KR100906853B1 - Structure for assembling lcd module - Google Patents

Structure for assembling lcd module Download PDF

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Publication number
KR100906853B1
KR100906853B1 KR1020070028543A KR20070028543A KR100906853B1 KR 100906853 B1 KR100906853 B1 KR 100906853B1 KR 1020070028543 A KR1020070028543 A KR 1020070028543A KR 20070028543 A KR20070028543 A KR 20070028543A KR 100906853 B1 KR100906853 B1 KR 100906853B1
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KR
South Korea
Prior art keywords
pcb
mold frame
backlight unit
lcd module
lcd panel
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KR1020070028543A
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Korean (ko)
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KR20080086635A (en
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박태봉
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엘지이노텍 주식회사
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Priority to KR1020070028543A priority Critical patent/KR100906853B1/en
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G02F1/133317—Intermediate frames, e.g. between backlight housing and front frame
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2202/00—Materials and properties
    • G02F2202/28—Adhesive materials or arrangements

Abstract

본 발명은 엘씨디 모듈의 조립구조에 관한 것으로서, LCD 패널; 상기 LCD 패널의 후방에 설치되는 백라이트유닛; 상기 LCD 패널과 백라이트유닛을 지지 고정하는 몰드프레임; 상기 몰드프레임의 후방에서 상기 백라이트유닛에 부착되고, LCD 패널과 FPCB에 의해 연결되며, 양측에는 일정부분에 걸쳐 소정의 접지부가 형성된 PCB; 상기 몰드프레임의 양측과 PCB의 접지부에 부착되는 도전성 테이프를 포함하여 구성되는 LCD 모듈의 조립구조에 관한 것이다.The present invention relates to an assembly structure of an LCD module, comprising: an LCD panel; A backlight unit installed at the rear of the LCD panel; A mold frame supporting and fixing the LCD panel and the backlight unit; A PCB attached to the backlight unit at the rear of the mold frame, connected to the LCD panel by an FPCB, and having a predetermined ground portion formed on a predetermined portion at both sides thereof; It relates to an assembly structure of the LCD module including a conductive tape attached to both sides of the mold frame and the ground portion of the PCB.

LCD 모듈, 백라이트유닛, 몰드프레임, 샤시, PCB, 도전성 테이프 LCD module, backlight unit, mold frame, chassis, PCB, conductive tape

Description

엘시디 모듈의 조립구조{STRUCTURE FOR ASSEMBLING LCD MODULE}Assembly structure of LCD module {STRUCTURE FOR ASSEMBLING LCD MODULE}

도 1은 종래 기술에 따른 LCD 모듈의 외관을 나타낸 사시도이다.1 is a perspective view showing the appearance of an LCD module according to the prior art.

도 2는 종래 기술에 따른 LCD 모듈의 결합구조를 나타낸 단면도이다.2 is a cross-sectional view showing a coupling structure of the LCD module according to the prior art.

도 3은 본 발명에 따른 LCD 모듈의 구성을 나타낸 분해 사시도이다.3 is an exploded perspective view showing the configuration of the LCD module according to the present invention.

도 4는 도 3에 분해 도시된 LCD 모듈의 결합상태를 나타낸 사시도이다.4 is a perspective view illustrating a coupling state of the LCD module illustrated in FIG.

도 5는 본 발명에 따른 LCD 모듈의 측면도이다.5 is a side view of the LCD module according to the present invention.

*도면 중 주요부분에 대한 부호의 설명** Description of the symbols for the main parts of the drawings *

A - LCD 모듈 10 - LCD 패널A-LCD Module 10-LCD Panel

20 - 백라이트유닛 30 - PCB20-Backlight Unit 30-PCB

31 - 접지부 50 - 도전성 테이프31-Ground 50-Conductive Tape

51 - 제 1부착부 52 - 제 2부착부51-First Attachment 52-Second Attachment

53 - 커팅라인53-cutting line

본 발명은 LCD 모듈의 조립구조에 관한 것이다.The present invention relates to an assembly structure of the LCD module.

평판디스플레이장치의 종류 중 하나인 LCD 모듈은 통상 2매의 도전성 유리판재를 평행하게 배치하고, 그 사이에 유전이방성을 갖는 액정을 주입하여, 외부로부터 인가되는 전압 변화에 따라 달라지는 액정의 편광성질을 이용해 각종 화면을 디스플레이하는 방식이다.LCD module, which is one type of flat panel display device, usually arranges two conductive glass plates in parallel, and injects liquid crystals having dielectric anisotropy therebetween, thereby changing the polarization properties of the liquid crystals depending on the voltage change applied from the outside. It is a method of displaying various screens by using.

이러한, LCD 모듈은 도 1 및 도 2의 도시와 같이 2매의 도전성 유리판재 사이에 액정물질이 채워진 LCD 패널(110)과, LED 패널(110)의 전,후면에 구비되는 편광판(미도시)과, LCD 패널(110)의 후방에 설치되어 LCD(110) 패널에 광원을 제공하는 백라이트유닛(BLU)(120)과, 신호의 전달을 위하여 FPCB(150)에 의해 LCD 패널(110)과 전기적으로 연결된 PCB(130)로 구성되어, LCD(110) 패널과 백라이트유닛(120)은 소정의 몰드프레임(140) 내에 수용되어 지지 고정되고, PCB(130)는 몰드프레임(140)의 후면에서 백라이트유닛(120)에 접착테이프에 의해 부착되는 방식으로 조립된다.1 and 2, the LCD module includes an LCD panel 110 filled with a liquid crystal material between two conductive glass plates, and a polarizing plate (not shown) provided on the front and rear surfaces of the LED panel 110. And a backlight unit (BLU) 120 installed at the rear of the LCD panel 110 to provide a light source to the LCD 110 panel, and electrically connected to the LCD panel 110 by the FPCB 150 for signal transmission. Comprising a PCB 130 connected to the LCD panel, the LCD 110 and the backlight unit 120 is accommodated in a predetermined mold frame 140 is supported and fixed, the PCB 130 is a backlight at the back of the mold frame 140 The unit 120 is assembled in such a manner that it is attached by an adhesive tape.

그러나, 종래의 LCD 모듈(100)은 PCB(130)와 LCD 패널(110)을 연결하는 FPCB(150)의 반발력 영향과, PCB(130)와 백라이트유닛(120) 사이에 접착되는 접착테이프의 접착력 및, PCB(130)의 온도상승으로 인한 PCB(130)의 휨 등 여러 가지의 요인으로 인해 PCB(130)와 백라이트유닛(120)과 맞닿는 부분 양측에서 들뜸이 발생되는 문제점이 있다.However, the conventional LCD module 100 has a repulsive force effect of the FPCB 150 connecting the PCB 130 and the LCD panel 110, and the adhesive force of the adhesive tape bonded between the PCB 130 and the backlight unit 120. And, due to various factors such as the bending of the PCB 130 due to the temperature rise of the PCB 130, there is a problem that the lifting occurs on both sides of the PCB 130 and the portion in contact with the backlight unit 120.

또한, PCB(130)에는 다양한 회로소자 및 서브 LCD 패널(160) 등이 설치되기 때문에 PCB(130)의 그라운드 영역이 작아지게 되므로 정전하 방전(ESD; Electro Static Discharge)에 취약해지는 문제점이 있게 되며, 이와 같은 문제점들은 LCD 모듈(100)의 품질(외관, 특성)에 악영향을 끼치게 되는 결점이 있다.In addition, since the PCB 130 is provided with various circuit elements and the sub-LCD panel 160, the ground area of the PCB 130 is reduced, so that there is a problem in that it is vulnerable to electrostatic discharge (ESD). However, these problems have a drawback that adversely affects the quality (appearance, characteristics) of the LCD module 100.

따라서, 본 발명은 기존 LCD의 설계와 두께 사양을 가지면서 ESD 내성 강화와 더불어 PCB의 양쪽 측면에서 발생되는 들뜸 현상을 개선시킬 수 있는 LCD 모듈의 조립구조를 제공한다.Accordingly, the present invention provides an assembly structure of the LCD module that can improve the lifting resistance generated on both sides of the PCB with enhanced ESD resistance while having the design and thickness specifications of the existing LCD.

본 발명은 LCD 패널; 상기 LCD 패널의 후방에 설치되는 백라이트유닛; 상기 LCD 패널과 백라이트유닛을 지지 고정하는 몰드프레임; 상기 몰드프레임의 후방에서 상기 백라이트유닛에 부착되고, 신호의 전달이 가능하도록 LCD 패널과 FPCB에 의해 연결되며, 양측에는 일정부분에 걸쳐 소정의 접지부가 형성된 PCB; 상기 몰드프레임의 양측과 PCB의 접지부에 부착되는 도전성 테이프를 포함하여 구성된다.The present invention LCD panel; A backlight unit installed at the rear of the LCD panel; A mold frame supporting and fixing the LCD panel and the backlight unit; A PCB attached to the backlight unit at the rear of the mold frame, connected to the LCD panel and the FPCB to enable signal transmission, and a PCB having a predetermined ground portion formed on both sides thereof; Conductive tape is attached to both sides of the mold frame and the ground portion of the PCB.

이하, 본 발명이 속하는 기술분야에서 통상의 지식을 가진자가 본 발명을 용이하게 실시할 수 있을 정도로 본 발명의 바람직한 실시 예를 첨부된 도면을 참조하여 상세하게 설명하면 다음과 같다.Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings such that those skilled in the art may easily implement the present invention.

도 3은 본 발명에 따른 LCD 모듈의 구성을 나타낸 분해 사시도이고, 도 4는 도 3에 분해 도시된 LCD 모듈의 결합상태를 나타낸 사시도이며, 도 5는 본 발명에 따른 LCD 모듈의 측면도이다.Figure 3 is an exploded perspective view showing the configuration of the LCD module according to the present invention, Figure 4 is a perspective view showing a combined state of the LCD module shown in Figure 3, Figure 5 is a side view of the LCD module according to the present invention.

도 3 내지 도 5의 도시와 같이 본 발명에 따른 LCD 모듈(A)은 기존 종래의 LCD 모듈과 동일하게 LCD 패널(10)과, LCD 패널(10)의 후방에 설치되어 LCD 패널(10)에 광원을 제공하는 백라이트유닛(20)이 몰드프레임(40)에 조립 고정되고, PCB(30)는 백라이트유닛(20)의 후방에 접착테이프에 의해 부착되는 구조와 동일하게 구성되지만, 몰드프레임(40)과 PCB(30)의 양측에 형성된 접지부(31)에 부착되는 도전성 테이프(50)에 의해 PCB(30)의 양측 들뜸을 개선시키고, ESD를 강화시킬 수 있다.As shown in FIGS. 3 to 5, the LCD module A according to the present invention is installed at the rear of the LCD panel 10 and the LCD panel 10 in the same manner as the existing conventional LCD module. The backlight unit 20 that provides the light source is assembled and fixed to the mold frame 40, and the PCB 30 is configured in the same manner as the structure attached to the back of the backlight unit 20 by an adhesive tape, but the mold frame 40 ) And the conductive tape 50 attached to the ground portion 31 formed on both sides of the PCB 30 to improve lifting of both sides of the PCB 30 and to enhance ESD.

즉, PCB(30)는 절연체인 에폭시 수지 등으로 만든 얇은 기판에 동도금을 하고, 이 동도금된 층을 식각하여 원하는 회로의 패턴형태로 형성되며, 이와 같은 상태에서 회로의 안정성 및 SMT 등을 위해 솔더 마스크(Solder Mask) 등의 절연체를 입히는 구조로 되어 있다.That is, the PCB 30 is copper plated on a thin substrate made of an epoxy resin as an insulator, and the copper plated layer is etched to form a pattern of a desired circuit. In this state, the solder is soldered for stability of the circuit and SMT. It has a structure in which an insulator such as a mask is coated.

이때, PCB(30)의 양측에는 동도금층이 노출되도록 절연체의 일부를 절개하여 형성되는 접지부(31)를 구비하고, 이 접지부(31)에는 도전성 테이프(50)를 부착시켜 도통시킴으로써, PCB(30)의 그라운드 영역이 확대되어 정전하 방전(ESD)이 강화될 수 있다.At this time, both sides of the PCB 30 is provided with a ground portion 31 formed by cutting a part of the insulator so that the copper plating layer is exposed, and the conductive portion 50 is attached to the ground portion 31 so as to conduct the PCB. The ground region of 30 may be enlarged to strengthen the electrostatic discharge ESD.

즉, 점차 PCB가 회로의 극소화, 절연층의 두께가 얇아지는 등의 이유로 보다 작은 정전기의 방전 전류가 방전될 때 생성되는 열에 의해 정전파괴가 일어날 수 있지만, 본 발명에서와 같이 PCB(30)의 그라운드 영역을 확대함으로써, 이를 보강할 수 있게 된다.That is, the electrostatic breakdown may occur due to heat generated when the discharge current of the smaller static electricity is gradually discharged due to the miniaturization of the circuit, the thickness of the insulating layer, etc., but as in the present invention, By enlarging the ground area, this can be reinforced.

도전성 테이프(50)는 도 3의 도시와 같이 PCB(30)에 구비된 접지부(31)와 도통이 가능한 재질로 접지부(31)에 부착되는 제 1부착부(51)와, 제 1부착부(51)에서 연장되어 몰드프레임(40)의 측면에 부착되는 제 2부착부(52)로 구분된다.As shown in FIG. 3, the conductive tape 50 may include a first attaching portion 51 attached to the ground portion 31 and a first attaching material, which may be electrically conductive with the ground portion 31 provided on the PCB 30. It is divided into a second attachment portion 52 extending from the portion 51 and attached to the side of the mold frame 40.

이때, 도전성 테이프(50)는 부착력의 향상 및 정전하 방전(EDS) 특성을 향상시키기 위해 제 1부착부(51)의 면적보다 제 2부착부(52)의 면적이 더욱 크게 형성되도록 하는 것이 바람직하다.At this time, the conductive tape 50 is preferably such that the area of the second attachment portion 52 is larger than the area of the first attachment portion 51 in order to improve the adhesion and the electrostatic discharge (EDS) characteristics. Do.

또한, 상기 PCB(30)에 부착되는 제 1부착부(51)와 몰드프레임(40)의 측면에 부착되는 제 2부착부(52)의 밴딩부위에는 상하단 내측으로 일정부분이 절개된 커팅라인(53)이 형성되도록 하여 상기 PCB(30)와 몰드프레임(40)에 대한 도전성 테이프(50)의 부착력을 더욱 향상시킬 수 있다.In addition, a cutting line in which a predetermined portion is cut in the upper and lower ends in the bending portion of the first attachment portion 51 attached to the PCB 30 and the second attachment portion 52 attached to the side of the mold frame 40 ( 53 may be formed to further improve the adhesion of the conductive tape 50 to the PCB 30 and the mold frame 40.

즉, 상기 커팅라인(53)은 제 1부착부(51)와 제 2부착부(52)의 부착 면적에 해당되는 밴딩부위를 최소화하기 위함으로, 상기 밴딩부위에서 발생되는 탄성력을 억제하기 위함이다.That is, the cutting line 53 is for minimizing the bending area corresponding to the attachment area of the first attachment portion 51 and the second attachment portion 52, and to suppress the elastic force generated in the bending portion. .

따라서, 도전성 테이프(50)의 제 1부착부(51)는 PCB(30)에 구비된 접지부(31)에 부착되어 도통되고, 다른 일단은 몰드프레임(40)의 측면에 부착되어 PCB(30)의 그라운드 영역을 확대시킬 수 있기 때문에 ESD가 강화되고, 또한 도전성 테이프(50)의 부착력에 의해 자연히 PCB(30)는 몰드프레임(40)에 견고한 상태로 부착 고정되기 때문에 PCB(30)의 양쪽 들뜸을 방지할 수 있게 된다.Therefore, the first attaching portion 51 of the conductive tape 50 is attached to the ground portion 31 provided in the PCB 30 and is conductive, and the other end is attached to the side of the mold frame 40 so that the PCB 30 ESD can be enlarged because the ground area of the substrate can be enlarged, and the PCB 30 is naturally fixed and fixed to the mold frame 40 by the adhesive force of the conductive tape 50 so that both sides of the PCB 30 are fixed. It is possible to prevent the lifting.

이상, 본 발명을 바람직한 실시 예를 이용하여 상세히 설명하였으나, 본 발명의 범위는 특정 실시 예에 한정되는 것은 아니며, 첨부된 특허청구범위에 의하여 해석되어야 할 것이다. 또한, 이 기술분야에서 통상의 지식을 습득한 자라면, 본 발명의 범위에서 벗어나지 않으면서도 많은 수정과 변형이 가능함을 이해하여야 할 것이다.As mentioned above, although this invention was demonstrated in detail using the preferable embodiment, the scope of the present invention is not limited to a specific embodiment, Comprising: It should be interpreted by the attached Claim. In addition, those skilled in the art should understand that many modifications and variations are possible without departing from the scope of the present invention.

본 발명에 따른 LCD 모듈의 조립구조에 의하면, PCB에 형성된 접지부와 몰드프레임의 측면에 부착되는 도전성 테이프에 의해 ESD의 내성을 강화시킬 수 있고, 또한 도전성 테이프가 PCB와 몰드프레임의 양측을 감싸는 구조로 부착되기 때문에 PCB의 들뜸 현상을 개선할 수 있기 때문에 제품의 신뢰성을 향상시킬 수 있게 되는 등의 효과를 제공한다.According to the assembly structure of the LCD module according to the present invention, it is possible to enhance the resistance of the ESD by the conductive tape attached to the ground portion formed on the PCB and the side of the mold frame, and the conductive tape is wrapped around both sides of the PCB and the mold frame Since it is attached to the structure, it is possible to improve the lifting phenomenon of the PCB, thereby improving the reliability of the product.

Claims (5)

삭제delete 삭제delete 삭제delete LCD 패널;LCD panel; 상기 LCD 패널의 후방에 설치되는 백라이트유닛;A backlight unit installed at the rear of the LCD panel; 상기 LCD 패널과 백라이트유닛을 지지 고정하는 몰드프레임;A mold frame supporting and fixing the LCD panel and the backlight unit; 상기 몰드프레임의 후방에서 상기 백라이트유닛에 부착되고, LCD 패널과 FPCB에 의해 연결되며, 양측에는 일정부분에 걸쳐 접지부가 형성된 PCB;A PCB attached to the backlight unit at the rear of the mold frame, connected to the LCD panel by an FPCB, and having a ground portion formed at a predetermined portion on both sides thereof; 상기 PCB의 접지부에 부착되는 제1부착부와, 상기 몰드프레임의 측면에 부착되는 제2부착부로 구성되는 도전성 테이프를 포함하며,Conductive tape comprising a first attachment portion attached to the ground portion of the PCB, and a second attachment portion attached to the side of the mold frame, 상기 도전성 테이프의 제 2부착부 면적이 상기 제 1부착부 면적보다 크게 구성되는 것을 특징으로 하는 LCD 모듈의 조립구조.And an area of a second attachment portion of the conductive tape is larger than that of the first attachment portion. 제 4 항에 있어서,The method of claim 4, wherein 상기 도전성 테이프의 제 1부착부와 제 2부착부의 밴딩부위에는 상하단 내측으로 일정 부분 절취된 커팅라인이 형성되는 것인 LCD 모듈의 조립구조.Assembly structure of the LCD module is formed in the bending portion of the first attachment portion and the second attachment portion of the conductive tape cut in a predetermined portion in the upper and lower ends.
KR1020070028543A 2007-03-23 2007-03-23 Structure for assembling lcd module KR100906853B1 (en)

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KR20050033730A (en) * 2003-10-07 2005-04-13 엘지.필립스 엘시디 주식회사 Liquid crystal display device module
KR20050068259A (en) * 2003-12-29 2005-07-05 엘지.필립스 엘시디 주식회사 Liquid crystal display device module
KR20060112142A (en) * 2005-04-26 2006-10-31 삼성전자주식회사 Flat panel display apparatus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20050033730A (en) * 2003-10-07 2005-04-13 엘지.필립스 엘시디 주식회사 Liquid crystal display device module
KR20050068259A (en) * 2003-12-29 2005-07-05 엘지.필립스 엘시디 주식회사 Liquid crystal display device module
KR20060112142A (en) * 2005-04-26 2006-10-31 삼성전자주식회사 Flat panel display apparatus

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