KR20080107493A - Apparatus for transferring wafer - Google Patents

Apparatus for transferring wafer Download PDF

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Publication number
KR20080107493A
KR20080107493A KR1020070055297A KR20070055297A KR20080107493A KR 20080107493 A KR20080107493 A KR 20080107493A KR 1020070055297 A KR1020070055297 A KR 1020070055297A KR 20070055297 A KR20070055297 A KR 20070055297A KR 20080107493 A KR20080107493 A KR 20080107493A
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KR
South Korea
Prior art keywords
wafer
transfer
chamber
transfer arm
arm
Prior art date
Application number
KR1020070055297A
Other languages
Korean (ko)
Inventor
김진환
이선우
Original Assignee
세메스 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 세메스 주식회사 filed Critical 세메스 주식회사
Priority to KR1020070055297A priority Critical patent/KR20080107493A/en
Publication of KR20080107493A publication Critical patent/KR20080107493A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

A wafer transfer device is provided to shorten the whole process time by standing by the transfer arm for transferring the wafer at the position close to the entrance of the processing chamber. A wafer transfer device(100) comprises the transfer chamber(110), and the transfer arm(120). The transfer chamber is connected to the processing chamber(300). The transfer chamber provides the space for transferring the wafer(200) to the processing chamber. The transfer arm is positioned in the processing chamber in order to stand by at the position close to the entrance of the processing chamber while the process of wafer is progressed. The transfer arm immediately transfers the wafer which is drawn from the processing chamber. The transfer arm includes the detecting sensor for detecting the transfer arm.

Description

Wafer transfer device {APPARATUS FOR TRANSFERRING WAFER}

1 is a configuration diagram schematically showing a wafer transfer apparatus according to an embodiment of the present invention.

2 and 3 are schematic views illustrating an example of a wafer transfer method using the wafer transfer apparatus of FIG. 1.

4 is a flowchart illustrating a method of transferring a wafer using the wafer transfer device of FIG. 1.

5 is a configuration diagram schematically showing an example of a wafer transfer method using a wafer transfer apparatus according to another embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

100: wafer transfer device 110: transfer chamber

120: transfer arm 130: detection sensor

140: holder 150: support

200: wafer 300: process chamber

400: door 500: loading chamber

The present invention relates to a wafer transfer apparatus, and more particularly, to a wafer transfer apparatus including a transfer chamber connected to a process chamber.

In general, semiconductor devices are fabricated from wafers based on silicon. Specifically, the semiconductor device includes a deposition process for forming a film on the wafer, a chemical mechanical polishing process for planarizing the film, a photolithography process for forming a photoresist pattern on the film, and the photoresist pattern. An etching process for forming the film into a pattern having electrical characteristics by using an ion, an ion implantation process for implanting specific ions into a predetermined region of the wafer, a cleaning process for removing impurities on the wafer, and the film Or an inspection process for inspecting the surface of the wafer on which the pattern is formed.

The above processes are each carried out in different process chambers. Thus, the wafer is transferred to the process chambers with respect to the transfer chambers connected to the process chambers. That is, a transfer arm for substantially transferring the wafer is disposed in the transfer chamber.

Herein, the process of transferring the wafer will be described in detail. First, the wafer is transferred from the loading chamber to the home position of the transfer chamber. In this case, the home position may generally correspond to the center of the transfer chamber because the process chambers are connected around the transfer chamber.

Then, the wafer is transferred to the process chamber to be processed. Subsequently, the transfer arm from which the wafer has been removed is moved to the home position of the transfer chamber and waited.

Then, when the process of the wafer is completed, the transfer arm is moved back to the process chamber to transfer the wafer to the home position of the transfer chamber. Then, the wafer is transferred to another process chamber so that another process can proceed. Repeating this process, when the wafer is completed, the transfer arm transfers the wafer to the unloading chamber.

However, by moving the transfer arm to the home position of the transfer chamber while the wafer is processing in the process chamber during the above process, the movement time of the transfer arm for transferring the wafer where the process is completed is long. There is a problem.

Accordingly, the present invention has been made in view of such a problem, and an object of the present invention is to provide a wafer transfer device capable of shortening the movement time of a transfer arm for transferring a wafer.

In order to achieve the above object of the present invention, a wafer transfer device according to one aspect includes a transfer chamber and a transfer arm. The transfer chamber is connected to the process chamber and provides a space for transferring a wafer to the process chamber. The transfer arm is disposed in the transfer chamber such that the wafer can be waited in front of the inlet of the process chamber while the process is in progress, and immediately transfers the wafer to be taken out from the process chamber.

In addition, the wafer transfer apparatus may further include a detection sensor for detecting the transfer arm such that the transfer arm waits in front of the inlet.

Thus, the detection sensor may be disposed in the transfer chamber corresponding to the entrance immediately to detect the presence of the transfer arm. In contrast, the detection sensor may be disposed at an end of the transfer arm to detect a distance between the transfer arm and a door installed at the inlet.

According to such a wafer transfer apparatus, the movement time of the transfer arm can be shortened by waiting the transfer arm at a position close to the inlet of the process chamber while the wafer is being processed in any one process chamber.

Hereinafter, a wafer transfer apparatus according to an exemplary embodiment of the present invention will be described in detail with reference to the accompanying drawings. As the inventive concept allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the text. However, this is not intended to limit the present invention to the specific disclosed form, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention. In describing the drawings, similar reference numerals are used for similar elements.

In addition, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art. Terms such as those defined in the commonly used dictionaries should be construed as having meanings consistent with the meanings in the context of the related art and shall not be construed in ideal or excessively formal meanings unless expressly defined in this application. Do not.

1 is a schematic view illustrating a wafer transfer apparatus according to an embodiment of the present invention, and FIGS. 2 and 3 are schematic views illustrating an example of a wafer transfer method using the wafer transfer apparatus of FIG. 1.

1 and 2, a wafer transfer apparatus 100 according to an embodiment of the present invention includes a transfer chamber 110, a transfer arm 120, and a detection sensor 130.

The transfer chamber 110 is a key component for manufacturing a semiconductor device, and provides a space for transferring the wafer 200 formed of a thin single crystal plate made of silicon to the process chamber 300. In detail, the transfer chamber 110 may be a center, and a plurality of process chambers 300 may be connected around the transfer chamber 110.

Here, the process chamber 300 is a member through which a process for fabricating a semiconductor device through the wafer 200 is substantially performed. An example of the process chamber 300 may include a chamber for performing a photographic process, a chamber for performing an etching process, and a chamber for performing a thin film stacking process.

A door 400 is installed between the process chamber 300 and the transfer chamber 110 to maintain respective chamber characteristics. The door 400 may be installed at the inlet of the process chamber 300 and the inlet of the transfer chamber 110, respectively, to more closely maintain the characteristics of the process chamber 300 and the transfer chamber 110. .

The door 400 may be controlled by a predetermined program or directly by a user. The door 400 is generally opened and closed using a linear motion of the cylinder. Alternatively, the door 400 may use a drive motor that rotates. In this case, a pinion gear and a rack gear may be used to convert the rotational motion into a linear motion.

The transfer chamber 110 may be connected to the loading chamber 500 of the cassette structure in which the plurality of wafers 200 are stored so that the wafer 200 may be loaded. Alternatively, although not shown in the drawing, the transfer chamber 110 may be connected to another transfer chamber, or may be connected to an unloading chamber (not shown) for unloading the wafer 200 where the process is completed.

The transfer chamber 110 needs to be maintained in a high vacuum state in order to prevent foreign matters from being contaminated on the wafer 200. This is to prevent an electrical defect from occurring due to the foreign matter of the semiconductor device manufactured through the wafer 200. In contrast, the transfer chamber 110 may be maintained at an atmospheric pressure state by controlling the clean state of the space in which the transfer chamber 110 is installed.

The transfer arm 120 substantially serves to transfer the wafer 200. Specifically, the transfer arm 120 transfers the wafer 200 from the loading chamber 500 to the transfer chamber 110, or transfers the wafer 200 from the transfer chamber 110 to the process chamber 300. Then, the process chamber 300 is transferred back to the transfer chamber 110.

Here, the conveyance may be substantially controlled automatically by a preset program or manually by an operator. That is, the transfer arm 120 may mean a robot arm widely used in an industrial site.

The transfer arm 120 is disposed and fixed to the transfer chamber 110. In detail, the transfer arm 120 is coupled to a fixed base 140 fixed to the bottom 114 of the transfer chamber 110.

When the transfer arm 120 moves only along the plane direction (x, y), the fixing arm 140 divides the transfer arm 120 into the plane direction ( It can be moved along the direction z perpendicular to x, y).

At this time, the specification for moving the holder 140 can be precisely controlled, but a pneumatic method with a low possibility of contamination may be used. Alternatively, if the transfer chamber 110 is very large in size and requires a large power, a hydraulic method may be used.

Since the transfer arm 120 must support the wafer 200, a support 150 is formed at an end thereof. The support 150 is a portion in direct contact with the wafer 200 and may be coated with a material having excellent strength on the contact surface. This is to prevent a flaw that may damage the wafer 200 from being formed on the contact surface.

The support 150 is preferably to minimize the contact area in order to prevent the contamination of the wafer 200 as much as possible. To this end, the support 150 may have a fork (fork) shape. In contrast, the support 150 may have a shape including at least three support points in contact with the wafer 200.

The support 150 may be formed in a vacuum hole on the surface facing the wafer 200 in order to more stably support the wafer 200. In contrast, the support 150 may be coated with a material having a high coefficient of friction, such as rubber, on a surface facing the wafer 200 in order to increase a friction index with the wafer 200.

The detection sensor 130 detects the transfer arm 120 such that the support 150 of the transfer arm 120 can stand by the entrance of the process chamber 300, that is, in front of the door 400. Specifically, the detection sensor 130 is disposed on the upper surface 112 of the transfer chamber 110 corresponding to the front of the door 400. In contrast, the detection sensor 130 may be disposed on a floor 114 corresponding to the front of the door 400 in the transfer chamber 110.

As a result, the detection sensor 130 detects the existence of the transfer arm 120 by irradiating light vertically to the center of the transfer chamber 110, thereby supporting the support 150 of the transfer arm 120. The approaching to the door 400 may be detected.

Accordingly, when the transfer arm 120 is detected by the detection sensor 130, the movement of the transfer arm 120 is stopped, thereby waiting the transfer arm 120 at a position close to the door 400. Can be. Of course, such sensing is performed during the process of the wafer 200 in the process chamber 300.

Therefore, the wafer transfer apparatus 100 waits the transfer arm 120 directly in front of the door 400 while the wafer 200 is processing through the detection sensor 130. The travel distance for conveying 200 can be shortened. That is, the transfer arm 120 may shorten the movement time for transferring the wafer 200, which is completed and carried out.

On the other hand, if the standby position of the transfer arm 120 is programmatically controlled to approach the door 400, the detection sensor 130 is the transfer arm 120 is the door 400 due to the error of the program ) To prevent a catastrophic failure. In other words, when the transfer arm 120 is detected by the detection sensor 130, an interlock is applied to the wafer transfer device 100.

3, the sensor 130 may additionally perform a function of detecting the presence of the wafer 200.

That is, the detection sensor 130 may detect whether the wafer 200 is substantially mounted on the transfer arm 120 during the process. If the detection sensor 130 applies the method of sensing the object through the light reflected from the object after irradiating light, the detection sensor 130 is the transfer arm 120 and the wafer 200 The presence of the wafer 200 can be confirmed by detecting a difference between the reflected light due to different materials.

Alternatively, the detection sensor 130 may include a camera for capturing a substantial image to directly determine whether the object to be photographed is the transfer arm 120 or the wafer 200. In this case, the detection sensor 130 may include a high resolution CCD camera.

The presence of the wafer 200 may be detected when the wafer 200 is transferred or conveyed to the process chamber 300 after the door 400 is opened. At this time, if the wafer 200 is not detected, it is checked whether the wafer 200 is dropped or the wafer 200 is not mounted from the beginning after the interlock.

4 is a flowchart illustrating a method of transferring a wafer using the wafer transfer device of FIG. 1.

1, 2, and 4, a method of transferring a wafer 200 may include first transferring the wafer 200 to a process chamber 300 through a transfer arm 120 to process a photo, etching, or exposure process. Proceed to step (S10). In this case, the transfer arm 120 basically loads the wafer 200 from the loading chamber 500.

Subsequently, the transfer arm 120 is disposed programmatically or immediately in front of the door 400 installed at the inlet of the process chamber 300 using the sensor 130 (S20). Here, the transfer arm 120 basically configures a program to wait immediately in front of the door 400, and the detection sensor 130 as a safety device for this, the door 400 of the transfer chamber 110 It is preferable to arrange on the top surface 112 or the bottom 114 corresponding to just in front of the.

Subsequently, the wafer 200 in which the process is completed is transferred to the transfer chamber 110 at the shortest moving distance through the transfer arm 120 (S30). Subsequently, the wafer 200 is transferred to another process chamber 300 to proceed with another process. Finally, the wafer 200 completed through all processes is unloaded.

As such, the transfer arm 120 is disposed in front of the door 400 installed at the inlet of the process chamber 300 while the wafer 200 is in process, thereby moving the transfer arm 120. By shortening the time it takes to transfer the wafer 200 can be shortened.

5 is a configuration diagram schematically showing an example of a wafer transfer method using a wafer transfer apparatus according to another embodiment of the present invention.

In the present exemplary embodiment, the same reference numerals may be used except for the position where the sensing sensor is disposed, and thus the same reference numerals will be omitted.

Referring to FIG. 5, the sensing sensor 630 of the wafer transfer apparatus 600 according to another embodiment of the present invention is disposed at an end of the transfer arm 620. Specifically, the detection sensor 630 is disposed at the end of the support 650 of the transfer arm 620.

As a result, the detection sensor 630 detects a distance between the process chamber 300 and the door 400 formed between the transfer chamber 610 and the transfer arm 620 to the wafer 200 to process the process chamber 300. During the process can be waited as close as possible to the door 400.

In this case, the distance from the door 400 detected by the detection sensor 630 may be arbitrarily set by the user. That is, the user needs to set the distance closest to the door 400 in a range where the transfer arm 620 does not collide with the door 400 in order to shorten the moving distance of the transfer arm 620. There is this. In contrast, when the sensing sensor 630 is manufactured, the proximity sensor may use a proximity sensor in which a proximity distance is already set.

In addition, the detection sensor 630 is specifically, the support arm 650 so as not to affect the wafer 200 to be mounted while placing the transfer arm 620 as close to the door 400 as possible. It is preferable to be disposed in the lower part of the end of. Alternatively, the detection sensor 630 may be disposed in parallel with the support 650. In this case, the detection sensor 630 has a disadvantage in that the transfer arm 620 is further separated from the door 400 by the thickness thereof, but is exposed to the wafer 200 and the presence of the wafer 200 exists. It also has the advantage that it can simultaneously perform the function of detecting.

Meanwhile, the detection sensor 630 may detect a distance from the door 400 to directly prevent the transfer arm 620 from hitting the door 400. This is because the detection sensor 630 detects the distance only when the door 400 is closed.

According to such a wafer transfer device, the wafer is transferred to a position close to the inlet of the process chamber while the process is performed on the wafer for fabricating the semiconductor device in any one process chamber, thereby transferring the finished wafer. It is possible to shorten the movement time of the transfer arm for. This can shorten the overall process time.

Although the detailed description of the present invention has been described with reference to the preferred embodiments of the present invention, those skilled in the art or those skilled in the art will have the idea of the present invention described in the claims to be described later. It will be understood that various modifications and variations can be made in the present invention without departing from the scope of the present invention.

Claims (4)

A transfer chamber connected to the process chamber and providing a space for transferring the wafer to the process chamber; And A wafer transfer device including a transfer arm disposed in the transfer chamber such that the wafer can be waited in front of the inlet of the process chamber while the process is in progress and immediately transfer the wafer to be taken out from the process chamber; . The wafer transfer apparatus of claim 1, further comprising a sensing sensor that senses the transfer arm such that the transfer arm waits in front of the inlet. The wafer transfer apparatus of claim 2, wherein the detection sensor is disposed in the transfer chamber corresponding to the entrance to detect the presence of the transfer arm. The wafer transfer apparatus of claim 2, wherein the detection sensor is disposed at an end of the transfer arm to detect a distance between the transfer arm and a door installed at the inlet.
KR1020070055297A 2007-06-07 2007-06-07 Apparatus for transferring wafer KR20080107493A (en)

Priority Applications (1)

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KR1020070055297A KR20080107493A (en) 2007-06-07 2007-06-07 Apparatus for transferring wafer

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KR1020070055297A KR20080107493A (en) 2007-06-07 2007-06-07 Apparatus for transferring wafer

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150090933A (en) * 2014-01-29 2015-08-07 세메스 주식회사 Substrate treating apparatus and substrate treating method using it

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150090933A (en) * 2014-01-29 2015-08-07 세메스 주식회사 Substrate treating apparatus and substrate treating method using it

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