KR20080062904A - Apparatus and method for grinding liquid crystal display panel - Google Patents

Apparatus and method for grinding liquid crystal display panel Download PDF

Info

Publication number
KR20080062904A
KR20080062904A KR1020060139091A KR20060139091A KR20080062904A KR 20080062904 A KR20080062904 A KR 20080062904A KR 1020060139091 A KR1020060139091 A KR 1020060139091A KR 20060139091 A KR20060139091 A KR 20060139091A KR 20080062904 A KR20080062904 A KR 20080062904A
Authority
KR
South Korea
Prior art keywords
polishing
liquid crystal
crystal panel
edges
vertical
Prior art date
Application number
KR1020060139091A
Other languages
Korean (ko)
Inventor
김점재
신태화
Original Assignee
엘지디스플레이 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지디스플레이 주식회사 filed Critical 엘지디스플레이 주식회사
Priority to KR1020060139091A priority Critical patent/KR20080062904A/en
Publication of KR20080062904A publication Critical patent/KR20080062904A/en

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/08—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
    • B24B9/10—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass
    • B24B9/102—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass for travelling sheets
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nonlinear Science (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Liquid Crystal (AREA)
  • Manufacturing & Machinery (AREA)
  • Mathematical Physics (AREA)

Abstract

The present invention reduces the overall process time by simultaneously performing the removal of the shorting bar and the sharp part of the metal pattern remaining after the scribing process of the unit liquid crystal panel in a large glass in one device. The present invention relates to a polishing apparatus for a liquid crystal panel, comprising: a polishing table for carrying a straight line and a reciprocating motion by loading a liquid crystal panel; First polishing means for moving the polishing table to polish both side edges of the liquid crystal panel vertically and inclinedly; It is characterized in that it comprises a second polishing means which is provided in the same line as the first polishing means to polish both side edges forming the long side of the liquid crystal panel inclined at a vertical angle and a predetermined angle.

Description

Polishing device and polishing method for liquid crystal panel {APPARATUS AND METHOD FOR GRINDING LIQUID CRYSTAL DISPLAY PANEL}

1 is a view showing a unit liquid crystal panel on a large substrate according to the prior art

FIG. 2 is a diagram illustrating a detailed configuration of a unit liquid crystal panel of FIG. 1.

3 is a view showing an apparatus for polishing a liquid crystal panel according to the related art.

4 is a view showing an apparatus for polishing a liquid crystal panel according to the present invention.

FIG. 5 is a view illustrating a vertical grinding wheel of FIG. 4. FIG.

FIG. 6 shows a polishing wheel in an inclined direction of FIG. 4. FIG.

※※ Explanation of symbols for main parts of drawing ※※

110: liquid crystal panel 122: rotation means

124: polishing table 126: suction hole

150a, 150b; 152a, 152b: vertical grinding wheel

151a, 151b; 153a, 153b: inclined grinding wheel

170, 180, 190: alignment means 172, 182, 192: alignment pin

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing apparatus and a polishing method of a liquid crystal panel, and more particularly, to a process of removing sharp portions and shorting bars of metal patterns remaining after a scribing process of a unit liquid crystal panel in a large substrate. This involves reducing the overall process time by simultaneously running the unit on one machine.

As information society progresses rapidly, the demand for display devices is changing in various forms. Recently, various flat panel display devices such as LCD, plasma display panel (PDP), electro luminescent display (ELD), and vacuum fluorescent display (VFD) have been studied, and some of them have already been commercialized.

Among them, LCD is the most widely used mobile image display device because of its excellent image quality, light weight, thinness, low power consumption, etc. In addition to mobile applications such as monitors of notebook computers, it can receive and display broadcast signals. Various developments are made for televisions and computer monitors.

In the general liquid crystal display, as shown in FIG. 1, in order to improve yield, a plurality of thin film transistor array substrates 11 are formed on a large substrate 10 and then formed on a separate large substrate. The liquid crystal panel is formed by bonding the obtained individual color filter substrates 12 onto the array substrate 11, where a cutting process for shipping the unit liquid crystal panel from the large substrate 10 is required.

Of course, the cutting of the unit liquid crystal panel is made along the scribing line 13 formed on the surface of the large substrate 10 with a diamond wheel having a higher hardness than glass, and the crack propagates along the scribing line 13. It is carried out through a process to make it possible.

Next, the structure of the unit liquid crystal panel formed on the large substrate 10 will be described with reference to FIG. 2. In the drawing, the unit liquid crystal panel 20 includes a thin film transistor array in which a plurality of gate lines and data lines arranged at regular intervals cross each other to define a pixel region, and a thin film transistor as a switching element is formed at the crossing portion. The substrate 21 and the color filter substrate 22 on which the color filter layers are formed are bonded to each other to form a liquid crystal layer in the space between the two substrates.

An outer portion of the thin film transistor array substrate 21 extends to a gate line and a data line to form a gate pad and a data pad, and the gate and the data pad are connected to the shorting bars 23 and 24 to be connected to each other. It comes into contact again with (25a, 25b). A scribing line 26 for cutting is formed between the metal wires 25a and 25b and the gate and the data pad.

As described above, the unit liquid crystal panel 20 cut along the scribing line 26 and shipped in individual units may additionally undergo a predetermined polishing process.

First, the unit liquid crystal panel 20 prevents crack generation due to a process impact, and removes sharp portions of the metal pattern remaining on the side edges in order to prevent the fragments from being torn off from the edge of the unit liquid crystal panel 20. The process is made.

Subsequently, after the scribing, the worker may not be injured at the edge of the unit liquid crystal panel 20, and at the same time, the polishing process may be performed to remove the remaining shorting bars 23 and 24.

Here, with respect to the latter polishing process, a description will be added with reference to FIG. 3. 3 is a view showing a polishing apparatus of a liquid crystal panel according to the prior art. In the drawing, the image of the liquid crystal panel 20 that is loaded and vacuum adsorbed on the liquid crystal panel 20 and the liquid crystal panel 20 that is vacuum adsorbed on the polishing table 50 is photographed and polished by the cameras 51 and 52. And an alignment portion 53 for aligning the stage 50 to the reference position, and first to fourth polishing portions 54 to 57 for polishing the edge of the liquid crystal panel 20.

First, a process for polishing the long side edge region of the liquid crystal panel 20 is performed. When the liquid crystal panel 20 is loaded and adsorbed so that the edge of the liquid crystal panel 20 protrudes on the polishing table 50, images of the liquid crystal panel 20 vacuum-adsorbed by the alignment unit 53 are photographed by the cameras 51 and 52. Photographed by aligning the polishing table 50 to the reference position.

The polishing table 50 is moved in the front-rear direction, and the long side edges (or short side edges) of the upper and lower surfaces of the liquid crystal panel 20 are rotated while the polishing wheels provided in the first to fourth polishing parts 54 to 57 rotate. Polish it. At this time, the shorting bar mentioned above is removed.

Subsequently, in order to polish the short edge region of the liquid crystal panel 20, the polishing table 50 is rotated 90 degrees and the image of the liquid crystal panel 20 rotated by the alignment unit 53 is photographed by the cameras 51 and 52. Align the polishing table 50 to the reference position.

Then, the polishing table 50 is moved in the front-rear direction, and the short side edges (or long side edges) of the upper and lower surfaces of the liquid crystal panel 20 are rotated while the polishing wheels provided on the first to fourth polishing parts 54 and 57 rotate. Polish).

However, such a conventional polishing process is performed in a separate polishing apparatus for polishing the sharp portion of the metal pattern remaining in the edge region of the liquid crystal panel shipped separately, and a plurality of polishing processes for polishing the corner region and removing the shorting bar. This resulted in an increase in the overall process time. As a result, the operation rate for manufacturing the liquid crystal panel is reduced, which leads to a decrease in yield, and has to bear a lot of losses.

Therefore, in order to solve the above problems, the present invention provides a method for simultaneously removing a sharp portion and a shorting bar in the long axis direction of a liquid crystal panel in order to perform a plurality of polishing processes performed in separate polishing apparatuses in one polishing apparatus. An object of the present invention is to polish the liquid crystal panel by configuring the polishing unit and the second polishing unit performing the same process in the short axis direction of the liquid crystal panel.

And the achievement of this object can be further embodied by the present invention. That is, the polishing apparatus of the liquid crystal panel according to the present invention includes a polishing table for loading a liquid crystal panel and performing a linear and reciprocating motion; First polishing means for moving the polishing table to polish both side edges of the liquid crystal panel vertically and inclinedly; It is characterized in that it comprises a second polishing means which is provided in the same line as the first polishing means to polish both side edges forming the long side of the liquid crystal panel vertically and obliquely.

In addition, the polishing method of the liquid crystal panel according to the present invention is to move the liquid crystal panel on the polishing table in a linear and reciprocating motion to the first region for performing the polishing process so that both edges forming the short sides of the liquid crystal panel are inclined at a vertical and predetermined angle. Polishing; Rotating the liquid crystal panel on the polishing table by 90 degrees; And moving the liquid crystal panel to a second area for performing a polishing process, and polishing both edges of the long side of the liquid crystal panel at an inclined angle at a vertical angle and a predetermined angle.

Then, the above configuration and method will be described in detail with reference to the accompanying drawings. 4 is a view showing an apparatus for polishing a liquid crystal panel according to the present invention. As shown in the drawing, a polishing table 124 is provided inside the polishing apparatus, which first loads the liquid crystal panel 110 shipped by an individual unit by scribing from a large substrate by a robot or the like. Of course, a rotating means 122 is provided on the polishing table 124 to rotate the loaded liquid crystal panel 110 by 90 degrees, and the liquid crystal panel 110 loaded on the upper side of the rotating means 122. ), Adsorption holes 126 are formed to prevent flow.

And before the liquid crystal panel 110 adsorbed on the polishing table 124 moves to the first polishing portion G1 for polishing the sharp portions of the edge regions such as the metal pattern and the upper and lower corner portions, Alignment with respect to the liquid crystal panel 1110 on the polishing table 124 is made through the first alignment means 170 positioned above the liquid crystal panel 110. Here, the first alignment means 170 sequentially contacts the alignment pins 172 provided at the ends of the first alignment means 170 to four side portions of the liquid crystal panel 110, and applies a predetermined force to the liquid crystal panel ( 110) to align the correct position.

In addition, the liquid crystal panel 110 aligned by the first alignment means 170 once again enters into the first polishing unit G1 by the sensing means 160a and 160b such as a sensor or a camera. It will determine the alignment error of. Of course, when an error occurs, the grinding wheels 150a and 150b in the vertical direction and the polishing wheels 150a and 150b in the inclined direction of the first polishing unit G1 are moved to maintain an appropriate distance or polish in the inclined direction. The inclination of the wheels 151a and 151b is adjusted by itself. This method is of course achieved by providing the error information to the CPU embedded in the polishing apparatus itself.

Thereafter, the liquid crystal panel 110 enters the first polishing part G1 and first waits to remove sharp portions such as metal patterns remaining on the edges (or edges forming the long sides) of the liquid crystal panel 110. The polishing wheels 150a and 150b in the vertical direction are operated.

After the removal of the sharp parts, the plurality of polishing wheels 151a and 151b which are inclined to both sides are operated to remove the shorting bars remaining on the upper and lower corner portions and the array substrate.

As a result, the first polishing process for the edge (or the edge forming the long side) of the liquid crystal panel 110 ends.

In the present invention, for the first polishing process, the first polishing means is used throughout the polishing wheels 150a and 150b in the vertical direction and the polishing wheels 151a and 151b in the inclined direction. It is called '.

On the other hand, the liquid crystal panel 110 on the polishing table 124 after the first polishing process is completed, the rotary means 122 is disposed on the polishing table 124 before entering the second polishing unit G2. The liquid crystal panel 110 is rotated by 90 degrees. Of course, the rotating means 122 will be configured by a motor or the like.

Then, the alignment with respect to the liquid crystal panel 110 is performed through the second alignment means 180 provided above. Of course, as described above, the second alignment means 180 sequentially contacts the alignment pins 182 provided at the ends of the second alignment means 180 to the four side portions of the liquid crystal panel 110 and applies a predetermined force. The liquid crystal panel 110 is aligned to the correct position.

After that, when the liquid crystal panel 110 aligned by the second alignment unit 180 enters the second polishing unit G2, the liquid crystal panel 110 may determine the alignment error of the liquid crystal panel 110 once again by the sensing means 162a and 162b. do. Of course, if an error occurs, the grinding wheels 152a and 152b in the vertical direction and the grinding wheels 153a and 153b in the inclined direction of the second polishing part G2 are moved to maintain an appropriate distance or inclined direction. The inclination of the polishing wheels 153a and 153b is adjusted by itself. This method is of course achieved by providing the error information to the CPU embedded in the polishing apparatus itself.

Thereafter, the liquid crystal panel 110 enters the second polishing part G2 and waits to remove sharp portions such as metal patterns remaining on the edges (or edges) forming the long sides of the liquid crystal panel 110. The polishing wheels 152a and 152b in the vertical direction are operated.

Then, after the removal of the sharp portion is finished to operate the plurality of polishing wheels (153a, 153b) inclined to both sides in order to remove the upper and lower corner portions and the shorting bar remaining on the array substrate. As a result, the second polishing process for the edge (or the edge forming the short side) of the liquid crystal panel 110 is completed.

In the present invention, for the second polishing process, the second polishing means is referred to as the grinding wheels 152a and 152b in the vertical direction and the polishing wheels 153a and 153b in the inclined direction provided in the second polishing unit. Refers to.

When the second polishing process is completed, the liquid crystal panel 110 is rotated 90 degrees in the reverse direction before being unloaded to return to the initial state of the first polishing apparatus. The liquid crystal panel 110 rotated as described above is aligned with the liquid crystal panel 110 by the third alignment means 190. In other words, the third alignment means 190 sequentially contacts the alignment pins 192 provided at the ends of the third alignment means 190 to the four sides of the liquid crystal panel 110 and applies a predetermined force to the liquid crystal panel. Align 110 to the correct position.

Thereafter, the liquid crystal panel 110 adsorbed on the polishing table 124 for unloading proceeds to the next process by a robot introduced from the outside when the vacuum adsorption is released.

The polishing table 124 returns to the loading unit and loads the next liquid crystal panel 110 to repeat the processes up to now.

Now, with reference to FIGS. 5 and 6, the first and second polishing parts G1 and G2 are configured to perform a polishing process in the inclined direction of the vertical and predetermined angles. . FIG. 5 is a view illustrating polishing wheels 150a, 150b; 152a, and 152b, which are configured in the first polishing part G1 and the second polishing part G2 of FIG. 4 and perform a polishing process in a vertical direction. 6 is a view illustrating polishing wheels 151a, 151b, 153a, and 153b configured in the first polishing part G1 and the second polishing part G2 of FIG. 4 to perform a polishing process in an inclined direction.

When the liquid crystal panel 110 on the polishing table 124, which is shipped as a separate unit from the external large substrate through scribing, proceeds to the first polishing part G1, it is fixed and rotated in the vertical direction as shown in FIG. The polishing wheels 150a and 150b are operated to remove sharp portions of edges such as metal patterns remaining on the short sides of the liquid crystal panel 110.

Then, the plurality of polishing wheels 151a and 151b which are provided in the first polishing unit G1 in succession to the vertical polishing wheels 150a and 150b and rotate at a predetermined angle on one side as shown in FIG. 6 are operated. Thus, the upper and lower corners of the edge forming the short side of the liquid crystal panel 110 are polished, and the shorting bar remaining on the array substrate is removed.

The same process is performed in the second polishing unit G2. In other words, when the liquid crystal panel 110 on the polishing table 124 rotated 90 degrees through the first polishing unit G1 proceeds to the second polishing unit G2, the liquid crystal panel 110 is fixed in the vertical direction as shown in FIG. 5. The rotating polishing wheels 152a and 152b are operated to remove sharp edges such as metal patterns remaining on the long sides of the liquid crystal panel 110.

Next, the plurality of polishing wheels 153a and 153b which are provided in the second polishing part G2 in succession to the vertical polishing wheels 152a and 152b and rotate at a predetermined angle as shown in FIG. The upper and lower corners of the edge forming the long side of the liquid crystal panel 110 are polished, and the shorting bar remaining on the array substrate is removed.

At this time, the polishing wheels 150a and 150b in the vertical direction performing the polishing process in the first polishing unit G1 and the polishing wheels 152a and 152b in the same direction performing the polishing process in the second polishing unit G2. ) Is polished by enforcing the short side and the long side of the liquid crystal panel 110, respectively, so that the distance between the polishing wheels provided at both sides thereof is different from each other.

Therefore, based on this, the polishing wheels 151a and 151b in the inclined direction at a predetermined angle to perform the polishing process in the first polishing unit G1 and the same direction in which the polishing process is performed in the second polishing unit G2 are performed. Since the polishing wheels 153a and 153b of the liquid crystal panel 110 also perform polishing by respectively managing the short side and the long side of the liquid crystal panel 110, the spacing of the polishing wheels provided on both sides thereof will also be different.

As a result of the configuration up to now, the polishing apparatus of the liquid crystal panel according to the present invention is to remove the sharp portion and the shorting bar in the direction forming the long side of the liquid crystal panel in order to perform a plurality of polishing processes in one polishing apparatus to form a short side of the liquid crystal panel By performing the same process in the above direction, the overall process time can be shortened, and as a result, the operation rate and yield for manufacturing the liquid crystal panel are increased. In addition, it is possible to maximize the efficiency of the polishing process by being able to adjust the interval of the polishing wheel provided in the polishing apparatus without being limited to the size of the liquid crystal panel.

Claims (12)

A polishing table loading linear liquid crystal panels and performing reciprocating motions; First polishing means for moving the polishing table to polish both side edges forming the short sides of the liquid crystal panel at an inclined angle at a vertical angle and a predetermined angle; And And a second polishing means which is provided on the same line as the first polishing means and polishes both side edges of the long side of the liquid crystal panel at a vertical angle and at a predetermined angle. The polishing apparatus of claim 1, wherein the first polishing means comprises: a vertical polishing wheel for vertically polishing both edges of the liquid crystal panel; And a plurality of inclined polishing wheels, which are integrally formed with the polishing wheel in the vertical direction and are followed, and which incline and polish the edges of the liquid crystal panel at a predetermined angle from the upper and lower sides. Device. The polishing apparatus of claim 1, wherein the second polishing means comprises: a vertical polishing wheel for vertically polishing the edges of the liquid crystal panel; And a plurality of inclined polishing wheels, which are integrally formed with the polishing wheel in the vertical direction and are followed, and which incline and polish the edges of the liquid crystal panel at a predetermined angle from the upper and lower sides. Device. The liquid crystal panel according to any one of claims 2 and 3, wherein the polishing wheel further comprises a sensing means for detecting an alignment error by sensing a liquid crystal panel on an entering polishing table, above the polishing wheel. Polishing device. The polishing apparatus of claim 4, wherein the sensing means is a sensing sensor or a camera. The polishing apparatus according to any one of claims 4 to 5, wherein the polishing wheel is moved by an alignment error determined by the sensing means to correct the error. The polishing apparatus of claim 1, wherein the polishing table further comprises rotation means for rotating the substrate loaded on the upper side. 8. The polishing apparatus of claim 7, wherein the rotating means further comprises an adsorption hole for adsorbing a substrate on an upper surface thereof. Moving the liquid crystal panel on the polishing table having linear and reciprocating motions to the first region for performing the polishing process, and polishing both edges forming the short sides of the liquid crystal panel at a vertical and predetermined angle; Rotating the liquid crystal panel on the polishing table by 90 degrees; And Moving the liquid crystal panel to a second region for performing a polishing process, and polishing both edges of the long side of the liquid crystal panel at an inclined angle at a vertical angle and at a predetermined angle. 10. The method of claim 9, wherein the polishing of the liquid crystal panel is performed by a vertical polishing wheel provided perpendicular to the first and second regions. 10. The method of claim 9, wherein the polishing of the liquid crystal panel inclined at a predetermined angle is performed by a plurality of polishing wheels in inclined directions that are inclined in the first region and the second region. 10. The method of claim 9, wherein the rotating of the liquid crystal panel by 90 degrees is performed by rotating means provided on the polishing table.
KR1020060139091A 2006-12-29 2006-12-29 Apparatus and method for grinding liquid crystal display panel KR20080062904A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020060139091A KR20080062904A (en) 2006-12-29 2006-12-29 Apparatus and method for grinding liquid crystal display panel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020060139091A KR20080062904A (en) 2006-12-29 2006-12-29 Apparatus and method for grinding liquid crystal display panel

Publications (1)

Publication Number Publication Date
KR20080062904A true KR20080062904A (en) 2008-07-03

Family

ID=39814970

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020060139091A KR20080062904A (en) 2006-12-29 2006-12-29 Apparatus and method for grinding liquid crystal display panel

Country Status (1)

Country Link
KR (1) KR20080062904A (en)

Similar Documents

Publication Publication Date Title
US20090029627A1 (en) Polishing apparatus and polishing method
JP2003275955A (en) Grinding table for liquid crystal display panel and grinding apparatus utilizing the same
JP2004145337A (en) Cutting apparatus for liquid crystal display panel
KR101980764B1 (en) Desorption apparatus having drum pad of arch form and method of fabricating lightweight and thin liquid crystal display device using thereof
JP2003279921A (en) Device for cutting liquid crystal display panel and method therefor
JP2007193342A (en) Apparatus and method of manufacturing liquid crystal display device
US11480819B2 (en) Display device and method of manufacturing the same
CN101236322B (en) Method and apparatus for producing electro-optical device
KR100955375B1 (en) Apparatus for transferring a liquid crystal display panel
US9687951B2 (en) Grinding apparatus and method for fabrication of liquid crystal display device
KR20080062904A (en) Apparatus and method for grinding liquid crystal display panel
KR100978261B1 (en) Cassette for containing liquid crystal dispaly device
JP2007105799A (en) Square substrate carrier for use in double-sided polishing device
KR101136792B1 (en) Grinder for LCD fabrication and the method for the same
KR101141931B1 (en) Apparatus and method for grinding edge
KR101101161B1 (en) Apparutus and method for grinding panel
KR20160141927A (en) Clamping system and apparatus for cutting plate employing the same
KR101986546B1 (en) Substrate griding apparatus and griding method
KR101226953B1 (en) Apparatusfor polishing substrates
KR101264406B1 (en) Work edge grinding apparatus and method using the same
KR100964328B1 (en) Scribing apparatus and method
JP2010133992A5 (en)
KR20100055769A (en) Substrate grinding apparatus and method for grinding the substrate using the same
JP2011095698A (en) Method of cutting off liquid crystal cell mother substrate and automated cutting system of the same
KR101309406B1 (en) Apparatus For Grinding A Substrate

Legal Events

Date Code Title Description
WITN Withdrawal due to no request for examination