KR20080022894A - 엘이디 도트 매트릭스 모듈 - Google Patents
엘이디 도트 매트릭스 모듈 Download PDFInfo
- Publication number
- KR20080022894A KR20080022894A KR1020060086696A KR20060086696A KR20080022894A KR 20080022894 A KR20080022894 A KR 20080022894A KR 1020060086696 A KR1020060086696 A KR 1020060086696A KR 20060086696 A KR20060086696 A KR 20060086696A KR 20080022894 A KR20080022894 A KR 20080022894A
- Authority
- KR
- South Korea
- Prior art keywords
- light emitting
- matrix module
- dot matrix
- light
- led
- Prior art date
Links
- 239000011159 matrix material Substances 0.000 title claims abstract description 45
- 239000011347 resin Substances 0.000 claims abstract description 8
- 229920005989 resin Polymers 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims description 11
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 238000001579 optical reflectometry Methods 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- 239000010703 silicon Substances 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 230000000903 blocking effect Effects 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 238000004381 surface treatment Methods 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 5
- IYZWUWBAFUBNCH-UHFFFAOYSA-N 2,6-dichlorobiphenyl Chemical compound ClC1=CC=CC(Cl)=C1C1=CC=CC=C1 IYZWUWBAFUBNCH-UHFFFAOYSA-N 0.000 description 11
- 230000017525 heat dissipation Effects 0.000 description 6
- 239000003086 colorant Substances 0.000 description 4
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 239000000428 dust Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 238000004078 waterproofing Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F13/00—Illuminated signs; Luminous advertising
- G09F13/20—Illuminated signs; Luminous advertising with luminescent surfaces or parts
- G09F13/22—Illuminated signs; Luminous advertising with luminescent surfaces or parts electroluminescent
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/302—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements characterised by the form or geometrical disposition of the individual elements
- G09F9/3026—Video wall, i.e. stackable semiconductor matrix display modules
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F13/00—Illuminated signs; Luminous advertising
- G09F13/20—Illuminated signs; Luminous advertising with luminescent surfaces or parts
- G09F13/22—Illuminated signs; Luminous advertising with luminescent surfaces or parts electroluminescent
- G09F2013/222—Illuminated signs; Luminous advertising with luminescent surfaces or parts electroluminescent with LEDs
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S362/00—Illumination
- Y10S362/80—Light emitting diode
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Multimedia (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (9)
- PCB;레드, 그린, 블루 3종류의 LED 칩이 하나의 도트 구조로 조합되어 상기 PCB 상에 매트릭스화 된 다수의 발광수단;상기 각각의 발광수단이 발광됨에 따라 발생되는 빛이 효율적으로 반사되어 방출되도록 내부에는 소정 기울기의 반사면을 갖는 다수의 광안내홀을 포함하여 상기 PCB 상면에 부착되는 반사판과;상기 발광수단의 광반사율을 향상시키기 위하여 상기 광안내홀의 반사면과 발광수단의 주변에 코팅 또는 도금처리된 반사체 및;상기 반사판의 광안내홀 내에 충진되는 열전도성 투명수지를 포함하여 구성되는 것을 특징으로 하는 LED 도트 매트릭스 모듈.
- 제 1 항에 있어서,상기 반사판의 광 안내홀은,상면이 일정 직경의 정원(正圓)으로 형성되고, 하면이 상기 정원보다 작은 크기를 갖는 타원(楕圓)으로 형성되어, 상기 상면과 하면이 연결되는 부분인 반사면이 비구면(非球面)의 형태로 형성되는 것을 특징으로 하는 LED 도트 매트릭스 모듈.
- 제 2 항에 있어서,상기 반사면은,상기 발광수단을 중심으로 어느 양측 반사면의 기울기가 다른 양측 반사면의 기울기에 비해 완만하게 형성되는 것을 특징으로 하는 LED 도트 매트릭스 모듈.
- 제 2 항 또는 제 3 항에 있어서,상기 광안내홀 하면에 형성된 타원은,장축을 단축으로 나눈 값이 1.1 ~ 1.3 정도의 값으로 형성되는 것을 특징으로 하는 LED 도트 매트릭스 모듈.
- 제 1 항에 있어서,상기 반사체는,은(Ag)으로 구성되는 것을 특징으로 하는 LED 도트 매트릭스 모듈.
- 제 1 항에 있어서,상기 반사판은,알루미늄(Al)으로 구성되는 것을 특징으로 하는 LED 도트 매트릭스 모듈.
- 제 1 항에 있어서,상기 열전도성 투명수지는,실리콘인 것을 특징으로 하는 LED 도트 매트릭스 모듈.
- 제 1 항에 있어서,상기 차단판의 표면에는 광안내홀을 제외한 부분의 비발광면에 무광택의 흑착색 표면처리되는 것을 특징으로 하는 LED 도트 매트릭스 모듈.
- 제 1 항에 있어서,상기 발광수단을 구성하는 LED 칩이 설치되는 부분의 PCB에는 소정의 관통홀이 형성되고, 이 관통홀은 납땜 처리하여 마감하며, 각각의 LED 칩은 상기 납땜 부위에 설치되는 것을 특징으로 하는 LED 도트 매트릭스 모듈.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060086696A KR100869076B1 (ko) | 2006-09-08 | 2006-09-08 | 엘이디 도트 매트릭스 모듈 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060086696A KR100869076B1 (ko) | 2006-09-08 | 2006-09-08 | 엘이디 도트 매트릭스 모듈 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR2020060024276U Division KR200432231Y1 (ko) | 2006-09-08 | 2006-09-08 | 엘이디 도트 매트릭스 모듈 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20080022894A true KR20080022894A (ko) | 2008-03-12 |
KR100869076B1 KR100869076B1 (ko) | 2008-12-08 |
Family
ID=39396701
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020060086696A KR100869076B1 (ko) | 2006-09-08 | 2006-09-08 | 엘이디 도트 매트릭스 모듈 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100869076B1 (ko) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8519603B2 (en) | 2010-11-30 | 2013-08-27 | Samsung Electronics Co., Ltd. | Light emitting diode (LED) lamp |
WO2015170833A1 (ko) * | 2014-05-09 | 2015-11-12 | (주)엔디에스 | 투명 디스플레이장치 및 이의 제조방법 |
KR20210133113A (ko) * | 2020-04-28 | 2021-11-05 | 주식회사 텐씨엘 | 놀이시설용 태그 리더기 및 이를 포함하는 놀이기구 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101005324B1 (ko) | 2009-01-07 | 2011-01-05 | 오명호 | Led 조명램프 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100519591B1 (ko) * | 2003-05-19 | 2005-10-10 | 서울반도체 주식회사 | 발광 다이오드 표시 장치 |
US7578131B2 (en) * | 2005-06-30 | 2009-08-25 | United Technologies Corporation | Augmentor spray bar mounting |
JP2007098003A (ja) * | 2005-10-07 | 2007-04-19 | Nippon Telegr & Teleph Corp <Ntt> | 血圧計 |
JP2008002009A (ja) * | 2006-06-22 | 2008-01-10 | Kureha Ltd | フロアマット用裏材及びその製造方法 |
-
2006
- 2006-09-08 KR KR1020060086696A patent/KR100869076B1/ko active IP Right Grant
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8519603B2 (en) | 2010-11-30 | 2013-08-27 | Samsung Electronics Co., Ltd. | Light emitting diode (LED) lamp |
WO2015170833A1 (ko) * | 2014-05-09 | 2015-11-12 | (주)엔디에스 | 투명 디스플레이장치 및 이의 제조방법 |
KR20210133113A (ko) * | 2020-04-28 | 2021-11-05 | 주식회사 텐씨엘 | 놀이시설용 태그 리더기 및 이를 포함하는 놀이기구 |
Also Published As
Publication number | Publication date |
---|---|
KR100869076B1 (ko) | 2008-12-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI289366B (en) | Light source unit, illumination device using the same, and display device using the same | |
US7607815B2 (en) | Low profile and high efficiency lighting device for backlighting applications | |
US8550680B2 (en) | Lighting device | |
US7381995B2 (en) | Lighting device with flipped side-structure of LEDs | |
EP2337099B1 (en) | Light emitting device and lighting unit using the same | |
CN102484195B (zh) | 发光器件以及使用该发光器件的光单元 | |
US7205719B2 (en) | Light source with LED and optical protrusions | |
US20070053179A1 (en) | Low profile light source utilizing a flexible circuit carrier | |
KR20170019630A (ko) | 발광 소자 및 이를 구비한 표시 장치 | |
EP1825719B1 (en) | Illumination system | |
US20110278617A1 (en) | Light emitting device package | |
CN102315363A (zh) | 发光器件模块 | |
JP2006339147A (ja) | 可撓性回路担体を使用した光源 | |
KR20120118686A (ko) | 발광소자 모듈 | |
KR20020035819A (ko) | 방수, 방진 구조를 가진 방열판 겸용 반사면을 구비한발광소자 매트릭스 모듈 및 그 형성방법 | |
JP2008159986A (ja) | 発光装置および照明装置 | |
JP2007109945A (ja) | 光源 | |
KR100869076B1 (ko) | 엘이디 도트 매트릭스 모듈 | |
JP2011187963A (ja) | 発光素子パッケージ、これを含む表示装置及び照明システム | |
KR20110128693A (ko) | 발광 소자 패키지 및 이를 구비한 라이트 유닛 | |
CN102479911B (zh) | 发光器件封装 | |
US20080158886A1 (en) | Compact High-Intensity LED Based Light Source | |
KR200432231Y1 (ko) | 엘이디 도트 매트릭스 모듈 | |
KR101978942B1 (ko) | 발광소자 패키지 | |
KR101924014B1 (ko) | 발광 소자 패키지 및 이를 구비한 조명 시스템 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20121031 Year of fee payment: 5 |
|
FPAY | Annual fee payment |
Payment date: 20131031 Year of fee payment: 6 |
|
FPAY | Annual fee payment |
Payment date: 20141110 Year of fee payment: 7 |
|
FPAY | Annual fee payment |
Payment date: 20171110 Year of fee payment: 10 |
|
FPAY | Annual fee payment |
Payment date: 20181112 Year of fee payment: 11 |
|
FPAY | Annual fee payment |
Payment date: 20191111 Year of fee payment: 12 |