KR20080076573A - Electro-static chuck having wood-profile electrode pattern and method for processing substrate using the same - Google Patents

Abstract

An electro-static chuck having wood-profile electrode patterns and a method for processing substrates using the same are provided to extend lifetime of the electro-static chuck by processing uniformly abrasion of an insulation layer between the substrates and electrodes. A bipolar electro-static chuck includes first and second electrodes(31,32). The first electrodes include plural first patterns. The second electrodes include plural second patterns which are separated from the first patterns and alternately arranged with the first patterns. The first and second patterns include wood-profile patterns which at least one or more patterns are connected from plural positions on line patterns to left and right directions of the line patterns.

Description

Electro-Static Chuck Having Wood-profile Electrode Pattern and Method for Processing Substrate Using The Same}

1 is an example showing a plan view of an electrode pattern of a bipolar electrostatic chuck according to the prior art.

2 is a view for explaining an electrostatic chuck according to an embodiment of the present invention.

3 is a view for explaining the electrode pattern of the electrostatic chuck according to an embodiment of the present invention.

4 is an enlarged view of a portion of the electrode pattern of FIG. 3.

5 is a flowchart illustrating a method of processing a substrate using an electrostatic chuck according to an embodiment of the present invention.

<Explanation of symbols on main parts of the drawings>

31: first electrode

32: second electrode

41: first line pattern

42: square pattern connected successively to the first line pattern

45: second line pattern

46: square pattern connected successively to the second line pattern

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electro-static chuck, and more particularly, to chucking a stable substrate by causing a uniform electrode area against the substrate to induce uniform electro-static force across the entire surface. Bipolar electrostatic chuck with twig-shaped electrode pattern which improves uniformity of substrate processing and saves time during dechucking process by rapid dechucking of substrate. A static chuck) and a substrate processing method using the same.

In addition to manufacturing various semiconductor chips such as processors and memories, flat panel displays such as liquid crystal displays, plasma displays, organic light emitting diode displays, etc., which are widely used in recent years, Manufacturing of a display device or panel for a flat panel display is performed in various process facilities or chambers. In order to manufacture such a semiconductor chip or display device, a surface of a semiconductor wafer or a glass substrate is generally manufactured by photography, etching, diffusion, ion implantation, metal deposition, chemical vapor deposition, and bonding of upper and lower glass substrates. The process is repeated and each substrate is carried in a carrier to move between the respective process equipment. The substrate in the process is transferred to the work position required in the process by the command of a transfer robot or an operator installed in each process facility.

On the other hand, in order to fix the substrate transferred to the working position of the process equipment, mechanical means using vacuum pressure, electrical means using electrical characteristics, etc. are used. An example of the electrical means is an electro-static chuck. . Electro-static chucks can be classified into two types, unipolar and bipolar. The unipolar electro-static chuck has one electrode and is chucked by forming an electric field with negative ions generated when a plasma layer is formed in a plasma state. It is insulated from each other by the insulating layer in between. In addition, a bipolar electro-static chuck includes two electrodes insulated from each other by an insulator, and chucking is performed by supplying a voltage having a positive or negative polarity to each electrode.

1 is an example showing a plan view of an electrode pattern 10 of a bipolar electro-static chuck according to the prior art. As shown in FIG. 1, the electrode pattern 10 has a structure in which two electrodes 11 and 12 in a line form, to which two voltages having different polarities are applied, progress side by side over the entire area. However, such an electrode structure has a structure in which it is difficult to generate constant power uniformly over the entire surface, and there is a limit to only reducing the electrode width in order to improve this.

In addition, in the electrode structure as shown in FIG. 1, due to the non-uniform electrostatic force on the entire surface, the friction generated while chucking the substrate according to the position may be distributed differently according to the position as the period of use elapses, and thus, between the substrate and the electrode The degree of wear of the insulating layer is not constant. Therefore, the life of the electro-static chuck is shortened due to the unevenness of wear, and the plasma discharge becomes unstable during each process step, for example, the deposition or etching of the insulating film or the metal layer, and thus the uniformity of the film thickness. There is a problem that can be degraded.

In the electrode structure shown in FIG. 1, in the process of dechucking the substrate after the substrate processing in the process facility, it is difficult to erase the charges induced in the substrate due to the uneven electrostatic power in the entire area, thereby eliminating the electrostatic power. Can be spent a lot of time. This problem has become more serious recently with the dealing with large area substrates such as liquid crystal display panels.

The present invention has been made to solve the problems of the prior art as described above, the object of the present invention is to improve the uniformity of the substrate processing by the stable chucking (chucking) of the substrate and to quickly dechuck (dechucking) the substrate In order to save time during the dechucking process, a bipolar electrostatic chuck with a branched electrode pattern is provided so that the electrode area against the substrate is uniform and a uniform electrostatic force is induced across the entire surface. to provide an electro-static chuck.

 In addition, another object of the present invention is to use a bipolar electro-static chuck having a branched electrode pattern in the process equipment to improve the uniformity of substrate processing and to achieve a rapid process process To provide a substrate processing method.

According to an aspect of the present invention, there is provided a bipolar electro-static chuck including: a first electrode having a plurality of first patterns; And a second electrode having a plurality of second patterns separated from the plurality of first patterns and alternately disposed with the plurality of first patterns, the plurality of first patterns and the plurality of second patterns. The patterns may have a branch shape in which at least one predetermined pattern is alternately connected in both directions to the left and right of the line pattern at a plurality of positions on the line pattern.

The at least one predetermined pattern includes two patterns connected in series through a connection pattern in one direction of the line pattern.

In the case where the predetermined pattern is a quadrangle, at least one side of the quadrangle is preferably larger than the width of the line pattern. The quadrangle may be in the form of a square, a rectangle, or a rhombus. When the predetermined pattern is a circle, the diameter of the circle is preferably larger than the width of the line pattern.

A bipolar electro-static chuck according to another aspect of the present invention includes a first electrode and a second electrode, the first electrode on a first line pattern, and the first line pattern At least one first predetermined pattern alternately connected to the left and right directions at spaced positions, wherein the second electrode is left at a second line pattern and at positions spaced apart from the second line pattern And at least one second predetermined pattern alternately connected in a right direction, wherein the first line pattern is repeatedly arranged alternately with the second line pattern, and between the first line pattern and the second line pattern. The at least one first predetermined pattern and the at least one second predetermined pattern are alternately arranged.

The at least one first and second predetermined patterns include two patterns connected in series through a connection pattern.

When the at least one first and second predetermined pattern is a quadrangle, at least one side of the quadrangle is preferably larger than the width of the line pattern, and the quadrangle may be any one of a square, a rectangle, and a rhombus. Can be.

In the case where the at least one first and second predetermined pattern is circular, the diameter of the circular shape is preferably larger than the width of the line pattern.

A bipolar electro-static chuck according to another aspect of the present invention is a bipolar electro-static chuck including a first electrode and a second electrode, wherein the first The electrode is formed to have two first square patterns alternately connected in both directions at a plurality of positions of each of the plurality of first line patterns, and the second electrode is alternately disposed with the plurality of first line patterns. Two second square patterns alternately connected in both directions at a plurality of positions of each of the plurality of second line patterns may be alternately disposed with the first square patterns.

According to yet another aspect of the present invention, a substrate processing method using a bipolar electro-static chuck that generates electrostatic power using two electrodes includes a substrate having the electro-static chuck. Loading onto the bed; Chucking the loaded substrate by biasing two electrodes of the electro-static chuck; Processing the chucked substrate by a process process; And dechucking the processed substrate by reverse biasing the two electrodes of the electro-static chuck after the machining, wherein the bipolar electro-static chuck A first electrode formed to have two first square patterns alternately connected in both left and right directions at a plurality of positions of each of the plurality of first line patterns, and a plurality of second alternately disposed with the plurality of first line patterns Chucking and dechucking the substrate using a second electrode formed such that two second square patterns alternately arranged in both left and right directions at a plurality of positions of each of the line patterns are alternately disposed with the first square patterns. (dechucking).

Here, the substrate processing method may be used for manufacturing a panel for a flat panel display or for manufacturing a semiconductor chip, and the processing may be performed by photography, etching, diffusion, ion implantation, metal deposition, chemical vapor deposition, and up and down. It may include any one or more of the bonding of the glass substrate.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings 1 to 5 as follows. For reference, embodiments of the present invention will be described taking an example applied to the process equipment of the apparatus for manufacturing a panel for flat panel display such as a liquid crystal display.

2 is a view for explaining an electro-static chuck 20 according to an embodiment of the present invention. Referring to FIG. 2, the electro-static chuck 20 may be embedded in a body 21 or manufactured separately from the body 21 and then coupled to the electrode part 22. ).

The electro-static chuck 20 is a bipolar type including two electrodes (+,-) for applying voltages of opposite polarities to the electrode portion 22. The electro-static chuck 20 is a flat panel display such as a liquid crystal display, a plasma display, an organic light emitting diode display, or the like. In the manufacture of a display device or panel, glass substrates in various process facilities or chambers are fixed by electrostatic force so that photography, etching, diffusion, ion implantation, metal deposition, chemical vapor deposition, and top and bottom Manufacturing process processes, such as bonding of a glass substrate, are made to be made stable. In addition, the electro-static chuck 20 may be used in various process facilities or chambers for manufacturing various semiconductor chips.

In particular, the electro-static chuck 20, as described in the description of Figure 3, the two electrodes of the electrode portion 22 is made of a wooden profile of the electrode pattern (wood profile). As a result, the electrode area of the electro-static chuck 20 against the substrate becomes uniform, so that a charge opposite to that of the electrode of the electrode portion 22 is generated when the substrate is chucked. The electrostatic force of and can be induced uniformly in the whole area. As the stable chucking of the substrate is performed, the uniformity of the substrate processing can be improved, and the friction between the substrate is evenly distributed, so that the degree of wear of the insulating layer existing between the substrate and the electrode is uniform. The effect of extending the life of the electro-static chuck) 20 is also expected. In addition, as in the uniform distribution of electrostatic power, when dechucking, it is possible to quickly erase the charges induced in the substrate, thereby saving time during the dechucking process, which requires waiting until the charge is erased. You can also expect the effect.

3 illustrates an electrode pattern 30 of the electrode unit 22 of the electro-static chuck 20 according to the present invention. Referring to FIG. 3, the electro-static chuck 20 includes a first electrode 31 and a second electrode 32.

As shown in FIG. 3, the first electrode 31 and the second electrode 32 each include patterns of a tree profile. That is, each of the first electrode 31 and the second electrode 32 has at least one predetermined pattern, for example, two rectangular patterns each having a left and right sides of the line pattern at a plurality of positions on a line pattern. Includes twig-shaped patterns connected in both directions. In this case, the twig-shaped patterns of the first electrode 31 are separated without being intersected with the twig-shaped patterns of the second electrode 32 and are alternately arranged. Alternately disposed between the line patterns of the first electrode 31 and the line patterns of the second electrode 32, and also the two square patterns of the first electrode 31 and the second electrode 32. The two square patterns of are alternately arranged. As such, the twig-shaped patterns of the first electrode 31 and the twig-shaped patterns of the second electrode 32 have at least one predetermined pattern, for example, two rectangular patterns on a line pattern. It includes tree branches alternately connected in both the left and right directions of the line pattern at a plurality of positions.

As shown in FIG. 3, it can be seen that predetermined patterns, such as two rectangular patterns, are continuously connected through a predetermined short connection pattern in either the left or right direction of the line pattern. Here, the two rectangular patterns are preferably in the form of squares, but may be in the form of other squares, such as a rectangle or a rhombus, as necessary. In addition, the present invention is not limited thereto, and patterns of other shapes, such as circles, may be used instead of the two rectangular patterns.

In the case where the pattern connected to the left and right of the line pattern is a quadrangle, four sides of the quadrangle are preferably larger than the width of the line pattern in order to increase the use area of the electrode relative to the total area and to induce appropriate electrostatic force. In particular, it is preferable that at least one side of the rectangle is larger than the width of the line pattern. In addition, in the case where the pattern connected to the line pattern to the left and right is another shape such as a circle, it may be preferable that the width of at least one side of the diameter or the other shape of the circle is larger than the width of the line pattern.

4 is an enlarged view of a part of an electrode pattern of an electro-static chuck 20 according to an embodiment of the present invention. Referring to FIG. 4, the first electrode 31 of the electro-static chuck 20 is left at positions spaced apart on the first line pattern 41 and the first line pattern 41. Two first square patterns 42 alternately connected in a direction and a right direction. In addition, the second electrode 32 of the electro-static chuck 20 is leftward and rightward at positions spaced apart from the second line pattern 45 and the second line pattern 45. It includes two second square pattern 46 alternately connected one by one.

In this case, the first line pattern 41 is repeatedly arranged several times alternately with the second line pattern 45 and between the first line pattern 41 and the second line pattern 45. The first square pattern 42 and the two second square patterns 46 are alternately arranged.

In addition, the two first square patterns 42 and the two second square patterns 46, respectively, as shown in Figure 4, two square patterns are connected in series form in series with each line pattern through a predetermined short connection pattern It is. At this time, the two rectangular patterns are arranged above a predetermined angle without being parallel to each other. However, the present invention is not limited thereto, and if necessary, in each of the two first square patterns 42 and the two second square patterns 46, the two square patterns may be horizontally arranged side by side. In addition, one square pattern may be used instead of each of the two first square patterns 42 and the two second square patterns 46, and in some cases, three or four square patterns may be used. It may also be considered.

As described above, an electro-static chuck 20 according to an embodiment of the present invention includes a first electrode 31 and a second electrode 32, and the first electrode 31. Is formed to have two first square patterns alternately connected in both the left and right directions at a plurality of positions of each of the plurality of first line patterns, and the second electrode 32 is connected to the plurality of first line patterns. Two second square patterns alternately connected in both the left and right directions at a plurality of positions of each of the plurality of second line patterns alternately disposed are alternately disposed with the first square patterns.

5 is a flowchart illustrating a method of processing a substrate using an electro-static chuck 20 according to an embodiment of the present invention.

Referring to FIG. 5, first, a semiconductor wafer substrate for manufacturing a semiconductor chip or a glass substrate for manufacturing a flat panel display panel is prepared (S510). The prepared substrate may be a bare substrate on which no film is deposited, or may be a substrate transferred after being subjected to a certain process in a previous step.

The substrate thus prepared is transferred to a predetermined process chamber and the like and loaded onto the electro-static chuck 20 in the chamber (S520). The loaded substrate is chucked by the electro-static chuck 20 to securely hold the substrate unaltered before processing the substrate loaded on the electro-static chuck 20. chucking). In order to chuck the substrate, the two electrodes 31 and 32 of the electro-static chuck 20 as described above are biased with DC voltages of opposite polarities to each other (S530). When the substrate is chucked to the electro-static chuck 20, the opposite charges induced in the substrate by the two electrodes 31, 32 of the electro-static chuck 20 The substrate remains unchanged in the electro-static chuck 20 in accordance with the static power of the, i.e., Johnson-Rahbek force or Coulomb force.

After the substrate is chucked, the substrate is processed by a process process (S540). For example, a panel for a flat panel display or a semiconductor chip may be manufactured by a process such as photography, etching, diffusion, ion implantation, metal deposition, chemical vapor deposition, and bonding of upper and lower glass substrates. Can be.

When substrate processing is complete, the opposite polarity of the voltage applied to each of the two electrodes 31, 32 of the electro-static chuck 20 during chucking for dechucking of the substrate Reverse biasing to the voltage of (S550). When the substrate is dechucked from the electro-static chuck 20, the counter charges that have been induced on the substrate at the time of chucking are erased and thus the substrate and the electro-static chuck The electrostatic force between the 20 is removed so that the substrate can be easily separated from the electro-static chuck 20. The substrate separated from the electro-static chuck 20 may be transferred to another process facility and processed for subsequent processing (S560).

As such, for chucking and dechucking of the substrate in a process chamber or the like, as shown in FIG. 3, two two alternatingly connected in both left and right directions at a plurality of positions of each of the plurality of first line patterns Two first electrodes 31 formed to have first square patterns and two second line patterns alternately connected in both the left and right directions at a plurality of positions of each of the plurality of second line patterns that are alternately disposed with the plurality of first line patterns. By using the electro-static chuck 20 having a second electrode 32 formed so that two square patterns are alternately arranged with the first square patterns, stable chucking and rapid dechucking ( dechucking).

That is, since the fine electrode pattern of the wood profile is evenly distributed over the entire area, the electrostatic chuck 20 and the substrate are uniform in the whole area during substrate chucking. Can be induced. Such stable chucking of the substrate may allow the substrate to be stably fixed to the electro-static chuck 20 without shaking, so that uniform processing may be performed on the entire surface of the substrate during substrate processing. In addition, since the friction with the substrate by the electrostatic force is evenly distributed, the wear degree of the insulating layer existing between the substrate and the electrode may be uniform, thereby increasing the life of the electro-static chuck 20. . In addition, as in the uniform distribution of the electrostatic power, when dechucking, it is possible to quickly erase the charges induced in the substrate, thereby saving time during the dechucking process of waiting for the charge to be erased. .

Bipolar electro-static chuck having a branched electrode pattern according to the present invention and a substrate processing method using the same can be modified and applied in various forms within the scope of the technical idea of the present invention. For example, in the above embodiments, the patterns connected to each line pattern are preferably rectangular patterns, but may be replaced with various shapes such as a circle, a triangle, a rhombus, and the like, as necessary. After all, the embodiments and the drawings are only for the purpose of describing the details of the invention, and are not intended to limit the scope of the technical idea of the invention, the scope of the present invention is not only the claims described below, but It should be judged to include an even range.

As described above, in the bipolar electro-static chuck and the substrate processing method using the same, the branch-shaped electrode patterns are uniformly distributed throughout the electro-static chuck. Since it is arranged so that the electrode area against the substrate can be made uniform, a uniform electrostatic force can be induced in the entire area.

In addition, in the bipolar electro-static chuck and the substrate processing method using the same, the chucking between the electro-static chuck and the substrate is stable, so that the substrate is processed in a process facility. The uniformity of substrate processing during the process can be improved, and the dechucking can be fast, saving the transfer time to equipment for other process processes.

In the bipolar electro-static chuck and the substrate processing method using the same, the friction between the electro-static chuck and the substrate is evenly distributed by the uniform electrostatic force in the entire area. By doing so, the degree of abrasion of the insulating layer present between the substrate and the electrode can be made uniform, resulting in a long life of the electro-static chuck.

Claims (14)

A first electrode having a plurality of first patterns; And A second electrode separated from the plurality of first patterns and having a plurality of second patterns alternately disposed with the plurality of first patterns; Including, The plurality of first patterns and the plurality of second patterns may include a branched shape in which at least one predetermined pattern is alternately connected in both directions to the left and right of the line pattern at a plurality of positions on the line pattern. chuck. The method of claim 1, wherein the at least one predetermined pattern, And two patterns connected in series through a connection pattern in one direction of the line pattern. The bipolar electrostatic chuck of claim 1, wherein the predetermined pattern is a quadrangle and at least one side of the quadrangle is larger than a width of the line pattern. The method of claim 3, wherein the rectangle is, A bipolar electrostatic chuck, wherein the shape is one of square, rectangular, and rhombus. The bipolar electrostatic chuck of claim 1, wherein the predetermined pattern is circular, and the diameter of the circular shape is larger than the width of the line pattern. A first electrode and a second electrode, The first electrode includes a first line pattern and at least one first predetermined pattern alternately connected in a left direction and a right direction at positions spaced apart on the first line pattern. The second electrode includes a second line pattern and at least one second predetermined pattern alternately connected to the left and right directions at positions spaced apart on the second line pattern, The first line pattern is alternately arranged alternately with the second line pattern, and the at least one first predetermined pattern and the at least one second predetermined pattern are alternated between the first line pattern and the second line pattern. Bipolar electrostatic chuck, characterized in that arranged. The method of claim 6, wherein the at least one first and second predetermined patterns, A bipolar electrostatic chuck comprising two patterns connected in series via a connection pattern. The bipolar electrostatic chuck of claim 6, wherein the at least one first and second predetermined pattern is a quadrangle, and at least one side of the quadrangle is larger than a width of the line pattern. The method of claim 8, wherein the rectangle is, A bipolar electrostatic chuck, wherein the shape is one of square, rectangular, and rhombus. 7. The bipolar electrostatic chuck of claim 6, wherein the at least one first and second predetermined pattern is circular, and the diameter of the circular is greater than the width of the line pattern. In a bipolar electrostatic chuck comprising a first electrode and a second electrode, The first electrode is formed to have two first square patterns alternately connected in both the left and right directions at a plurality of positions of each of the plurality of first line patterns. The second electrode may include two second square patterns alternately connected in both the left and right directions at a plurality of positions of each of the plurality of second line patterns that are alternately disposed with the plurality of first line patterns. Bipolar electrostatic chuck, characterized in that formed to alternate with each other. In the substrate processing method using a bipolar electrostatic chuck that generates electrostatic power using two electrodes, Loading a substrate onto the electrostatic chuck; Biasing the two electrodes of the electrostatic chuck to chuck the loaded substrate; Processing the chucked substrate by a process process; And Dechucking the processed substrate by reverse biasing the two electrodes of the electrostatic chuck after the processing, The bipolar electrostatic chuck, A first electrode formed to have two first square patterns alternately connected in both left and right directions at a plurality of positions of each of the plurality of first line patterns, and a plurality of second alternately disposed with the plurality of first line patterns Chucking and dechucking the substrate using a second electrode formed such that two second square patterns alternately arranged in both left and right directions at a plurality of positions of each of the line patterns are alternately disposed with the first square patterns. Substrate processing method. The method of claim 12, wherein the processing is A substrate processing method comprising at least one of photography, etching, diffusion, ion implantation, metal deposition, chemical vapor deposition, and bonding of upper and lower glass substrates. The substrate processing method according to claim 12, wherein the substrate processing method is used for manufacturing a panel for a flat panel display or manufacturing a semiconductor chip.

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