KR20080030349A - Light emitting diode package - Google Patents

Abstract

A light emitting diode package is provided to minimize the shaking of light generated when the light emitting diode package is connected to AC(Alternating Current) power by forming a delay unit at the lithe emitting diode package. Plural light emitting diode blocks(210,220) are comprised of light emitting diode arrays(200a,200b,200c,200d) that are connected in parallel to each other with a reverse polarity. A delay unit(300) delays AC power applied from the outside. The delay unit is connected in parallel to an optional light emitting block of the light emitting blocks. The light emitting arrays include plural light emitting diodes being connected in serial. The delay unit includes an RC integration circuit. The plural light emitting diode blocks are connected in parallel. The delay unit minimizes the shaking of light generated when a light emitting diode package is connected to the AC power.

Description

Light Emitting Diode Package {LIGHT EMITTING DIODE PACKAGE}

1 is a plan view of a light emitting diode package according to the present invention;

2 is a circuit diagram of a light emitting diode package according to the present invention.

3 is a circuit diagram of a light emitting diode package according to another embodiment of the present invention.

4 is a power waveform diagram applied to the LED package according to the present invention.

<Explanation of symbols for the main parts of the drawings>

100: base plate 200a: first light emitting diode array

200b: second light emitting diode array 200c: second light emitting diode array

200d: fourth light emitting diode array 210: first light emitting diode block

220: second light emitting diode block 300: delay unit

The present invention relates to a light emitting diode package, and more particularly, to a light emitting diode package using an RC integrated circuit.

A light emitting diode (LED) refers to a device that generates a small number of carriers (electrons or holes) injected using a P-N junction structure of a compound semiconductor, and emits predetermined light by recombination thereof. Such light emitting diodes have been used as display devices and backlights, and researches for applying them to general lighting applications have recently been actively conducted.

A light emitting device using a light emitting diode as described above, that is, a light emitting diode package has a small power consumption and a lifetime of several to several tens of times compared to a conventional light bulb or a fluorescent lamp, and is superior in terms of reducing power consumption and durability.

In general, a light emitting diode package for general lighting use is connected to an AC power source without a plurality of light emitting diodes connected in series / parallel on a single substrate without external devices or circuits. Such a light emitting diode package is expected to replace the lighting in the future because it has several advantages of the general light emitting diode and can be directly connected to the existing lighting equipment.

However, the light emitting diode package according to the related art has a plurality of light emitting diodes connected in series in both directions, and thus, when the light emitting diode package is used in alternating current, light shaking occurs due to a change in the alternating voltage.

An object of the present invention is to solve the above-mentioned problems of the prior art, a light emitting diode package capable of minimizing light blur caused when using a light emitting diode package equipped with a plurality of light emitting diodes directly connected to the alternating current To provide.

In order to achieve the above object, the present invention includes a plurality of light emitting diode blocks composed of light emitting diode arrays connected in parallel to each other in reverse polarity, and a light emitting diode comprising a delay unit for delaying an AC power applied from the outside for a predetermined time. Provide the package.

The delay unit includes an RC integrating circuit, and may be connected in parallel with any of the light emitting diode blocks.

The light emitting diode array may include a plurality of light emitting diodes connected in series, and the plurality of light emitting diode blocks may be connected in parallel.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

However, the present invention is not limited to the embodiments disclosed below, but will be implemented in various forms, and only the embodiments are intended to complete the disclosure of the present invention, and to those skilled in the art to fully understand the scope of the invention. It is provided to inform you. Like reference numerals in the drawings refer to like elements.

1 is a plan view of a light emitting diode package according to the present invention, FIG. 2 is a circuit diagram of a light emitting diode package according to the present invention, FIG. 3 is a circuit diagram of a light emitting diode package according to another embodiment of the present invention, and FIG. Power waveform diagram applied to the LED package according to the invention.

As shown in FIG. 1, a light emitting diode package according to the present invention includes a base plate 100, first and second light emitting diode blocks 210 and 220 disposed on the base plate 100, and applied externally. It includes a delay unit 300 for delaying the AC power for a predetermined time.

The base plate 100 is for mounting the first and second light emitting diode blocks 210 and 220 and applying power applied from the outside to the first and second light emitting diode blocks 210 and 220. It may include a printed circuit board (PCB).

An electrode pattern and an electrode may be formed in the base plate 100 to apply external power to the first and second light emitting diode blocks 210 and 220, and the first and second light emitting diode blocks ( 210 and 220 may be electrically connected to the electrode pattern. In this case, external power applied to the electrode may be applied to the first and second light emitting diode blocks 210 and 220 by the electrode pattern.

The first and second light emitting diode blocks 210 and 220 may include first and second light emitting diode arrays 200a and 200b and third and fourth light emitting diode arrays 200c and 200d, respectively. The fourth to fourth light emitting diode arrays 200a to 200d each include a plurality of light emitting diodes. In this case, the first and second LED arrays 200a and 200b and the third and fourth LED arrays 200c and 200d are connected in parallel with the same polarity, respectively, and the first and second LED blocks 210 , 220 are connected in parallel to each other in reverse polarity.

The light emitting diode is a light source of the LED package according to the present invention, the light emitting chip is mounted therein. That is, the light emitting diode has a structure in which a light emitting chip is mounted to emit light by an external power source, for example, a structure in which a light emitting chip electrically connected to an electrode pattern is mounted on a substrate on which an electrode pattern is formed. Such a light emitting chip generates a small number of carriers (electrons or holes) injected using a p-n junction structure of a semiconductor and emits light by recombination thereof. However, the present invention is not limited thereto, and the LED package according to the present invention may be composed of a plurality of light emitting chips, respectively. That is, the light emitting chip may be directly mounted without mounting a light emitting diode on the base plate 100. For example, the light emitting chip may be mounted on the base plate 100, and the electrode pattern of the base plate 100 may be connected to the light emitting chip by a predetermined wiring. In addition, the light emitting diode may emit various colors according to the type of the light emitting chip and the phosphor.

The delay unit 300 is for delaying an AC voltage applied to the first light emitting diode block 210. The delay unit 300 may be configured with various types of circuits. It includes a circuit.

The RC integrated circuit includes a capacitor (C) and a first resistor (R1), the first resistor (R1) is connected to one end of the first light emitting diode block 210, the capacitor (C) It is connected in parallel with the first light emitting diode block (210).

Therefore, in the LED package according to the present embodiment, as shown in FIG. 2, the other end of the first resistor R1 is connected to one end of the first LED array 200a and the first LED array 200a of the LED package 200a is connected. One end of the second resistor R2 is connected to the other end. In addition, the capacitor C is connected to one end of the first LED array 200a and the other end of the second resistor R2, and the third resistor R3 to the other end of the second LED array 200b. One end of is connected. In addition, the other end of the second resistor R2 and the capacitor C and the other end of the third resistor R3 are connected, and one end of the second LED array 200b and the other end of the first resistor R1 are connected. do. In this case, an external power source is applied to one end of the first resistor R1.

One end of the fourth resistor R4 is connected to the other end of the third LED array 200c, and one end of the fifth resistor R5 is connected to the other end of the fourth LED array 200d. At this time, one end of the third LED array 200c and one end of the fourth LED array 200d are connected, and the other end of the fourth resistor R4 and the other end of the fifth resistor R5 are connected. In addition, the other ends of the second and third resistors R2 and R3 and the other ends of the fourth and fifth resistors R4 and R5 are connected to one end of the third and fourth LED arrays 200c and 200d. External power is applied.

At this time, the delay unit 300 is connected to the first LED array 200a of the first LED block 210 so that an AC power delayed by a predetermined time is applied to the first LED array 200A. In addition, AC power delayed by a predetermined time by connecting the delay unit 300 to the first LED array 200a of the first LED block 210 is a third LED of the second LED block 220. Is applied to the array 200c. However, the present invention is not limited thereto, and the delay unit 300 may be connected to each of the first and third LED arrays 200a and 200c.

In addition, the LED package according to the present invention is not limited thereto. As shown in FIG. 3, the first and second LED arrays 200a and 200b and the third and fourth LED arrays 200c and 200d are illustrated in FIG. 3. May be connected to the first and second resistors R1 and R2, respectively. That is, the first and second LED arrays 200a and 200b may be connected in parallel with different polarities and connected to one resistor, that is, the first resistor R1. The third and fourth LED arrays 200c, 200d) may also be connected in parallel with different polarities and connected to one resistor, that is, the second resistor R2. At this time, the other end of the first and second resistors R1 and R2 is also connected to the other end of the capacitor C.

In the present embodiment, for convenience of description, external powers applied to the first light emitting diode block 210 and the second light emitting diode block 220 are referred to as first and second AC voltages B and A, respectively. do. In this case, the first and third light emitting diode arrays 200a and 200c are turned on at a positive voltage of the first AC voltage B, and the second and fourth light emitting diode arrays 200b and 200d are respectively It turns on at the negative voltage of the second AC voltage A.

In the LED package according to the present exemplary embodiment having the above structure, as illustrated in FIG. 3, a first AC power source B is applied to the first LED block 210, and the second LED block 220 is applied. The second AC power source A is applied to the. That is, the first AC power source B delayed by the delay unit for a predetermined time is not present in the first and second LED arrays 200a and 200b, and the third and fourth LED arrays 200c and 200d are not provided. The second AC power source A that is not delayed is applied. 3 illustrates an AC power waveform applied to the third, first, fourth, and second light emitting diode arrays 200c, 200a, 200d, and 200b in order from an upper waveform.

Therefore, in the region (1), the third LED array 200c is turned on, and in the region (2), the first and third LED arrays 200a and 200c are turned on. In the region (3), the first and fourth LED arrays 200a and 200d are turned on, and in the region (4), the second and fourth LED arrays 200b and 200d are turned on. In the region (5), the third and fourth light emitting diode arrays 200c and 200d are turned on.

Therefore, the LED package according to the present exemplary embodiment may be sequentially driven without a section in which the first to fourth LED arrays 200a to 200d are turned off at the same time, thereby minimizing light blurring.

Meanwhile, in the present exemplary embodiment, the first and second light emitting diode blocks 210 and 220 are each provided with two light emitting diode arrays. However, the present invention is not limited thereto, and a plurality of light emitting diode arrays may be provided. . In addition, in the present embodiment, a delay unit is provided only in the first light emitting diode block 210, but is not limited thereto. The delay unit may be provided in either the first light emitting diode block 210 or the second light emitting diode block 220. Can be. Furthermore, in the present embodiment, only two light emitting diode blocks have been described as an example, but the light emitting diode blocks may be plural.

Although described above with reference to the drawings and embodiments, those skilled in the art can be variously modified and changed within the scope of the invention without departing from the spirit of the invention described in the claims below. I can understand.

As described above, the present invention may provide a LED package capable of minimizing light blur caused when the LED package is directly connected to AC by providing a delay unit in the LED package.

Claims (5)

A plurality of light emitting diode blocks composed of light emitting diode arrays connected in reverse polarity to each other; Light emitting diode package comprising a delay unit for delaying the AC power applied from the outside for a predetermined time. The method according to claim 1, The delay unit is a light emitting diode package, characterized in that connected in parallel with any of the light emitting diode blocks of the plurality of light emitting diode blocks. The method according to claim 1, The LED array comprises a plurality of light emitting diodes connected in series. The method according to claim 1 or 2, The delay unit comprises a RC integrating circuit. The method according to claim 1 or 2, The light emitting diode package, characterized in that the plurality of light emitting diode blocks are connected in parallel.

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