KR20080094539A - Single type cleaning device - Google Patents

Abstract

A single type cleaning device is provided to enhance cleaning capability by performing cleaning on upper and lower surfaces of substrates through ultrasound wave oscillation. A single type cleaning device includes a propagation water supply unit(6) and an oscillation unit(7). The propagation water supply unit supplies propagation water to a lower surface of a substrate. The oscillation unit disposed close to the substrate to form a propagation water film(5) under the substrate applies ultrasound wave oscillation to the propagation water film. The ultrasound wave oscillation applied to the propagation water film is penetrated through the substrate and then the penetrated ultrasound wave oscillation is applied to cleaning water(3) on an upper surface(W1) of the substrate. Then the upper surface of the substrate is cleaned.

Description

Single leaf type washing machine {SINGLE TYPE CLEANING DEVICE}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a single sheet cleaning apparatus for a substrate for cleaning a semiconductor silicon wafer and a substrate on which a device pattern is formed on a photomask, one by one.

In a manufacturing process such as a semiconductor, when particles of organic matter, dust such as metal, foreign matters, etc. adhere to the substrate when performing a process process treatment on a substrate used for manufacturing a semiconductor such as a semiconductor substrate or a photomask substrate In addition, since uniform processing cannot be performed in the substrate surface and indirectly cross-contaminates from other substrates to such substrates, it is a cause of lowering the yield of product manufacturing. Therefore, before the substrate is treated, particles and the like are removed from the substrate rather than being cleaned with the cleaning apparatus.

BACKGROUND OF THE INVENTION [0002] Conventionally, a washing apparatus for cleaning a substrate includes a medium type washing apparatus capable of simultaneously cleaning a plurality of objects to be cleaned and a sheet type cleaning apparatus for washing one to be cleaned one by one. In recent years, due to the increase in size of semiconductor substrates and the miniaturization of semiconductor wiring patterns, sheet-fed cleaning apparatuses have been widely used to reduce damages to patterns caused by cleaning rather than discharge type cleaning apparatuses.

As such a single wafer cleaning apparatus, for example, Japanese Patent Application Laid-Open No. 2004-356593 discloses a wafer in which a thin film is formed on the back surface of an ion implanted surface in order to satisfactorily remove particles firmly attached to the wafer after ion implantation. A method is disclosed in which ultrasonic vibration is applied to a first cleaning liquid capable of etching a thin film only on its back surface.

For example, Japanese Patent Application Laid-Open No. 2006-95458 discloses an ultrasonic diaphragm facing the cleaning surface of the object to be cleaned in order to perform the most effective cleaning on the semiconductor wafer, and supplying a cleaning liquid between the diaphragm and the object to be cleaned to ultrasonic vibration. When cleaning the cleaning surface of the object to be cleaned with the cleaning liquid interposed therebetween, a single wafer cleaning apparatus is disclosed in which the vibrating surface of the diaphragm is disposed close to a position where the average sound pressure of the cleaning surface of the object to be cleaned is at or near its highest point.

However, when ultrasonic vibration is applied in a sheet cleaning apparatus such as Japanese Patent Laid-Open Publication No. 2004-356593 and Japanese Patent Laid-Open Publication No. 2006-95458, it is very difficult to control the output to the ultrasonic vibration in order to obtain a high cleaning effect. Instead of obtaining a high cleaning effect, damage to the substrate pattern was increased in the same substrate as in the case of the substrate, and the yield reduction of substrate production was caused by the pattern damage during cleaning.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object of the present invention is to prevent damage to a substrate and to obtain a high cleaning effect even in a substrate which is very easily damaged, especially a substrate having a device pattern formed thereon. The present invention provides a single sheet cleaning device.

In order to achieve the above object, the present invention provides a cleaning apparatus comprising at least a holding means for holding a substrate in a horizontal state and a cleaning liquid ejecting means for ejecting a cleaning liquid toward an upper surface of the substrate held by the holding means.

Radio wave water supply means for supplying radio wave water to a lower surface of the substrate;

And vibrating means disposed close to the substrate so as to form a film by the propagation water so as to apply ultrasonic vibrations permeable to the substrate to the propagation film,

Ultrasonic vibration applied to the radio wave film by the vibration means is applied to the cleaning liquid placed on the upper surface of the substrate through the substrate to provide a single wafer cleaning apparatus, characterized in that for cleaning the upper surface.

As described above, the sheet type cleaning apparatus of the present invention is disposed so as to form a film by the radio wave water supply means for supplying the radio wave water to the lower surface of the substrate and directly below the substrate to transmit ultrasonic vibrations permeable to the substrate to the radio wave film. It is provided with an oscillating means to be applied, and the ultrasonic vibration applied to the radio wave film by the oscillating means is used to clean the upper surface of the substrate by being lowered by the cleaning liquid placed on the upper surface of the substrate.

As a result, since the vibrating means is not disposed opposite to the substrate surface susceptible to ultrasonic vibration, the ultrasonic vibration applied from the vibrating means does not directly contact the upper surface of the substrate, but ultrasonic vibration is generated in the radio wave film formed on the lower surface of the substrate. Because it is transmitted to the device pattern surface of the substrate and applied to the cleaning liquid on the device pattern surface of the upper surface of the substrate, even if the substrate is susceptible to damage by ultrasonic vibration cleaning, damage to the upper surface of the surface to be cleaned can be suppressed. The effect can be obtained.

Therefore, the pattern damage at the time of washing | cleaning and the lack of washing | cleaning can be eliminated, and the yield of a board | substrate manufacture is improved.

In this case, the holding means is preferably provided with a rotation drive for rotating while holding the substrate horizontally.

In this way, since the holding means is provided with a rotation driving unit for rotating the substrate while holding the substrate horizontally, the holding means can be rotated at the time of cleaning to uniformly clean the inside of the substrate surface. In this state, the substrate can be dried by centrifugal force, and the cleaning and drying of the substrate can be effectively performed.

In addition, the vibration means is preferably configured to be able to move up and down to adjust the distance between the vibration means and the substrate.

Thus, if the vibrating means can move up and down, and the distance between the vibrating means and the substrate can be adjusted, the thickness of the electric wave film formed on the lower surface of the substrate can be adjusted, and the formation and destruction of the electric wave film can be freely controlled. can do.

In addition, since the vibration means moves up and down, the distance between the vibration means and the substrate can be widened by a predetermined interval or more, so that the vibration means can move away from the radio waves remaining on the vibration means, thereby effectively drying the substrate. .

In addition, the vibrating means is preferably spread on the lower front surface of the substrate, or the vibrating means is spread over a portion of the lower portion of the substrate so that the vibrating means and / or the holding means is rotated to ultrasonic vibration on the front surface of the substrate It may be made to transmit.

As such, the vibrating means is spread over the lower front surface of the substrate, or the vibrating means is spread over the lower portion of the substrate so that the ultrasonic vibration is transmitted to the front surface of the substrate by rotating the vibrating means and / or the holding means, so that the ultrasonic waves are spread over the entire surface of the substrate. Vibration can be transmitted seamlessly.

In addition, it is preferable that at least the surface of the said vibrating means is quartz. In this way, if at least the surface of the vibrating means is made of quartz, impurities in the vibrating means can be prevented from contaminating the substrate through the radio waves.

Moreover, it is preferable that the said cleaning liquid ejection means is comprised so that up-and-down movement is possible and the space | interval of the said cleaning liquid ejection means and the said board | substrate can be adjusted.

In this way, if the cleaning liquid ejecting means is configured to be capable of vertical movement, and the gap between the cleaning liquid ejecting means and the substrate can be adjusted, the amount and supply position of the cleaning liquid to be placed on the upper surface of the substrate can be adjusted according to the thickness of the substrate.

In addition, the cleaning liquid jetting means can be brought close to the substrate surface in a range that prevents the cleaning liquid from splashing on the substrate surface and does not interfere.

The propagation water supply means may supply a functional water of dissolved N ₂ water or CO ₂ water, the concentration of which is controlled, to the lower surface of the substrate as the propagation water.

In this way, the propagation water supply means supplies the functional water of the concentration-controlled dissolved N ₂ water or CO ₂ water to the lower surface of the substrate as the propagation water so that the gas concentration is adjusted to generate a desired cavitation to transmit the ultrasonic waves to the upper surface of the substrate. Since the cleaning force by vibration can be adjusted, and the lower surface of a board | substrate can also be wash | cleaned with a high washing | cleaning force as needed, it can also wash | clean effectively even if a lower surface of a board | substrate is suppressed, damaging the easily damaged upper surface of a board | substrate.

Further, the radio wave water supply means has a radio wave injection nozzle for injecting radio wave water on the wavefront of the substrate, the radio wave nozzle has an ultrasonic vibrator on the bottom surface of the wave propagation introduced from the side by the ultrasonic vibrator It is preferable that the wave propagation nozzle is attached to the vibration means by applying ultrasonic vibration to water.

In this way, if there is an ultrasonic vibrator on the bottom surface of the wave propagation nozzle, the ultrasonic vibration by the ultrasonic vibrator on the bottom surface of the wave propagation nozzle can also be applied to the portion of the direct jet from which the wave propagates. As a result, it is possible to reliably apply the desired ultrasonic vibration to the entire surface of the substrate, which further increases the cleaning power.

In the single wafer cleaning apparatus according to the present invention, even a substrate having a substrate surface which is very easily damaged, and particularly a substrate having a device pattern formed thereon, damage to the substrate can be suppressed and a high cleaning effect can be obtained simply.

As described above, when ultrasonic vibration is conventionally applied, it is very difficult to control the output of ultrasonic vibration in order to obtain a high cleaning effect, and in particular, a substrate such as a device pattern is formed, and a damage to the substrate pattern is achieved instead of a high cleaning effect. This increase and a decrease in yield of substrate fabrication due to pattern damage during cleaning had occurred.

In order to solve such a problem, the present inventors made extensive research. Usually, when trying to clean something, it is common to inject a cleaning liquid onto the surface to be cleaned, and even with a conventional single wafer cleaning apparatus, the substrate surface (to-be-cleaned surface) to which the cleaning effect by ultrasonic vibration is mainly obtained. Regardless of facing up or down, it is common for the vibrating means to be disposed so that the cleaning liquid to which the ultrasonic vibration is applied directly touches the surface to be cleaned (for example, Japanese Patent Application Laid-Open No. 2004-356593). , Japanese Patent Laid-Open No. 2006-95458, etc.).

Here, the present inventors can suppress the damage to the surface to be cleaned of a substrate having a substrate surface which is very susceptible to damage, especially a substrate having a device pattern formed thereon. Permeable to the substrate by placing the substrate surface on the holding means to obtain the cleaning effect by keeping the substrate on the holding means and supplying the radio wave water to the lower surface of the substrate so as to form a film by the wave water directly under the substrate. Vibration means for applying the ultrasonic vibration to the radio wave film, the ultrasonic vibration applied to the radio wave film as a vibration means is to clean the upper surface of the substrate by lowering the cleaning liquid placed on the upper surface of the substrate The present invention has been completed.

EMBODIMENT OF THE INVENTION Hereinafter, although embodiment of this invention is described concretely using drawing, this invention is not limited to this.

BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic diagram which shows one Embodiment of the single type washing | cleaning apparatus which concerns on this invention.

As shown in Fig. 1, the embodiment of the sheet type cleaning apparatus 1 according to the present invention includes a holding means 2 for holding the substrate W in a horizontal state, and an upper surface W1 of the substrate held by the holding means ( Washing liquid spraying means 4 for spraying the washing liquid 3 by cleaning the surface to be cleaned).

Further, the electric wave water supply means 6 for supplying the electric wave water to the lower surface of the substrate W2 and the film 5 by the electric wave water directly under the substrate W are formed in close proximity to each other so that the substrate W has a permeability. And a vibrating means (7) for applying the ultrasonic vibrations to the radio wave film (5).

Then, the ultrasonic vibration applied to the radio wave film 5 by the vibrating means 7 is applied to the cleaning liquid 3 placed on the upper surface W1 of the substrate through the substrate W, thereby cleaning the upper surface of the substrate W1. will be.

When the substrate cleaning is performed using the sheet cleaning apparatus 1 of the present invention, the ultrasonic wave is maintained by holding the substrate W with the substrate surface on which the retaining means 2 is to be cleaned. Since the vibrating means 7 is not disposed opposite to the substrate surface that is easily damaged by the vibration, ultrasonic vibrations applied by the vibrating means 7 do not directly touch, and are formed on the lower surface W2 of the substrate by the vibrating means 7. Ultrasonic vibration is applied to the propagated water film 5, and the ultrasonic vibration is applied to the cleaning liquid 3 which is transmitted from the lower surface of the substrate W2 to the upper surface of the substrate W2 and placed on the upper surface of the substrate W1.

Thereby, even if the board | substrate and the photomask board | substrate which have a board | substrate surface which is easy to be damaged by ultrasonic vibration washing | cleaning can be suppressed damage, the high cleaning effect of ultrasonic vibration can be acquired simply.

Therefore, the pattern damage at the time of washing | cleaning, the damage of a board | substrate surface, the lack of washing | cleaning can be eliminated, and the yield of board | substrate manufacture is improved.

In addition, in the present invention, since the propagation water is held between the vibration means disposed close to the bottom surface of the substrate and the substrate, the propagation water film is economical and the ultrasonic waves can be efficiently transmitted to the substrate because the propagation water used for cleaning the substrate is small. Can be. In addition, since the ultrasonic vibration can be transmitted uniformly over a wide range at the same time, the entire surface of the substrate can be cleaned more uniformly. At this time, it is preferable to wash at a vibration frequency of 500 kHz or more.

The holding means 2 is preferably provided with a rotation drive 8 for rotating while holding the substrate W horizontal.

Thereby, the holding means 2 can be rotated at the time of washing | cleaning, and it can wash | clean uniformly in the surface of the board | substrate W, and the board | substrate W as it is, without having to convey the board | substrate W to the drying apparatus after cleaning the board | substrate W. ) Can be rotated and dried by centrifugal force, and the single sheet type cleaning apparatus 1 can be efficiently performed from substrate cleaning to drying.

It is preferable that the vibrating means 7 is comprised so that up-and-down movement is possible and the space | interval of the said vibrating means 7 and the board | substrate W can be adjusted.

As a result, the thickness of the radio wave film 5 formed on the lower surface of the substrate W2 can be adjusted, and the formation and destruction of the radio wave film 5 can be freely controlled. As a result, it is possible to cope with adjustment of the cleaning force and irregularities such as a pattern formed on the substrate. In addition, it is possible to evacuate the vibrating means 7 at the time of carrying in and out of the substrate W. FIG.

The vertical movement of this vibrating means 7 can be controlled by the vibrating means moving actuator 9, for example. Adjusting the distance between the vibrating means 7 and the substrate W, for example, by moving the vibrating means 7 upwards before cleaning the substrate W, narrowing the distance between the vibrating means 7 and the substrate W, It is disposed directly underneath to form the radio wave water film 5 between the wave propagation means 7 and the substrate (W). Further, for example, after cleaning the substrate W, the vibration means 7 may be moved downward to break the radio wave film 5 to dry the substrate while widening the distance between the vibration means 7 and the substrate W. have.

In particular, the vibrating means 7 is sufficient to control the formation and destruction of the radio wave film as long as the vibrating means moving actuator 9 can adjust the distance between the vibrating means 7 and the substrate W between 0.1 mm and 30 mm. Do.

In addition, an air cylinder may be used for two-position control when the substrate is disposed close to the lower surface of the substrate during cleaning and when the substrate is moved away from the lower surface of the substrate during drying. As a result, it is possible to easily form and destroy the radio wave film. .

As for the vibration means, for example, two embodiments can be taken as shown in Figs. 2 and 3. 2 is a schematic view showing an embodiment of a vibrating means.

As shown in Fig. 2, the vibrating means 7 is preferably spread out on the entire lower surface of the substrate (W).

In this way, if the vibrating means 7 is spread out on the entire lower surface of the substrate W, ultrasonic vibrations can be passed through the entire surface of the substrate at the same time.

The vibrating means 7 has a built-in ultrasonic vibrator (not shown).

In addition, even if the vibrating means 7 does not spread in the lower whole surface of the board | substrate W as mentioned above, it can also be set as FIG. 3 is a schematic view showing another embodiment of the vibration means.

As shown in FIG. 3, the vibrating means 7 is spread in a rectangular shape below a portion of the substrate W so that the ultrasonic vibration is transmitted to the entire surface of the substrate W by rotating the vibrating means 7 and / or the holding means 2. You may.

Thereby, ultrasonic vibration can permeate | transmit completely throughout the board | substrate. In this form, the number of radio waves can be further reduced.

The vibrating means 7 preferably has at least the surface of quartz.

In this way, if at least the surface of the vibrating means 7 is made of quartz, impurities in the vibrating means 7 can be prevented from contaminating the substrate W via the radio waves.

It is preferable that the washing | cleaning liquid ejection means 4 is comprised so that the vibrating means 7 can move up and down, and can adjust the space | interval of the said washing | cleaning liquid ejection means 4 and the board | substrate W. FIG.

Thereby, the quantity of the washing | cleaning liquid 3 put on the board | substrate upper surface W1 can be adjusted according to the thickness of the board | substrate W. As shown in FIG. It is sufficient that the vertical motion of the cleaning liquid jetting means 4 can be adjusted between 0.1 mm and 20 mm.

Moreover, the washing | cleaning liquid spraying means 4 may eject the washing | cleaning liquid 3 with which the density | concentration, the ejection pressure, etc. were adjusted, for example by the washing | cleaning liquid supply means 10. FIG.

The electric wave water supply means 6 may be provided with the electric wave water jet nozzle as shown in FIG.

5 is a schematic view in the case where a radio wave jetting nozzle is provided in the vibrating means.

This electric wave water supply means 6 is equipped with the electric wave water injection nozzle 13 for injecting electric wave water to the lower surface W2 of a board | substrate. In particular, the wave propagation nozzle 13 has an ultrasonic vibrator 13a at its bottom surface and is introduced from the side of the wave propagation nozzle 13 by the propagation water supply pipe 14 by the ultrasonic vibrator 13a. It is sprayed by applying ultrasonic vibration to the radio waves and is installed in the vibration means (7).

In this way, the radio wave water supply means 6 includes the radio wave water injection nozzle 13 provided on the bottom surface of the ultrasonic vibrator 13a and is installed in the vibration means 7 as shown in FIG. Since the wave water to which the ultrasonic vibration is applied can be injected, ultrasonic vibration can be applied to the portion of the substrate directly above by the ultrasonic vibrator on the bottom surface of the wave propagation nozzle. Therefore, it is possible to reliably apply the desired ultrasonic vibration to the entire surface of the substrate, which leads to an increase in the cleaning power.

However, in such a configuration, the ultrasonic vibrator 7a provided with the vibrating means 7 and the ultrasonic vibrator 13a provided with the wave propagation nozzle 13 have their frequencies different from each other so that the ultrasonic vibration does not disappear. It is desirable to be properly motivated

Moreover, the electric wave water supplied from the electric wave water supply means 6 can supply the functional water of concentration-controlled dissolved N ₂ water or dissolved CO ₂ water to the lower surface W2 of a board | substrate as electric wave water.

As a result, by adjusting the gas concentration to generate a desired cavitation, the cleaning power can be adjusted by the ultrasonic vibration transmitted through the upper surface W1 of the substrate, and the lower surface of the substrate W2 can be cleaned with high cleaning power as necessary. The substrate lower surface W2 can also be cleaned while the damage to the substrate upper surface W1 is easy, and both surfaces of the substrate W can be efficiently cleaned.

Moreover, you may use the chemical | medical solution for cleaning the back surface of the board | substrate in which the device pattern etc. are not formed in the board | substrate as this propagation channel.

4 is a view for explaining the radio wave water supply port, Figure 4 (a) is a schematic diagram and Figure 4 (b) is an X-X cross-sectional view of Figure 4 (a). The supply port of the electric wave water may form the electric wave water supply port 12 at the center of the vibrating means 7 as shown in FIG. 1, and at both ends of the ultrasonic vibrator 7a built in the vibrating means 7 as shown in FIG. 4. The electric wave water supply port 12 may be formed.

In addition, in the sheet type cleaning device 1 of the present invention, the vibration means 7 needs to apply ultrasonic vibrations permeable to the substrate W to the radio wave film 5. Thus, in order to simply adjust the frequency of the ultrasonic vibration permeable to the board | substrate W and to apply it to the radio wave film 5 by the vibration means 7, it is preferable to set it as follows.

For example, the vibration control means 11 which is set in advance so as to oscillate the frequency of the ultrasonic vibration having the permeability suitable for the type (substrate thickness, material, etc.) of the substrate W may be connected to the vibration means 7. Put it. As a result, ultrasonic vibrations permeable to the substrate to be cleaned simply and automatically by simply selecting the type (substrate thickness, material, etc.) of the substrate W by the vibration control means 11 at the time of substrate cleaning are easily and automatically. It can apply to (5).

Hereinafter, although an Example and a comparative example of this invention demonstrate this invention concretely, this invention is not limited to this.

(Example)

A photomask substrate having a thickness of 6.35 mm was washed with the sheet type cleaning apparatus 1 according to the present invention as shown in FIG. 1 as follows.

<Used sheet cleaning device>

The used single wafer cleaning apparatus 1 includes a holding means 2 for holding the substrate W in a horizontal state and a washing liquid spraying means for ejecting the cleaning liquid 3 toward the upper surface W1 of the substrate held by the holding means ( 4) is provided. In addition, the electric wave water supply means 6 for supplying the electric wave water to the lower surface of the substrate W2 is disposed close to the substrate W so as to form a film 5 by the electric wave water. Vibration means (7) for applying ultrasonic vibration to the radio wave film (5).

In addition, the holding means 2 uses that the rotation drive part 8 for rotating while keeping the substrate W horizontal is used, and the vibrating means 7 and the washing | cleaning liquid ejecting means 4 are comprised so that up-and-down movement is possible. Use what is available. And the vibrating means 7 whose surface is quartz spreads on the whole lower surface of the board | substrate W, and the electric wave water is supplied from the center of the vibrating means 7 like FIG. In addition, vibration control means 11, which is designed to oscillate the frequency of ultrasonic vibration having a permeability suitable for the type of substrate W (substrate thickness, material, etc.), is connected to the vibration means 7.

<Washing of board>

Using such a single wafer cleaning apparatus 1, first, the substrate is held in the holding means 2 with the surface on which the device pattern is formed facing upward, and the cleaning liquid jetting means 4 has a distance of 5 from the substrate. It adjusted so that it might be mm. Next, the vibrating means moving actuator 9 moves the vibrating means 7 so as to be 3.3 mm apart from the substrate, and when the functional water of the dissolved N ₂ number, which is concentration-controlled by the electric wave water supply means 6, is substrate ( It was confirmed that the electric wave water was formed between the substrate W and the vibrating means 7 to supply the electric wave water film 5 to W2). Subsequently, the type of substrate was selected by the vibration control means 11 to clean the photomask substrate.

At this time, 5% of ammonia water was used as the cleaning liquid jetted from the cleaning liquid jetting means 4, and the output to the vibrating means 7 was W density: 0.5W / cm 2.

<Drying of the board>

Next, the vibrating means 7 was moved with the vibrating means moving actuator 9 so as to be 13.3 mm apart from the substrate, thereby destroying the radio wave film 5. And the holding means 2 was rotated at the high speed by the rotation drive part 8, and the photomask board | substrate was rotated and dried.

<Result>

As a result of observing the substrate surface on which the pattern of the cleaned and dried photomask substrate was formed with an electron microscope, the device pattern was not damaged at all and the number of particles on the substrate surface was measured. All particles having a size of 0.2 µm or more were removed, and the cleaning power was exerted by the desired ultrasonic vibration.

(Comparative Example)

In order to compare with an Example, the photomask board | substrate of the specification similar to an Example was wash | cleaned as follows by the conventional single wafer type | mold washing | cleaning apparatus.

<Used sheet cleaning device>

The single sheet cleaning apparatus used includes a holding means for holding the substrate in a horizontal state, a cleaning liquid spraying means for ejecting the cleaning liquid toward the upper surface of the substrate held by the holding means, and a desired ultrasonic vibration to be applied to the cleaning liquid sprayed on the substrate. The thing provided with the vibration means opposingly arranged on the board | substrate upper surface was used.

<Washing of board>

The photomask substrate was held by the holding means with the surface on which the pattern of the photomask substrate is formed facing upward. Next, 5% of ammonia water was sprayed on the upper surface of the photomask substrate as the washing liquid by the washing liquid spraying means. Moreover, the vibration means was arrange | positioned facing the upper surface of the board | substrate, and the output of the ultrasonic vibration of the grade which does not run short of cleaning power was adjusted to W density: 0.5W / cm <2>. Ultrasonic vibration was applied to the cleaning liquid which jetted this ultrasonic vibration, and the upper surface of the photomask substrate was wash | cleaned.

<Drying of the board>

Subsequently, in order to compare the cleaning effect, the holding means was rotated by the rotation driving unit provided in the holding means, and the substrate was dried.

<Result>

As a result of measuring the number of particles on the surface of the substrate on which the pattern of the cleaned and dried photomask substrate was formed as described above, there was no particle larger than 0.2 µm, and the cleaning power by the desired ultrasonic vibration was exhibited. However, as a result of observing the surface of the substrate with an electron microscope, the device pattern was found to be damaged by about 30 places where the pattern fell.

As a result of the above examples and comparative examples, the single wafer cleaning apparatus according to the present invention can suppress damage to the substrate even with a substrate having a substrate surface which is very easily damaged, and in particular, a substrate having a device pattern formed thereon. And it was found that the high cleaning effect can be obtained simply.

In addition, this invention is not limited to the said embodiment. The above embodiment is merely an example and any one having substantially the same configuration as the technical idea described in the claims of the present invention and having the same operation and effect is included in the technical idea of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic diagram which shows one Embodiment of the single type washing | cleaning apparatus which concerns on this invention.

2 is a schematic view showing an embodiment of a vibrating means.

3 is a schematic view showing another embodiment of the vibration means.

4 is a view for explaining a supply port of radio waves, (a) is a schematic diagram, (b) is a cross-sectional view taken along line X-X.

5 is a schematic view in the case where a radio wave jetting nozzle is provided in the vibrating means.

(Explanation of the sign)

1-Sheet cleaning device 2-Maintaining means

3-washing 4-washing liquid ejection means

5-wave film 6-wave feed means

7 vibrating means 7a, 13a-ultrasonic vibrators

8-rotation drive 9-vibration means movement actuator

10-washing liquid supply means 11-vibration control means

12-Frequency Feed Holes 13-Frequency Spray Nozzles

14-wave feeder W-substrate

W1-substrate top W2-substrate bottom

Claims (27)

An embedded cleaning apparatus comprising at least a holding means for holding a substrate in a horizontal state and a cleaning liquid ejecting means for ejecting a cleaning liquid toward an upper surface of the substrate held by the holding means. Radio wave water supply means for supplying radio wave water to a lower surface of the substrate; At least vibrating means disposed close to the substrate so as to form a film by the propagation water so as to apply ultrasonic vibrations permeable to the substrate to the propagation film, Single wafer cleaning apparatus, characterized in that for cleaning the upper surface of the substrate by the ultrasonic vibration applied to the radio wave film in the vibration means is applied to the cleaning liquid placed on the upper surface through the substrate. The method of claim 1, The holding means is a single wafer cleaning device, characterized in that the rotary drive for rotating the substrate while maintaining the horizontal. The method of claim 1, The vibrating means is configured to enable the vertical movement can be adjusted to the interval between the vibrating means and the substrate single-leaf type washing apparatus. The method of claim 2, The vibrating means is configured to enable the vertical movement can be adjusted to the interval between the vibrating means and the substrate single-leaf type washing apparatus. The method of claim 1, The vibrating means is a sheet type cleaning device, characterized in that the spread across the lower surface of the substrate. The method of claim 2, The vibrating means is a sheet type cleaning device, characterized in that the spread across the lower surface of the substrate. The method of claim 3, The vibrating means is a sheet type cleaning device, characterized in that the spread across the lower surface of the substrate. The method of claim 4, wherein The vibrating means is a sheet type cleaning device, characterized in that the spread across the lower surface of the substrate. The method of claim 1, The vibrating means is spread over a portion of the lower portion of the substrate, the ultrasonic wave type washing apparatus, characterized in that the ultrasonic vibration is transmitted to the front surface of the substrate by rotating the vibration means and / or the holding means. The method of claim 2, The vibrating means is spread over a portion of the lower portion of the substrate, the ultrasonic wave type washing apparatus, characterized in that the ultrasonic vibration is transmitted to the front surface of the substrate by rotating the vibration means and / or the holding means. The method of claim 3, The vibrating means is spread over a portion of the lower portion of the substrate, the ultrasonic wave type washing apparatus, characterized in that the ultrasonic vibration is transmitted to the front surface of the substrate by rotating the vibration means and / or the holding means. The method of claim 4, wherein The vibrating means is spread over a portion of the lower portion of the substrate, the ultrasonic wave type washing apparatus, characterized in that the ultrasonic vibration is transmitted to the front surface of the substrate by rotating the vibration means and / or the holding means. The method according to any one of claims 1 to 12, And said vibrating means is at least said surface is made of quartz. The method according to any one of claims 1 to 12, The cleaning liquid ejecting means is configured to be able to move up and down so that the interval between the cleaning liquid ejecting means and the substrate can be adjusted. The method of claim 13, The cleaning liquid ejecting means is configured to be able to move up and down so that the interval between the cleaning liquid ejecting means and the substrate can be adjusted. The method according to any one of claims 1 to 12, And the propagation water supply means supplies a concentration-controlled dissolved N ₂ water or dissolved CO ₂ water to the lower surface of the substrate as the propagated water. The method of claim 13, And the propagation water supply means supplies a concentration-controlled dissolved N ₂ water or dissolved CO ₂ water to the lower surface of the substrate as the propagated water. The method of claim 14, And the propagation water supply means supplies a concentration-controlled dissolved N ₂ water or dissolved CO ₂ water to the lower surface of the substrate as the propagated water. The method of claim 15, And the propagation water supply means supplies a concentration-controlled dissolved N ₂ water or dissolved CO ₂ water to the lower surface of the substrate as the propagated water. The method according to any one of claims 1 to 12, The propagation water supply means has a propagation water injection nozzle for injecting the propagation water on the lower surface of the substrate, the propagation water injection nozzle has an ultrasonic vibrator on its bottom surface and propagated from the side by the ultrasonic vibrator The ultrasonic wave is sprayed by applying ultrasonic vibration, wherein the full-wave spray nozzle is installed in the vibration means, single sheet cleaning apparatus. The method of claim 13, The propagation water supply means has a propagation water injection nozzle for injecting the propagation water on the lower surface of the substrate, the propagation water injection nozzle has an ultrasonic vibrator on its bottom surface and the radio wave water introduced from the side by the ultrasonic vibrator Ultrasonic vibration is applied to the spray, wherein the full-wave injection nozzle is installed on the vibration means, single sheet cleaning apparatus. The method of claim 14, The propagation water supply means has a propagation water injection nozzle for injecting the propagation water on the lower surface of the substrate, the propagation water injection nozzle has an ultrasonic vibrator on its bottom surface and the radio wave water introduced from the side by the ultrasonic vibrator Ultrasonic vibration is applied to the spray, wherein the full-wave injection nozzle is installed on the vibration means, single sheet cleaning apparatus. The method of claim 15, The propagation water supply means has a propagation water injection nozzle for injecting the propagation water on the lower surface of the substrate, the propagation water injection nozzle has an ultrasonic vibrator on its bottom surface and the radio wave water introduced from the side by the ultrasonic vibrator Ultrasonic vibration is applied to the spray, wherein the full-wave injection nozzle is installed on the vibration means, single sheet cleaning apparatus. The method of claim 16, The propagation water supply means has a propagation water injection nozzle for injecting the propagation water on the lower surface of the substrate, the propagation water injection nozzle has an ultrasonic vibrator on its bottom surface and the radio wave water introduced from the side by the ultrasonic vibrator Ultrasonic vibration is applied to the spray, wherein the full-wave injection nozzle is installed on the vibration means, single sheet cleaning apparatus. The method of claim 17, The propagation water supply means has a propagation water injection nozzle for injecting the propagation water on the lower surface of the substrate, the propagation water injection nozzle has an ultrasonic vibrator on its bottom surface and the radio wave water introduced from the side by the ultrasonic vibrator Ultrasonic vibration is applied to the spray, wherein the full-wave injection nozzle is installed on the vibration means, single sheet cleaning apparatus. The method of claim 18, The propagation water supply means has a propagation water injection nozzle for injecting the propagation water on the lower surface of the substrate, the propagation water injection nozzle has an ultrasonic vibrator on its bottom surface and the radio wave water introduced from the side by the ultrasonic vibrator Ultrasonic vibration is applied to the spray, wherein the full-wave injection nozzle is installed on the vibration means, single sheet cleaning apparatus. The method of claim 19, The propagation water supply means has a propagation water injection nozzle for injecting the propagation water on the lower surface of the substrate, the propagation water injection nozzle has an ultrasonic vibrator on its bottom surface and the radio wave water introduced from the side by the ultrasonic vibrator Ultrasonic vibration is applied to the spray, wherein the full-wave injection nozzle is installed on the vibration means, single sheet cleaning apparatus.

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