KR20080051869A - Led lamp cartridge structure - Google Patents

Led lamp cartridge structure Download PDF

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Publication number
KR20080051869A
KR20080051869A KR1020060123656A KR20060123656A KR20080051869A KR 20080051869 A KR20080051869 A KR 20080051869A KR 1020060123656 A KR1020060123656 A KR 1020060123656A KR 20060123656 A KR20060123656 A KR 20060123656A KR 20080051869 A KR20080051869 A KR 20080051869A
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KR
South Korea
Prior art keywords
led
led lamp
pin
lamp cartridge
heat dissipation
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Application number
KR1020060123656A
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Korean (ko)
Inventor
차승권
Original Assignee
현대자동차주식회사
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Priority to KR1020060123656A priority Critical patent/KR20080051869A/en
Publication of KR20080051869A publication Critical patent/KR20080051869A/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/27—Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60Q—ARRANGEMENT OF SIGNALLING OR LIGHTING DEVICES, THE MOUNTING OR SUPPORTING THEREOF OR CIRCUITS THEREFOR, FOR VEHICLES IN GENERAL
    • B60Q1/00—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor
    • B60Q1/0064—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor with provision for maintenance, e.g. changing the light bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015—Fastening arrangements intended to retain light sources
    • F21V19/0025—Fastening arrangements intended to retain light sources the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

An LED(Light Emitting Diode) lamp cartridge structure is provided to reduce a cost for repair and replacement of an LED lamp by individually replacing the LED lamp and facilitating fixation of an LED lamp cartridge. An LED lamp cartridge structure is formed by stacking a heat discharging substrate on an upper part of a steel sheet and horizontally arranging at least one LED(10) on the heat discharging substrate. The LED includes an LED main body, a lamp, and a LED pin. The lamp is installed on an upper part of the LED main body. The LED pin is extended to a lower part of the LED main body as much as a predetermined length. The at least one LED attached to the heat discharging substrate is individually replaced. A device for fixing an LED lamp cartridge(100) to a predetermined position of a vehicle includes a circular pin(60), a first plate spring(70), and a second plate spring(80). The first plate spring wraps the pin and the second plate spring fixes one end of the LED lamp cartridge.

Description

엘이디 램프 카트리지 구조{LED LAMP CARTRIDGE STRUCTURE}LED lamp cartridge structure {LED LAMP CARTRIDGE STRUCTURE}

도 1a 와 도 1b 는 본 발명에 따른 엘이디 램프 카트리지 전체 구조를 도시한 도면,1a and 1b is a view showing the overall structure of the LED lamp cartridge according to the present invention,

도 2 는 본 발명에 따른 단일의 엘이디 램프 카트리지 구조를 도시한 도면,2 illustrates a single LED lamp cartridge structure according to the present invention;

도 3 은 본 발명에 따른 엘이디 개별 교체를 위한 엘이디 핀의 구조를 도시한 도면,Figure 3 is a view showing the structure of the LED pin for the individual LED replacement according to the present invention,

도 4a 와 도 4b 는 본 발명의 엘이디 램프 카트리지를 차체 소정위치에 결착시키는 상태를 도시한 도면임.4A and 4B are views showing a state in which the LED lamp cartridge of the present invention is bound to a vehicle body predetermined position.

< 도면의 주요 부분에 대한 부호의 설명 ><Description of Symbols for Main Parts of Drawings>

10 : 엘이디 11 : 엘이디 본체 10: LED 11: the body of the LED

13 : 램프 15 : 엘이디 핀 13: lamp 15: LED pin

30 : 방열기판 50 : 강판 30: heat dissipation substrate 50: steel sheet

60 : 원형핀 70 : 제1 판스프링 60: round pin 70: first leaf spring

80 : 제2 판스프링 80: second leaf spring

본 발명은 엘이디 램프 카트리지 구조에 관한 것으로, 특히 엘이디 램프 각각을 개별적으로 교체 가능하도록 구성한 엘이디 램프 카트리지 구조에 관한 것이다.The present invention relates to an LED lamp cartridge structure, and more particularly to an LED lamp cartridge structure configured to replace each of the LED lamps individually.

일반적으로 엘이디(LED)(발광다이오드) 램프는 적절한 조건에서 합리적인 효율과 양호한 수명을 가질 수 있다. 예컨대, 24시간동안 발광되는 조건으로 100년의 수명을 갖는다.In general, LED (light emitting diode) lamps can have reasonable efficiency and good life under appropriate conditions. For example, it has a life of 100 years under conditions that emit light for 24 hours.

또한 엘이디 램프는 비교적 작은 하우징으로 둘러싸일 수 있어 설치 공간상에 잇점을 갖는다. The LED lamp can also be surrounded by a relatively small housing, which has advantages in the installation space.

그러나, 이러한 엘이디 램프의 특징적인 조건들로 인해 종래에는 한 개 이상의 엘이디가 고장났을 경우, 어셈블리 단위로 교체를 해야 하므로 정상적인 엘이디 까지도 버려야 하므로, 엘이디 램프 수리에 따른 과다한 비용이 발생되는 문제점이 있다.However, due to the characteristic conditions of such LED lamps, when one or more LEDs fail in the related art, since the replacement of the LEDs is necessary, the normal LEDs must be discarded, resulting in excessive cost due to LED lamp repair.

따라서 본 발명은 상기한 종래의 문제점을 해결하기 위한 것으로, 엘이디 램프의 카트리지 방식을 적용하여 개별 엘이디의 교체가 가능하도록 하여, 엘이디 램프의 교체 또는 수리시 비용절감을 도모할 수 있는 엘이디 램프 카트리지를 제공하는 것을 목적으로 한다.Therefore, the present invention is to solve the above-mentioned conventional problems, by applying the LED lamp cartridge method to enable the replacement of the individual LED, LED lamp cartridge which can reduce the cost when replacing or repairing the LED lamp It aims to provide.

상기 목적을 달성하기 위한 본 발명의 엘이디 램프 카트리지 구조는 강판의 상부에 방열기판이 적층되고, 상기 방열기판상에 적어도 하나 이상의 엘이디가 횡 으로 배열된 엘이디 램프 카트리지 구조에 있어서, 상기 엘이디는 엘이디 본체와, 상기 엘이디 본체 상측의 램프와, 상기 엘이디 본체 하부로 일정길이 연장되어 나온 엘이디 핀을 포함하여, 상기 방열기판상에 결착된 개별 엘이디가 교체 가능하도록 한 것을 특징으로 한다.LED lamp cartridge structure of the present invention for achieving the above object is a heat dissipation substrate is laminated on the upper portion of the steel plate, LED lamp cartridge structure in which at least one LED is arranged laterally on the heat dissipation substrate, the LED body and the LED body, It includes a lamp on the upper side of the LED body, and an LED pin extending a predetermined length to the lower portion of the LED body, it characterized in that the individual LED is bound on the heat dissipation substrate is replaceable.

상기 엘이디 핀은 그 하단이 양측방향으로 벌어진 형상으로 형성되게 하는 것이 바람직하다.The LED pin is preferably such that the lower end is formed in a shape in both directions.

상기 엘이디 핀이 삽입되는 방열기판상에는 접지핀이 구비되고, 이 접지핀 은 방열기판상의 홈 안으로 삽입되어 들어간 형태로 형성되도록 한다.A ground pin is provided on the heat dissipation board into which the LED fin is inserted, and the ground pin is formed to be inserted into a groove on the heat dissipation board.

상기 엘이디 램프 카트리지를 차체 소정 위치에 고정시키기 위한 결착수단은 원형의 핀과, 상기 핀을 감싸는 제1 판스프링과, 상기 엘이디 램프 카트리지의 타측단을 결착시키는 제2 판스프링으로 구성되도록 하는 것이 바람직하다.The fastening means for fixing the LED lamp cartridge to the vehicle body predetermined position is preferably configured to include a circular pin, a first leaf spring surrounding the pin, and a second leaf spring for fastening the other end of the LED lamp cartridge. Do.

이하 첨부된 도면을 참조하여 본 발명에 따른 엘이디 램프 카트리지의 적합한 실시예에 대해 상세한 설명을 하기로 한다.Hereinafter, a preferred embodiment of the LED lamp cartridge according to the present invention with reference to the accompanying drawings will be described in detail.

도 1 은 본 발명에 따른 엘이디 램프 카트리지 구조를 도시한 도면으로,1 is a view showing the structure of the LED lamp cartridge according to the present invention,

도 1 의 (a)는 엘이디 램프가 방열기판상에 결착된 상태의 단면도이고,1 (a) is a cross-sectional view of the LED lamp is bonded on the heat dissipation substrate,

도 1 의 (b)는 상기 도 1 (a)의 저면도이다.FIG. 1B is a bottom view of FIG. 1A.

도시된 바와 같이, 엘이디(10), 즉 엘이디 리어 콤비는 엘이디 소자로부터 나오는 발열량이 환경시험 내열조건을 만족하므로 엘이디 칩의 접지 조건만 방열기판(30)에 적절히 되어 있으면 방열조건은 만족한다.As shown, the LED 10, that is, the LED rear combination, the heat generated from the LED element satisfies the environmental test heat resistance conditions, so if only the grounding conditions of the LED chip is properly in the heat dissipation substrate 30, the heat dissipation conditions are satisfied.

종래의 접지조건은 납땜구조로 엘이디 소자의 핀을 통하여 방열기판(30)으로 나가는 구조를 가지나, 본 발명은 엘이디의 개별교체를 위해 방열기판(30)에 엘이디 칩의 핀(15)을 도 2 에 도시된 바와 같이 접지하는 구조를 갖는다.Conventional grounding conditions have a structure in which a soldering structure goes out to the heat dissipation substrate 30 through the fins of the LED element, but the present invention shows the fins 15 of the LED chip on the heat dissipation substrate 30 for LED replacement individually. It has a structure to ground as shown in.

도 2 는 본 발명에 따른 엘이디 램프 카트리지에 있어서, 엘이디 램프의 개별 교체를 위한 엘이디 칩 핀의 구조를 도시한 도면이다.2 is a view showing the structure of the LED chip pin for the individual replacement of the LED lamp in the LED lamp cartridge according to the present invention.

도시된 바와 같이, 본 발명의 엘이디(10)는 가운데의 엘이디 본체(11)와, 상기 엘이디 본체(11) 상측의 램프(13)와, 상기 엘이디 본체(11) 하부로 일정길이 연장되어 나온 엘이디 핀(15)으로 구성된다.As shown, the LED 10 of the present invention is the LED body 11 in the center, the lamp 13 of the upper side of the LED body 11, and the LED extending a predetermined length below the LED body 11 It consists of a pin 15.

본 발명의 상기 엘이디 핀(15)은 그 하단이 양측방향으로 벌어진 형상으로 형성되어 있으며, 본 발명의 상기 엘이디 핀(15)이 삽입되는 방열기판(30)상에는 접지핀(31)이 형성되어 있으며, 이 접지핀(31)은 도 2 에 도시된 바와 같이, 일측단이 방열기판(30)상의 일정지점(37)에 고정되고, 타측 단부는 방열기판(30)상의 홈(31) 안으로 삽입되어 들어간 형태로 형성되어 있다. 즉, 상기 접지핀(33)은 방열기판(30)상의 고정점(37)을 기준으로 방열기판(30)상의 홈(31) 안으로 절곡되어 들어가며, 그 단부는 방열기판(30) 상의 홈(31) 안에서 상부로 돌출되어 나온 구조로 형성된다.The LED fin 15 of the present invention is formed in a shape in which the lower end is spread in both directions, the ground fin 31 is formed on the heat dissipation substrate 30 is inserted into the LED fin 15 of the present invention 2, one end of the ground pin 31 is fixed to a predetermined point 37 on the heat dissipation board 30, and the other end of the ground pin 31 is inserted into the groove 31 on the heat dissipation board 30. It is formed in the shape that entered. That is, the ground pin 33 is bent into the groove 31 on the heat dissipation substrate 30 based on the fixing point 37 on the heat dissipation substrate 30, and the end of the ground pin 33 is the groove 31 on the heat dissipation substrate 30. ) It is formed into a structure that protrudes upwards from the inside.

따라서, 본 발명의 엘이디(10)가 방열기판(30)상의 홈(31) 안으로 삽입되어 들어가는 초기상태는 도 2 의 (a)에 도시된 바와 같이, 엘이디 핀(15)이 접지핀(33)의 상측단(33a)을 누르면서 홈(31) 안으로 들어간다.Accordingly, the initial state in which the LED 10 of the present invention is inserted into the groove 31 on the heat dissipation substrate 30 is as shown in FIG. 2A, and the LED pin 15 is the ground pin 33. While pressing the upper end (33a) of the into the groove (31).

다음, 도 2 의 (b)에 도시된 바와 같이, 본 발명의 엘이디 핀(15)이 방열기판(30)상의 홈(31)에 끼워지는 동안 엘이디 핀(15)은 누르는 힘에 의해서 접지 핀(33)의 형상에 따라 그 하단부가 양측방향으로 안내되어, 엘이디 핀(15)이 방열기판(30)의 홈(31) 안쪽으로 삽입되어 접지가 완료된다. 즉, 엘이디 핀(15)의 하단부는 방열기판(30)의 홈(31) 안쪽으로 완전히 삽입되고, 엘이디 핀(15)의 중간부위는 방열기판(30)의 홈 내측단(33)과 상호 접촉하게 된다.Next, as shown in Figure 2 (b), while the LED pin 15 of the present invention is fitted into the groove 31 on the heat dissipation board 30, the LED pin 15 is a ground pin (by pressing force) The lower end is guided in both directions according to the shape of 33, and the LED fin 15 is inserted into the groove 31 of the heat dissipation board 30 to complete the grounding. That is, the lower end of the LED fin 15 is completely inserted into the groove 31 of the heat dissipation substrate 30, the middle portion of the LED fin 15 is in contact with the inner end 33 of the groove of the heat dissipation substrate 30. Done.

한편, 도 3 은 본 발명의 엘이디 램프 카트리지(100)가 차체에 결착되는 구조를 도시한 도면이다.On the other hand, Figure 3 is a view showing a structure in which the LED lamp cartridge 100 of the present invention is bound to the vehicle body.

본 발명의 엘이디 램프 카트리지(100)는 상기 도 3 의 도면을 기준으로, 상측에 강판(50)이 위치하고, 그 하부로 방열기판(30)과 엘이디(10)의 순으로 결착된 구조를 이룬다.The LED lamp cartridge 100 of the present invention has a structure in which the steel plate 50 is located on the upper side, and the heat dissipation substrate 30 and the LED 10 are bound to the lower side based on the drawing of FIG. 3.

상기 구조에서, 엘이디 램프 카트리지(100)의 일측단부에서는, 상측의 강판(50)이 그 하부의 방열기판(30)에 비해 더 측방향으로 연장되어 나온 구조를 이루고 있다. 이와 대응하여 상기 돌출되어 나온 강판(50)을 고정하기 위한 결착수단이 차체의 소정위치에 설치되어 있다. 상기 강판(50) 결착수단은 도시된 바와 같이, 원형의 핀(60)과, 상기 핀(60)을 감싸는 제1 판스프링(70)으로 형성되어 있다.In the above structure, at one end of the LED lamp cartridge 100, the upper steel plate 50 is formed to extend laterally than the lower heat dissipation substrate 30. Correspondingly, binding means for fixing the protruding steel sheet 50 is provided at a predetermined position of the vehicle body. As illustrated, the binding means of the steel plate 50 is formed of a circular fin 60 and a first leaf spring 70 surrounding the fin 60.

본 발명의 엘이디 램프 카트리지(100)의 타 측단을 고정시키기 위한 결착수단(80)은 제2 판스프링(80)으로서, 상부의 주석도금 강판(50)과 방열기판(30)의 단부가 동일한 길이를 가지고 있어 이에 맞게 상기 제2 판스프링(80)의 형상을 맞추어 엘이디 램프 카트리지(100)의 고정이 용이하게 이루어지도록 한다.The binding means 80 for fixing the other end of the LED lamp cartridge 100 of the present invention is a second leaf spring 80, the length of the upper end of the tin-plated steel sheet 50 and the heat dissipation substrate 30 is the same length The shape of the second leaf spring (80) according to this to facilitate the fixing of the LED lamp cartridge 100 is made.

본 발명의 엘이디 램프 카트리지(100)를 차체 소정 위치에 고정시키기 위한 결착순서는 도 3 에 도시되어 있는 바와 같이, 먼저, 엘이디 램프 카트리지(100)의 일측단, 즉 상측의 강판(50)의 측방향으로 돌출되어 나온 단부를 원형핀(60)을 감싸고 있는 제1 판스프링(70)의 안으로 삽입시킨다. 이후, 엘이디 램프 카트리지(100)의 타측단을 제2 판스프링(80)에 삽착시킴으로써 엘이디 램프 카트리지(100)의 고정이 완료된다.The binding procedure for fixing the LED lamp cartridge 100 of the present invention to a predetermined position of the vehicle body is shown in Fig. 3, first, one side end of the LED lamp cartridge 100, that is, the side of the upper steel plate 50 The end protruding in the direction is inserted into the first leaf spring 70 surrounding the circular pin 60. Thereafter, fixing the LED lamp cartridge 100 is completed by inserting the other end of the LED lamp cartridge 100 into the second leaf spring 80.

상기에서 상기 강판(50)은 주석도금 강판으로 형성하는 것이 바람직하다.The steel sheet 50 is preferably formed of a tin plated steel sheet.

한편, 도 4a 는 본 발명에 따른 단일의 엘이디 램프 카트리지(100)를 다수열로 차체 소정위치에 결착시킨 상태를 도시한 도면으로, 엘이디 램프 카트리지(100) 전면의 장착모습을 나타낸다.On the other hand, Figure 4a is a view showing a state in which a single LED lamp cartridge 100 in accordance with the present invention in a plurality of rows to bind to the vehicle body predetermined position, showing the mounting appearance of the LED lamp cartridge 100 front.

도 4b 는 본 발명의 단일 엘이디 램프 카트리지(100)가 다수열로 차체에 결착된 상태의 배면 모습을 나타낸다.4B is a rear view of the single LED lamp cartridge 100 of the present invention attached to the vehicle body in multiple rows.

이상에서 설명한 바와 같이, 본 발명에 따른 엘이디 램프 카트리지는 엘이디 램프 각각을 개별적으로 교체 가능하고, 엘이디 램프 카트리지의 결착이 용이하여, 엘이디 램프의 수리 또는 교체작업시 이에 따른 비용이 절감되며, 작업의 단순화로 작업시간을 단축시킬 수 있는 효과를 발휘한다.As described above, the LED lamp cartridge according to the present invention can individually replace each of the LED lamps, easy to bind the LED lamp cartridge, thereby reducing the cost when repairing or replacing the LED lamp, It simplifies the work time.

Claims (4)

강판의 상부에 방열기판이 적층되고, 상기 방열기판상에 적어도 하나 이상의 엘이디가 횡으로 배열된 엘이디 램프 카트리지 구조에 있어서,In the LED lamp cartridge structure in which a heat dissipation substrate is stacked on the steel plate and at least one LED is laterally arranged on the heat dissipation substrate, 상기 엘이디는 엘이디 본체와, 상기 엘이디 본체 상측의 램프와, 상기 엘이디 본체 하부로 일정길이 연장되어 나온 엘이디 핀을 포함하여, 상기 방열기판상에 결착된 개별 엘이디가 교체 가능하도록 한 것을 특징으로 하는 엘이디 램프 카트리지 구조.The LED includes an LED body, an LED lamp on the upper side of the LED body, and an LED pin extending a predetermined length to the lower portion of the LED body, LED lamps, characterized in that the individual LEDs bound on the heat dissipation board is replaceable Cartridge structure. 제 1 항에 있어서,The method of claim 1, 상기 엘이디 핀은 그 하단이 양측방향으로 벌어진 형상으로 형성된 것을 특징으로 하는 엘이디 램프 카트리지 구조.The LED pin cartridge structure, characterized in that the lower end formed in a shape that is open in both directions. 제1 항에 있어서,According to claim 1, 상기 엘이디 핀이 삽입되는 방열기판상에는 접지핀이 구비되고, 이 접지핀 은 방열기판상의 홈 안으로 삽입되어 들어가도록 절곡도니 형상으로 형성되는 것을 특징으로 하는 엘이디 램프 카트리지 구조.An LED lamp cartridge structure, characterized in that the ground pin is provided on the heat dissipation substrate into which the LED fin is inserted, and the ground pin is bent into a groove to be inserted into a groove on the heat dissipation substrate. 제 1 항에 있어서,The method of claim 1, 상기 엘이디 램프 카트리지를 차체 소정 위치에 고정시키기 위한 결착수단은 원형의 핀과, 상기 핀을 감싸는 제1 판스프링과, 상기 엘이디 램프 카트리지의 타측단을 결착시키는 제2 판스프링으로 구성되는 것을 특징으로 하는 엘이디 램프 카트리지 구조.The fastening means for fixing the LED lamp cartridge to a predetermined position on the vehicle body is characterized by consisting of a circular pin, a first leaf spring surrounding the pin, and a second leaf spring for binding the other end of the LED lamp cartridge. LED lamp cartridge structure.
KR1020060123656A 2006-12-07 2006-12-07 Led lamp cartridge structure KR20080051869A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011105670A1 (en) * 2010-02-26 2011-09-01 Park Jae-Soon Surface-mounted light-emitting unit array, method for repairing same, and light-emitting unit for repairing same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011105670A1 (en) * 2010-02-26 2011-09-01 Park Jae-Soon Surface-mounted light-emitting unit array, method for repairing same, and light-emitting unit for repairing same
KR101064146B1 (en) * 2010-02-26 2011-09-16 박재순 Surface mount light emitting unit array, repair method thereof and light emitting unit for repair

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