KR20080083798A - Dumping unit and chip mounter having the same - Google Patents

Dumping unit and chip mounter having the same Download PDF

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Publication number
KR20080083798A
KR20080083798A KR1020070024451A KR20070024451A KR20080083798A KR 20080083798 A KR20080083798 A KR 20080083798A KR 1020070024451 A KR1020070024451 A KR 1020070024451A KR 20070024451 A KR20070024451 A KR 20070024451A KR 20080083798 A KR20080083798 A KR 20080083798A
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KR
South Korea
Prior art keywords
unit
electronic component
roller
nozzle
case
Prior art date
Application number
KR1020070024451A
Other languages
Korean (ko)
Inventor
박민규
Original Assignee
삼성테크윈 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성테크윈 주식회사 filed Critical 삼성테크윈 주식회사
Priority to KR1020070024451A priority Critical patent/KR20080083798A/en
Publication of KR20080083798A publication Critical patent/KR20080083798A/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

A dumping unit and a chip mounter having the same are provided to store a defective component stably in a storage place by guiding the defective component separated from a nozzle to the storage place. A dumping unit includes a case(100), a roller(200), and a guide(250). The case has an inner space, and an upper part thereof is opened. The roller is rotatably installed by supporting both ends thereof to the case. The roller has protrusions(210), which collide with an electronic component(10), on an outer peripheral surface thereof. One end of the guide is substantially in contact with outer surfaces of the protrusions along a length of the roller, and the other end thereof is installed inside the case to be inclined to a predetermined position of the case.

Description

DUMPING UNIT AND CHIP MOUNTER HAVING THE SAME}

1 is a perspective view showing a dumping unit of the present invention and a surface mounter having the same.

2 is a block diagram showing the operation of the dumping unit of the present invention.

3 is a cross-sectional view showing one embodiment of a roller according to the present invention.

4 is a cross-sectional view showing another embodiment of a roller according to the present invention.

5 is a cross-sectional view showing a state before operation of the dumping unit of the present invention.

6 is a cross-sectional view showing a state after the operation of the dumping unit of the present invention.

** Description of symbols for the main parts of the drawing **

50 nozzle part

60: vacuum generator

70: nozzle XY drive unit

80 nozzle raising unit

90: vision inspection unit

100: case

200: roller

210: protrusion

300: rotating motor

400: control unit

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mounter, and more particularly, to a dumping unit and a surface mounter having the same, which can easily remove and store a fail chip adsorbed by a nozzle using an external force.

Generally, a surface mounter is a device for mounting a small electronic component such as an IC chip or a resistor chip on a printed circuit board.

The surface mounter includes a transfer unit for transferring a printed circuit board to a predetermined position, a component supply unit for supplying a plurality of electronic components to be mounted on the printed circuit board, and a transfer unit for transferring the electronic components to be mounted on the printed circuit board. It consists of a header part.

The header portion is mounted on an XY robot capable of plane, elevating and rotating movement of an electronic component supplied through the component supply portion from an arbitrary position point on a rectangular coordinate.

Accordingly, the header part may be moved to a position where the electronic component is supplied and a predetermined position on the printed circuit board by the operation of the XY robot.

Here, the header portion has a nozzle that individually adsorbs electronic components supplied from the component supply portion.

The nozzle is formed with a vacuum line connected to the nozzle tip formed at its end. The vacuum line is connected to the vacuum generating unit and the tube.

When a vacuum is generated from the vacuum generating unit to the vacuum line through the tube, a predetermined vacuum pressure is formed on the nozzle tip.

Accordingly, when the header portion is moved upward by the XY robot and lowered toward one surface of the electronic component, the nozzle tip of the nozzle is in close contact with one surface of the electronic component. When a vacuum is provided from the vacuum generator to the nozzle tip, the nozzle sucks one surface of the electronic component.

Subsequently, the header part is transferred to a predetermined position on the printed circuit board on which the electronic component is to be mounted by an XY robot and lowered to the predetermined position of the printed circuit board, whereby the electronic component may be mounted on the printed circuit board.

At this time, the conventional surface mounter has a dump function.

The dump function is a function of forcibly disengaging from the nozzle when the electronic component absorbed by the nozzle is an abnormal component.

More specifically, conventional nozzles adsorb electronic components. At this time, the vision inspection unit installed in the surface mounter determines whether the electronic component adsorbed by the nozzle is a normal component or an abnormal component.

Here, when the electronic component adsorbed to the nozzle in the vision inspection unit is an abnormal component, the controller releases the vacuum provided to the vacuum line of the nozzle through the vacuum generating unit. Therefore, the electronic component adsorbed on the nozzle tip is separated from the nozzle and falls below it.

At this time, conventionally, when the nozzle tip, which is the end of the nozzle, is magnetized, there is a problem that the electronic component is not easily separated from the nozzle tip even when the vacuum is released as described above.

In addition, conventionally, even if the nozzle tip is made of ceramic to prevent the magnetization as described above, there is a problem that the electronic component is not normally separated from the nozzle due to the foreign matter between the nozzle tip and the electronic component.

Accordingly, the present invention has been made to solve the above problems, and the first object of the present invention is to apply the abnormal parts to the abnormal parts by applying an impact force from the outside when the electronic parts adsorbed to the nozzle are the abnormal parts. The present invention provides a dumping unit and a surface mounter having the same, which can be easily separated from the nozzle.

A second object of the present invention is to provide a dumping unit and a surface mounter having the same, which can stably store the abnormal parts by guiding the abnormal parts separated from the nozzle to a storage position.

The present invention provides a dumping unit in order to achieve the above object.

The dumping unit has a case having an inner space formed therein and an upper portion thereof, a roller having both ends supported and rotated on the case, a roller having protrusions colliding with an electronic component on an outer circumferential surface thereof, and one end thereof in a longitudinal direction of the roller. And a guide substantially in contact with the outer surface of the protrusions and installed inside the case so that the other end is inclined to a predetermined position of the case.

Here, the protrusion is preferably made of a brush.

In addition, the protrusion is preferably made of a sponge.

In addition, one end of the roller may be connected to the rotary motor.

The rotating motor may be connected to the control unit. The controller may control the rotational speed of the roller by transmitting a drive signal to the rotary motor.

In addition, both ends of the roller may be inserted and supported in a lifting hole formed in a predetermined length along a vertical direction with respect to the bottom of the case.

Both ends of the roller supported by the lifting hole may be connected to a driving cylinder.

The driving cylinder may lift both ends of the roller along the lifting hole.

The present invention provides a surface mounter having a dumping unit in order to achieve the above object.

In the surface mounter, an electronic component mounted on a printed circuit board is adsorbed at an end thereof, and the nozzle part is lifted up and the bottom part of the nozzle part is applied to the electronic component adsorbed at the end of the nozzle part. And a dumping unit for disengaging the component from the nozzle portion.

Here, the dumping unit is formed so that the inner space is formed, the top is opened, the case is located at the bottom of the nozzle portion, the both ends are supported and rotated on the case, and a roller provided with a protrusion to collide with the electronic component on the outer peripheral surface; A guide having one end substantially in contact with the outer surface of the protrusions along the lengthwise direction of the roller, the other end being inclined to a predetermined position of the case, and whether the electronic component sucked into the nozzle part is a normal part. It is preferable to include a vision inspection unit for determining whether or not an abnormal component, and a control unit for applying an impact force rotated to the electronic component by colliding the projections and the electronic component when the electronic component is an abnormal component.

The control unit preferably lowers the nozzle unit and applies an impact force to the electronic component.

In addition, the controller may raise the roller to apply an impact force rotated to the electronic component.

In addition, the protrusion may be made of a brush or a sponge.

In addition, one end of the roller may be connected to the rotary motor.

The rotating motor may be connected to the control unit. The controller may control the rotational speed of the roller by transmitting a drive signal to the rotary motor.

In addition, both ends of the roller may be inserted and supported in a lifting hole formed in a predetermined length along a vertical direction with respect to the bottom of the case.

Both ends of the roller supported by the lifting hole may be connected to a driving cylinder.

The driving cylinder may lift both ends of the roller along the lifting hole.

Hereinafter, with reference to the accompanying drawings, it will be described the dumping unit of the present invention and the surface mounter having the same.

1 is a perspective view showing a dumping unit of the present invention and a surface mounter having the same. 2 is a block diagram showing the operation of the dumping unit of the present invention. 3 is a cross-sectional view showing one embodiment of a roller according to the present invention. 4 is a cross-sectional view showing another embodiment of a roller according to the present invention. 5 is a cross-sectional view showing a state before operation of the dumping unit of the present invention. 6 is a cross-sectional view showing a state after the operation of the dumping unit of the present invention.

1 and 2, the surface mounter having the dumping unit of the present invention has a nozzle part 50 which is lifted and lifted by an electronic component 10 mounted on a printed circuit board (not shown) at an end thereof; The nozzle XY drive part 70 which changes the position of the said nozzle part 50 along an XY axis, and the nozzle lifting part 80 which raises and lowers the said nozzle part 50 are provided.

Here, the nozzle XY driving unit 70 and the nozzle lifting unit 80 is electrically connected to the control unit 400. The controller 400 may drive the nozzle XY driver 70 and the nozzle lift unit 80.

The nozzle unit 50 is equipped with a nozzle tip 51 at the end thereof. A vacuum line 52 connected to the nozzle tip 51 is formed inside the nozzle unit 50. The vacuum line 52 is connected to the vacuum generator 60 and the tube 61.

The surface mounter is located at the bottom of the nozzle unit 50 to apply an impact force that is rotated to the electronic component 10 adsorbed to the end of the nozzle unit 50 to the electronic component 10 to the nozzle unit 50. And a dumping unit for disengaging from it.

The dumping unit is provided with an inner space, an upper portion of which is opened, a case 100 positioned at the bottom of the nozzle unit 50, and both ends supported by the case 100 to be rotated, and an electronic component on an outer circumferential surface thereof. The roller 200 provided with the protrusion 210 colliding with the 10 and one end thereof are substantially in contact with the outer surface of the protrusion 210 along the longitudinal direction of the roller 200, and the other end of the case 100. Vision inspection unit 90 to determine whether the guide 250 is installed in the case 100 inclined to a predetermined position, and whether the electronic component 10 adsorbed by the nozzle unit 50 is a normal component or an abnormal component ) And a control unit 400 for impacting the protrusion 210 and the electronic component 10 against each other and applying an impact force to the electronic component 10 when the electronic component 10 is an abnormal component. Equipped.

In more detail, the case 100 has an inner space and an upper portion thereof is opened. In addition, both sides of the case 100 are provided with rotation support holes 110 into which both ends 220 of the roller 200 are fitted.

Both ends 220 of the roller 200 are connected to the rotary motor 300.

The rotary motor 300 may be connected to the control unit 400. The controller 400 may control the rotation speed of the roller 200 by transmitting a driving signal to the rotation motor 300.

The roller 200 has a protrusion 210 that collides with the electronic component 100 on its outer circumferential surface.

The protrusion 210 may be a brush as shown in FIG. 3, or may be a foam material 210 ′ such as a strofoam or a sponge as shown in FIG. 4.

The inside of the case 100 may further include a guide 250 that substantially contacts the outer surface of the protrusion 210 of the roller 200.

The guide 250 has its bottom surface fixed to the bottom surface of the case 100 and its top surface abuts against the protrusion 210 of the roller 200. In addition, the guide 250 is installed along the length direction of the roller 250.

In particular, the guide 250 has an inclined surface 251. The inclined surface 251 may be an inclined surface that is formed to open toward the bottom from the upper surface of the guide 250.

In addition, although not shown in the drawings, both ends 220 of the roller 200 may be inserted into and supported in a lifting hole formed in a predetermined length along a vertical direction with respect to the bottom surface of the case 100. Both ends of the roller supported by the lifting hole may be connected to a driving cylinder.

Here, the lifting hole may be a hole in which the rotation support hole 110 extends a predetermined length in a vertical direction with respect to the bottom surface of the case 110.

The driving cylinder may lift both ends 220 of the roller 200 along the lifting hole.

The vision inspector 90 may be a camera capable of acquiring image information about the bottom surface of the electronic component 10. The vision inspection unit 90 compares the preset image information of the normal electronic component 10 and the acquired image information with each other, and may recognize it as a fail component when they are different from each other.

The vision inspection unit 90 may be electrically connected to the control unit 400. The controller 400 may drive the nozzle XY driver 70 and the nozzle lifter 80 when the electronic component 10 is an abnormal component.

Next, the operation and effects of the dumping unit of the present invention having the configuration as described above and the surface mounter having the same.

1 and 2, the nozzle unit 50 sucks the electronic component 10 supplied to a predetermined position. The operation of the nozzle unit 50 to suck the electronic component 10 may be performed through the operations of the nozzle XY driving unit 70 and the nozzle lifting unit 80 mentioned above.

Here, the vacuum generator 60 forms a predetermined vacuum in the vacuum line 52 provided in the nozzle unit 50 through the tube 61. Accordingly, the nozzle tip 51 connected to the vacuum line 52 may absorb one surface of the electronic component 10.

As such, the electronic component 10 adsorbed by the nozzle unit 50 may be determined by the vision inspection unit 90 to determine whether the electronic component 10 is a normal component or an abnormal component.

That is, the vision inspection unit 90 acquires image information on the bottom of the electronic component 10. Then, the vision inspection unit 90 determines whether the acquired image information matches the preset image information. For example, if the length and number of the leads 11 of the electronic component 10 do not match the preset length and number information of the leads 11, the component is recognized as an abnormal component.

Subsequently, the vision inspection unit 90 transmits the result recognized as the abnormal component to the control unit 400.

The controller 400 rotates the roller 200 at a constant speed, and contacts the electronic component 10 adsorbed by the nozzle unit 50 to the outer surface of the roller 200, that is, the protrusion 210 of the roller 200. Let's do it.

This operation will be described in detail with reference to FIGS. 5 and 6.

First, the control unit 400 transmits an electrical signal to the rotary motor 300, the rotary motor 300 transmits a rotational force to the rotary shaft 310, this rotational force rotates the roller 200 at a constant rotational speed .

Subsequently, the controller 400 transmits a driving signal to the nozzle XY driving unit 70 to move the nozzle unit 50 to the upper portion of the roller 200, and transmits a driving signal to the nozzle lifting unit 80 to the nozzle. The electronic component 10 adsorbed by the unit 50 is lowered to a position where it is in contact with the protrusion 210 of the roller 200.

Therefore, the electronic component 10 adsorbed by the nozzle unit 50 collides with the protrusion 210 of the roller 200 that is rotated.

At this time, the controller 400 may transmit an electrical signal to the vacuum generator 60 to release the vacuum formed in the vacuum line 52 of the nozzle unit 50.

Accordingly, the electronic component 10 adsorbed to the nozzle unit 50 may be separated from the nozzle tip 51 due to the impact force applied from the protrusion 210 to be rotated and the vacuum released as described above.

Therefore, the separated electronic component 10 may fall on the bottom surface of the case 100. In this case, the electronic component 10 may be bumped away from the bottom surface of the case 100 while being separated from the nozzle tip 51. Accordingly, the electronic components 10 may not be collected in a predetermined space on the bottom surface of the case 100.

In this case, the guide 250 according to the present invention causes the electronic component 10 to strike the inclined surface 251 of the guide 250, thereby guiding and gathering the electronic component 10 to a predetermined position. Can be.

In addition, when the protrusion 210 is a brush as illustrated in FIG. 3, the electronic component 10 separated from the nozzle tip 51 may be sandwiched between the brushes. At this time, since the upper surface of the guide 250 is in contact with the protrusion 210 of the roller 200, the electronic component 10 sandwiched between the brushes is caught by the guide 250, the caught electronic component 10 ) May be guided through the inclined surface 251 of the guide 250 to a predetermined position.

On the other hand, when the protrusion 210 is a foam member 210 'as shown in FIG. 4, since the foam member 210' has a predetermined elastic force, the electronic component 10 that is hit between the foam member 210 ' The impact force can be efficiently transmitted to the electronic component 10 without being pinched, so that the electronic component 10 can be easily detached from the nozzle tip 51.

As described above, the present invention has an effect that the abnormal part can be easily detached from the nozzle by applying an impact force from the outside to the abnormal part when the electronic component absorbed by the nozzle is the abnormal part.

In addition, the present invention has the effect of reliably storing the abnormal parts by guiding the abnormal parts separated from the nozzle to the storage position.

Claims (11)

A case having an inner space formed therein and an upper portion thereof opened; A roller having both ends supported and rotated on the case, and a protrusion provided on the outer circumferential surface thereof to collide with the electronic component; And And a guide having one end substantially in contact with the outer surface of the protrusions along the length direction of the roller, and the other end being installed inside the case such that the other end is inclined to a predetermined position of the case. The method of claim 1, Dumping unit, characterized in that the protrusion is made of a brush. The method of claim 1, Dumping unit, characterized in that the protrusion is made of a sponge. The method of claim 1, One end of the roller is connected to the rotating motor, The rotary motor is connected to the control unit, the control unit dumping unit, characterized in that for controlling the rotational speed of the roller by transmitting a drive signal to the rotary motor. A nozzle unit on which an electronic component mounted on a printed circuit board is adsorbed and lifted at an end thereof; And And a dumping unit positioned at a bottom of the nozzle unit, the dumping unit including a dumping unit for applying an impact force to the electronic component adsorbed at the end of the nozzle unit to release the electronic component from the nozzle unit. The method of claim 5, The dumping unit is provided with a case having an inner space, an upper portion of which is opened and positioned at the bottom of the nozzle unit, both ends of which are supported and rotated on the case, and a roller having a protrusion projected to collide with an electronic component on its outer circumferential surface; A guide which is substantially in contact with the outer surface of the protrusions along the lengthwise direction of the roller and is installed inside the case so that the other end is inclined to a predetermined position of the case; A dumping unit, comprising: a vision inspection unit for determining whether the electronic component is abnormal, and a control unit for causing the protrusions and the electronic component to collide with each other to apply an impact force to the electronic component when the electronic component is an abnormal component. Surface mounter having a. The method of claim 6, The control unit is a surface mounter having a dumping unit, characterized in that for lowering the nozzle unit to apply an impact force rotated to the electronic component. The method of claim 6, The control unit is a surface mounter having a dumping unit, characterized in that for raising the roller to apply an impact force rotated to the electronic component. The method of claim 5, The protrusion has a dumping unit, characterized in that consisting of a brush surface mounter. The method of claim 5, Surface mounter having a dumping unit, characterized in that the protrusion is made of a sponge. The method of claim 5, One end of the roller is connected to the rotating motor, The rotary motor is connected to the control unit, the control unit is a surface mount machine having a dumping unit, characterized in that for controlling the rotational speed of the roller by transmitting a drive signal to the rotary motor.
KR1020070024451A 2007-03-13 2007-03-13 Dumping unit and chip mounter having the same KR20080083798A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020070024451A KR20080083798A (en) 2007-03-13 2007-03-13 Dumping unit and chip mounter having the same

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Application Number Priority Date Filing Date Title
KR1020070024451A KR20080083798A (en) 2007-03-13 2007-03-13 Dumping unit and chip mounter having the same

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KR20080083798A true KR20080083798A (en) 2008-09-19

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200001864A (en) * 2018-06-28 2020-01-07 한화정밀기계 주식회사 Apparatus for dumping component

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200001864A (en) * 2018-06-28 2020-01-07 한화정밀기계 주식회사 Apparatus for dumping component

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