KR20080036491A - Manufacturing process of passivity element of insertion type - Google Patents

Manufacturing process of passivity element of insertion type Download PDF

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Publication number
KR20080036491A
KR20080036491A KR1020070001204A KR20070001204A KR20080036491A KR 20080036491 A KR20080036491 A KR 20080036491A KR 1020070001204 A KR1020070001204 A KR 1020070001204A KR 20070001204 A KR20070001204 A KR 20070001204A KR 20080036491 A KR20080036491 A KR 20080036491A
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South Korea
Prior art keywords
layer
copper
photoresist layer
driven component
substrate
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KR1020070001204A
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Korean (ko)
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KR100850221B1 (en
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한-친 시흐
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트리포드 테크놀로지 코포레이션
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0568—Resist used for applying paste, ink or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1453—Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

A manufacturing process of a passive element of an insertion type is provided to reduce variation of a resistance value in printing an accurate electrical resistance value by forming a uniform copper plated layer. A manufacturing process of a passive element of an insertion type includes the steps of: providing a substrate(10) with a copper plated layer(12); covering a part of a pair of connection pads serving as the passive element on the copper plated layer by forming a first design photoresist layer on the copper plated layer; plating a copper electroplated layer(16) on a part of the copper plated layer which is not covered by the first design photoresist layer; covering the first design photoresist layer and a part of the copper electroplated layer by forming a second design photoresist layer on the first design photoresist layer and the part of the copper electroplated layer, and not covering a copper electroplated layer between the pair of connection pads; removing the copper electroplated layer and the cooper plated layer which are not covered by the second design photoresist layer until the substrate is exposed; exposing the stepwise connection pads by removing the first and second design photoresist layer; and forming a passive element material on the stepwise connection pads and the substrate.

Description

감입식 피동부품의 제조방법{MANUFACTURING PROCESS OF PASSIVITY ELEMENT OF INSERTION TYPE}Manufacturing method of the immersion driven component {MANUFACTURING PROCESS OF PASSIVITY ELEMENT OF INSERTION TYPE}

도 1a 내지 도 1e는 종래의 감입식 피동부품의 제조방법을 보인 공정도.1A to 1E are process diagrams showing a method for manufacturing a conventional immersion driven component.

도 2a 내지 도 2g는 본 발명의 감입식 피동부품의 제조방법을 보인 공정도.Figure 2a to 2g is a process chart showing a method of manufacturing the immersion driven component of the present invention.

<도면의 주요 부분에 대한 부호의 설명><Explanation of symbols for the main parts of the drawings>

10 : 기판 10: substrate

12 : 동박층12: copper foil layer

13 : 한 쌍의 접속패드13: A pair of connection pad

8, 14, 18 : 포토레지스트층8, 14, 18: photoresist layer

6, 16 : 동 전기도금층6, 16: copper electroplating layer

2, 20 : 피동부품재료2, 20: driven component material

본 발명은 일종의 피동부품의 제조방법에 관한 것이며, 특히 감입식 피동부품의 제조방법에 관한 것이다.TECHNICAL FIELD The present invention relates to a method of manufacturing a kind of driven component, and more particularly, to a method of manufacturing a sensitive driven component.

내부 감입식 제조공정은 일종의 특수 유전체, 저항재료, 유기유리섬유기판 등의 적층 구조물을 이용하여 피동부품을 설계하고, 응용시 전기회로의 특성과 필요에 따라 고저 유전계수와 전기저항기판재료를 채용하여 콘덴서, 전기저항 또는 고주파 전송선의 내부매장의 설계에 응용된다.The internal immersion manufacturing process designs the driven parts using a laminated structure such as a kind of special dielectric, resistance material, and organic glass fiber substrate, and adopts high and low dielectric constant and electric resistance substrate material according to the characteristics and needs of the electric circuit when applied. It is applied to the design of internal storage of capacitor, electric resistance or high frequency transmission line.

도 1a 내지 도 1e는 종래의 감입식 피동부품의 제조방법을 보인 공정도이다.1A to 1E are process diagrams showing a method for manufacturing a conventional immersion driven component.

도 1a 내지 도 1e를 참조하면, 먼저, 도 1a와 같이 동박층(12)을 가진 기판(10) 위에, 동 전기도금층(6)을 전기 도금한 다음 도 1b와 같이 주로 예정된 피동부품(예컨대 전기저항)의 한 쌍의 접속패드 위에 각각 도안화 된 포토레지스트층(8)이 형성된다. 도안화 포토레지스트층(8)의 형성은 주로 노광, 현상 등의 수단을 이용하여 완성한 것이다. 이어서, 도 1c에 도시된 바와 같이, 도안화 포토레지스트층(8)이 커버되지 않은 일부 동박층(12)과 동 전기도금층(6)을 기판(10)이 노출될 때까지 에칭(etching)하여, 요형 홈이 형성되게 한다. 도 1d에 도시된 바와 같이 도안화 포토레지스트층(8)를 제거한 후, 도 1e와 같이 에칭된 요형 홈과 요형 홈 근처의 동 전기도금층(6) 위에 전기저항재료(2)(즉, 레지스터 페이스트)가 형성되게 함으로서 피동부품(예컨대 전기저항)의 한 쌍의 접속패드의 접촉계면으로 사용되게 한다.Referring to FIGS. 1A-1E, first, a copper electroplating layer 6 is electroplated on a substrate 10 having a copper foil layer 12 as shown in FIG. 1A, and then mainly intended driven parts (eg, electric The patterned photoresist layer 8 is formed on the pair of connection pads. Formation of the patterned photoresist layer 8 is completed mainly using means, such as exposure and image development. Subsequently, as shown in FIG. 1C, some of the copper foil layer 12 and the copper electroplating layer 6 which are not covered by the patterned photoresist layer 8 are etched until the substrate 10 is exposed. , Concave groove is formed. After removing the patterned photoresist layer 8 as shown in FIG. 1D, the resistive material 2 (i.e., resistor paste) is formed on the copper electroplating layer 6 near the recessed grooves and the recessed grooves as shown in FIG. ) To be used as a contact interface of a pair of connection pads of a driven component (e.g., electrical resistance).

그러나, 이러한 제조방법은 도금의 적절한 제어가 쉽지 않아 동 전기도금층(6)의 표면(특히 상기 한 쌍의 접속패드)위에 항상 많은 과립상(顆粒狀)이 형성되고, 전기저항재료(2)가 그 위에 형성되면, 두께의 균일화를 이루지 못하여, 신뢰성이 문제가 된다. 그 결과 근본이 불균일한 동 도금층(6) 위에 정밀한 전기저항치를 인쇄하는 것은, 전기저항치의 변이(變異)가 과다한 결과만 있을 수밖에 없다. However, such a manufacturing method is not easy to control the plating properly, so that many granules are always formed on the surface of the copper electroplating layer 6 (particularly, the pair of connection pads), and the electrical resistance material 2 If formed on it, thickness cannot be made uniform and reliability becomes a problem. As a result, printing the precise electrical resistance value on the copper plating layer 6 whose origin is nonuniform only results in excessive variation of the electrical resistance value.

본 발명의 주요목적은 계단상 접속패드 위에(특히 균일성이 우수한 동박층 위에) 전기저항재료가 형성될 때, 상대적으로 전기저항재료의 균일성을 향상시킬 수 있는 일종의 감입식 피동부품의 제조방법을 제공하는 것이다.The main object of the present invention is a method of manufacturing a kind of immersed driven component which can improve the uniformity of the electrical resistance material when the electrical resistance material is formed on the stepped connection pad (especially on the copper foil layer having excellent uniformity). To provide.

상기 목적을 달성하기 위한 본 발명은, 감입식 피동부품의 제조방법으로서 주로 순서에 따라 크기가 다른 포토레지스트층 2개를 형성하여, 기판 위에 형성된 동박층과 동 전기도금층이 피차 고저낙차를 구비한 계단상 접속패드로 에칭되게 하고, 또한 균일성이 부족한 동 전기도금층에 저항재료가 형성되는 것을 피하고, 단일 계단상 접속패드 위에(특히 균일성이 우수한 동박층 위에)만 저항재료가 형성되게 하여, 저항재료의 균일성이 상대적으로 향상되게 한 것을 특징으로 한다.In order to achieve the above object, the present invention provides a method for manufacturing a sensitized driven component, in which two photoresist layers of different sizes are mainly formed in order, and the copper foil layer and the copper electroplating layer formed on the substrate are provided with a high drop. Etched with a stepped connection pad, avoiding the formation of a resistive material on the copper electroplating layer which lacks uniformity, and allowing a resistive material to be formed only on a single stepped connection pad (especially on a copper foil layer having excellent uniformity). It is characterized in that the uniformity of the resistance material is relatively improved.

이하, 본 발명의 장점을 보다 용이하게 이해를 할 수 있도록 하기 위해 첨부된 도면을 참조하여 본 발명에 대하여 상세히 설명한다. Hereinafter, the present invention will be described in detail with reference to the accompanying drawings so that the advantages of the present invention can be more easily understood.

도 2a 내지 도 2g는 본 발명의 감입식 피동부품의 제조방법을 보인 공정도이다.2A to 2G are process diagrams showing a method for manufacturing a sensitized driven component of the present invention.

본 발명의 감입식 피동부품의 제조방법은 주로 순서에 따라 크기가 다른 포토레지스트층(14)(18) 2개를 형성하여, 기판(10) 위에 형성된 동박층과 동 전기도금층이 피차 고저낙차를 구비한 계단상 접속패드로 에칭되게 하고(도 2e 참조), 또한 균일성이 부족한 동 전기도금층에 저항재료(20)가 형성되는 것을 피하고, 단일 계단상 접속패드 위에(특히 균일성이 우수한 동박층(12) 위에)만 저항재료(20)가 형성되게 하여(도 2g 참조), 저항재료의 균일성이 상대적으로 향상되게 할 수 있다.In the manufacturing method of the immersed driven component of the present invention, two photoresist layers 14 and 18 having different sizes are formed in order, so that the copper foil layer formed on the substrate 10 and the copper electroplating layer are subjected to high and low dropping. To be etched with the provided stepped connection pads (see FIG. 2E), and to avoid the formation of the resistive material 20 in the copper electroplating layer which lacks uniformity, and on the single stepped connection pads (especially the excellent copper foil layer) Only on (12) can the resistive material 20 be formed (see FIG. 2G), whereby the uniformity of the resistive material can be relatively improved.

구체적으로, 먼저 도 2a를 참조하면, 본 발명의 제조방법은 동박층(12)을 가진 기판(10)을 제공하지만, 종래의 기술처럼 바로 도금을 하지 않는다. 도 2b를 참조하면, 도금 전에 먼저 동박층(12) 위에 형성된 제1도안화 포토레지스트층(14)이 동박층(12)의 피동부품(전기저항 콘덴서, 인덕턴스 등)인 한 쌍의 접속패드(13)의 일부를 커버한다.Specifically, referring first to Figure 2a, the manufacturing method of the present invention provides a substrate 10 having a copper foil layer 12, but does not immediately plate as in the prior art. Referring to FIG. 2B, a pair of connection pads in which the first patterned photoresist layer 14 formed on the copper foil layer 12 before the plating is a driven component (electric resistance capacitor, inductance, etc.) of the copper foil layer 12 ( 13) to cover a part.

다음에 제1도안화 포토레지스트층(14)이 커버하지 않은 동박층(12) 위에 도 2c와 같이 동 전기도금층(16)을 도금하고, 이어서, 제1도안화 포토레지스트층(14)과 일부 동 전기동금층(16) 위에 제2도안화 포토레지스트층(18)(제1도안화 포토레지스트층(14)보다 큼)을 형성하여 제1도안화 포토레지스트층(14)과 일부 동 전기동금층(16)을 커버하지만, 도 2d에 도시된 바와 같이 상기 한 쌍의 접속패드(13) 사이의 동 전기도금층(16)(잠시 후 에칭해 버림)은 커버하지 않는다.Next, the copper electroplating layer 16 is plated on the copper foil layer 12 which is not covered by the first patterning photoresist layer 14 as shown in FIG. 2C, and then partially with the first patterning photoresist layer 14. The second patterned photoresist layer 18 (which is larger than the first patterned photoresist layer 14) is formed on the copper electroplated layer 16, so that the first patterned photoresist layer 14 and some copper electroplated layers ( 16, but does not cover the copper electroplating layer 16 (temporarily etched away) between the pair of connection pads 13 as shown in FIG. 2D.

도 2e를 참조하는 바와 같이, 제2도안화 포토레지스트층(18)을 이용하여, 제2도안화 포토레지스트층(18)이 커버하지 않은 동 전기도금층(16)과 동박층(12)을 기판(10)이 노출될 때까지 제거한다.As shown in FIG. 2E, the copper electroplating layer 16 and the copper foil layer 12 which are not covered by the second design photoresist layer 18 are substrates using the second design photoresist layer 18. Remove until (10) is exposed.

도 2f를 참조하면, 피동부품재료(20)(예컨대 저항 페이스트)가 형성되기 전에 먼저 제1도안화 포토레지스트층(14)과 제2도안화 포토레지스트층(18)을 제거한 후, 동박층(12)과 동 전기도금층(16)을 재차 노출되게 한다. 동박층(12)과 동 전기도금층(16) 사이에는 서로 고저낙차가 있으므로, 동박층(12)과 동 전기도금층(16) 으로 조성된 접속패드를 계단상 접속패드라고도 한다.Referring to FIG. 2F, before the driven component material 20 (for example, the resist paste) is formed, the first patterned photoresist layer 14 and the second patterned photoresist layer 18 are removed, and then the copper foil layer ( 12) and the copper plating layer 16 is exposed again. Since there is a high drop between the copper foil layer 12 and the copper electroplating layer 16, the connection pad formed of the copper foil layer 12 and the copper electroplating layer 16 is also called a stepped connection pad.

마지막으로, 도 2g를 참조하면, 상기 계단상 접속패드 및 기판(10) 위에 피동부품재료(20)가 형성된다. 계단상 접속패드 및 기판(10) 위에 형성된 피동부품재료(20)는 피동부품의 접촉계면이다.Finally, referring to FIG. 2G, a driven component material 20 is formed on the stepped connection pads and the substrate 10. The driven component material 20 formed on the stepped connection pad and the substrate 10 is a contact interface of the driven component.

상기 내용을 종합하면, 본 발명의 감입식 피동부품의 제조방법을 이용하여 제조한 감입식 피동부품은 피동부품재료(20)에 불 균일한 동 전기도금층(16)이 형성되지 않으므로, 기판(10) 위에 상대적으로 비교적 균일한 동박층(12)이 형성되고, 이에 따라 피동부품재료(20)의 균일성도 향상된다. 상기 원인으로 본 발명의 감입식 피동부품은 양호한 신뢰도가 있는 동시에 정밀한 전기저항치를 인쇄할 때, 이 방법에 의해 저항치의 차이성도 낮아진다.In summary, since the non-uniform copper electroplating layer 16 is not formed on the driven component material 20, the substrate 10 may be fabricated using the method for manufacturing the driven component of the present invention. The relatively uniform copper foil layer 12 is formed on the upper side), thereby improving the uniformity of the driven component material 20. For this reason, when the immersed driven component of the present invention has a good reliability and at the same time prints an accurate electric resistance value, the difference in resistance value is also lowered by this method.

이상의 설명과 같이 본 발명의 감입식 피동부품의 제조방법에 의하면, 피동부품에 불 균일한 동 전기도금층이 형성되지 않으므로, 기판 위에 상대적으로 비교적 균일한 동박층이 형성되고, 이에 따라 피동부품재료의 균일성도 향상되며, 상기 원인으로 본 발명의 감입식 피동부품은 양호한 신뢰도가 있는 동시에 정밀한 전기저항치를 인쇄할 때, 저항치의 변이를 감소시킬 수 있는 효과가 있다.As described above, according to the manufacturing method of the immersed driven component of the present invention, since a non-uniform copper electroplating layer is not formed on the driven component, a relatively uniform copper foil layer is formed on the substrate, whereby Uniformity is also improved, and as a result of the above, the immersed driven component of the present invention has a good reliability and at the same time has an effect of reducing the variation of the resistance value when printing a precise electrical resistance value.

이상의 실시예는 본 발명의 특징을 보이기 위한 최선의 일 실시 형태만을 설명한 것일 뿐, 본 발명에 대해 어떤 형식상의 제한을 하고자 하는 것은 아니므로, 본 발명과 동일한 목적 하에서 본 발명에 대한 다양한 수정과 변경을 실시할 수 있으며, 그러한 변경은 모두 본 발명의 보호범위에 포함된다.The above embodiments are only illustrative of the best mode for showing the features of the present invention, and are not intended to limit any form of the present invention, and various modifications and changes to the present invention under the same purpose as the present invention. It may be carried out, all such changes are included in the scope of protection of the present invention.

Claims (4)

일종의 감입식 피동부품의 제조방법에 있어서,In the method of manufacturing a kind of immersed driven component, 동박층을 구비한 기판이 제공되고;A substrate having a copper foil layer is provided; 상기 동박층 위에 제1도안화 포토레이스트층이 형성되되, 상기 동박층 중의 피동부품인 한 쌍의 접속패드의 일부가 커버되고;A first drawing phototrace layer is formed on the copper foil layer, wherein a portion of the pair of connection pads, which are driven components in the copper foil layer, is covered; 상기 제1도안화 포토레지스트층이 커버하지 않은 동박층 부분에 동 전기도금층이 도금되고;A copper electroplating layer is plated on a portion of the copper foil layer not covered by the first patterned photoresist layer; 상기 제1도안화 포토레지스트층과 상기 일부 동 전기도금층 위에 제2도안화 포토레지스트층을 형성되되, 상기 제1도안화 포토레지스트층과 일부 동 전기도금층이 커버되고, 상기 한 쌍의 접속패드 사이의 동 전기도금층이 커버되지 않고;A second patterned photoresist layer is formed on the first patterned photoresist layer and the part of the copper electroplating layer, wherein the first patterned photoresist layer and the part of the copper electroplating layer are covered, and between the pair of connection pads. Copper electroplating layer is not covered; 상기 제2도안화 포토레지스트층이 커버하지 않은 상기 동 전기도금층과 상기 동박층을 상기 기판이 노출될 때까지 제거하고;Removing the copper electroplating layer and the copper foil layer not covered by the second design photoresist layer until the substrate is exposed; 상기 제1도안화 포토레지스트층과 제2도안화 포토레지스트층을 제거하여, 상기 동박층과 상기 동 전기도금층 사이에 고저낙차를 구비한 계단상 접속패드가 노출되게 하며;Removing the first patterned photoresist layer and the second patterned photoresist layer to expose a stepped connection pad having a high drop between the copper foil layer and the copper electroplating layer; 상기 계단상 접속패드 및 상기 기판 위에 피동부품재료가 형성되는 것을 포함하는 것을 특징으로 하는 감입식 피동부품의 제조방법.And a driven component material is formed on said stepped connection pad and said substrate. 제1항에 있어서, The method of claim 1, 상기 피동부품은 전기저항, 콘덴서, 인덕턴스에서 선택된 것을 특징으로 하는 감입식 피동부품의 제조방법.And said driven component is selected from an electrical resistor, a capacitor and an inductance. 제1항에 있어서, The method of claim 1, 상기 피동부품재료는 저항 페이스트인 것을 특징으로 하는 감입식 피동부품의 제조방법.And said driven component material is a resistance paste. 제1항에 있어서,The method of claim 1, 상기 계단상 접속패드 및 기판 위에 형성된 피동부품재료는 상기 피동부품의 접촉계면인 것을 특징으로 하는 감입식 피동부품의 제조방법.And a driven component material formed on the stepped connection pad and the substrate is a contact interface of the driven component.
KR1020070001204A 2006-10-23 2007-01-05 Manufacturing process of passivity element of insertion type KR100850221B1 (en)

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