvano scanners and Y-axis which receive light of each light passing through the homogenizer and change the optical path. Laser multi-cutting apparatus, characterized in that formed by galvanos scanner. The optical unit is a laser multi-cutting device, characterized in that consisting of an imaging lens for adjusting the spot size of the incident light is a plurality of light reflected from the Y-axis galvanoscopy scanner.

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