KR20080065385A - Apparatus for mixing and supplying camical material - Google Patents

Abstract

A compound mixing and supplying apparatus is provided to cope with the change of processes quickly by adding baths according to the number of compounds and to reduce the installation space by making the structure and volume small. A compound mixing and supplying apparatus(100) is composed of: plural compound baths(110,110') receiving compounds through a supply pipe(111,111'); plural feedback baths(120,120') positioned lower than each compound bath; plural level adjusting units(140,140') connecting each compound bath and each feedback bath to drop the compounds fed excessively, to each feedback bath; a mixing bath(130) for receiving the compounds from each compound bath and mixing the compounds at the predetermined ratio; and plural mixing bath delivery pipes(150,150') connecting each compound bath and the mixing bath to deliver the compounds filled into each compound bath, to the mixing bath.

Description

Compound Mix Feeder {APPARATUS FOR MIXING AND SUPPLYING CAMICAL MATERIAL}

1 is a block diagram of a compound mixing supply device according to an embodiment of the present invention

Figure 2 is a cross-sectional view showing a level control unit associated with compound A in the compound mixture supply according to an embodiment of the present invention

3 is a cross-sectional view showing a level control unit associated with a compound B in a compound mixing supply device according to an embodiment of the present invention;

Figure 4 is a flow chart illustrating a compound mixture supply method according to an embodiment of the present invention

5 is a block diagram of a compound mixing supply device according to another embodiment of the present invention

6 is a cross-sectional view showing a level control unit associated with compound A in a compound mixing supply device according to another embodiment of the present invention.

7 is a cross-sectional view showing a level control unit associated with compound B in a compound mixing supply device according to another embodiment of the present invention.

8 is a flowchart for explaining a compound mixture supply method according to another embodiment of the present invention.

9 is a view for explaining a liquid level fluctuation prevention structure in the compound mixing supply apparatus according to another embodiment of the present invention

* Drawing reference for the main part

111, 111 ': Supply piping

110,110 ': Compound Bath

120,120 ': Feedback Bath

130: mixed bath

140,140 ': level control unit

150,150 ': Mixed bath delivery piping

160,160 ': storage bath

170,170 ': Plumbing for storage vessel delivery

V ₁ , V ₁ ', V ₂ , V _{2 ,} ' V ₃ , V ₃ ', V ₄ , V ₄ ', V ₅ , V ₅ ': opening and closing valve

V ₆ , V ₆ ': Three way valve

S: Guide slot

141,141 ': connection piping

142,142 ': Open / Close Valve

143,143 ': No seal

211,211 ': Supply piping

210,210 ': Compound Beth

215,215 ': Compound Auxiliary Bath

220,220 ': Feedback Bath

230: Mixed bath

240,240 ': Level control unit

250,250 ': Mixed bath delivery piping

260,260 ': storage bath

270,270 ': Plumbing for storage bath delivery

V ₆ , V ' ₆ : 3 way valve

The present invention relates to a compound mixing feeder, and more particularly, to a compound mixing feeder capable of mixing and supplying various amounts of compounds.

In general, in order to meet the various requirements of the production process in the production process of electrical, electronic components and chemicals, including the semiconductor industry, it is necessary to mix and supply 2-4 kinds of chemicals at a certain ratio according to the process conditions through the chemical supply device. It is universal.

As semiconductor circuits become more integrated, the mixing ratio of chemicals continues to change as semiconductor processes become more complex and process conditions change steadily. For example, the abrasive used in the chemical mechanical polishing process is increasing the semiconductor yield by mixing a certain amount of fruit tree (H ₂ O ₂ ) in the slurry (Slurry) to remove the step and the target metal film to a certain thickness.

Most compound mixing feeders and wet stations used in semiconductor processes may continue to require changes in their mixing conditions as mentioned above as the process changes. However, in many cases it is difficult to respond immediately to the requirements. Because existing compounds and wet stations change the structure and program of the device as the measuring tank, level sensor or compound changes, each time successful mixing is required. In addition, in order to mix various compounds, the structure of the device becomes large and complicated, making makeup procedures difficult, and the system becomes large, taking up a lot of manufacturing space. When mixing 3-4 kinds of compounds, it is necessary to supply a certain amount to the tank at a certain ratio, but it is difficult to measure the exact mixing ratio of most make-up compounds because there is no accurate concentration meter. In addition, failure to match the mixing ratio may result in not only loss of the compound but also decrease in semiconductor yield.

Accordingly, the present invention has been devised in view of the above problems, and an object of the present invention is to provide a compound mixing supply device which can easily adjust the amount of a compound by only adjusting the level of the level control unit using potential energy. .

In addition, an object of the present invention is to provide a compound mixture supply device that can respond quickly to process changes by adding as many baths as the number of compounds to be mixed.

In addition, the problem to be achieved by the present invention is to provide a compound mixing supply device that can be reduced in structure and volume, the installation space is not large, and the loss of the compound and improve the yield.

In order to realize the above technical problem, a compound mixture supply device according to an embodiment of the present invention includes a plurality of compound baths through which a compound is supplied through a supply pipe; A plurality of feedback baths positioned relatively lower than each compound bath; A plurality of level adjusting units connecting the respective compound baths and the respective feedback baths such that the compound supplied to the compound baths and the supplied compounds fall toward the respective feedback baths; A mixing bath which receives the compound from the compound baths at a predetermined ratio and mixes them; And a plurality of mixed bath delivery pipes for connecting the compound bath and the mixed bath so that the compound filled in the compound bath is sent toward the mixed bath.

A gas inlet pipe through which nitrogen gas is injected into the feedback bath is connected to one side of each feedback bath, and a storage bath delivery pipe for feeding back the compound filled in the feedback bath to the storage bath is connected to the other side.

The level control unit may be connected to the height adjustable along the guide slot formed on the side of the compound bath and the feedback bath; An on / off valve installed in the middle of the connecting pipe; And a sealing member for sealing the guide slot formed on the side surfaces of the compound bath and the feedback bath.

A capacitive sensor is installed in each of the feedback baths, and an opening and closing valve for opening and closing the flow of the compound is installed in the middle of each of the supply pipes and each of the mixed baths.

The diameter of the compound bath in the vicinity of the level control unit is set relatively smaller than the diameter of the place in the other part.

Compound mixing supply method according to an embodiment of the present invention comprises the steps of adjusting the level control unit of each compound bath so that the appropriate amount of compound is filled in each compound bath; Supplying an amount of a compound to each compound bath; Filling each compound bath with a predetermined amount of compound and dropping the overfed compound into each of the feedback baths; Sensing an amount of the compound dropped into each of the feedback baths to determine whether an appropriate amount of the compound is filled in each of the compound baths; Blocking supply pipes installed in the respective compound baths when an appropriate amount of the compound is filled in the compound baths; Sending a compound filled in each of the compound baths into a mixing bath; And mixing and supplying a compound supplied from each compound bath.

On the other hand, the compound mixture supply apparatus according to another embodiment of the present invention a plurality of compound bath to which the compound is supplied through the supply pipe; A plurality of compound auxiliary baths positioned relatively lower than each compound bath; A plurality of feedback baths positioned relatively lower than each compound auxiliary bath; Of the compounds supplied to the respective compound baths, a plurality of compounds connecting the respective compound baths, the compound auxiliary baths and the respective feedback baths so that the over-supplied compounds are sequentially dropped toward the compound auxiliary baths and the respective feedback baths. Level adjusting unit; A mixed bath which receives a compound at a predetermined ratio and mixes the compound bath and the compound auxiliary bath; And a plurality of mixed bath delivery pipes connecting the respective compound baths, the compound auxiliary baths, and the mixed baths such that the compounds filled in the compound baths and the compound auxiliary baths are sent toward the mixing baths.

In addition, the compound mixture supply method according to another embodiment of the present invention comprises the steps of adjusting the level adjusting unit of each compound bath and each compound auxiliary bath so that the appropriate amount of the compound is filled in each compound bath and each compound auxiliary bath; Supplying a certain amount of compound to each compound bath through each supply piping; Each compound over-supplied to each compound bath falls to each compound auxiliary bath, and the compound over-supplied to each compound auxiliary bath falls to each compound feedback bath; Sensing, by the electrostatic sensor, an amount of the compound dropped into each feedback bath, and determining whether an appropriate amount of the compound is filled in each compound bath and each compound auxiliary bath; If the correct amount of the compound is not filled in each compound bath and each compound auxiliary bath, the compound is continuously supplied to the compound bath through the supply pipe.If the appropriate amount of the compound is filled in each compound bath and each compound auxiliary bath. Closing the on / off valve to stop supplying the compound from each supply pipe; Operating the three-way valve to deliver the compound filled in each compound bath to the primary mixing bath; Mixing the compound introduced into the mixing bath in the mixing bath; Operating a three-way valve to deliver the compound filled in each compound auxiliary bath to the secondary mixing bath, and feeding back the compound dropped into the feedback bath to the storage bath; And mixing the compound introduced into the mixing bath using a mixer in the mixing bath and supplying the same to a production process in need thereof.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

In the compound mixing supply apparatus according to the preferred embodiment of the present invention, the apparatus for mixing and supplying the compound A and the compound B is described as an example. Here, although not shown in the drawings, when the C compound is added, a bath related to the C compound is added to the apparatus, thereby enabling rapid response to process changes.

1 is a block diagram of a compound mixture supply apparatus according to an embodiment of the present invention, Figure 2 is a cross-sectional view showing a level control unit associated with the compound A in the compound mixture supply apparatus according to an embodiment of the present invention, 3 is a cross-sectional view showing a level control unit associated with a compound B in a compound mixing supply device according to an embodiment of the present invention.

1 to 3, the compound mixture supply device 100 according to an embodiment of the present invention includes a plurality of compound baths 110 and 110 to which each compound is supplied through supply pipes 111 and 111 ′. '), A plurality of feedback baths 120 and 120' positioned relatively lower than the respective compound baths 110 and 110 ', and each compound is fixed from the compound baths 110 and 110'. It is provided with a mixing bath 130 to receive and mix at a ratio.

And each of the compound baths 110 and 110 'such that the compound supplied to the compound baths 110 and 110' falls toward the respective feedback baths 120 and 120 '. A plurality of level adjusting units 140 and 140 ′ are connected between the feedback baths 120 and 120 ′.

The compound baths 110 and 110 ′ and the compound baths 110 and 110 ′ are disposed under the compound baths 110 and 110 ′ so that the compounds filled in the compound baths 110 and 110 ′ are sent out toward the mixing bath 130. A plurality of mixing bath delivery pipes 150 and 150 ′ connecting the mixing bath 130 are connected.

Gas injection pipes 121 and 121 'are connected to one side of each of the feedback baths 120 and 120' to allow nitrogen gas N ₂ to be injected into the feedback baths 120 and 120 '. Storage vessel delivery piping (170, 170 ') for feeding back the compound filled in the feedback bath (120, 120') toward the storage bath (160, 160 ') is connected to the side.

An opening / closing valve V ₁ (V ₁ ′) is provided in the middle of each of the supply pipes 111 and 111 ′, and in the middle of each of the nitrogen supply pipes 121 and 121 ′. Opening and closing valve (V ₂ ) (V ₂ ') for limiting the supply of nitrogen gas is installed, the opening and closing valve (V ₃₎ for opening and closing the flow of the compound in the middle of each of the mixing vessel delivery pipe 150, 150' (V ₃ ') is installed. And the opening and closing valve (V ₄ ) (V _{4 '} ) is installed in the storage vessel delivery pipe (170, 170').

The level adjusting unit 140, 140 ′ is connected with height adjustment along each guide slot S formed in the side surfaces of the compound baths 110, 110 ′ and the feedback baths 120, 120 ′. Pipes 141 and 141 '; On-off valves 142 and 142 'installed in the middle of the connection pipes 141 and 141'; And sealing members 143 and 143 'for sealing the guide slot S.

The connecting pipes 141 and 141 'are installed to be inclined so that the compound falls smoothly toward the feedback baths 120 and 120'. The on-off valves 142 and 142 'open and close the flow of the compound.

The seal members 143 and 143 'are formed at both ends of the connection pipes 141 and 141', and at the connection portions of the compound baths 110 and 110 'and the feedback baths 120 and 120'. It serves to seal gaps (not shown).

Capacitive sensors 125 and 125 'are installed in each of the feedback baths 120 and 120' so that the compound drops from the compound baths 110 and 110 'to the feedback baths 120 and 120'. It measures the amount of.

Inside the mixing bath 130, a mixer 131 for mixing the compound sent from each of the compound baths 110 and 110 'is installed.

Hereinafter, with reference to Figure 4 will be described the operation of the compound mixture supply apparatus according to an embodiment configured as described above.

Figure 4 is a flow chart illustrating a compound mixture supply method according to an embodiment of the present invention.

1, 2, and 4, first, the level adjusting units 140 and 140 ′ of the compound baths 110 are adjusted to fill an appropriate amount of the compound baths 110 and 110 ′ (S110). . In other words, the connecting pipes 141 and 141 'of the level adjusting units 140 and 140' are moved up and down so that the appropriate compound is filled in the A compound bath 110 and the B compound bath 110 '. Adjust

In this state, the A compound and the B compound are respectively supplied to the A compound bath 110 and the B compound bath 110 'through the respective supply pipes 111 and 111' (S120). At this time, since the height of the connection pipes 141 and 141 'of the level adjusting unit was adjusted in the previous step, an appropriate amount of the compound, for example, A compound bath (A compound bath 110 and B compound bath 110') ( 2 liters in the 110 and 1 liter in the B compound bath 110 ', and the over-supplied compound falls into the respective feedback baths 120 and 120' (S130). This uses the potential energy of water and uses the principle that water flows from a high place to a low place.

The electrostatic sensors 125 and 125 'sense the amount of the compound dropped to each feedback bath 120 and 120', and the appropriate amount of the compound is added to the A compound bath 110 and the B compound bath 110 '. It is determined whether it is filled (S140).

If the compound A and B compound 110 'are not filled with the proper amount of compound, the compound is continuously supplied to the compound baths 110 and 110' through the supply pipes 111 and 111 '. and, if a compound bath 110 and the B compound bath 110 'when turned the compound of the titration quantity filled in, the compounds bath (110 and 110' opening mounted at an upper side of) the valve (V ₁₎ (V ₁ ') Is blocked to stop the compound supply from the supply pipes 111 and 111' installed in the A compound bath 110 and the B compound bath 110 '(S150).

In this state, the compound A filled in the A compound bath 110 and the B compound bath 110 'by opening and closing the valve V ₃ (V ₃ ′) installed under each compound bath 110, 110 ′. 2 liters and 1 liter of compound B are sent to the mixing bath 130. At the same time, the compound dropped to the feedback baths 120 and 120 'is fed back through the gas injection pipes 121 and 121'. The nitrogen gas (N ₂ ) injected into the 120 (120) is fed back to the storage bath (160) (160 ') (S160).

Next, the mixing bath 130 mixes the A compound and the B compound introduced into the mixing bath 130 using the mixer 131 and supplies them to the production process that requires them (S170).

On the other hand, Figure 5 is a block diagram of a compound mixture supply apparatus according to another embodiment of the present invention, Figure 6 is a cross-sectional view showing a level control unit associated with compound A in the compound mixture supply apparatus according to another embodiment of the present invention 7 is a cross-sectional view showing a level control unit associated with a compound B in a compound mixing supply apparatus according to another embodiment of the present invention.

In the compound mixing supply apparatus according to another embodiment of the present invention, the difference from the compound mixing supply apparatus according to an embodiment of the present invention, the compound auxiliary bath is added to the compound mixing supply apparatus according to an embodiment of the present invention There is a point. Therefore, in the compound mixing supply apparatus according to another embodiment of the present invention, it is possible to continuously mix and supply the compound by the compound auxiliary bath.

5 to 7, the compound mixture supply apparatus 200 according to another embodiment of the present invention is a plurality of compound bath (210, 210 ') to which the compound is supplied through the supply pipe 211, 211' And a plurality of compound auxiliary baths 215 and 215 'positioned relatively lower than each of the compound baths 210 and 210', and lower than the compound auxiliary baths 215 and 215 '. A mixed bath that receives a plurality of compounds from a plurality of feedback baths 220 and 220 ', and the compound baths 210 and 210' and the compound auxiliary baths 215 and 215 'in a proportion. 230.

The over-supplied compound among the compounds supplied to each of the compound baths 210 and 210 'is sequentially dropped toward the compound compound baths 215 and 215' and the respective feedback baths 220 and 220 '. A plurality of level adjusting units 240 connecting the compound baths 210 and 210 ', the compound auxiliary baths 215 and 215', and the feedback baths 220 and 220 'to connect them to each other. 240 'is installed.

Under each compound bath 210, 210 'and each compound auxiliary bath 215, 215', each compound bath 210, 210 'and each compound auxiliary bath 215, 215' ) To connect each compound bath (210) (210 '), each compound auxiliary bath (215) (215') and each mixing bath (230) so that a compound filled in the mixing bath (230) is sent out toward the mixing bath (230). A plurality of mixed bath delivery pipes 250, 250 'are provided.

Gas feed pipes 221 and 221 ′ in which nitrogen gas is supplied into the feedback baths 220 and 220 ′ are connected to the upper sides of the feedback baths 220 and 220 ′, and the feedback baths 221 and 221 ′ are connected to the bottom of the feedback baths 220 and 220 ′. Storage vessel delivery pipes 270 and 270 'are connected such that the compound filled in the 220 and 220' is fed back to the storage baths 260 and 260 '.

In the middle of each of the supply pipes (211, 211 '), the opening and closing valve (V ₁ ) (V ₁ ') for limiting the supply of the compound is installed, the middle of each of the nitrogen supply pipes (221, 221 ') Opening and closing valve (V ₂ ) (V ₂ ') for limiting the supply of nitrogen gas is installed, the opening and closing valve (V ₃₎ for opening and closing the flow of the compound in the middle of each of the mixing vessel delivery pipe (250, 250') ) (V ₅ ) (V ₃ ') (V ₅ ') is installed, the opening and closing valve (V ₄ ) (V _{4 '} ) is installed in the storage vessel delivery pipe (270, 270'). In addition, a compound filled in each compound bath 210 and 210 'or a compound filled in each compound auxiliary bath 215 and 215' are selectively selected in the middle of each of the mixed bath delivery pipes 250 and 250 '. Three-way valve (V ₆ ) (V ' ₆ ) is installed to send out.

Each level adjusting unit 240, 240 ′ is provided on the side of each compound bath 210, 210 ′, each compound auxiliary bath 215, 215 ′, and a feedback bath 220, 220 ′. Connecting pipes 241 and 241 'which are vertically adjusted along the guide slots S formed; On-off valves 242 and 242 'installed in the middle of the connection pipes 241 and 241'; And sealing members 243 and 243 'for sealing the guide slot S. Capacitive sensors 225 and 225 'are installed in the feedback baths 220 and 220', respectively.

Here, in the configuration of each level control unit, the connection pipe which is adjusted up and down along the guide slots formed on the side of each compound auxiliary bath (215, 215 ') and each of the feedback bath (220, 220'), The sealing member for sealing the on-off valve and the guide slot (S) is the same as the above-mentioned structure, so the description thereof will be omitted below.

Hereinafter, with reference to Figure 8 will be described the operation of the compound mixing supply device according to another embodiment of the present invention configured as described above.

8 is a flowchart illustrating a compound mixture supply method according to another embodiment of the present invention.

5, 6, and 8, first, each compound bath 110, 110 ′ and each compound auxiliary bath 215, 215 ′ are filled with an appropriate amount of the compound bath 110, 110 ′. ') And the level adjusting units 240 and 240' of the compound auxiliary baths 215 and 215 'are adjusted (S210). In other words, the connection pipe 241 of the level adjusting unit 240, 240 'such that each compound bath 210, 210' and each compound auxiliary bath 215, 215 'is filled with an appropriate amount of a compound ( 241 ') up and down to adjust its height. In this state, a certain amount of compound is supplied to each compound bath 210 and 210 'through each supply pipe 211 and 211' (S220).

In this case, since the height of the connection pipes 241 and 241 'of the level adjusting units 240 and 240' is adjusted in the previous step, the compound A of the bath 210 and the compound A of the auxiliary bath 215 may include an appropriate amount of a compound, For example, two liters and two liters of the compound are filled, and the B compound bath 210 'and the B compound auxiliary bath 215' are filled with an appropriate amount of a compound, for example, one liter and one liter of the compound. In other words, the A compound oversupplied to the A compound bath 210 falls toward the A compound auxiliary bath 215, and the compound oversupplied to the A compound auxiliary bath 215 falls toward the A compound feedback bath 220. . In the same manner, the B compound is also sequentially dropped toward the B compound auxiliary bath 215 'and the B compound feedback bath 220' (S230).

Then, the electrostatic sensor 225, 225 'senses the amount of compound dropped into each feedback bath 220, 220', each compound bath 210, 210 ', each compound auxiliary bath 215 It is determined whether the appropriate amount of the compound is filled in 215 '(S240).

In the case where the proper amount of the compound is not filled in each compound bath 210, 210 ′ and each compound auxiliary bath 215, 215 ′, each compound bath 210 is supplied through the supply pipes 211, 211 ′. Continue supplying the compound toward (210 '), and if the appropriate amount of compound is filled in each compound bath (210) (210') and each compound auxiliary bath (215) (215 '), the closing valve (V ₁ ) Blocking (V ₁ ') to stop the compound supply from each supply pipe (211) (211') (S250).

In this state, each of the three-way valve (V ₆ ) (V ₆ ') is operated to send the compound filled in each compound bath (110) (110') to the primary mixing bath (230) (S260).

In the mixing bath 230, the compound introduced into the mixing bath 230 is mixed using the mixer 231 (S270).

Next, each of the three-way valves V ₆ (V ₆ ′) is operated to deliver the compound filled in each compound auxiliary bath 215, 215 ′ to the secondary mixing bath 230, and the feedback bath 220. The compound dropped to 220 'is injected into nitrogen feedback into the feedback baths 220 and 220' and fed back to the storage baths 260 and 260 '(S280).

Next, the mixing bath 230 mixes the compound introduced into the mixing bath 230 using the mixer 231 and supplies it to the production process that requires it (S290).

Meanwhile, FIG. 9 is a view for explaining a liquid level fluctuation prevention structure in the compound mixing supply device according to another embodiment of the present invention, wherein the compound bath 210 and the compound auxiliary bath 215 are adjacent to each other. Diameter d) is set relatively smaller than diameter D of the other part. By such a structure, an error can be efficiently reduced in volume control by fluctuation of the liquid surface. This technique is of course applied not only to compound baths but also to feedback baths.

As described above, in the detailed description of the present invention has been described with respect to preferred embodiments of the present invention, those skilled in the art to which the present invention pertains various modifications can be made without departing from the scope of the present invention Of course. Therefore, the scope of the present invention should not be limited to the described embodiments, but should be determined not only by the claims below, but also by the equivalents of the claims.

According to the present invention as described above, it is possible to easily adjust the amount of the compound only by the up and down adjustment of the level control unit using the potential energy.

In addition, by adding a bath as many as the number of compounds to be mixed, it is possible to respond quickly to process changes.

In addition, it is very economical because no compound wasted by feeding back the compound supplied with the storage bath.

Moreover, since there is no need for an electronic flowmeter, there is little trouble.

Claims (14)

A plurality of compound baths through which the compound is supplied through the supply piping; A plurality of feedback baths positioned relatively lower than each compound bath; A plurality of level adjusting units connecting the respective compound baths and the respective feedback baths such that the compound supplied to the compound baths and the supplied compounds fall toward the respective feedback baths; A mixing bath for receiving a compound at a predetermined ratio from each compound bath and mixing the mixed bath; And And a plurality of mixed bath delivery pipes connecting the respective compound baths and the mixed baths such that the compounds filled in the compound baths are sent out toward the mixing baths. The method of claim 1, One side of each of the feedback bath is connected to the gas injection pipe for injecting nitrogen gas into the feedback bath, the other side is connected to the storage vessel delivery pipe for feeding back the compound filled in the feedback bath toward the storage bath. Compound mixing supply apparatus. The method of claim 1, The level adjusting unit A connection pipe capable of height adjustment along a guide slot formed on a side of the compound bath and the feedback bath; An on / off valve installed in the middle of the connection pipe; And And a sealing member for sealing a guide slot formed on a side of the compound bath and the feedback bath. The method of claim 1, And a capacitive sensor is installed in each of the feedback baths. The method of claim 1, Compound supply device, characterized in that the opening and closing valve for opening and closing the flow of the compound is installed in the middle of each of the supply pipe, each of the mixing vessel sending pipe. The method of claim 1, And the diameter of the compound bath in the vicinity of the level control unit is set relatively smaller than the diameter of the other portion. Adjusting the level adjusting unit of each compound bath so that a proper amount of compound is filled in each compound bath; Supplying an amount of a compound to each compound bath; Filling each compound bath with a predetermined amount of compound and dropping the overfed compound into each of the feedback baths; Sensing an amount of the compound dropped into each of the feedback baths to determine whether an appropriate amount of the compound is filled in each of the compound baths; Blocking supply pipes installed in the respective compound baths when an appropriate amount of the compound is filled in the compound baths; Sending a compound filled in each of the compound baths into a mixing bath; And Mixing and supplying a compound supplied from each of the compound bath; compound mixing supply method comprising a. Second embodiment A plurality of compound baths through which the compound is supplied through the supply piping; A plurality of compound auxiliary baths positioned relatively lower than each compound bath; A plurality of feedback baths positioned relatively lower than each compound auxiliary bath; Of the compounds supplied to the respective compound baths, a plurality of compounds connecting the respective compound baths, the compound auxiliary baths and the respective feedback baths so that the over-supplied compounds are sequentially dropped toward the compound auxiliary baths and the respective feedback baths. Level adjusting unit; A mixed bath which receives a compound at a predetermined ratio and mixes the compound bath and the compound auxiliary bath; And Compound compound supply comprising a plurality of mixed bath delivery pipe connecting each compound bath, each compound auxiliary bath and the mixed bath so that the compound filled in each compound bath and each compound auxiliary bath is sent toward the mixing bath Device. The method of claim 8, Compound mixing supply device, characterized in that the three-way valve is installed in the middle of the mixing vessel delivery pipe. The method of claim 8, A gas supply pipe for supplying nitrogen gas into the feedback bath is connected to one side of each of the feedback baths, and a pipe for transmitting the storage bath is connected to the other side so that the compound filled in the feedback bath is fed back to the storage bath. Compound mixing feeder. The method of claim 8, The level adjusting unit includes a connection pipe which is adjusted up and down along the guide slot formed on the side of the compound bath, the compound auxiliary bath and the feedback bath; An on / off valve installed in the middle of the connection pipe; And And a sealing member for sealing a guide slot formed on a side surface of the compound bath, the compound auxiliary bath, and the feedback bath. The method of claim 8, And a capacitive sensor is installed in each of the feedback baths. The method of claim 8, And the diameter of the compound bath in the vicinity of the level control unit is set relatively smaller than the diameter of the other portion. Adjusting the level adjusting unit of each compound bath and each compound auxiliary bath so that an appropriate amount of compound is filled in each compound bath and each compound auxiliary bath; Supplying a certain amount of compound to each compound bath through each supply piping; Each compound over-supplied to each compound bath falls to each compound auxiliary bath, and the compound over-supplied to each compound auxiliary bath falls to each compound feedback bath; Sensing, by the electrostatic sensor, an amount of the compound dropped into each feedback bath, and determining whether an appropriate amount of the compound is filled in each compound bath and each compound auxiliary bath; If the correct amount of the compound is not filled in each compound bath and each compound auxiliary bath, the compound is continuously supplied to the compound bath through the supply pipe.If the appropriate amount of the compound is filled in each compound bath and each compound auxiliary bath. Closing the on / off valve to stop supplying the compound from each supply pipe; Operating the three-way valve to deliver the compound filled in each compound bath to the primary mixing bath; Mixing the compound introduced into the mixing bath in the mixing bath; Operating a three-way valve to deliver the compound filled in each compound auxiliary bath to the secondary mixing bath, and feeding back the compound dropped into the feedback bath to the storage bath; And Mixing a compound introduced into the mixing bath using a mixer in the mixing bath and feeding the compound to a production process in need thereof.

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