KR20080062109A - Socket assembly for circuit module card - Google Patents

Socket assembly for circuit module card Download PDF

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Publication number
KR20080062109A
KR20080062109A KR1020060137476A KR20060137476A KR20080062109A KR 20080062109 A KR20080062109 A KR 20080062109A KR 1020060137476 A KR1020060137476 A KR 1020060137476A KR 20060137476 A KR20060137476 A KR 20060137476A KR 20080062109 A KR20080062109 A KR 20080062109A
Authority
KR
South Korea
Prior art keywords
circuit module
module card
heat
unit
push rod
Prior art date
Application number
KR1020060137476A
Other languages
Korean (ko)
Inventor
이지형
Original Assignee
엘지전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지전자 주식회사 filed Critical 엘지전자 주식회사
Priority to KR1020060137476A priority Critical patent/KR20080062109A/en
Publication of KR20080062109A publication Critical patent/KR20080062109A/en

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0256—Details of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms
    • H05K5/0286—Receptacles therefor, e.g. card slots, module sockets, card groundings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

A socket assembly for a circuit module card is provided to smoothly radiate heat of the circuit module card by closely contacting a heat sink to the circuit module card mounted to the socket assembly. A socket(200) includes a rear unit(210) having a connection terminal(215) connected to a circuit module card(1), a first side unit(220) extended from the rear unit and having a first hinge coupling unit(221), and a second side unit(230) extended from the rear unit to be separated from the first side unit in parallel. A push rod(260) is installed adjacent to the second side unit to move in an extending direction of the second side unit and has a protrusion(262) at an opposite side to the second side unit. A separating member(240) is installed in the rear unit to push the circuit module card while allowing coupling between the circuit module card and the connection terminal. A link(250) is rotatably installed around a rotation axis of the rear unit. One end of the link is rotatably coupled with the push rod, and the other end thereof is rotatably coupled with the separating member. A heat sink(100) has a heat absorbing unit(110) to absorb heat from the circuit module card, a heat radiating unit(120) to radiate the heat outside, a second hinge coupling unit(130) coupled with the first hinge coupling unit, and an extending unit(140) with an inclined slot to insert the protrusion of the push rod. A support unit(235) is formed at the second side unit to prevent vertical movement of the push rod. The inclined slot separates the heat absorbing unit from the circuit module card in backward movement of the push rod.

Description

Socket assembly for card mounting {Socket assembly for circuit module card}

1 is an exploded perspective view showing a conventional card mounting socket assembly,

Figure 2 is an exploded perspective view showing a card mounting socket assembly according to the invention,

Figure 3 is an exploded perspective view showing the lower side of the heat sink of the card mounting socket assembly according to the present invention,

4 is a perspective view illustrating a state in which the card mounting socket assembly according to the present invention is assembled;

5 is a plan view schematically showing a state when the mounting of the circuit module card to the card mounting socket assembly according to the present invention is almost completed;

6 is a side view in the same state as in FIG. 5,

7 is a plan view schematically showing a state in which the removal of the circuit module card from the card mounting socket assembly according to the present invention;

8 is a side view in the same state as in FIG. 7.

<Description of Symbols for Major Parts of Drawings>

100: heat sink 110: heat absorbing portion

120: heat dissipation unit 130: second hinge coupling portion

140: extension portion 141: slope slot

200: card mounting socket 210: rear

212: rotating shaft 215: connecting terminal

220: first side portion 221: first hinge coupling portion

230: second side portion 240: separation member

250: link 260: pushrod

262: protrusion 270: elastic member

280: thermal conductive pad 290: flexible metal plate

The present invention relates to a socket assembly for card mounting, and more particularly to a socket assembly to which a circuit module card that generates a lot of heat is mounted.

The conventional card mounting socket assembly shown in FIG. 1 is a heat sink for dissipating heat generated from the card mounting socket 20 and the circuit module card 1 to which the circuit module card 1 is mounted. (10).

A separating member 21 is mounted inside the card-mounting socket, which is configured to interlock with the push rod 23 by the link 22. When the push rod 23 is pushed in the X direction, the separating member 21 is mounted. The member 21 moves in the -X direction to push the mounted circuit module card 1 in the -X direction. For reference, the connection terminal 24 connected to the circuit in the circuit module card 1 is fixed to the card mounting socket 20, and the separation member 21 has a hole for accommodating the connection terminals. have. The heat sink 10 includes a heat absorbing part 11 that is in close contact with the circuit module card 1 and receives heat, and a heat dissipating part 12 that emits heat to the outside, and is mounted on the card by a bolt 15. It is fixed to the socket 20.

However, in the card mounting socket assembly having the above configuration, the degree of close contact between the heat sink 10 and the circuit module card 1 depends on the degree to which the heat sink 10 is in close contact with the card mounting socket 20. It is determined that heat dissipation from the circuit module card 1 is not smooth when the heat sink 10 is not in close contact with the circuit module card 1, and the heat sink 10 is connected to the circuit module card 1. When too close, there is a problem that a lot of force is required to separate the circuit module card 1 from the card mounting socket 20 by the friction between them, causing inconvenience to the user.

The present invention solves the above problems, the heat sink is separated when the circuit module card is removed, it does not take much force, the heat sink is in close contact with the circuit module card when the circuit module card is mounted It is an object of the present invention to provide a card mounting socket assembly in which heat dissipation is smooth.

In order to achieve the above object, the present invention provides a rear portion provided with a connection terminal to which a circuit module card can be connected, a first side portion extending from the rear portion and having a first hinge coupling portion, and extending from the rear portion. A card mounting socket including a second side portion spaced apart in parallel to the first side portion; A push rod installed adjacent to the second side portion such that the second side portion is moved in an extending direction and having a protrusion formed on an opposite side of the second side portion; A separation member installed at a rear part to push the circuit module card, the separation member allowing the connection of the circuit module card and the connection terminal; A link rotatably installed about a rotation shaft formed in the rear portion, the link having one end rotatably coupled to the push rod and the other end rotatably coupled to the separating member; And a heat absorbing part receiving heat from the circuit module card, a heat dissipating part dissipating heat received from the heat absorbing part to the outside, a second hinge coupling part hinged to the first hinge coupling part, and the heat absorbing part. A heat sink having an extension part disposed on an opposite side of the second hinge coupler and having an inclined slot into which the protrusion of the push rod may be inserted, wherein the second side part includes a support portion 235 for preventing the sliding of the push rod; Is formed, and the inclined slot provides a card mounting socket assembly formed so that the heat absorbing part is separated from the circuit module card when the push rod is moved to the rear side.

The card mounting socket assembly may not push the circuit module card when the circuit module card is completely inserted into the connection terminal, but further includes an elastic member for applying an elastic force in a direction pushing the circuit module card with respect to the separating member. It is preferable to include.

An elastic heat conductive pad is disposed on the heat absorbing surface of the heat absorbing portion, and the heat conductive pad is preferably covered by a flexible metal plate which may be in close contact with the circuit module card.

Next, with reference to Figures 2 to 8 will be described in detail the card mounting socket assembly according to the present invention. The card mounting socket assembly according to the present invention includes a card mounting socket 200, a push rod 260, a separating member 240, a link 250, and a heat sink 100, and an elastic member 270. It is preferable to further include).

The card mounting socket 200 has a rear portion 210 and a first side portion 220 and a second side portion 230 extending perpendicularly from both ends thereof form a '-' shape as a whole. The rear part 210 is provided with a connection terminal 215 to which the circuit module card 1 can be connected. The first side coupling portion 220 is formed with a first hinge coupling portion 221, which is hinged with the second hinge coupling portion 130 to be described later. The second side portion 230 extends from the rear portion 210 and is spaced in parallel to the first side portion 220.

Since the card mounting socket 200 is fixed to an electronic device such as a television or a computer, for example, it is preferable that a fixing hole 200a is formed in the card mounting socket 200. In addition, although FIG. 2 shows that protrusions and grooves are formed inside each of the first side part 220 and the second side part 230, they may be formed differently according to a standard regarding the appearance of the circuit module card 1.

Since the present invention relates to a card mounting socket assembly capable of accommodating a circuit module card 1 that generates a large amount of heat, the present invention is not limited to the specific function of the circuit module card. However, the circuit module card 1 that generates a lot of heat may be exemplified by a card in which a circuit module for receiving a cable broadcast is embedded. As such, a PCMCIA standard may be used. There is a Point of Deployment (POD) module card.

The rear part 210 is provided with a separating member 240, the separating member 240 is movable in the X, -X direction of Figure 2, according to the push rod 260, the circuit module The card 1 can be pushed in the -X direction. The separating member 240 is provided with a hole for accommodating the connection terminal 215, and pushes the circuit module card (1) fitted to the connection terminal 215, the connection terminal 215 and the circuit Remove the module card (1). In addition, the separating member 240 has a thin thickness so that the connection terminal 215 is sufficiently protruded in the -X direction, as shown in Figure 2, the combination of the circuit module card 1 and the connection terminal 215 Allow.

In addition, the rear portion 210 is formed with a rotating shaft 212, the link 250 is rotatably installed. One end (Y-direction side end) of the link 250 is rotatably connected to the connecting portion 261 of the push rod described later, and the other end (-Y-direction side end) is rotatably connected to the aforementioned separation member. Connected. Therefore, when the separating member 240 is pressed in the X direction, the push rod 260 is moved in the -X direction, and when the pushing rod 260 is pressed in the X direction, the separating member 240 is in the -X direction. Is moved.

The push rod 260 is installed adjacent to the second side portion 230 so that the second side portion 230 can be moved along the extending direction, and has a protrusion 262 protruding to the opposite side of the second side portion 230. do. The protrusion is movably received within the inclined slot 141 of the heat sink, so that the heat sink 100 can be rotated in association with the movement of the push rod 260.

The heat sink 100 includes a heat absorbing unit 110 that receives heat from the circuit module card 1, a heat dissipating unit 120 that discharges heat received from the heat absorbing unit 110 to the outside, and the first hinge coupling unit. A second hinge coupling portion 130 which is hinged to the 221, and the heat absorbing portion 110 is disposed on the opposite side of the second hinge coupling portion 130, the protrusion 262 of the push rod is to be inserted It is provided with an extension portion 140 is formed inclined slot 141.

The inclined slot 141 extends 140 so that the heat absorbing part 110 of the heat sink 100 moves away from the circuit module card 1 when the push rod 260 is moved to the rear side (X direction). 2 is illustrated as having a negative slope on the XZ plane.

Since the heat absorbing part 110 is a part receiving heat from the circuit module card 1, the heat absorbing part 110 is formed to be flat so as to widen the contact surface with the circuit module card, and the heat dissipating part 120 is configured to smoothly discharge heat into the atmosphere. The surface area is formed to be wide. The second hinge coupler 130 is rotatably coupled to the first hinge coupler 221 by the hinge shaft 295 shown in FIG. 4.

In particular, an elastic thermal conductive pad 280 is disposed on the bottom surface 111 of the heat absorbing portion, and the thermal conductive pad 280 is preferably covered by the flexible metal plate 290, which is an elastic thermal conductive pad 280. ) To secure a wide contact area with the circuit module card 1 and to prevent damage to the thermal conductive pad 280 due to friction with the circuit module card 1. In particular, since the metal plate is preferably formed of a material having high thermal conductivity and ductility, it is preferable that the metal plate is made of a metal plate mainly composed of aluminum. In order to improve the thermal conductivity of the circuit module card 1 and the heat absorbing part 110, it is preferable that no adhesive is used between the heat conductive pad 280 and the bottom surface 111 of the heat absorbing part, and the heat conductive pad 280 absorbs heat. The stepped portion 112 and the flexible metal plate 290 on both sides of the portion are disposed to be in close contact with the bottom surface 111 of the heat absorbing portion. Both ends 291 and 292 of the flexible metal plate 290 are fixed to the bottom surface 111 of the heat absorbing portion by an adhesive or the like.

The separating member 240 is provided in a direction (-X direction) for pushing the circuit module card that cannot push the circuit module card 1 when the circuit module card 1 is fully inserted into the connection terminal 215. It is desirable to receive an elastic force, which is to be pushed by the push rod 260 once the separating member 240 starts pushing the circuit module card 1 so that the user can remove the circuit module card 1 completely. 260) to reduce the force to be added additionally. To this end, an elastic member 270 is required, and the elastic member 270 illustrated in FIG. 2 is made of a wire, a coil wound around a rotating shaft 212, and extends from one side of the coil to separate the member 240. The second end portion 272 supported by the support portion 241 and the first end portion 271 extending from the other side of the coil and supported by the support portion 211 formed at the rear portion perform the above-described functions.

Hereinafter, with reference to Figures 5 to 8 will be described the operation of the card mounting socket assembly according to the present invention.

5 and 6 show when the circuit module card 1 is mounted in the card mounting socket assembly, in which case the circuit module card 1 is pushed in the X direction by the user, and thus the separating member ( 240 moves in the X direction, and the push rod 260 is moved in the -X direction by the action of the link 250. At this time, since the push rod 260 cannot be moved (move in the Z and -Z directions) by the support portions 235 formed on the second side portion 230, the protrusion 262 formed on the push rod is shown in FIG. As shown in the drawing, the inclined slot 141 is formed to extend the extension 140 downward (-Z direction). Considering that the second hinge coupling portion 130 of the heat sink 100 is hinged to the first hinge coupling portion 221, the heat sink is slightly rotated about the hinge shaft 295, and thus The heat absorbing portion 110 or the flexible metal plate 290 of the heat sink is in close contact with the circuit module card 1, and thus can receive the heat generated from the circuit module card 1 smoothly and release it to the outside.

7 and 8 show when the circuit module card 1 is detached from the card mounting socket assembly, in which the push rod 260 is pressed in the X direction by the user, and the link 250 acts upon it. By this, the separating member 240 is moved in the -X direction, and the circuit module card 1 is pushed by the separating member 240 to be separated in the -X direction. At this time, since the push rod 260 cannot be moved (move in the Z and -Z directions) by the support portions 235 formed on the second side portion 230, the protrusion 262 formed on the push rod is illustrated in FIG. 8. As shown in the drawing, the inclined slot 141 is formed to extend the extension 140 upwards (Z direction). As a result, the heat absorbing part 110 or the flexible metal plate 290 of the heat sink is spaced apart from the circuit module card 1, and thus the heat absorbing part 110 is moved when the circuit module card 1 is moved in the -X direction thereafter. (Or the friction between the flexible metal plate 290 and the circuit module card 1 is eliminated, so that the circuit module card 1 can be separated with little force.

According to the present invention, when the circuit module card is removed, heat sinks are separated and do not require much force. In the state where the circuit module card is mounted, the heat sink is in close contact with the circuit module card so that heat dissipation of the circuit module card is smoothly performed. A card mounting socket assembly is provided.

Although the present invention has been described with reference to the embodiments shown in the drawings, this is merely exemplary, and it will be understood by those skilled in the art that various modifications and equivalent other embodiments are possible. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

Claims (3)

A rear portion provided with a connection terminal to which a circuit module card can be connected, a first side portion extending from the rear portion and having a first hinge coupling portion, and a second side portion extending from the rear portion and spaced apart in parallel to the first side portion; Card mounting socket including; A push rod installed adjacent to the second side portion such that the second side portion is moved in an extending direction and having a protrusion formed on an opposite side of the second side portion; A separation member installed at a rear part to push the circuit module card, the separation member allowing the connection of the circuit module card and the connection terminal; A link rotatably installed about a rotation shaft formed in the rear portion, the link having one end rotatably coupled to the push rod and the other end rotatably coupled to the separating member; And A heat absorbing part receiving heat from the circuit module card, a heat dissipating part dissipating heat received from the heat absorbing part to the outside, a second hinge coupling part hinged to the first hinge coupling part, and the heat absorbing part A heat sink having an extension part disposed on an opposite side of the hinge coupling part and having an inclined slot into which the protrusion of the push rod can be inserted; The second side portion is provided with a support portion (235) to prevent the movement of the push rod, the inclined slot is a card mounting socket assembly formed so that the heat absorbing portion away from the circuit module card when the push rod is moved to the rear side. The method of claim 1, When the circuit module card is fully inserted into the connection terminal, but the circuit module card can not push, further comprising an elastic member for applying an elastic force in the direction to push the circuit module card with respect to the separating member Socket assembly for. The method according to claim 1 or 2, An elastic heat conducting pad is disposed on the heat absorbing surface of the heat absorbing portion, The thermally conductive pad is a card mounting socket assembly, characterized in that covered by a flexible metal plate that can be in close contact with the circuit module card.
KR1020060137476A 2006-12-29 2006-12-29 Socket assembly for circuit module card KR20080062109A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020060137476A KR20080062109A (en) 2006-12-29 2006-12-29 Socket assembly for circuit module card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020060137476A KR20080062109A (en) 2006-12-29 2006-12-29 Socket assembly for circuit module card

Publications (1)

Publication Number Publication Date
KR20080062109A true KR20080062109A (en) 2008-07-03

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ID=39814275

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020060137476A KR20080062109A (en) 2006-12-29 2006-12-29 Socket assembly for circuit module card

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KR (1) KR20080062109A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230152046A1 (en) * 2021-11-18 2023-05-18 Quanta Computer Inc. Die-cast fin with opening and cover

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230152046A1 (en) * 2021-11-18 2023-05-18 Quanta Computer Inc. Die-cast fin with opening and cover

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