KR20080030701A - Process for preparation of porous ceramic filter having improved bonding strength by addition of ground layer - Google Patents

Abstract

A method for manufacturing a porous ceramic filter having improved bonding strength by addition of a ground layer is provided to enhance thermal, mechanical and chemical strengths of the filter and impart more excellent bonding strength between assembled segments by absorbing components of an adhesion layer into porous structure of segments, thereby preventing macropores or cracks due to the macropores from forming in the adhesion layer. As a method for manufacturing a porous ceramic filter by stacking, drying, plugging and sintering a plurality of ceramic segments(100), the method comprises: applying a ground material onto surfaces of the ceramic segments and drying the ground material to form a layer("ground layer")(110); applying an adhering material onto the ground layer and drying the adhering material to form a layer("adhesion layer")(120); and assembling the segments, wherein the ground material comprises (a) a ceramic powder having a particle diameter larger than pores in the surfaces of the segments as well as (b) a ceramic powder having a particle diameter smaller than the pores in the surfaces of the segments. The ground layer and the adhesion layer are formed by heating and drying the ground material or the adhering material to a temperature of 80 to 150 deg.C after applying the ground material or the adhering material. Further, a thickness of the ground layer is 0.3 to 0.8mm, and a thickness of the adhesion layer is 1 to 3mm.

Description

Process for Preparation of Porous Ceramic Filter Having Improved Bonding Strength by Addition of Ground Layer

1 is a schematic diagram of a ceramic segment for a common porous ceramic filter;

2 is a schematic diagram of a filtering process of a general porous ceramic filter;

3 is a partially enlarged view of a porous ceramic filter bonded by a conventional method;

4A, 4B, 4C and 4D are schematic diagrams of a manufacturing process of a porous ceramic filter according to one embodiment of the present invention;

5 is a partially enlarged view before sintering in a bonded porous ceramic filter in accordance with one embodiment of the present invention;

<Description of Major Symbols in Drawing>

100: ceramic segment

110: ground floor

120: adhesive layer

The present invention relates to a method of manufacturing a honeycomb ceramic filter having an improved bonding strength by adding a base layer, and more particularly, to a method of manufacturing a porous ceramic filter by laminating, drying, plugging, and sintering a plurality of ceramic segments. Applying and drying a base material on the surface of the ceramic segment to form a layer ("base layer"), applying and drying a bonding material on the base layer to form a layer ("bonding layer") and then joining the segments, The base material comprises a ceramic powder (a) having a particle size larger than the segment surface pores and a ceramic powder (b) having a particle size smaller than the segment surface pores.

Recently, due to serious environmental problems such as abnormal weather phenomenon caused by air pollution, interest in diesel vehicles with less emissions of harmful gases such as carbon monoxide (CO) and hydrocarbons (HC) than gasoline vehicles is increasing. to be. However, diesel vehicles have a problem in that a large amount of particulate materials such as nitrogen oxides (NOx) and the like are emitted. Accordingly, research on a diesel particulate filter (hereinafter referred to as DPF) for removing harmful gases and particulate matters emitted from diesel engines of diesel vehicles has been actively conducted.

The DPF captures carbon monoxide, hydrocarbons, particulate matter, etc. in diesel exhaust gas, injects diesel fuel, which is fuel, at predetermined intervals, and utilizes exhaust gas generated during operation of the vehicle, and the catalyst is coated on the ceramic filter. By the reaction, the filter is regenerated by oxidizing the collected material with harmless carbon dioxide, water and the like.

A honeycomb ceramic filter having a honeycomb structure is mainly used for such a soot filtration device.

FIG. 1 is a schematic perspective view of a typical honeycomb ceramic filter segment 10, and FIG. 2 is a schematic diagram of a filtering process of the honeycomb ceramic filter of FIG.

1 and 2, the ceramic segment 10 has the form of a hexagonal column, which is generally rectangular in cross section, and has a plurality of cells 12, 13 communicating with each other at both cross sections 20, 30 thereof. The barrier ribs 11 are formed in a lattice-like structure so that they can be formed. These cells 12 and 13 are plugged in an alternating arrangement so that they are made of a closed cell 12 which is closed by a plug and an open cell 13 which is not formed with a plug. Or checkerboard.

In the ceramic segment 10 for the porous ceramic filter having such a structure, the particulate matter 40 of the exhaust gas flows into the open cell 13 opened in the front surface 20 of the porous ceramic filter 10 and is adjacent to the porous material. After passing through the partition wall 11, the rear surface 30 is discharged to the open cell 13 that is open. At this time, the particulate matter of the exhaust gas is collected in the micro-pores (not shown) formed in the partition wall 11 or the inner end 15a of the plug 15 located in the closed cell 12 on the rear surface. That is, the particulate matter contained in the exhaust gas is caught by the porous partition 11 while passing through the closed cell 12 in the open cell 13 at the front face 20 but closed in the rear face 30. All.

When the collected fine particles accumulate in the porous ceramic filter, the pressure loss of the filter is increased and the output of the engine is reduced. Therefore, the collected fine particles are periodically used by external ignition means such as an electric heater or a burner. And the combustion is performed to regenerate the porous ceramic filter. Therefore, in general, the porous ceramic filter adopts an alternating regeneration system mounted in a form of 2/1 set so that the other side can be used when one side is being regenerated.

3 schematically shows an enlarged view of the bonding site of the porous ceramic segments joined by the conventional method.

Referring to FIG. 3, a honeycomb ceramic filter is generally manufactured by applying, laminating, drying, and sintering a slurry-like bonding layer 52 on the surfaces of a plurality of porous ceramic segments 60 and 70. In some cases, another bonding layer 51 serving as a buffer layer may be added between the bonding layer 52 and the surfaces of the ceramic segments 60 and 70. The ceramic segments thus bonded are manufactured by cutting the outer shape into a predetermined shape according to the structure of the soot filtration device to which it is mounted, applying the bonding layer 52 to the outer wall, and then drying and sintering.

However, in applying the slurry bonding layer 52 to the surfaces of the porous ceramic segments 60 and 70 having a large porosity, inorganic binders, organic binders, and the like, which are components constituting the bonding layer 52, are formed inside the segment. As a result of excessive sol migration, large pores (55) and cracks in the binder were identified . In addition, the inorganic sol, which contributes a lot to the strength development of the bonding material, may move toward the segment, whereby a phenomenon in which the strength of the bonding layer is lowered may occur.

Such a large pore 55 causes a local high temperature in the regeneration process of the ceramic filter as described above, lowers the regeneration efficiency by non-uniformity of the regeneration temperature, and causes cracks due to thermal stress. As a result, the bonding strength between the segments is weakened, which causes a serious problem that the bonded segments are separated again in a chemical process such as a heat treatment process or a catalyst impregnation process.

In this regard, Japanese Patent Application Laid-Open No. 2000-285878 discloses a method using a silane coupling agent, but when the silane coupling agent is used, the sol component is limited to silica and the manufacturing cost is increased. There is a problem. In addition, Japanese Patent Application Publication No. 1994-161938 discloses a method of using polyvinyl alcohol (PVA) and cellulose-based hydrophilic organic polymer as an organic binder. However, even with the above technique, the sol component cannot be sufficiently prevented from moving, and as the content of the organic binder is increased, the bonding strength of the segment is lowered.

In addition, Japanese Patent Application Laid-Open Publication No. 1999-088391 discloses a technique for controlling the roughness of the surface of the segment, but the process for controlling this is not easy because the variation of the surface roughness of the segment produced in the actual extrusion process is large, There is a problem that it is difficult to control the change in porosity.

On the other hand, Japanese Patent Application Laid-Open No. 2004-322097 discloses a technique for applying a base layer having a different viscosity from the adhesive layer between a segment surface and an adhesive layer. In other words, by applying a relatively low-viscosity base layer on the surface of the segment and applying a uniform coating, a high-viscosity adhesive layer is added to prevent the adhesive layer from being uniformly applied to the segment surface and causing partial staining to lower the adhesive strength. Disclosed is a technique. However, since the composition of the low-viscosity base layer and the high-viscosity adhesive layer is not described, it is not possible to know exactly the exact reaction of the reactor which contributes to the increase in the adhesive strength, but at least the low-viscosity material is more porous than the high viscosity material. It is expected that this may result in excessive inhalation of the surface.

As a result, the technique suggests a new concept of adding a base layer, but it does not seem to fundamentally solve the problems of the prior art. There is a very high need for a technology that can be solved.

Accordingly, an object of the present invention is to solve the problems of the prior art as described above and the technical problems that have been requested from the past.

After extensive research and various experiments, the inventors of the present application form a base layer of ceramic segments, form a bonding layer on the base layer, and then join the segments, and the base material has a larger particle diameter than the segment surface pores. In the case of simultaneously including the ceramic powder (a) and the ceramic powder (b) having a particle diameter smaller than the segment surface pores, it is possible to fundamentally solve the problem that the bonding components are excessively sucked into the porous structure of the segment, It has been found that the adhesive strength is greatly improved and the present invention has been completed.

Accordingly, a method of manufacturing a honeycomb ceramic filter according to the present invention is a method of manufacturing a porous ceramic filter by laminating, drying, plugging, and sintering a plurality of ceramic segments, by applying and drying a base material on the surface of the ceramic segment. &Quot; base layer ", and apply and dry a bonding material on the base layer to form a layer (" bonding layer ") and then join the segments, wherein the base material is a ceramic powder having a particle size larger than the segment surface pores. a) and ceramic powder (b) having a particle diameter smaller than the segment surface pores.

As described above, by having the base layer having a predetermined composition and particle size, it is possible to solve the problems caused by excessive suction of the bonding components contained in the bonding layer into the porous structure of the segment, and the base layer may also include an adhesive component. As a result, it is possible to provide very good bonding force between the joined segments.

Here, the "ceramic powder (a) having a particle diameter larger than the segment surface pores" does not necessarily mean only a ceramic powder having a particle size larger than the pores of the segment surface pores, and is generally the same as or larger than the pores of the segment surface pores. It is used by the concept containing the ceramic powder which has a particle diameter.

The thickness of the base layer and the bonding layer can be appropriately adjusted within the range to achieve the effect as described above, in one preferred embodiment, the thickness of the base layer is 0.3 ~ 0.8 mm, the thickness of the bonding layer May be formed to each 1 to 3 mm.

If the thickness of the base layer is too thin, it does not substantially serve as a base layer for preventing inhalation of the resin, and if the thickness of the bonding layer is too thin, it is difficult to expect the desired bonding strength. On the contrary, since the base layer and the bonding layer collect dust and do not function as a catalyst carrier, when the thickness of the base layer and the bonding layer is too thick, the specific surface area per unit volume of the honeycomb ceramic filter is reduced, so that It is not preferable because the performance will be degraded.

The bonding layer is a layer that substantially exerts the bonding force between the ceramic segments. In order to exert such adhesive force, a predetermined amount of ceramic powder of the bonding material needs to be sucked into the porous structure of the ceramic segment. If the size of the ceramic powder of the bonding material is too large, it is not preferable because it is not sucked into the porous structure of the ceramic segment. Therefore, it is preferable that the ceramic powder of the said bonding material mainly consists of powder (b ') of a small particle size. Even in the case of the powder (b ') having a small particle size, excessive suction is prevented by the base layer, so that it is not a big problem.

In one preferred example, the base material may have a composition consisting of ceramic powders (a, b), ceramic fibers, inorganic sol, organic binder and water.

That is, the base layer simultaneously includes ceramic powder (a) having a larger particle size than segment surface pores and ceramic powder (b) having a smaller particle size than segment surface pores. The ceramic powder (a) has a particle diameter larger than that of the segment surface pores, and simultaneously forms a predetermined gap between the ceramic powder (a) while blocking pores on the segment surface, and the ceramic powder (b) is the ceramic By properly filling the voids formed between the powders (a), it is possible to prevent the binder components from excessively moving to the segment surface.

Thus, by the interaction of these ceramic powders (a) and ceramic powder (b), the binder components are prevented from excessively suctioning the back into the porous structure of the segment surface, while the binder components It can be properly sucked into the porous structure of the segment surface. In addition, the components included in the base material can exhibit an adhesive force by itself, and exhibits excellent adhesive force together with the adhesive material which is a component of the adhesive layer.

The ceramic powders (a, b) is not particularly limited as long as the material can withstand a high temperature sintering process or regeneration process, for example, silicon nitride (Si ₃ N ₄ ), alumina, stainless powder, carbonization Silicon (SiC) or the like may be used, but is not limited thereto.

The organic binder is a material that provides the bonding strength of the layer components at room temperature, for example, polyvinylidene fluoride, polyvinyl alcohol, carboxymethyl cellulose (CMC), starch, hydroxypropyl cellulose, regenerated cellulose Rhodes, polyvinylpyrrolidone, tetrafluoroethylene, polyethylene, polypropylene, ethylene-propylene-diene terpolymer (EPDM), sulfonated EPDM, styrene butylene rubber, fluorine rubber, various copolymers, high polymer polymerized poly It may be one or two or more selected from the group consisting of vinyl alcohol, but is not limited thereto.

The inorganic components such as the inorganic sol and the ceramic fiber are materials that provide the bonding force between the layer components after the sintering process of the honeycomb filter, and the inorganic sol may be, for example, a colloidal such as a silica sol, an alumina sol, or a mixture thereof. A sol may be used, and the ceramic fiber may be, for example, silica, mullite, alumina, silica-alumina, or the like, but is not limited thereto.

The amount of the ceramic powder (a) should be included to such an extent that it can serve to fill the porous structure of the segment surface and to form a predetermined void, and when the amount of the ceramic powder (a) is too large, the ceramic The pores formed between the powders (a) can suck up a significant amount of the binder component, while on the other hand, if the amount of ceramic powder (a) is too small, the pores on the surface of the segment are hardly obstructed and substantially suction of the binder components is achieved. It does not play a role as a base layer to prevent this.

In addition, when the amount of the ceramic powder (b) is too large or too small, it is difficult to obtain an effect of inducing the suction of the appropriate amount of the binder component into the internal pores of the segment while preventing excessive inhalation of the adhesive material into the internal pores of the segment. .

Therefore, based on the total weight of the base material, the ceramic powder (a) is contained in 1 to 30% by weight, the ceramic powder (b) is preferably included in 15 to 60% by weight.

Since the ceramic filter manufactured by joining a plurality of ceramic segments is subjected to a high temperature sintering process or regeneration process, the base layer and the bonding layer should also be able to withstand high temperatures. Therefore, the ceramic powder is preferably silicon carbide (SiC) powder which is excellent in heat resistance and hardly deformed even at high temperatures, and the particle diameter of the ceramic powder (a) is equal to or larger than the particle size of pores formed in the porous structure of the ceramic segment surface. It may be, for example, one or a mixture of two or more having a particle diameter of 20 ㎛ or more.

The particle diameter of the ceramic powder (b) is smoothly moved through the pores generated by the ceramic powder (a) within a range smaller than the particle diameter of the ceramic powder (a) to be appropriately sucked into the porous structure of the segment surface, thereby It can be adjusted to a size that can exert the adhesion of, for example, may be one or a mixture of two or more having a particle diameter of less than 15 ㎛.

In one preferred embodiment, the ceramic powder (a) is a SiC powder having a particle size of 25 ~ 35 ㎛, the ceramic powder (b) is a SiC powder having a particle diameter of 0.5 ~ 1.2 ㎛ and a particle diameter of 7 ~ 8 ㎛ It may be a mixture of SiC powder having.

As the material of the bonding layer, the bonding material serves to substantially exert the bonding force between the segments, known bonding layer components can be used. In one preferred example, the bonding material may be composed of a ceramic powder (b '), a ceramic fiber, an inorganic sol, an organic binder, and water.

That is, the ceramic fiber, the inorganic sol, the organic binder, and water may be included for the same reason as described above with respect to the component of the base material, and the ceramic powder is added to prevent excessive suction of the bonding material among the components included in the base material ( a) is not included here.

When the amount of the ceramic powder (b ') is too large, other components included in the bonding material may be relatively reduced, and thus the bonding strength and fluidity may be weakened. On the contrary, when the amount of the ceramic powder (b') is too small, sufficient adhesion may not be achieved. Powder (b ') may preferably be included in 30 to 60% by weight based on the total weight of the bonding material.

In one preferred embodiment, the ceramic powder (b ') is one or a mixture of two or more having a particle diameter of less than 15 μm, and in a specific example, SiC powder having a particle size of 0.5 to 1.2 μm and a particle size of 7 to 8 μm It may be a mixture of SiC powder having. That is, by having a particle size smaller than the pores of the segment, it is possible to pass through between the ceramic powder (a) having a large particle diameter included in the base layer to be properly sucked into the pores formed on the surface of the segment to exhibit the adhesive force.

In one preferred embodiment, the bonding material may further include ceramic hollow spheres and / or clay in the range of 10% by weight or less based on the total weight.

Since the ceramic hollow spheres and / or clays are excellent in retaining and supporting power of the components of the bonding material, are stable to high temperature and high pressure, have low specific gravity and have appropriate strength, they can impart predetermined adhesion and strength to the bonding layer. In addition, since the bonding material paste is not easily fractured, it has an advantage of easy handling.

The ceramic hollow sphere may be composed of, for example, silica, alumina, mullite, fly ash and the like, but is not limited thereto.

When the amount of the ceramic hollow spheres and / or clays is added too much, the amount of the bonding components in the bonding layer is relatively reduced, and the amount of the hollow spheres increases, so that the adhesive strength may be weakened. It is hard to expect. Therefore, the ceramic hollow sphere and / or clay is preferably added in less than 10% by weight based on the total weight of the bonding material.

Preferably, the ceramic hollow sphere may have a plurality of mullite whiskers having a hollow structure having an outer diameter of 20 to 100 μm. Here, the "whisker" means a needle-shaped single crystal having a very high tensile strength. In general, whiskers have a diameter in the range of tens of micrometers in sub-micron size and an aspect ratio (length / diameter ratio) of 10 or more, and the smaller the diameter of the whisker, the higher the tensile strength and the closer to the theoretical strength.

Therefore, the mullite whisker has a very high strength, and when used as a porous filter, can withstand high temperature thermal cycles such as a regeneration process, thereby providing a predetermined strength to the bonding layer. Moreover, since the hollow spheres formed of mullite whiskers act as a bonding material after maintaining the hollow structure to a considerable temperature, a more uniform and stable bonding layer can be formed.

The base layer and the bonding layer may be preferably formed by applying a base material or a bonding material and heating and drying at 80 to 150 ° C. That is, the base material is coated on the ceramic segment and then heated to 80 to 150 ° C. to dry and then the bonding material is applied, and the base material and the bonding layer are formed on the ceramic segment by heating to 80 to 150 ° C. again.

The coating method of the base material or the bonding material is not particularly limited, and may be applied using a known coating method. For example, the base material or the bonding material may be uniformly coated using a rubber roll and a rubber blower.

In a specific example, the base material is coated on the ceramic segment, dried at 100 ° C. for 15 minutes, and then the bonding material is applied to the dried segment and bonded to dry the material at 100 ° C. to form the base layer and the bonding layer. .

The present invention also provides a honeycomb ceramic filter manufactured by the above method.

That is, the honeycomb ceramic filter may be manufactured by sequentially stacking ceramic segments on which the base layer and the bonding layer are formed, and then cutting the silicon carbide sintered body through a sintering process to a predetermined shape. The shape of the ceramic segment may vary, and in one preferred example, may have a rectangular parallelepiped structure in cross section. In addition, the number of ceramic segments bonded to each other is appropriately determined according to a desired specification of the honeycomb ceramic filter on which the catalyst component is carried.

The structure and manufacturing method of the honeycomb ceramic filter are well known, and a detailed description thereof will be omitted herein.

Hereinafter, although described with reference to the drawings according to an embodiment of the present invention, this is for easier understanding of the present invention, the scope of the present invention is not limited thereto.

4A, 4B, 4C, 4D, and 4E schematically illustrate the manufacturing process of the porous ceramic filter according to one embodiment of the present invention as a series of process diagrams.

Referring to these drawings, the porous ceramic filter according to the present invention comprises the step (4a) of manufacturing the ceramic segment 100, the step of forming the base layer 110 on the ceramic segment 100 (4b), the base layer ( Step 4c of forming the adhesive layer 120 on the 110, and sequentially stacking the ceramic segments 101, 102, 103, 104, 105, and 106 on which the base layer 110 and the adhesive layer 120 are formed. (4d) and drying the laminated segments, and cutting the outer shape into a predetermined shape, and after the base layer 110 and the adhesive layer 120 are formed on the cut outer surface, drying and curing under appropriate pressure. Can be prepared in step 4e. The shape of the foundation may vary depending on the shape required, for example, it may be a cylindrical shape of an elliptical cross section as shown in the dotted line of FIG.

5 is an enlarged cross-sectional view of the junction portion before sintering in the porous ceramic filter according to the present invention.

Referring to FIG. 5, the base layer 110 is coated on the surfaces of the ceramic segments 200 and 210, and the bonding layer 120 is coated on the base layer 110. That is, the base layer 110, the bonding layer 120, and the base layer 110 are stacked between the ceramic segments 200 and 210.

The base layer 110 serves as a buffer to prevent excessive bonding of the bonding components of the bonding layer to the surfaces of the ceramic segments 200 and 210. Simultaneously including the ceramic powder having a larger particle size than the segment surface pores and the ceramic powder having a smaller particle size than the segment surface pores, the buffer serves to improve the adhesion strength between the segments.

The bonding layer 120 is formed by applying an adhesive on the base layer 110, and is a layer that substantially functions to bond the ceramic segments 200 and 210. Therefore, the bonding layer 120 includes bonding components. For example, silicon carbide powder having excellent heat resistance and no deformation at high temperature may be used as the main component.

Hereinafter, the present invention will be described in more detail with reference to Examples, but the following Examples are provided to illustrate the present invention, and the scope of the present invention is not limited thereto.

Example 1

The base material was applied to the surface of the sintered segment, dried at 100 ° C. for 15 minutes, and then the bonded material was applied to the dried segment, and then bonded and dried again at 100 ° C., thereby joining the segments. At this time, the composition of the base material and the bonding material is shown in Table 1 and Table 2, respectively.

<Table 1> Composition of the base material (A)

<Table 2> Composition (B) of bonding material

Example 2

The segments were bonded in the same manner as in Example 1 except that the composition of the bonding material was as shown in Table 3 below.

Table 3 Composition of Bonding Material (C)

Example 3

The segments were bonded in the same manner as in Example 1 except that the composition of the bonding material was as shown in Table 4 below.

Table 4 Composition of Bonding Material (D)

Comparative Example 1

The segments were bonded in the same manner as in Example 1, except that the composition of the base material was set as shown in Table 5 below.

<Table 5> Base material composition (E)

Comparative Example 2

The segments were bonded in the same manner as in Comparative Example 1 except that the composition of the bonding material was as shown in Table 6 below.

Table 6 Composition of bonding material (C)

Comparative Example 3

The segments were bonded in the same manner as in Comparative Example 1 except that the composition of the bonding material was as shown in Table 7 below.

Table 7 Composition of Bonding Material (D)

Experimental Example

Bonding strength test (3 point bending strength) of the bonded segments in the Example and Comparative Example was obtained as a result of Table 8 below.

TABLE 8

As shown in Table 8, the bonding strength of Examples 1 to 3 is significantly superior to the bonding strength of Comparative Examples 1 to 3, in particular, when the bonding strength of Example 3 and Comparative Example 3 is compared to the bonding of Example 3 It can be seen that the strength is more than twice as high. Here, the viscosity of the base material composition A of the said Example and the base material composition E of the comparative example did not show a big difference. That is, the biggest difference between the base material composition A and E is the difference in the particle size distribution of the SiC used. Therefore, even when the viscosity of the base material is similar, it shows that there is an effect of preventing sol migration depending on the particle size of the used particles.

While the above has been described above with reference to embodiments according to the present invention, those of ordinary skill in the art to which the present invention pertains can make various applications and modifications within the scope of the present invention. will be.

As described above, in the method of manufacturing a porous ceramic filter according to the present invention, a base material is coated and dried on a surface of a ceramic segment to form a layer (“base layer”), and a bonding material is applied and dried on the base layer. To form a layer (" bonding layer ") to bond the segments together, and the base material simultaneously includes ceramic powder (a) having a larger particle size than segment surface pores and ceramic powder (b) having a smaller particle size than segment surface pores. By doing so, it is possible to fundamentally solve the problem of excessive suction of the bonding components into the porous structure of the segment, and a porous ceramic filter having excellent adhesion strength can be obtained.

Claims (16)

A method of manufacturing a porous ceramic filter by laminating, drying, plugging, and sintering a plurality of ceramic segments, the method comprising applying and drying a base material on a surface of the ceramic segment to form a layer (“base layer”), and over the base layer. After applying and drying the bonding material to form a layer ("bonding layer") to join the segments, the base material is a ceramic powder having a particle size larger than the segment surface pores (a) and a ceramic powder having a particle size smaller than the segment surface pores (b) a manufacturing method comprising the same time. The method of claim 1, wherein the base layer has a thickness of 0.3 to 0.8 mm and the bonding layer has a thickness of 1 to 3 mm. The method according to claim 1, wherein the ceramic powder of the bonding material mainly consists of powder (b ') having a small particle size. The method of claim 1, wherein the base material has a composition comprising ceramic powders (a, b), ceramic fibers, inorganic sol, organic binder, and water. The method according to claim 4, wherein the ceramic powder (a) is contained in 1 to 30% by weight, the ceramic powder (b) is contained in 15 to 60% by weight based on the total weight of the base material Manufacturing method. The method according to claim 5, wherein the ceramic powder (a) is one or two or more mixtures having a particle size of 20 µm or more in a range equal to or larger than the particle size of pores formed in the porous structure of the ceramic segment surface. The method of claim 5, wherein the ceramic powder (b) is one or two or more mixtures having a particle diameter of less than 15 ㎛. The method of claim 5, wherein the ceramic powder (a) is a SiC powder having a particle size of 25 ~ 35 ㎛, the ceramic powder (b) is a SiC powder having a particle size of 0.5 ~ 1.2 ㎛ and a particle diameter of 7 ~ 8 ㎛ Method for producing a mixture characterized in that the SiC powder. The method of claim 1, wherein the bonding material has a composition comprising ceramic powder (b '), ceramic fiber, inorganic sol, organic binder, and water. The method of claim 9, wherein the ceramic powder (b ') is included in an amount of 30 to 60 wt% based on the total weight of the bonding material. The method according to claim 10, wherein the particle diameter of the ceramic powder (b ') is one or two or more mixtures having a particle diameter of less than 15 mu m. 12. The method of claim 11, wherein the ceramic powder (b ') is a mixture of SiC powder having a particle size of 0.5 to 1.2 mu m and SiC powder having a particle size of 7 to 8 mu m. The method of claim 9, wherein the bonding material further comprises ceramic hollow spheres and / or clay in the range of 10% by weight or less based on the total weight. The method of claim 13, wherein the ceramic hollow sphere is characterized in that a plurality of mullite whiskers have a hollow structure of 20 to 100 ㎛ outer diameter. The method of claim 1, wherein the base layer and the bonding layer is formed by applying a base material or a bonding material and heating and drying at 80 to 150 ° C. A honeycomb ceramic filter manufactured by the method according to any one of claims 1 to 15.

Images