KR20080081662A - Structure for assembling lcd module - Google Patents

Structure for assembling lcd module Download PDF

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Publication number
KR20080081662A
KR20080081662A KR1020070021976A KR20070021976A KR20080081662A KR 20080081662 A KR20080081662 A KR 20080081662A KR 1020070021976 A KR1020070021976 A KR 1020070021976A KR 20070021976 A KR20070021976 A KR 20070021976A KR 20080081662 A KR20080081662 A KR 20080081662A
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KR
South Korea
Prior art keywords
pcb
lcd
lcd module
backlight unit
chassis
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KR1020070021976A
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Korean (ko)
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구태훈
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엘지이노텍 주식회사
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Priority to KR1020070021976A priority Critical patent/KR20080081662A/en
Publication of KR20080081662A publication Critical patent/KR20080081662A/en

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133615—Edge-illuminating devices, i.e. illuminating from the side
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G02F1/133317—Intermediate frames, e.g. between backlight housing and front frame
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2201/00—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
    • G02F2201/46—Fixing elements

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

An assembly structure for an LCD module is provided to enable a chassis made of a conductive material to be fixed and installed in a structure of surrounding an LCD module, thereby preventing a PCB from getting looser. An assembly structure for an LCD(Liquid Crystal Display) module(A) includes an LCD panel, a backlight unit, a mold frame(40), a PCB(Printed Circuit Board)(30), and a chassis(60). The backlight unit is installed in the LCD panel to provide a light source. The mold frame supports and fixes the LCD panel and the backlight unit. The PCB is attached to the backlight unit, and is connected by the LCD panel and an FPCB(Flexible Printed Circuit Board)(50). A grounding portion(31) is formed in the PCB. The chassis has contact pieces(61) to connect electrically with the grounding portion formed in the PCB.

Description

엘시디 모듈의 조립구조{STRUCTURE FOR ASSEMBLING LCD MODULE}Assembly structure of LCD module {STRUCTURE FOR ASSEMBLING LCD MODULE}

도 1은 종래 기술에 따른 LCD 모듈의 외관을 나타낸 사시도이다.1 is a perspective view showing the appearance of an LCD module according to the prior art.

도 2는 종래 기술에 따른 LCD 모듈의 결합구조를 나타낸 단면도이다.2 is a cross-sectional view showing a coupling structure of the LCD module according to the prior art.

도 3은 본 발명에 따른 LCD 모듈의 정면측 분해 사시도이다.3 is a front exploded perspective view of the LCD module according to the present invention.

도 4는 본 발명에 따른 LCD 모듈의 후면측 분해 사시도이다.4 is an exploded perspective view of the back side of the LCD module according to the present invention.

도 5는 도 4에 분해 도시된 LCD 모듈의 결합상태를 나타낸 사시도이다.FIG. 5 is a perspective view illustrating a coupling state of the LCD module illustrated in FIG. 4.

*도면 중 주요부분에 대한 부호의 설명** Description of the symbols for the main parts of the drawings *

A - LCD 모듈 10 - LCD 패널A-LCD Module 10-LCD Panel

11 - LCD 구동 IC 30 - PCB11-LCD Driver ICs 30-PCB

31 - 접지부 40 - 몰드프레임31-Ground part 40-Mold frame

41 - 장착홈 50 - FPCB41-Mounting Groove 50-FPCB

60 - 샤시 61 - 접촉편60-Chassis 61-Contact Piece

본 발명은 LCD 모듈의 조립구조에 관한 것이다.The present invention relates to an assembly structure of the LCD module.

평판디스플레이장치의 종류 중 하나인 LCD 모듈은 통상 2매의 도전성 유리판재를 평행하게 배치하고, 그 사이에 유전이방성을 갖는 액정을 주입하여, 외부로부터 인가되는 전압 변화에 따라 달라지는 액정의 편광특성을 이용해 각종 화면을 디스플레이하는 방식이다.LCD module, which is one type of flat panel display device, usually arranges two conductive glass plates in parallel, and injects liquid crystals having dielectric anisotropy therebetween, and thus the polarization characteristics of liquid crystals varying according to the voltage change applied from the outside. It is a method of displaying various screens by using.

이러한, LCD 모듈은 도 1 및 도 2의 도시와 같이 2매의 도전성 유리판재 사이에 액정물질이 채워진 LCD 패널(110)과, LCD 패널(110)의 후방에 설치되어 LCD 패널(110)에 광원을 제공하는 백라이트유닛(BLU)(120)과, 제어신호 및 데이터 신호의 전달을 위하여 FPCB(150)에 의해 LCD 패널(110)과 전기적으로 연결된 PCB(130)로 구성되어, LCD 패널(110)과 백라이트유닛(120)은 소정의 몰드프레임(140) 내에 수용되어 지지 고정되고, PCB(130)는 몰드프레임(140)의 후면에서 백라이트유닛(120)에 접착테이프에 의해 부착되는 방식으로 조립된다.1 and 2, the LCD module is provided with an LCD panel 110 filled with a liquid crystal material between two conductive glass sheets, and is disposed behind the LCD panel 110 to provide a light source to the LCD panel 110. It is composed of a backlight unit (BLU) 120 for providing a, and a PCB 130 electrically connected to the LCD panel 110 by the FPCB 150 for the transmission of control signals and data signals, LCD panel 110 And the backlight unit 120 is accommodated in a predetermined mold frame 140 is supported and fixed, PCB 130 is assembled in a manner that is attached to the backlight unit 120 by the adhesive tape on the back of the mold frame 140. .

그러나, 종래의 LCD 모듈(100)은 PCB(130)와 LCD 패널(110)을 연결하는 FPCB(150)의 반발력 영향과, PCB(130)와 백라이트유닛(120) 사이에 접착되는 접착테이프의 접착력 및, PCB(130)의 온도상승으로 인한 PCB(130)의 휨 등 여러 가지의 요인으로 인해 PCB(130)와 백라이트유닛(120)과 맞닿는 부분에서 들뜸이 발생되는 문제점이 있게 된다.However, the conventional LCD module 100 has a repulsive force effect of the FPCB 150 connecting the PCB 130 and the LCD panel 110, and the adhesive force of the adhesive tape bonded between the PCB 130 and the backlight unit 120. And, due to various factors such as the bending of the PCB 130 due to the temperature rise of the PCB 130, there is a problem that the lifting occurs in the portion in contact with the PCB 130 and the backlight unit 120.

또한, PCB(130)에는 다양한 회로소자 및 서브 LCD 패널(160) 등이 설치되기 때문에 PCB(130)의 그라운드 영역이 작아지게 되므로 정전하 방전(ESD; Electro Static Discharge)에 취약해지는 문제점이 있게 되며, 이와 같은 문제점들은 LCD 모듈(100)의 품질(외관, 특성)에 악영향을 끼치게 되는 결점이 있다.In addition, since the PCB 130 is provided with various circuit elements and the sub-LCD panel 160, the ground area of the PCB 130 is reduced, so that there is a problem in that it is vulnerable to electrostatic discharge (ESD). However, these problems have a drawback that adversely affects the quality (appearance, characteristics) of the LCD module 100.

따라서, 본 발명은 전술한 종래의 제반 문제점을 해결하기 위하여 안출된 것으로, 이러한 본 발명의 목적은 LCD 모듈 PCB의 들뜸을 개선 시킴과 동시에 ESD특성을 개선 시킬 수 있는 LCD 모듈의 조립구조를 제공함에 있다.Accordingly, the present invention has been made to solve the above-mentioned conventional problems, an object of the present invention is to provide an assembly structure of the LCD module that can improve the ESD characteristics and at the same time improve the lifting of the LCD module PCB. have.

이러한, LCD 패널; 상기 LCD 패널에 설치되어 광원을 제공하는 백라이트유닛; 상기 LCD 패널와 백라이트유닛을 지지 고정하는 몰드프레임; 상기 백라이트유닛에 부착되며, LCD 패널과 FPCB에 의해 연결되고, 소정의 접지부가 형성된 PCB; 상기 PCB에 형성된 접지부와 도통이 가능하도록 접촉편이 구비된 샤시를 포함하여 구성된다.Such, LCD panels; A backlight unit installed on the LCD panel to provide a light source; A mold frame supporting and fixing the LCD panel and the backlight unit; A PCB attached to the backlight unit, connected by an LCD panel and an FPCB, and having a predetermined ground portion; It is configured to include a chassis provided with a contact piece to enable conduction with the ground portion formed on the PCB.

이하, 본 발명이 속하는 기술분야에서 통상의 지식을 가진자가 본 발명을 용이하게 실시할 수 있을 정도로 본 발명의 바람직한 실시 예를 첨부된 도면을 참조하여 상세하게 설명하면 다음과 같다.Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings such that those skilled in the art may easily implement the present invention.

도 3은 본 발명에 따른 LCD 모듈의 정면측 분해 사시도이고, 도 4는 본 발명에 따른 LCD 모듈의 후면측 분해 사시도이며, 도 5는 도 4에 분해 도시된 LCD 모듈의 결합상태를 나타낸 사시도이다.Figure 3 is an exploded perspective view of the front side of the LCD module according to the present invention, Figure 4 is a rear exploded perspective view of the LCD module according to the present invention, Figure 5 is a perspective view showing a combined state of the LCD module shown in Figure 4 exploded. .

도 3 내지 도 5의 도시와 같이 본 발명에 따른 LCD 모듈(A)은 기존 종래의 LCD 모듈과 동일하게 LCD 패널(10)과, LCD 패널(10)의 후방에 설치되어 LCD 패널(10)에 광원을 제공하는 백라이트유닛(미도시)이 몰드프레임(40)에 조립 고정되어 PCB(30)가 백라이트유닛의 후방에 접착테이프에 의해 부착되는 구조와 동일하게 구성되지만, 몰드프레임(40)에 대하여 PCB(30)를 안정적으로 지지하면서 고정시킬 수 있는 샤시(60)를 구비하여 PCB(30)의 들뜸 현상 및 ESD의 특성을 개선 시킬 수 있다.As shown in FIGS. 3 to 5, the LCD module A according to the present invention is installed at the rear of the LCD panel 10 and the LCD panel 10 in the same manner as the existing conventional LCD module. The backlight unit (not shown) that provides the light source is assembled and fixed to the mold frame 40 so that the PCB 30 is configured in the same structure as the adhesive tape attached to the rear of the backlight unit, but with respect to the mold frame 40. The chassis 30 may be stably supported while fixing the PCB 30 to improve the lifting phenomenon of the PCB 30 and the characteristics of the ESD.

즉, LCD 모듈(A)의 하단 일부를 감싸는 구조로 형성되는 샤시(60)의 양측 끝단이 몰드프레임(40)의 양측에 형성되는 접지부(31)에 접촉되도록 함으로써 가능하게 된다.That is, both ends of the chassis 60 formed in a structure surrounding the lower portion of the LCD module A may be contacted with the grounding portions 31 formed on both sides of the mold frame 40.

여기서, 샤시(60)는 일정 두께의 도전성 재질을 갖는 판체의 양단을 "ㄷ" 자 형으로 절곡하여 형성되고, 이에 따라 양단에는 PCB(30)의 접지부(31)에 접촉되어 접지되는 접촉편(61)이 형성되며, 몰드프레임(40)의 하단 양측에는 상기 샤시(60)의 접촉부(61)가 결합되어 일정 고정력을 제공하기 위한 장착홈(41)이 구비된다.Here, the chassis 60 is formed by bending both ends of the plate body having a conductive material of a predetermined thickness into a "c" shape, and thus contact ends of the chassis 60 which are in contact with the ground portion 31 of the PCB 30 at the both ends. 61 is formed, and the lower side of the mold frame 40, the contact portion 61 of the chassis 60 is coupled is provided with a mounting groove 41 for providing a fixed fixing force.

따라서, 샤시(60)는 LCD 모듈(A)의 하단 전방을 지지하면서 몰드프레임(40)을 통해 PCB(30)를 지지하면서 일정 고정력을 제공하기 때문에 PCB(30)의 들뜸 현상을 해소할 수 있게 된다.Therefore, since the chassis 60 supports the PCB 30 through the mold frame 40 while supporting the lower front of the LCD module A, the chassis 60 can solve the lifting phenomenon of the PCB 30. do.

한편, 몰드프레임(40)의 후면에 설치되어 FPCB(50)에 의해 LCD 패널(10)과 전기적으로 연결되는 PCB(30)는 하단 양측에 소정의 크기로 접지부(31)가 형성되어 샤시와 접촉됨으로써, 일정 그라운드 영역을 확보하도록 한다.On the other hand, the PCB 30, which is installed on the rear of the mold frame 40 and electrically connected to the LCD panel 10 by the FPCB 50, has a ground portion 31 formed at a predetermined size on both sides of the lower side, so that the chassis and By contacting, a certain ground area is secured.

즉, PCB(30)는 절연체인 에폭시 수지 등으로 만든 얇은 기판에 동도금을 하고, 이 동도금된 층을 식각하여 원하는 회로의 패턴형태로 형성되며, 이와 같은 상태에서 회전의 안정성 및 SMT 등을 위해 솔더마스크(Solder Mask) 등의 절연체를 입히는 구조로 되어 있다.That is, the PCB 30 is copper-plated on a thin substrate made of an epoxy resin, which is an insulator, and the copper-plated layer is etched to form a pattern of a desired circuit. In this state, solder is used for stability of rotation and SMT. It has a structure in which an insulator such as a mask is coated.

이때, 샤시(60)의 접촉편(61)과 전기적인 도통이 가능하도록 PCB(30)의 하단 양측에는 동도금층이 노출되도록 절연체를 절개하는 접지부(31)가 형성되도록 하여 몰드프레임(40)의 측면에 구비된 장착홈(41)을 통하여 장착된 접촉편(61)과 접촉되기 때문에 LCD 패널(10) 및 LCD 구동 IC(11)로의 직접적인 ESD 인가시 상기의 접지부(31)와 샤시(60)가 PCB의 그라운드 영역으로 ESD를 유도하기 때문에 ESD의 특성을 개선 시킬 수 있게 된다.At this time, in order to enable electrical conduction with the contact piece 61 of the chassis 60, the lower end of the PCB 30 to form a ground portion 31 for cutting the insulator so that the copper plating layer is exposed to the mold frame 40 Since the contact with the contact piece 61 mounted through the mounting groove (41) provided on the side of the ground panel 31 and the chassis (see above) upon direct ESD application to the LCD panel 10 and the LCD driving IC (11). Since 60) induces ESD into the ground area of the PCB, it is possible to improve the characteristics of the ESD.

한편, 본 발명에서는 상기 샤시(60)의 접촉편(61)이 몰드프레임(40)의 하단 양측에 구비된 장착홈(41)을 통해 PCB(30)의 접지부(31)와 접촉되도록 하는 것에 대하여 설명하였으나, 이에 한정되는 것은 아니며 상기 샤시(60)가 몰드프레임(40)을 완전히 감싸는 구조로 끝단 접촉편(61)이 PCB(30)의 접지부(31)에 끼워져 고정될 수도 있음은 물론, 상기 샤시(60)의 고정구조는 특정한 구성에 한정되는 것은 아니다.Meanwhile, in the present invention, the contact piece 61 of the chassis 60 is in contact with the ground portion 31 of the PCB 30 through mounting grooves 41 provided on both sides of the lower end of the mold frame 40. As described above, the present invention is not limited thereto. The end contact piece 61 may be fixed to the ground portion 31 of the PCB 30 by the chassis 60 so as to completely surround the mold frame 40. The fixed structure of the chassis 60 is not limited to a specific configuration.

이상, 본 발명을 바람직한 실시 예를 이용하여 상세히 설명하였으나, 본 발명의 범위는 특정 실시 예에 한정되는 것은 아니며, 첨부된 특허청구범위에 의하여 해석되어야 할 것이다. 또한, 이 기술분야에서 통상의 지식을 습득한 자라면, 본 발명의 범위에서 벗어나지 않으면서도 많은 수정과 변형이 가능함을 이해하여야 할 것이다.As mentioned above, although this invention was demonstrated in detail using the preferable embodiment, the scope of the present invention is not limited to a specific embodiment, Comprising: It should be interpreted by the attached Claim. In addition, those skilled in the art should understand that many modifications and variations are possible without departing from the scope of the present invention.

상술한 바와 같이 본 발명에 따른 LCD 모듈의 조립구조에 의하면, 도전성의 재질을 갖는 샤시가 LCD 모듈을 감싸는 구조로 고정 설치되기 때문에 PCB의 들뜸 현상을 억제할 수 있고, 또한 샤시의 접촉편이 PCB에 형성된 접지부에 접촉되어 도통됨으로서 LCD로의 직접적인 ESD를 PCB의 그라운드 영역을 유도하기 때문에 ESD의 특성을 개선 시킬 수 있게 되는 등의 효과를 제공한다.As described above, according to the assembly structure of the LCD module according to the present invention, since the chassis having a conductive material is fixedly installed in a structure surrounding the LCD module, lifting of the PCB can be suppressed, and the contact piece of the chassis is connected to the PCB. By contacting the formed ground portion and conducting, direct ESD to the LCD leads to the ground area of the PCB, thereby improving the characteristics of the ESD.

Claims (4)

LCD 패널;LCD panel; 상기 LCD 패널에 설치되어 광원을 제공하는 백라이트유닛;A backlight unit installed on the LCD panel to provide a light source; 상기 LCD 패널와 백라이트유닛을 지지 고정하는 몰드프레임;A mold frame supporting and fixing the LCD panel and the backlight unit; 상기 백라이트유닛에 부착되며, LCD 패널과 FPCB에 의해 연결되고, 소정의 접지부가 형성된 PCB;A PCB attached to the backlight unit, connected by an LCD panel and an FPCB, and having a predetermined ground portion; 상기 PCB에 형성된 접지부와 도통이 가능하도록 접촉편이 구비된 샤시를 포함하는 LCD 모듈의 조립구조.Assembly structure of the LCD module including a chassis provided with a contact piece to enable conduction with the ground portion formed on the PCB. 제 1 항에 있어서,The method of claim 1, 상기 접지부는,The ground portion, 상기 PCB의 절연체 일부가 절개되어 형성되는 것인 LCD 모듈의 조립구조.Assembly structure of the LCD module is formed by cutting a part of the insulator of the PCB. 제 1 항에 있어서,The method of claim 1, 상기 접지부는 PCB 내부 도금층이 외부로 노출되도록 상기 PCB의 절연체 일부가 절개되어 형성되는 것인 LCD 모듈의 조립구조.Wherein the ground portion of the LCD module assembly structure is formed by cutting a part of the insulator of the PCB so that the PCB inner plating layer is exposed to the outside. 제 1 항에 있어서,The method of claim 1, 상기 몰드프레임의 양측에는,On both sides of the mold frame, 상기 샤시의 접촉편이 체결되기 위한 체결홈이 구비되는 것인 LCD 모듈의 조립구조.Assembly structure of the LCD module is provided with a fastening groove for fastening the contact pieces of the chassis.
KR1020070021976A 2007-03-06 2007-03-06 Structure for assembling lcd module KR20080081662A (en)

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