KR20080090102A - A terminal of a socket for a memory module - Google Patents

A terminal of a socket for a memory module Download PDF

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Publication number
KR20080090102A
KR20080090102A KR1020070033188A KR20070033188A KR20080090102A KR 20080090102 A KR20080090102 A KR 20080090102A KR 1020070033188 A KR1020070033188 A KR 1020070033188A KR 20070033188 A KR20070033188 A KR 20070033188A KR 20080090102 A KR20080090102 A KR 20080090102A
Authority
KR
South Korea
Prior art keywords
contact
memory module
terminal
socket
pin
Prior art date
Application number
KR1020070033188A
Other languages
Korean (ko)
Inventor
최영대
Original Assignee
최영대
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 최영대 filed Critical 최영대
Priority to KR1020070033188A priority Critical patent/KR20080090102A/en
Publication of KR20080090102A publication Critical patent/KR20080090102A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
    • H01R33/74—Devices having four or more poles, e.g. holders for compact fluorescent lamps
    • H01R33/76—Holders with sockets, clips, or analogous contacts adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2103/00—Two poles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00—Connectors or connections adapted for particular applications
    • H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H01R24/20—Coupling parts carrying sockets, clips or analogous contacts and secured only to wire or cable

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  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

A terminal of a socket for testing a memory module is provided to firmly fix a contact point contact part at an inner side of a socket housing and elastically tightly attach a pin contact part to a connection pin. A contact point contact part(31) is formed to be bent in an S shape upwardly and contacts with a contact point(12) of a memory module(10). A pin contact part(32) is formed to be bent from a lower end of the contact point contact part and extends vertically downwardly so that an outer side of a connection pin allowing connection to a circuit board can be in contact with one side thereof. The contact point contact part includes a stop piece formed at an upper end and bent to be fixedly caught at an inner side of the socket housing. A stop protrusion is formed at an outer side of the contact point contact part and fixedly caught at an inner side of the socket housing.

Description

Terminal of a socket for a memory module

1 is a perspective view showing an example of a memory module socket according to the present invention;

2 is an enlarged perspective view of the main portion of the present invention;

Figure 3 is a longitudinal sectional view showing a state of use of the present invention.

4 is a perspective view illustrating an example of a terminal used in a conventional memory module socket.

Figure 5 is a longitudinal cross-sectional view showing a state of use of FIG.

※ Explanation of codes for main parts of drawing

10: memory module

   11 substrate 12 contact

   13: memory chip

20: socket housing

   21: memory coupling groove 22: terminal fixing groove

   23: connecting pin

30: terminal

   31: contact contact portion 311: locking piece

   312: engaging projection 32: pin contact

   321: contact protrusion 322: fixing protrusion

The present invention relates to a socket for a memory module test, and more particularly, to a terminal of a socket for a memory module test in which a terminal is fabricated by integrally processing a contact contact part and a pin contact part by bending.

In general, a detachable memory module is used in a personal computer, a server computer, a notebook computer and the like for easy expansion of the memory capacity.

As shown in FIG. 4, the memory module has a plurality of contacts 102 formed on a lower side of the substrate 101, and at least one memory chip 103 is attached to an outer surface of the substrate 101 to attach the substrate 101 to the substrate 101. A plurality of memory chips 103 are connected to each other so as to be connected to the main board of the computer through the contact point 102.

In addition, after the assembly of the memory module is completed in the process of manufacturing the memory module 100 as described above to check whether the normal operation, in this case by mounting the memory module in the memory module test socket to apply a constant signal and current In addition, the operation status according to this is displayed and inspected separately.

The memory module test socket has a recessed memory coupling groove 201 in which a lower end of the memory module 100 is inserted into an upper surface of the socket housing 200 formed of a synthetic resin material such as plastic, and the memory coupling groove ( A plurality of terminals corresponding to the number of contacts are inserted into the inside of the 201 to allow the memory module 100 to be coupled to the socket housing 200 and to be connected to the test circuit through the terminals.

As shown in FIGS. 5 to 6, the terminal 300 has an S-shaped contact contact 301 which is elastically contacted with a contact of a memory module, and a terminal is provided below the contact contact 301. Pin contact portion 302 is formed is coupled to the connecting pin 202 to make the 300 in contact with the main board, the contact contact portion 301 and the pin contact portion 302 by punching the metal plate by pressing It is formed integrally.

However, the conventional terminal as described above had a problem in that the contact surface with the contact was not uniform due to the burr generated by the shearing force during press working. There was a problem of deterioration.

In addition, the terminal as described above has a problem in that the quality of the product is poor because the plating is not properly made on the sharp surface generated by the burr when performing a post-process, such as plating on the product, due to the sharp surface generated at this time There was also a problem that the scratches occur in the memory module, and as a result of having a large number of terminals manufactured separately and each terminal inserted into the socket housing manually by inserting one by one, there was also a problem that the assembly is very poor.

In addition, the terminal as described above has a problem that the contact surface is easily deformed or spaced as the pin contact portion and the connection pin is connected by the fitting coupling, resulting in poor contact.

Accordingly, the present invention has been made in order to solve the conventional problems as described above, the object is that the terminal used for the test socket of the memory module is processed by the contact contact portion and the pin contact portion integrally produced by bending. It is in a ship.

In addition, an object of the present invention is to simplify the operation of inserting the terminal inside the socket housing and at the same time to prevent the contact contact portion is separated out of the socket housing.

In addition, an object of the present invention is to ensure that the contact contact portion is firmly fixed to the inside of the socket housing.

In addition, an object of the present invention is to make the pin contact portion elastically in close contact with the connecting pin.

It is also an object of the present invention to prevent the pin contact portion from moving inside the socket housing.

In order to achieve the above object, the present invention is a terminal fixed to the inside of the socket housing to which the memory module is coupled in contact with the contacts of the memory module, the upper side is bent in an S-shape the outer surface of the contact of the memory module And a contact portion contacting the contact portion; and a pin contact portion extending downwardly vertically by integrally bending the lower end of the contact contact portion so that the outer surface of the connection pin to be connected to the circuit board is in contact with one side thereof. .

In addition, the contact contact portion; is characterized in that the engaging piece bent to be fixed to the inside of the socket housing at the upper end is formed.

In addition, it characterized in that the engaging projection is fixed to the inside of the socket housing to the outside of the contact contact portion is formed.

In addition, the one side of the pin contact portion is bent to elastic contact with the connecting pin is characterized in that the contact protrusion protruding.

In addition, the outer side of the pin contact portion is characterized in that the fixing projections are fixed to the inside of the socket housing formed.

Hereinafter, preferred embodiments of the present invention will be described in more detail with reference to the accompanying drawings.

1 is a perspective view showing an example of a memory module socket according to the present invention, Figure 2 is an enlarged perspective view of the main part of the present invention, Figure 3 is a longitudinal cross-sectional view showing a state of use of the present invention, as shown The present invention relates to a test socket of a memory module 10 that checks an operation state by supplying current and a signal to a conventional memory module 10 used in a computer, and the like, in particular, of a metal material inserted into the socket housing 20. The terminal 30 is formed of a contact contact part 31 and a pin contact part 32 which are bent at one time to maintain a more uniform contact surface with the memory module 10 so that the contactability is excellent. .

The memory module 10 is used in a general computer or the like, and a plurality of contacts 12 are formed at a lower side of the substrate 11, and a plurality of memory chips 13 are attached to the substrate 11 to form a substrate ( The lower side of 11) is inserted into the socket and at the same time the contact 12 is in contact with the terminal 30 inserted into the socket housing 20 so that the current and the signal are connected.

The socket housing 20 forms the body of the socket, and is fixed to the circuit board of the inspection equipment, and the memory coupling groove 21 opened to the upper side to receive and fix the lower end of the memory module 10 described above to the upper side. And a terminal fixing groove 22 in which the terminal 30 is inserted into a position corresponding to the contact 12 of the memory module 10 inside the memory coupling groove 21.

The terminal 30 is inserted into and fixed to the inside of the terminal fixing groove 22 to make an electrical connection while being in contact with the contact 12 of the memory module 10, and inside the socket housing 20. The number corresponding to the contact 12 is inserted, and an integral metal wire having electrical conductivity is bent so that the contact contact part 31 is formed at the upper side, and the pin contact part 32 is formed at the lower side thereof.

The contact contact part 31 is a part that elastically contacts the contact 12 of the memory module 10 and is formed by bending a metal material in an S-shape, and an outer end thereof is an inner side of the memory coupling groove 21. The substrate 11 of the memory module 10 is inserted into the memory coupling groove 21 so that the contact 12 is in close contact with the outer surface of the contact contact part 31.

The pin contact portion 32 is formed by integrally bending the lower end of the contact contact portion 31 vertically downward, and the connection pin 23 for contacting the terminal 30 to the circuit board is in contact, the connection The pin 23 is formed of a conventional metal wire, the upper end is inserted into the lower surface of the socket housing 20 is disposed inside the terminal fixing groove 22, the lower end protrudes below the socket housing 20, inspection equipment It is fixed to the circuit board of the soldering, and the outer surface of the pin contact portion 32 is in contact with each other and the outer surface of the upper side of the connecting pin 23 so that the electrical connection is made.

Accordingly, the contact contact portion 31 and the pin contact portion 32 of the terminal 30 are bent to form a contact surface of the contact contact portion 31 and the memory module 10 and the contact surface of the pin contact portion 32 and the connection pin 23. Compared to the conventional manufacturing method, it is possible to maintain a more uniform state, and as the contact area increases, the contactability is not only excellent, but also the plurality of terminals 30 can be arranged and processed in parallel in an integrated state. As a result, productivity is increased, and the plurality of terminals 30 can be inserted into the socket housing 20 while being integrally connected, thereby improving the assemblability.

In addition, the upper end of the contact contact portion 31 is formed with a locking piece 311 bent vertically upwards, and a support jaw for supporting the upper surface of the locking piece 311 is formed inside the socket housing 20 By preventing the contact contact portion 31 from being pushed to the upper side while being fixed to the support jaw, when the memory module 10 coupled to the socket housing 20 is pulled out of the socket, the terminal 30 is simultaneously pulled out and the socket housing ( By preventing the separation from 20), it is desirable to maintain a stable connection even in the repetitive coupling and disconnection of the memory module 10.

In addition, the rear side of the contact contact portion 31 by forming a locking projection 312 protruding outward so that the terminal 30 is fixed to the inside of the socket housing 20, the terminal 30 is the socket housing 20 It is desirable to be firmly fixed to the inner side of the c) and to prevent stable movement while maintaining a stable connection state.

In addition, the pin contact portion 32 is bent to elastically contact the connection pin 23 to one side to form a protruding contact protrusion 321 so that the connection pin 23 and the pin contact portion 32 elastically close to each other. In order to maintain a more stable and smooth connection state, it is preferable to form a fixing protrusion 322 that is fixed to an inner side surface of the socket housing 20 on the outside of the pin contact portion 32. ) Is more preferably fixed to the inside of the socket housing (20).

As described above, the present invention allows the terminal to be integrally processed by the contact contact portion and the pin contact portion by bending, thereby maintaining a more uniform contact surface than the terminal manufactured by the conventional press working method. Not only the contactability is excellent, but also it is possible to manufacture by connecting a plurality of terminals integrally has the effect of improving the assembly.

In addition, the present invention is to facilitate the operation of inserting the terminal inside the socket housing by forming a locking piece at the end of the contact contact portion and at the same time to prevent the contact contact portion from being separated out of the socket housing, when removing the memory module from the socket The terminal can be prevented from being pushed out of the socket housing, thereby increasing the reliability of the socket, and having the effect of stably repetitive coupling and detachment of the memory module.

In addition, the present invention by forming a locking projection on the outside of the contact contact portion to securely fixed to the inside of the socket housing, the terminal is prevented from moving inside the socket housing to achieve a stable and smooth connection with the memory module Have.

In addition, the present invention by forming a contact protrusion in the pin contact portion to be elastically in close contact with the connecting pin, so that even when the impact and vibration is applied from the outside, the terminal and the connecting pin to maintain a stable connection state do.

In addition, the present invention forms a fixing projection on the pin contact portion to prevent the pin contact portion from moving inside the socket housing, the terminal is more firmly fixed to the inside of the socket housing is more stable and smoothly connected to the terminal of the memory module Will have an effect.

Claims (5)

In the terminal 30 is fixed to the inside of the socket housing 20 to which the memory module 10 is coupled to contact the contacts 12 of the memory module 10, Contact contact portion 31 is bent in an S-shape toward the upper side and the outer surface is in contact with the contact 12 of the memory module 10; and A pin contact portion 32 which is bent integrally with the lower end of the contact contact portion 31 so that the outer surface of the connection pin 23 to be connected to the circuit board is in contact with one side thereof; Terminal for the memory module test socket. The method of claim 1, The contact contact portion 31; The terminal of the socket for the memory module test, characterized in that the hook piece 311 is bent to be fixed to the inside of the socket housing 20 at the upper end. The method of claim 2, The terminal of the memory module test socket, characterized in that the engaging projection 312 is formed to be fixed to the inside of the socket housing 20 to the outside of the contact contact portion 31. The method according to any one of claims 1 to 3, The terminal of the memory module test socket, characterized in that the one side of the pin contact portion 32 is bent so as to elastically contact the connection pins 23 protruding contact protrusions (321) is formed. The method of claim 4, wherein The terminal of the memory module test socket, characterized in that the fixing projection 322 is formed to be locked to the inside of the socket housing 20 to the outside of the pin contact portion 32.
KR1020070033188A 2007-04-04 2007-04-04 A terminal of a socket for a memory module KR20080090102A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020070033188A KR20080090102A (en) 2007-04-04 2007-04-04 A terminal of a socket for a memory module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070033188A KR20080090102A (en) 2007-04-04 2007-04-04 A terminal of a socket for a memory module

Publications (1)

Publication Number Publication Date
KR20080090102A true KR20080090102A (en) 2008-10-08

Family

ID=40151488

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070033188A KR20080090102A (en) 2007-04-04 2007-04-04 A terminal of a socket for a memory module

Country Status (1)

Country Link
KR (1) KR20080090102A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200109492A (en) * 2019-03-13 2020-09-23 주식회사 오킨스전자 Vertical gender for semiconductor test and manufacturing method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200109492A (en) * 2019-03-13 2020-09-23 주식회사 오킨스전자 Vertical gender for semiconductor test and manufacturing method thereof

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E902 Notification of reason for refusal
E601 Decision to refuse application