KR20080088084A - Apparatus and method for treating substrate - Google Patents

Apparatus and method for treating substrate Download PDF

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Publication number
KR20080088084A
KR20080088084A KR1020070030485A KR20070030485A KR20080088084A KR 20080088084 A KR20080088084 A KR 20080088084A KR 1020070030485 A KR1020070030485 A KR 1020070030485A KR 20070030485 A KR20070030485 A KR 20070030485A KR 20080088084 A KR20080088084 A KR 20080088084A
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KR
South Korea
Prior art keywords
chucking
substrate
chucking pins
pins
spin chuck
Prior art date
Application number
KR1020070030485A
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Korean (ko)
Inventor
김시은
Original Assignee
세메스 주식회사
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Publication date
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Priority to KR1020070030485A priority Critical patent/KR20080088084A/en
Publication of KR20080088084A publication Critical patent/KR20080088084A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

The present invention relates to a substrate processing apparatus having a plurality of chucking pins and a processing method for chucking a substrate thereof. The substrate processing apparatus divides and sets a plurality of groups including the same number of chucking pins in order to alternately drive the plurality of chucking pins. The substrate processing apparatus alternately drives each group of chucking pins when the substrate is seated on the spin chuck during processing, thereby smoothing the fluid flow around the chucking pins. Therefore, according to the present invention, by smoothing the flow of the fluid during the process, it is possible to improve the process effect, it is possible to prevent damage to the substrate in the subsequent process.

Description

Substrate processing apparatus and its processing method {APPARATUS AND METHOD FOR TREATING SUBSTRATE}

1 is a perspective view showing the configuration of a substrate processing apparatus according to the present invention;

2 is a cross-sectional view of the substrate processing apparatus shown in FIG. 1;

3 is a plan view of the substrate processing apparatus shown in FIG. 1;

4A-4B are cross-sectional views illustrating the cross chucking state of chucking pins in accordance with the present invention; And

5 is a flowchart showing a cross chucking procedure of the substrate processing apparatus according to the present invention.

Explanation of symbols on the main parts of the drawings

100 substrate processing apparatus 102 chamber

104: spin chuck 106: axis of rotation

108: control unit 110: support pin

120, 122 to 124: chucking pin 130: drive unit

The present invention relates to a substrate processing apparatus, and more particularly, to a substrate processing apparatus having a plurality of chucking pins and a processing method for driving the chucking pins thereof.

In general, semiconductor manufacturing apparatus are manufactured by repetitive performance of unit processes such as deposition, photolithography, etching, chemical mechanical polishing, cleaning, and drying. Among these unit processes, a cleaning and drying process is a process of removing foreign matter or unnecessary film remaining on the surface of the semiconductor substrate during each unit process.

For example, a substrate processing apparatus for processing a cleaning and drying process is divided into a batch type for cleaning a plurality of substrates at the same time and a sheet type for cleaning a substrate in sheet units. Among them, the single wafer cleaning apparatus, that is, the substrate processing apparatus includes a spin chuck for supporting a single substrate and at least one nozzle for supplying cleaning liquids to the substrate processing surface. When the substrate is mounted on the spin chuck, the substrate processing apparatus supports the substrate using a plurality of support pins provided on the spin chuck, and chucks an edge portion of the substrate using the plurality of chucking pins. This prevents the substrate from being separated from the spin chuck during the process. Subsequently, the substrate processing apparatus sequentially sprays the cleaning liquid, the rinse liquid and the drying gas through the nozzle to the substrate to clean and dry the substrate.

However, the substrate processing apparatus chucks the substrate by the chucking pins even during the process, thereby preventing the flow of the fluids required for the cleaning process around the substrate. Therefore, the surface of the substrate around the chucking pins may have a deterioration in cleaning effect or water spots, which may cause process errors in subsequent processes.

It is an object of the present invention to provide a substrate processing apparatus and method for driving a plurality of chucking pins to smooth the flow of fluid required for the process.

Another object of the present invention is to provide a substrate processing apparatus having a plurality of chucking pins and a processing method for cross chucking its chucking pins.

In order to achieve the above objects, the substrate processing apparatus of the present invention has a feature of dividing and setting a plurality of chucking pins in the same number during a process process and alternately driving the divided chucking pins. As such, the substrate treating apparatus smoothes the fluid flow around the plurality of chucking pins during the processing.

A substrate processing apparatus of the present invention, a spin chuck on which a substrate is mounted; A plurality of chucking pins provided on an upper surface of the spin chuck to chuck the substrate seated on the spin chuck so as not to be separated when the spin chuck is rotated; A driving unit driving the plurality of chucking pins to chuck and release the substrate seated on the spin chuck; The plurality of chucking pins are divided into first and second chucking pins having the same number, and the substrate is alternately alternately formed by each of the divided first and second chucking pins during the process of the substrate processing apparatus. And a control unit controlling the driving unit to chuck.

In one embodiment, the control unit; The plurality of chucking pins are divided and set to prevent the substrate seated on the spin chuck from being separated by the first or second chucking pins.

In another embodiment, the plurality of chucking pins include first to sixth chucking pins; The first chucking pins include the first, third and fifth chucking pins, and the second chucking pins include the second, fourth and sixth chucking pins.

According to another feature of the invention, the substrate of the substrate processing apparatus having a plurality of chucking pins on the upper surface of the spin chuck on which the substrate is seated, and setting the chucking pins into the same number of first and second chucking pins A processing method for chucking is provided. According to this method, the first and second chucking pins are chucked. When the substrate is seated on the spin chuck, the substrate is chucked with the first and second chucking pins. Rotate the spin chuck. The process fluid is supplied to the substrate. Alternately chuck the first and second chucking pins. Determine if the process is complete. When the process is complete the supply of the fluid is stopped. Then the rotation of the spin chuck is stopped.

In one embodiment, the alternately chucking; Chucking the first chucking pins while the substrate is chucked by the first and second chucking pins; Chucking the first chucking pins again; Chucking the second chucking pins; Chucking the second chucking pins again; If the process is not completed, repeat chucking alternately.

In another embodiment, the alternately chucking; The substrate is fixed by the first or second chucking pins so as not to be separated from the spin chuck.

In yet another embodiment, chucking and unchucking a substrate using the first or second chucking pins; Each of the chucking pins keeps the upper state of the spin chuck up to chuck the substrate, and each of the chucking pins keeps the same state as the top surface of the spin chuck to dechuck the substrate.

The embodiments of the present invention may be modified in various forms, and the scope of the present invention should not be interpreted as being limited by the embodiments described below. This embodiment is provided to more completely explain the present invention to those skilled in the art. Therefore, the shape of the components in the drawings, etc. have been exaggerated to emphasize a more clear description.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to FIGS. 1 to 5.

1 and 2 are diagrams showing the configuration of a substrate processing apparatus according to the present invention.

1 and 2, the substrate processing apparatus 100 may fix an edge portion of the substrate W to prevent separation of the substrate W on the spin chuck 104 on which the substrate (W in FIG. 2) is seated. And a plurality of chucking pins 120 to chuck. According to the present invention, the substrate processing apparatus 100 chucks the substrate W by crossing some or all of the plurality of chucking pins 120.

Specifically, the substrate processing apparatus 100 may include, for example, a process chamber 102 that processes a cleaning process, a spin chuck 104 provided inside the process chamber 102, and a substrate on which the substrate is mounted, and the spin chuck 104. A plurality of support pins 110 provided on the upper surface, a plurality of chucking pins 120 provided corresponding to the respective support pins 110, the substrate W mounted on the spin chuck 104 And a plurality of chucking pins (130 of FIG. 2) to close / open (up / down) some or all of the plurality of chucking pins 120 to chuck and unchuck them. A portion of the 120 includes a controller (108 in FIG. 2) for controlling the drive unit 130 to cross chuck.

The spin chuck 104 includes a plurality of support pins 110 and a plurality of chucking pins 120 on an upper surface thereof to support the substrate W and to chuck an edge portion of the substrate W to process the process. In progress, the substrate W is prevented from being separated by the rotation of the spin chuck 104. That is, the spin chuck 100 is provided with a plurality of chucking pins 120 (eg, about 6 to about 8) at equal intervals at the edge of the upper surface on which the substrate W is placed, and inside the plurality of chucks. The support pins 110 are installed at equal intervals. The support pins 110 support the rear surface of the substrate W, and the chucking pins 120 prevent the substrate W from being separated from the spin chuck 104 by centrifugal force. Therefore, the substrate W seated on the spin chuck 104 is chucked to the rear edge and side surfaces of the substrate W by the close state of the chucking pins 120 while being supported by the support pins 110. Or chucked by an open state. For example, the chucking pins 120 may be operated in the open state by being lowered in the same manner as the upper surface of the spin chuck 104 and protruded above the spin chuck 104 to operate in the closed state.

In addition, the chucking pins 120 are divided into at least two groups, and are disposed at equal intervals so that the substrates W are chucked by each of the divided groups. Therefore, during the process, the substrate processing apparatus 100 chucks the substrate W by driving the divided groups alternately.

In addition, the spin chuck 104 is coupled to the rotary shaft 106 at the bottom, and is rotated by receiving the rotational force of the driving device (not shown) (for example, a spin motor) through the rotary shaft 106.

For example, the driver 130 includes a cylinder for eccentrically rotating and vertically moving the chucking pins 120, and drives the chucking pins 120 to cross-chuck the substrate W under the control of the controller 108.

In addition, the controller 108 may include, for example, a controller, a programmable logic controller (PLC), a computer device, or the like. The controller 108 may include substrate transfer, fluid supply, and spin chuck driving according to the process of the substrate processing apparatus 100. Control the operation. The controller 108 has a control program therein to control the substrate W mounted on the spin chuck 104 to cross-chuck during the process, thereby controlling the driver 130 as the process proceeds.

Referring to FIG. 3, the substrate processing apparatus 100 may include a plurality of chucking pins in order to prevent an undesired flow of fluid by a plurality of chucking pins 120: 122, 124 installed on the spin chuck 104. 120 divides the substrate into the same number of groups 122 and 124 and chucks the substrate W by driving the divided chucking pins 122 and 124 to cross each other. At this time, each of the divided groups 122 and 124 is disposed so that the substrate W is not separated from the spin chuck 104 by the plurality of chucking pins 122a to 122c and 124a to 124c. For example, the substrate processing apparatus 100 may include first to sixth chucking pins 122a to 122c and 124a to 124c, and may include first, third and fifth chucking pins as illustrated in FIG. 3. 122a to 122c are set to the first chucking pins 122, and the second, fourth and sixth chucking pins 124a to 124c are set to the second chucking pins 124, respectively And the second chucking pins 122 and 124 alternately close and open to chuck the substrate W seated on the spin chuck 104. As another example, when the chucking pins 120 are eight, it is obvious to divide the four alternately located chucking pins 120 into two groups and chuck the substrate into each group.

Specifically, the cross chucking operation of the plurality of chucking pins according to the present invention is as follows.

That is, referring to FIG. 4A, the first chucking pins 122: 122a to 122c of the plurality of chucking pins 120 may be driven in a closed state with the substrate W mounted on the spin chuck 104. Chuck W) and the remaining second chucking pins 124: 124a-124c are driven open to chuck the substrate W. FIG. Referring to FIG. 4B, the first chucking pins 122 that are previously chucked are driven to an open state to chuck the substrate W, and the remaining second chucking pins 124 are closed to drive the substrate. Chuck (W). And for cross chucking of the first and second chucking pins 122, 124, both the first and second chucking pins 122, 124 are closed in a first or second chucking pin 122 or 124 drives to an open state. Therefore, the spin chuck 104 interrupts the flow of fluid generated by the chucking pins 120 when the substrate W is rotated at high speed because the chucking pins 120: 122 and 124 are driven at the intersection during processing. Can be prevented.

As described above, the substrate processing apparatus 100 according to the present invention divides and sets a plurality of chucking pins 120 into group units 122 and 124, and each of the chucking pins 122 and 124 that are divided. By driving them to cross chuck, it smooths the flow of fluids needed for the process around the chucking pins 120. Therefore, the cleaning effect can be improved, and the effect of preventing damage to the substrate W in a subsequent process can be obtained.

5 is a flowchart showing the cross chucking procedure of the substrate processing apparatus according to the present invention. This procedure is a control program processed by the controller 108 and is stored in a memory device (not shown) of the controller 108.

Referring to FIG. 5, in operation S150, both the first and second chucking pins 122 and 124 are opened. When a process (eg, a cleaning process) is performed in step S152 and the substrate W is seated on the spin chuck 104, both the first and second chucking pins 122 and 124 are closed in step S154. The substrate W is chucked. In step S156, the spin chuck 104 is rotated, and in step S158, the substrate is supplied from an apparatus (e.g., nozzle) (not shown) for supplying a fluid (e.g., cleaning liquid, etching liquid and / or dry gas, etc.). (W) to inject the fluid according to the cleaning process.

In operation S160, the first chucking pins 122 are driven to an open state. That is, the first chucking pins 122 are open to chuck the substrate W, and the second chucking pins 124 remain closed to chuck the substrate W continuously. In operation S162, the first chucking pins 122 are driven to a closed state. That is, the first chucking pins 122 are open and the second chucking pins 124 are closed, so that the first and second chucking pins 122, 124 are first closed again for cross chucking. The substrate W is chucked by driving in the state. In operation S164, the first and second chucking pins 122 and 124 drive the second chucking pins 124 in the closed state. Accordingly, the first and second chucking pins 122 and 124 cross-chuck each other in steps S160 to S164. In operation S166, both of the first and second chucking pins 122 and 124 are driven in a closed state to drive the second chucking pins 124 in a closed state to chuck the substrate W. FIG.

In step S168, it is determined whether the process is completed, and when the process is completed, the procedure proceeds to step S160 to repeat the processing of steps S160 to S166 to cross chuck the first and second chucking pins 122 and 124. When the process is completed, the flow advances to step S170 to stop the fluid injection and stop the rotation of the spin chuck 104 in step S172.

Therefore, the substrate processing apparatus 100 of the present invention cross-chucks the plurality of chucking pins 120 to smooth the flow of the fluid, thereby obtaining a uniform cleaning effect.

In the above, the configuration and operation of the substrate processing apparatus according to the present invention are shown in accordance with the detailed description and drawings, which are merely described by way of example, and various changes and modifications may be made without departing from the spirit of the present invention. It is possible.

As described above, the substrate processing apparatus of the present invention can smoothly flow the fluid around the plurality of chucking pins by dividing the plurality of chucking pins into groups and driving the divided chucking pins crosswise.

For this reason, the substrate processing apparatus of this invention can improve the cleaning effect, and can acquire the effect of preventing a board | substrate damage in a subsequent process.

Claims (7)

In the substrate processing apparatus: A spin chuck on which the substrate is seated; A plurality of chucking pins provided on an upper surface of the spin chuck to chuck the substrate seated on the spin chuck so as not to be separated when the spin chuck is rotated; A driving unit driving the plurality of chucking pins to chuck and release the substrate seated on the spin chuck; The plurality of chucking pins are divided into first and second chucking pins having the same number, and the substrate is alternately alternately formed by each of the divided first and second chucking pins during the process of the substrate processing apparatus. And a control unit for controlling the driving unit to chuck. The method of claim 1, The control unit; And dividing the plurality of chucking pins to prevent the substrate seated on the spin chuck from being separated by the first or second chucking pins. The method of claim 2, The plurality of chucking pins include first to sixth chucking pins; Wherein the first chucking pins comprise the first, the third and the fifth chucking pins, and the second chucking pins comprise the second, fourth and sixth chucking pins. Substrate processing apparatus. In the processing method of the substrate processing apparatus comprising a plurality of chucking pins on the upper surface of the spin chuck on which the substrate is seated, and setting the chucking pins into the same number of first and second chucking pins: Chucking the first and second chucking pins; When the substrate is seated in the spin chuck, chucking the substrate with the first and second chucking pins; Rotate the spin chuck; Supplying a fluid for processing into a substrate; Alternately chuck the first and second chucking pins; Determine whether the process is complete; Stopping the supply of the fluid when the process is complete; next The processing method of the substrate processing apparatus characterized by the stop of rotation of the said spin chuck. The method of claim 4, wherein Alternately chucking; Chucking the first chucking pins while the substrate is chucked by the first and second chucking pins; Chucking the first chucking pins again; Chucking the second chucking pins; Chucking the second chucking pins again; If the process is not completed, the chucking alternately is repeated. The method according to claim 4 or 5, Alternately chucking; And the substrate is fixed by the first or second chucking pins so as not to be separated from the spin chuck. The method according to claim 4 or 5, The chucking and the chucking release; Substrate chucking by chucking the substrate by keeping each of the chucking pins up on the spin chuck and keeping the chucking pins down with the upper surface of the spin chuck. Method of treatment of the device.
KR1020070030485A 2007-03-28 2007-03-28 Apparatus and method for treating substrate KR20080088084A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102569150A (en) * 2012-02-23 2012-07-11 北京七星华创电子股份有限公司 Device and method for clamping easily cleaned thin-walled disc
KR20190042524A (en) * 2012-08-07 2019-04-24 도쿄엘렉트론가부시키가이샤 Substrate cleaning device, substrate cleaning system, substrate cleaning method and storage medium

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102569150A (en) * 2012-02-23 2012-07-11 北京七星华创电子股份有限公司 Device and method for clamping easily cleaned thin-walled disc
WO2013123742A1 (en) * 2012-02-23 2013-08-29 北京七星华创电子股份有限公司 Easy-to-clean clamping device and method for thin-walled disk-shaped object
KR20190042524A (en) * 2012-08-07 2019-04-24 도쿄엘렉트론가부시키가이샤 Substrate cleaning device, substrate cleaning system, substrate cleaning method and storage medium

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