KR20080053999A - Mold for punching a printed circuit film - Google Patents

Abstract

A mold for punching a printed circuit film is provided to extend life span of the mold by fabricating an insert member and a punch using materials having a superior hardness. A mold(1000) for punching a printed circuit film comprises a die(100) for supporting a base material and a punch(200) mounted on the die. The printed circuit film is made by punching the base material. The punch strikes the base material supported by the die while moving up/down. The die includes a holder plate(10) and an insert member(20). The insert member is detachably coupled to the holder plate and has hardness larger than that of the holder plate. The insert member has an opening into which the punch is inserted.

Description

MOLD FOR PUNCHING A PRINTED CIRCUIT FILM}

1 is an exploded perspective view of a die for punching a printed circuit film according to an embodiment of the present invention.

2 is a view schematically showing a state in which the base material is supplied to the mold of FIG.

3 and 4 are cross-sectional views taken along line III-III of FIG. 1, respectively, and schematically illustrate states of the base material when it is punched out and after it is hit.

5 is a graph showing the wear amount of the punch according to the experimental example of the present invention and the comparative example of the prior art.

The present invention relates to a mold for punching a printed circuit film that can minimize wear.

In general, a liquid crystal display device converts an optical property such as birefringence, photoreactivity, and light scattering characteristics of a liquid crystal cell that emits light by applying a voltage to a specific molecular array of the liquid crystal and converts it into another molecular array. It is a display apparatus which converts and displays information using the modulation of the light by a liquid crystal cell. Liquid crystal display devices are used in all flat panel display products such as mobile phones, monitors, and TVs. Recently, as technological developments progress rapidly, more high-definition, lighter weight, and thinner products are produced.

In a liquid crystal display, a flexible printed circuit film electrically connects the liquid crystal display panel and the printed circuit board. When the integrated circuit chip is mounted on a flexible printed circuit film, the chip may be used as a chip on film (COF) and a tape carrier package (TCP). The flexible printed circuit film is manufactured by punching a base material into a predetermined size using a mold.

The present invention aims to provide a die for punching a printed circuit that can minimize wear.

The mold according to an embodiment of the present invention to produce a printed circuit film (printed circuit film) from the base material. The mold includes i) a die for supporting the base material, and ii) a punch mounted on the die so as to be liftable and hitting the base material supported on the die to strike a printed circuit film from the base material. The die comprises i) a holder plate, and ii) an insert member detachably coupled on the holder plate, having a hardness greater than the hardness of the holder plate, and having an opening into which the punch is inserted.

The holder plate can be made of high speed steel and the insert member can be made of cemented carbide. The hardness of the punch may be greater than the hardness of the holder plate. The punch can be made of cemented carbide. The punch and insert member may comprise one or more materials selected from the group consisting of WC, Co and ZrO ₂ . The punch and insert member may be coated with any one or more of materials consisting of TiN, TiC, TiCN and TiAlN.

The mold according to one embodiment of the present invention may further comprise one or more push pins, i) a punch mounted, facing another holder plate, and ii) positioned on another holder plate opposite the insert member. have. The push pin can be supported by an elastic member embedded in a hole formed in another holder plate. When the punch punches the printed circuit film and rises, the push pin can rise while pressing the insert member by the elastic member.

The die may further include a guide member positioned adjacent to the insert member in the direction in which the substrate extends to guide the substrate. The hardness of the guide member may be smaller than the hardness of the insert member. The guide member may be made of high speed steel. Guide grooves are formed in the holder plate, and the insert member and the guide member may be coupled to the guide groove by fitting.

Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. As those skilled in the art can easily understand, the embodiments described below may be modified in various forms without departing from the concept and scope of the present invention. Where possible, the same or similar parts are represented using the same reference numerals in the drawings.

When a portion is referred to as being "above" another portion, it may be just above the other portion or may be accompanied by another portion in between. In contrast, when a part is mentioned as "directly above" another part, no other part is intervened in between.

It is to be understood that the terms first, second and third are used to describe various parts, components, regions, layers and / or sections, but are not limited to these. These terms are only used to distinguish one part, component, region, layer or section from another part, component, region, layer or section. Accordingly, the first portion, component, region, layer or section described below may be referred to as the second portion, component, region, layer or section without departing from the scope of the invention.

The terminology used herein is for reference only to specific embodiments and is not intended to limit the invention. As used herein, the singular forms “a,” “an,” and “the” include plural forms as well, unless the phrases clearly indicate the opposite. As used herein, the term "comprising" embodies a particular characteristic, region, integer, step, operation, element, and / or component, and other specific characteristics, region, integer, step, operation, element, component, and / or group. It does not exclude the presence or addition of.

Terms indicating relative spaces such as "below" and "above" may be used to more easily describe the relationship between different parts of one part shown in the drawings. These terms are intended to include other meanings or operations of the device in use with the meanings intended in the figures. For example, when the device in the figure is reversed, any parts described as being "below" of other parts are described as being "above" other parts. Thus, the exemplary term "below" encompasses both up and down directions. The device can be rotated 90 degrees or at other angles, the terms representing relative space being interpreted accordingly.

Unless defined otherwise, all terms including technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art. Commonly defined terms used are additionally interpreted as having a meaning consistent with the related technical literature and the presently disclosed contents, and are not interpreted as ideal or very formal meaning unless defined.

Embodiments of the invention described with reference to perspective and cross-sectional views specifically illustrate ideal embodiments of the invention. As a result, various modifications of the drawings, for example, manufacturing methods and / or specifications, are expected. Thus, the embodiment is not limited to the specific form of the illustrated region, but includes, for example, modification of the form by manufacture. For example, regions shown or described as flat may have properties that are generally rough and / or rough. Also, portions shown to have sharp angles may be rounded. Accordingly, the regions shown in the figures are only approximate in nature, and their forms are not intended to depict the exact form of the regions and are not intended to narrow the scope of the invention.

1 is an exploded view of a die 1000 for punching a printed circuit film according to an embodiment of the present invention.

The mold 1000 includes a die 100 and a punch 200. The die 100 supports the base material M (shown in FIG. 2, hereinafter same) passing thereover. The punch 200 is installed to be capable of lifting up and down on the die 100. The punch 200 strikes the base material M (shown in FIG. 2) and punches the printed circuit film P (shown in FIG. 3 and the same below) from the base material M. FIG.

The die 100 includes a first holder plate 10, an insert member 20, and guide members 33. In addition, the die 100 may further include other components as necessary.

Guide grooves 11 and outlets 12 are formed in the first holder plate 10. The guide groove 11 is formed extending in the direction in which the base material M travels, that is, along the x-axis direction. The guide groove 11 can be easily coupled to the first holder plate 10 by sliding the insert member 20 and the guide members 33. The punched-out printed circuit film P (shown in FIG. 3, hereinafter same) is discharged to the outside through the discharge port 12.

The insert member 20 is coupled over the first holder plate 10. For example, the insert member 20 is fastened to the first holder plate 10 by inserting the screw 123 into the screw hole 122 and then engaging the screw hole 131 of the first holder plate 10. can do. Since the insert member 20 is screwed onto the first holder plate 10, the insert member 20 is detachable from the first holder plate 10. Therefore, since only the insert member 20 can be continuously replaced while the first holder plate 10 is continuously used, the manufacturing cost of the printed circuit film P can be reduced.

The insert member 20 has an opening 21. The punch 200 is operated to be inserted into the opening 21 to punch the base material M placed on the opening 21. The insert member 20 is formed with a hole 201 in which a push pin 161 for fixing the base M is inserted so that the punch 200 can accurately punch the base M. Since the pressing pin 161 is fixed to the base material M while being inserted into the hole 201, the printed circuit film P may be accurately punched by the punch 200.

The guide members 33 are located adjacent to the insert member 20. Since the guide members 33 are adjacent to the insert member 20 in a direction in which the base material M travels, that is, in the x-axis direction, the guide members 33 may stably guide the base material M. The guide members 33 may be coupled to the first holder plate 10 by inserting a screw 223 into the screw hole 134, for example, on the first holder plate 10. Since the guide members 33 support the insert member 20 in the x-axis direction, the insert member 20 may be prevented from flowing by interaction with the punch 200.

The punch 200 is mounted to the second holder plate 60. The second holder plate 60 is connected to the first holder plate 10 by the lifting pillars 15. A fastening table 210 is installed on the second holder plate 60 to be connected to a mold driving unit (not shown). For example, the 2nd holder plate 60 raises and lowers the punch 200 by operation | movement of the metal mold | die drive part which uses hydraulic pressure etc .. As shown in FIG. An elastic member 17 is provided on the outer circumference of the elevating pillar 15 in order to elevate after the second holder plate 60 is lowered. After the punching is completed by the elasticity of the elastic member 17, the second holder plate 60 can be easily raised.

Fastening holes 15a are formed at the upper ends of the lifting pillars 15. The bolt support 66 is inserted into the through hole 65 formed in the second holder plate 60, and the bolt 66 is inserted into the bolt support 66. The bolt support 66 passes through the through hole 65 and is supported by the second holder plate 60. The bolt 66 is inserted and coupled to the fastening hole 15a. Therefore, the second second holder plate 60 can be firmly fixed on the lifting pillar 15.

The push pin 161 is installed on the second holder plate 60. When the second holder plate 60 is lowered, the push pin 161 is inserted into the hole 201 of the insert member 20 to fix the base M. Therefore, since the base material M is fixed, it is easy to punch the printed circuit film with the punch 200.

In the present embodiment, the insert member 20 and the punch 200 are made of an alloy having excellent hardness. The insert member 20 and the punch 200 are easily worn because they contact each other when the printed circuit film P is punched. Therefore, the insert member 20 and the punch 200 may be made of a high hardness alloy, for example, cemented carbide, thereby minimizing both wear. As a cemented carbide, F10 or F20 can be used. By forming the insert member 20 and the punch 200 with a material including WC, Co or ZrO ₂ , wear can be minimized.

Alternatively, wear of TiN, TiC, TiCN, or TiAlN having excellent hardness may be applied to the insert member 20 and the punch 200 to minimize wear due to the contact between the two. For the coating of the aforementioned materials, chemical vapor deposition (CVD) or physical vapor deposition (PVD) may be used.

However, since the cemented carbide is expensive, the guide member 30 and the first holder plate 10 that do not have a direct relationship with the punching of the printed circuit film P may have a hardness greater than that of the insert member 20 and the punch 200. It can be made of inexpensive materials with small hardness. For example, the guide member 30 and the first holder plate 10 may be made of high speed steel having a hardness of about 80 HRa. As the high speed steel, SKD11 and DC53 can be used.

In general, when the punching number of punches increases, the material deterioration increases due to repeated wear between the die and the punch. In this case, the quality of the printed circuit film is deteriorated, foreign matters are generated, and in more severe cases, the mold may be broken. In particular, when foreign matter occurs, the short circuit occurs in the printed circuit film, or when the printed circuit film is attached to the panel, visibility is deteriorated. Therefore, the mold punching which does not cause the wear of the mold and material deterioration is set, and if it exceeds the limit punching, the deteriorated part is removed and regrind. In addition, when regrinding is performed more than predetermined number of times, a metal mold | die is discarded. Therefore, the service life of the mold is short, which increases the manufacturing cost.

In this embodiment, the insert member 20 and the punch 200 used for punching the printed circuit film F are made of a material having excellent hardness. For example, the insert member 20 and the punch 200 can be manufactured from a cemented carbide having a hardness of about 91 HRa. Therefore, since the life of the mold can be extended, the cost of manufacturing the printed circuit film can be greatly reduced.

2 shows a state in which the base material M (shown by a dashed-dotted line) is supplied to the mold 1000. For convenience of explanation, the upper part of the mold 1000 is omitted in FIG. 2. The position of the printed circuit film P to be punched out by the punch 200 (shown in FIG. 1, hereinafter same) is shown in the base material M. FIG.

Wiring is formed inside the printed circuit film P, and the periphery of the wiring is covered with a resin film and insulated from the outside. An integrated circuit chip or the like may be mounted on a printed circuit film P cut into a suitable size to be used in a display device. That is, the display panel and the printed circuit board are connected by using the printed circuit film P. FIG. In particular, since the printed circuit film P may be flexible, the volume of the display device may be minimized by fixing the printed circuit board to the rear surface of the display panel.

As shown in FIG. 2, the base material M is supplied in the x-axis direction. The base material M is supplied in roll form. The base material M in the form of a roll is released into the mold 1000. Openings M1 are formed at both sides of the base material M. As shown in FIG. The base member M is aligned with the opening M1 and the hole 201 of the insert member 20 while continuously pulling the base material M in the x-axis direction for a predetermined length. As the punch 200 descends, the push pin 161 (shown in FIG. 1) sequentially passes through the opening M1 and the hole 201. Therefore, when the printed circuit film is punched, it is possible to firmly fix the base material (M). This will be described in more detail with reference to FIGS. 3 and 4.

3 is a cross-sectional view taken along line III-III of FIG. 1. 3 schematically shows a state of punching the base material (M).

As shown in FIG. 3, an auxiliary plate 68 is mounted below the second holder plate 60. The auxiliary plate 68 is fixed to the second holder plate 60 by screws 69. The push pin 163 is installed in communication with the second holder plate 60 and the auxiliary plate 68. The push pins 163 are mounted in the holes 164 formed in the second holder plate 60 and the holes 601 formed in the auxiliary plate 68.

The elastic member 163 is embedded in the hole 164 formed in the second holder plate 60. An elastic force acts on the push pin 161 by the elastic member 163. Even when the elastic member 163 pushes the push pin 161, a step is formed in the push pin 161, so that the push pin 161 is caught by the hole 601 and does not fall out.

As shown in FIG. 3, before the punch 200 moves downward, the pressing pin 161 is first inserted into the hole M1 of the base material M and the hole 201 of the insert member 20. Secure (M). While the push pin 161 fixes the base material M, the punch 200 descends to press the base material M to punch the printed circuit film P. As shown in FIG. The printed circuit film P falls while passing through the opening 21 and the outlet 12.

As a next step, FIG. 4 shows a state in which the punch 200 that completed the punching of the printed circuit film P (shown in FIG. 3 and the same below) is raised again.

Since the base material M is continuously advanced, the unbeaten portion is again placed on the die 100. When the punch 200 punches the printed circuit film P and rises, the push pin 161 also rises. However, since the push pin 161 presses the insert member 20, the insert member 20 may also flow in the + z-axis direction as the push pin 161 rises. However, in the present embodiment, when the punch is raised by the elastic force of the elastic member 163, the push pin 161 is raised while pressing the insert member 20 in the z-axis direction. Therefore, the insert member 20 does not flow well and is stably fixed on the first holder plate 10.

Hereinafter, the present invention will be described in detail through experimental examples. These experimental examples are only for illustrating the present invention, and the present invention is not limited thereto.

Experimental Example 1

A mold having the same structure as the mold shown in FIG. 1 was produced. Punch and insert members were made of cemented carbide including WC. Using this mold, the wear amount of the punch punching out 150,000 printed circuit films was measured.

Experimental Example 2

Punch and insert members were made of cemented carbide KD20 alloy. The remaining experimental conditions are the same as in Experimental Example 1 described above.

Comparative Example 1

Punch and insert members were made of SKHS alloy, high speed steel. The remaining experimental conditions are the same as in Experimental Example 1 described above.

Comparative Example 2

Punch and insert members were made of high speed steel, SKD11 alloy. The remaining experimental conditions are the same as in Experimental Example 1 described above.

Comparative Example 3

Punch and insert members were made of stellite, a high speed steel. The remaining experimental conditions are the same as in Experimental Example 1 described above.

Experiment result

Figure 5 shows the wear amount of the punch according to Experimental Example 1 and Experimental Example 2 of the present invention and Comparative Examples 1 to 3 of the prior art. As shown in FIG. 5, in Experimental Example 1, the amount of wear was extremely small at about 0.2 × 10 ⁻⁸ m ³ . In addition, in Experimental Example 2, the amount of wear was less than that of Experimental Example 1 on the order of 0.1 × 10 ⁻⁸ m ³ .

On the other hand, in Comparative Example 1, the wear amount was about 2.75 × 10 ⁻⁸ m ³ , in Comparative Example 2, the wear amount was about 4.75 × 10 ⁻⁸ m ³ , and in Comparative Example 3, the wear amount was 5.5 × 10 ⁻⁸ m ³ or so. Therefore, it was found that the wear amount of the punch of Experimental Example 1 and Experimental Example 2 was about 10 to 55 times less than the wear amount of the punch used in Comparative Examples 1 to 3. As described above, since the mold produced according to the experimental example of the present invention has a relatively small amount of wear, the mold can be used for a long time.

By using an insert member and a punch made of a material having excellent hardness, the service life of the mold can be extended, and foreign matters can be prevented from adhering to the printed circuit film. In addition, since the insert member is manufactured to be detachable, only the insert member can be replaced separately, thereby reducing the manufacturing cost of the printed circuit film.

Although the embodiments of the present invention have been described above, the present invention is not limited thereto, and the present invention may be modified or modified in various ways within the scope of the claims and the detailed description of the invention and the accompanying drawings. Naturally, it is within the scope of the present invention.

Claims (13)

A mold for punching a printed circuit film for manufacturing a printed circuit film from a base material, A die supporting the base material, and A punch mounted on the die so as to be liftable and punching the base material supported on the die to punch the printed circuit film from the base material Including, The die, Holder plate, and An insert member detachably coupled on the holder plate, the insert member having a hardness greater than that of the holder plate and having an opening into which the punch is inserted. Printed circuit membrane punching mold comprising a. In claim 1, The holder plate is made of high speed steel, the insert member is a mold for punching printed circuit film is made of cemented carbide. In claim 1, The punch of the punch is greater than the hardness of the holder plate punching die for printed circuit film. In claim 3, The punch is a mold for punching printed circuit film is made of cemented carbide. In claim 1, The punch and the insert member is a mold for punching a printed circuit layer comprising at least one material selected from the group consisting of WC, Co and ZrO ₂ . In claim 1, The punch and the insert member is a mold for punching a printed circuit film coated with any one or more of materials consisting of TiN, TiC, TiCN and TiAlN. In claim 1, Another holder plate mounted with the punch and facing the holder plate, and One or more push pins positioned on the another holder plate opposite the insert member Printed circuit membrane punching mold further comprising. In claim 7, The push pin is a mold for punching a printed circuit film that is supported by an elastic member embedded in a hole formed in the another holder plate. The method of claim 8, When the punch punches and rises the printed circuit film, the push pin is raised by pressing the insert member by the elastic member. In claim 1, The die further comprises a guide member for guiding the base material is located adjacent to the insert member in the direction that the base material proceeds. In claim 10, The hardness of the guide member is smaller than the hardness of the insert member die for printing circuit film punching. In claim 10, The guide member is a die for punching a printed circuit film is made of high speed steel. In claim 10, A guide groove is formed in the holder plate, and the insert member and the guide member are inserted into and coupled to the guide groove.

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