KR20080111295A - Probe card - Google Patents

Abstract

A probe card is provided to facilitate removing a foreign material in an interconnector between a probe substrate and a printed circuit board. A probe card(10) of a apparatus for inspection of a semiconductor comprises a first substrate, a second substrate, and an elevating member(400). In the second substrate, a probe(210) contacting a checking object is provided. The elevating member makes the second substrate up and down from the first substrate in order to broaden and narrow interval between the first substrate and the second substrate. The elevating member comprises a first reinforcement plate, and a moving plate. The first reinforcement plate is installed at the first substrate. The moving plate supports the second substrate and is moved with being rotated in the first reinforcement plate with a screw method.

Description

Probe Card {PROBE CARD}

1 is an exploded perspective view of a probe card according to an embodiment of the present invention.

2 is a perspective view of a probe card according to an embodiment of the present invention.

3 is a bottom view of a probe card according to an embodiment of the invention.

4 is a cross-sectional view taken along the line AA ′ of FIG. 3.

5 is an enlarged view illustrating main parts of FIG. 4.

6A through 6D are diagrams illustrating steps in assembling the probe card.

7 is a cross-sectional view of the probe card showing a state in which the moving plate is rotated to bring the pads of the probe substrate and the interconnects into non-contact state.

8 and 9 are views showing an example in which an actuator is applied to up and down a probe substrate.

<Description of the symbols for the main parts of the drawings>

10: probe card

100: printed circuit board

200: probe substrate

210: probe

300: interconnect

400: lifting member

500: fixed member

The present invention relates to a test apparatus for semiconductor inspection, and more particularly, to a probe card capable of testing chips of a semiconductor substrate.

In general, a semiconductor device repeatedly performs various unit processes such as an oxidation process, a diffusion process, an etching process, and a metal process to form a plurality of chips divided into respective regions on a substrate such as a semiconductor wafer. In this case, defects generated during the manufacturing process of the semiconductor device may cause chip defects. Such chip defects may be determined before the sawing process of the substrate for the packaging process to improve the yield and cost of the semiconductor device. Is advantageous in

In order to determine whether each chip constituting the substrate is defective, an electrical die sorting (EDS) process, which is an electrical characteristic test of the chip, is performed by using a probing system, and the EDS test is performed on a computer. The apparatus is performed using a prober station equipped with a probe card capable of electrically contacting a tester in which devices are embedded and a unit semiconductor chip of a wafer under test. The probe card is used as an intermediate medium connecting the pad and the tester of the semiconductor chip to examine the micropattern of the semiconductor chip on the wafer and the characteristics of the electrode during the manufacturing process of the semiconductor device, each probe (probe) ) Is in direct contact with the pad of the semiconductor chip.

In general, a probe card includes interconnectors, which are interface means for placing a plurality of probes in direct contact with a printed circuit board and a test object (wafer chip) and interfacing electrically connected to the probe substrate attached to a lower surface thereof. .

Here, the interconnect is connected to the pad of the probe substrate in a state where it is mounted on the printed circuit board. When the foreign matter contained in the air is attached between the interconnect and the pad of the probe substrate, it may have various adverse effects. have. That is, when a foreign material is attached to an interconnection that electrically connects the printed circuit board and the probe board, a test error occurs, thereby deteriorating reliability of the product. In addition, if foreign matter larger than the distance between the interconnects is attached to the pad of the interconnect or the probe substrate, a short may occur in which the interconnects are electrically connected.

In order to solve this problem, the probe board is periodically removed and cleaned from the printed circuit board. However, after cleaning, the flatness of the probe board must be newly adjusted when assembling the probe board to the printed circuit board. .

SUMMARY OF THE INVENTION An object of the present invention is to provide a probe card capable of adjusting a gap between a printed circuit board and a probe substrate.

It is also an object of the present invention to provide a probe card that can easily remove foreign substances in the interconnect between the printed circuit board and the probe substrate.

Probe card of the semiconductor inspection apparatus according to the present invention for achieving the above object is a first substrate to which an electrical signal is applied from the outside; A second substrate provided with probes in contact with the inspection object; And an elevating member for moving the second substrate up and down from the first substrate to widen or narrow the gap between the first substrate and the second substrate.

According to an embodiment of the present invention, the elevating member includes a first reinforcing plate installed on the first substrate; And a moving plate that supports the second substrate and moves while being rotated in a screw manner to the first reinforcing plate.

According to an embodiment of the present invention, the first reinforcing plate is made of a circular ring shape having a screw thread on the inner circumferential surface, the movable plate has a screw thread coupled to the thread of the first reinforcing plate on the outer circumferential surface, The second substrate is formed in a circular ring shape having a supporting jaw.

According to an embodiment of the present invention, the upper housing is provided with a pressing member for pressing the second substrate to adjust the flatness of the second substrate.

According to an embodiment of the present invention, the probe card further includes a fixing member for preventing the rotation of the second substrate so that the second substrate does not rotate together with the moving plate.

According to an embodiment of the present invention, the fixing member includes a housing fixed to the first substrate; An insert pin installed in the housing and having an end thereof in contact with the second substrate; It includes an elastic body installed between the housing and the insert pin so that the insert pin is elastically supported.

According to an embodiment of the present invention, the elevating member includes a first reinforcing plate installed on the first substrate; A moving plate supporting the second substrate and installed to be movable upward and downward from the first reinforcing plate; And an elevating member installed on the first reinforcing plate to move the movable plate in an up and down direction.

According to an embodiment of the present invention, the probe card is provided between the first substrate and the second substrate, and further includes a connection member for electrical connection between the first substrate and the second substrate.

Probe card of the semiconductor inspection apparatus according to the present invention for achieving the above object is a first substrate to which an electrical signal is applied from the outside; A first reinforcing plate installed on one surface of the first substrate; And a second substrate assembly provided on the first reinforcing plate and provided with probes contacting the test object. The second substrate assembly is moved up / down on the first reinforcing plate so as to widen or narrow the gap with the first substrate.

According to an embodiment of the present invention, the second substrate assembly is moved while being rotated in a screw manner to the first reinforcing plate.

According to an embodiment of the present invention, the second substrate assembly may include a second substrate provided with the probes; And a moving plate supporting the second substrate and moving while being rotated in a screw manner to the first reinforcing plate.

According to an embodiment of the present invention, the second substrate assembly further includes an upper housing for fixing the movable plate and the second substrate.

According to an embodiment of the present invention, the movable plate and the upper housing are fixed by an interference fitting pin.

According to an embodiment of the present invention, the second substrate assembly is installed in the upper housing, and further includes a pressing member for pressing the second substrate to adjust the flatness of the second substrate.

According to an embodiment of the present invention, the probe card is provided between the first substrate and the second substrate assembly, and further includes an interface member for electrical connection between the first substrate and the second substrate assembly.

For example, embodiments of the present invention may be modified in various forms, and the scope of the present invention should not be construed as being limited by the embodiments described below. This embodiment is provided to more completely explain the present invention to those skilled in the art. Accordingly, the shape of the elements in the drawings and the like are exaggerated to emphasize a clearer description.

An embodiment of the present invention will be described in detail with reference to FIGS. 1 to 9. In addition, in the drawings, the same reference numerals are denoted together for components that perform the same function.

The probing inspection apparatus for semiconductor wafer inspection has an inspection head electrically connected to a test system for performing IC chip inspection in a wafer state, the probe card is electrically connected to the inspection head, and the wafer on which the semiconductor chip is formed is a wafer probe. It is placed in the station and moved to a position where it can come into contact with the probe card.

The probe card 10 may include a pad of a chip to test a probe 210 of a probe substrate 200 mounted on a printed circuit board 100 to test each chip on a wafer; (Not shown), and transmits the electrical signal (SIGNAL) of the test system to the chip, and each signal wiring and each pad on the board in the chip unit so that the substrate can be actually tested. It is a core inspection device that connects simultaneously.

1 and 2 are an exploded perspective view and a perspective view of a probe card according to an embodiment of the present invention. 3 is a bottom view of a probe card according to an embodiment of the invention. 4 is a cross-sectional view taken along the line AA ′ of FIG. 3.

1 to 4, the probe card 10 is directly connected to a first substrate (hereinafter, referred to as a printed circuit board) 100 having a conductor wiring pattern formed on an insulating substrate and an inspection object (a wafer chip). A second substrate (hereinafter referred to as a probe substrate) 200 having a plurality of probes in contact with the probe (hereinafter referred to as a probe substrate) 200 is disposed between the printed circuit board 100 and the probe substrate 200 to electrically connect them. For up / down of the probe board 200 from the printed circuit board 100 so as to widen or narrow the gap between the interconnecting means 300 as the interface means, the probe board 200 and the printed circuit board 100. And a fixing member 500 installed on the elevating member 400 and the printed circuit board 100.

The printed circuit board 100 includes a first reinforcing plate 410 on one surface 102 facing the probe substrate 200, and a second reinforcing plate 120 on the other surface 104. The first and second reinforcing plates 410 and 120 are fixed to the printed circuit board 100 by fastening the bolts 130. The first reinforcing plate 410 is formed in a circular ring shape having a thread 412 on the inner circumferential surface. Although the present invention has been described as a printed circuit board 100, the present invention is not limited thereto, and various substrates (for example, a substrate such as a multilayer circuit board) on which an insulating wiring pattern is formed may be used.

The probe substrate 200 includes probes 210 which respectively contact the contact pads (not shown) of the chip formed on the semiconductor substrate to be tested. In the present invention, it is obvious that the probes 210 may be applied to various probes such as a mass type probe, a bump type probe, or a needle type probe manufactured using MEMS and semiconductor technology in a semiconductor processing line. . The probe substrate 200 has a circular plate shape having a protrusion 202 at an edge thereof.

In the present invention, although the probe substrate is made of a single substrate, a plurality of pieces of substrates are bonded to each other on the same plane and integrated into a variety of forms, such as the assembly of the probe blocks in which the probes are installed in a rod shape having a predetermined length Can be formed.

Referring to FIG. 5, the interconnections 300 are disposed between the printed circuit board 100 and the probe substrate 200, and are interface means for electrically connecting them. The interconnects 300 may be formed of a first contact portion 302 inserted into a connection hole (not shown) formed in one surface of the printed circuit board 100 and a contact portion of the pad 204 of the probe substrate 200. It includes two connecting portion 320 and the connecting portion 330 that can be elastically bent therebetween. For example, the interconnect 300, which is an interface means for electrically connecting the printed circuit board 100 and the probe substrate 200, may be formed in various shapes, and the interconnect 300 may be formed of the printed circuit board 100. One surface 102 may be provided in the form of a connection pad in contact with the pad 204 of the probe substrate 200.

The elevating member 400 includes a first reinforcing plate 410, a moving plate 420, and an upper housing.

Looking at the configuration of the elevating member 400 one by one, first, the first reinforcing plate 410 is made of a circular ring shape, is installed on one surface 102 of the printed circuit board 100. The first reinforcing plate 410 has a thread 412 on the inner peripheral surface, the thread 412 is for the movement of the moving plate 420.

The moving plate 420 supports the probe substrate 200 and may be moved in the up and down direction according to the rotational direction in a state in which the moving plate 420 is screwed to the inner circumferential surface of the first reinforcing plate 410. That is, the movable plate 420 is formed on the outer circumferential surface of the thread 422 is fastened to the thread of the first reinforcing plate 410, the support on which the protrusion 202 formed on the edge of the probe substrate 200 is placed on the inner circumferential surface Jaw 424 is formed. The moving plate 420 has four first insertion holes 426 formed on an upper surface thereof.

The upper housing 430 is formed in a circular ring shape, and serves to hold the probe substrate 200 from being separated from the moving plate 420. The upper housing 423 has second insertion holes 432 corresponding to the first insertion hole 426. The fixing of the upper housing 430 and the movable plate 420 is forcibly prevented by the second insertion hole 432 and the first insertion hole 426 while the first insertion hole 426 and the second insertion hole 432 are aligned. It is made by the fitting pin 440 to be fitted. At this time, a part of the upper housing 430 supports the edge of the probe substrate 200 to prevent the probe substrate 200 from being mounted on the moving plate 420.

On the other hand, the upper housing 430 is provided with a fine adjustment screw 450 that is a member for pressing the edge (protrusion) of the probe substrate 200 in order to adjust the flatness of the probe substrate 200. The fine adjustment screw 450 is fastened to the screw holes 434 formed in the upper housing 430, and the fine adjustment screw 450 is installed in four directions of the upper housing 430. The operator adjusts the flatness of the probe substrate by tightening or loosening the fine adjustment screws 450 while the probe substrate 200 is fixed to the moving plate 420 by the upper housing 430.

The fixing member 500 prevents the probe substrate 200 from being rotated so that the probe substrate 200 does not rotate together with the moving plate 420. The fixing member 500 includes a housing 510, an insert pin 520, and an elastic body 530. The housing 510 is screwed into the screw hole 122 formed in the second reinforcing plate 120, and one surface 102 of the printed circuit board 100 through the through hole 109 formed in the printed circuit board 100. Installed through. The housing 510 has an inner space 512 in a direction toward the probe substrate 200, and an elastic body 530 and an insert pin 520 are sequentially installed in the inner space 512. One end of the insert pin 520 is exposed from the housing 510 and fits into a fitting groove 206 formed on one surface of the probe substrate 200. The insert pin 520 prevents the probe substrate 200 from being rotated while being elastically supported by the elastic body 530.

Referring to the assembly process of the probe card 10 having the above-described configuration step by step.

As shown in FIG. 6A, first and second reinforcing plates 410 and 120 are installed on both sides of the printed circuit board 100, and interconnections 30 are formed on one surface of the printed circuit board 100. Inserted into a connection hole (not shown) formed on one surface of the 100, the fixing member 500 is installed through one surface through the through hole 109. The probe substrate 200 is mounted on the support jaw 424 formed on the inner circumferential surface of the moving plate 420. Referring to FIG. 6B, the moving plate 420 on which the probe substrate 200 is placed is screwed to the inner circumferential surface thread 412 of the first reinforcing plate 410 installed on one surface 102 of the printed circuit board 100. The leveling of the probe substrate 200 is adjusted by rotating the moving plate 420 in the forward or reverse direction. At this time, the movable plate 420 adjusts the height of the probe substrate 200 such that the second connectors 320 of the interconnections 300 may be elastically contacted with the pad 204 of the probe substrate 200 ( 6C). For example, when the moving plate 420 rotates in the left direction, the probe substrate 200 is down, and when the moving plate 420 rotates in the right direction, the probe substrate 200 is up. In the leveling operation, the fixing member 500 balances the printed circuit board 100 with the probe substrate 200, and at the same time, serves to fix the probe substrate 200. Since the fixing member 500 simultaneously supports four probe substrates 200 in a state where the insert pin 520 is elastically installed by the elastic body, the fixing member 500 may balance the probe substrate 200. As shown in FIG. 6D, after adjusting the leveling using the moving plate 420, the probe substrate 200 is fixed using the upper housing 430. The upper housing 430 is fixed to the moving plate 420 by the fitting pin 440. After the fixing of the probe substrate 200 is completed, the assembly of the probe card 10 is completed by precisely adjusting the flatness of the probe substrate 200 by tightening or loosening the fine adjustment screws 450.

On the other hand, in the process of using the probe card 10, if foreign matter adheres to the pad 204 of the probe substrate 200 in contact with the interconnect can be easily removed through the following operation.

As shown in FIG. 7, the moving plate 420 is rotated in the right direction to make the pad 204 of the probe substrate 200 and the interconnect 300 non-contact, and again, the moving plate 420 in the left direction. When the non-contact / contact process of rotating and contacting the interconnect 300 with the pad 204 of the probe substrate 200 is repeatedly performed several times, foreign matter adhered to the pad 204 of the probe substrate 200 naturally. Will fall. In addition, foreign matter adhering to the interconnect 300 will also fall off as the interconnect 300 is compressed / restored by the up / down of the probe substrate 200. Even if the process of releasing or tightening the movable plate 420 is repeatedly performed, the probe substrate 200 may only be adjusted in height and the flatness of the probe substrate 200 remains fixed by the fine adjustment screw 450. Will be maintained.

In addition, when the probe card 10 is not used, as shown in FIG. 7, when the probe substrate 200 is stored while being spaced apart from the interconnect 300, the load provided to the interconnect 300 may be reduced. By reducing the interconnect 300 can maintain the elastic force is bent and restored again. That is, the probe card 10 of the present invention can prevent deformation (banding) of the interconnect 300 by non-contacting the probe substrate 200 and the interconnect 300 when not in use for a long time.

In the present invention, the probe card may be modified in the following alternative embodiments.

(Variation example of probe card)

8 and 9 are views showing an example in which an actuator is applied to up and down a probe substrate.

The probe card 10a may include a printed circuit board 100, first and second reinforcing plates 410 and 120, interconnects 300, and a probe substrate having the same configuration and function as the probe card 10 according to the above-described embodiment. 200, the upper housing 430, and the fine adjustment screw 450, and the like, and the description thereof will be omitted in the present modification because it has been described in detail above.

However, in the present modified example, the leveling of the probe substrate 200 is controlled through the up and down of the moving plate 420 by the actuator 470. The moving plate 420 has a connecting bar 428 connected to the actuator 470, and the moving plate 420 is installed to be elevated on the first reinforcing plate 410. At least two actuators 470 are preferably installed on one surface 102 of the printed circuit board 100 and are controlled to operate at the same time. The actuator 470 may be a pneumatic cylinder or a hydraulic cylinder and a linear motor, step motor, linear moving member, etc., which can be controlled step by step.

On the other hand, the present invention can be variously modified and can take various forms in the probe card consisting of the above configuration. It is to be understood, however, that the present invention is not limited to the specific forms referred to in the above description, but rather includes all modifications, equivalents and substitutions within the spirit and scope of the invention as defined by the appended claims. It should be understood to do.

As described above, the present invention can finely adjust the gap between the printed circuit board and the probe substrate while maintaining the flatness of the probe substrate.

In addition, the present invention can easily remove foreign substances in the interconnect between the printed circuit board and the probe substrate.

Claims (21)

In the probe card of the semiconductor inspection device: A first substrate; A second substrate provided with probes in contact with the inspection object; And And a lifting member for lifting up and down the second substrate from the first substrate so as to widen or narrow the gap between the first substrate and the second substrate. The method of claim 1, The lifting member is A first reinforcing plate installed on the first substrate; And a moving plate supporting the second substrate and moving while being rotated in a screw manner with respect to the first reinforcing plate. The method of claim 2, The first reinforcing plate is a probe card of a semiconductor inspection device, characterized in that the circular ring shape having a screw thread on the inner peripheral surface. The method of claim 3, The moving plate has a screw thread coupled to the screw thread of the first reinforcing plate on the outer peripheral surface, the inner peripheral surface of the probe card of the semiconductor inspection apparatus, characterized in that it has a circular ring shape having a support jaw on which the second substrate is mounted. The method of claim 2, The probe card is The probe card of the semiconductor inspection apparatus further comprises an upper housing for fixing the moving plate and the second substrate. The method of claim 5, The moving plate further includes first insertion holes formed on the upper surface, The upper housing further includes second insertion holes formed to correspond to the first insertion holes. The probe card further comprises an interference fitting pin inserted into the second insertion hole through the first insertion hole. The method of claim 5, Probe card of the semiconductor inspection device, characterized in that the upper housing is provided with a pressing member for pressing the second substrate to adjust the flatness of the second substrate. The method of claim 7, wherein The pressing member is a probe card of the semiconductor inspection device, characterized in that installed radially in the upper housing. The method of claim 2, The probe card is And a fixing member for preventing rotation of the second substrate so that the second substrate does not rotate together with the moving plate. The method of claim 9, The fixing member is a probe card of the semiconductor inspection device, characterized in that installed through the first substrate. The method of claim 9, The fixing member A housing fixed to the first substrate; And an insert pin installed at the housing and having an end thereof in contact with the second substrate. The method of claim 11, The fixing member And an elastic body installed between the housing and the insert pin so that the insert pin is elastically supported. The method of claim 1, The lifting member is A first reinforcing plate installed on the first substrate; A moving plate supporting the second substrate and installed to be movable upward and downward from the first reinforcing plate; And And a lifting member mounted on the first reinforcing plate and configured to move the moving plate in a vertical direction. The method according to claim 1 or 2, The probe card is And a connection member provided between the first substrate and the second substrate, the connection member for electrical connection between the first substrate and the second substrate. In the probe card of the semiconductor inspection device: A first substrate to which an electrical signal is applied from the outside; A first reinforcing plate installed on one surface of the first substrate; And A second substrate assembly provided on the first reinforcing plate and provided with probes contacting the test object; And the second substrate assembly is moved up / down on the first reinforcing plate so as to widen or narrow the interval with the first substrate. The method of claim 15, The second substrate assembly Probe card of the semiconductor inspection device, characterized in that the first reinforcing plate is rotated in a screw manner. The method of claim 15, The second substrate assembly A second substrate provided with the probes; And And a moving plate which supports the second substrate and moves while being rotated in a screw manner to the first reinforcing plate. The method of claim 17, The second substrate assembly The probe card of the semiconductor inspection apparatus further comprises an upper housing for fixing the moving plate and the second substrate. The method of claim 18, And the movable plate and the upper housing are fixed by an interference fitting pin. The method of claim 18, The second substrate assembly And a pressing member installed in the upper housing and pressing the second substrate to adjust the flatness of the second substrate. The method of claim 15, The probe card is And an interface member provided between the first substrate and the second substrate assembly, the interface member configured to electrically connect the first substrate and the second substrate assembly to each other.

Images